Chip testing device and sorting machine

Abstract

The utility model relates to the technical field of sorting machines, and discloses a chip testing device and a sorting machine. The chip testing device comprises a testing seat, an air distributing block and an adjusting block. Specifically, the test seat is used for placing a chip to be tested; the gas distribution block is provided with a first gas path, a second gas path, a test cavity and a first guide hole, the test seat is located at the bottom of the test cavity, the first gas path flows through the test seat, and the first end of the second gas path is communicated with the test cavity; and the adjusting block is slidably connected to the first guide hole, a fourth gas path is arranged in the adjusting block, and the adjusting block can slide to the first station so that the second end of the second gas path can communicate with the first gas path through the fourth gas path. According to the utility model, the blowing heat exchange mode of the original test seat is maintained during the test, and the temperature of the chip is controlled; and after the test is finished, the temperature control gas after heat exchange is blown back to the test cavity in the gas distribution block, so that the temperature control of the test environment is realized, the temperature control gas is fully utilized, and the waste is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a sorting machine technical field especially relates to a chip testing device and sorting machine. BACKGROUND

[0002] With the rapid development of integrated circuit technology, chip test response time becomes the increasingly important parameter index in the whole test, in order to realize the test demand of high precision, high response of low power chip, the existing blowing scheme is to increase the air passage in the test seat, during the test, high and low temperature gas blows through the test seat interior, and the temperature of chip is controlled by the heat transfer of test seat probe, and the temperature of chip surface is controlled by the pressure head, and the high response high precision test of small chip is realized. However, the temperature control gas is directly discharged after blowing and heat exchange to the probe, which will cause the waste of temperature control gas.

[0003] Therefore, there is an urgent need for a chip testing device and sorting machine to solve the above problems. UTILITY MODEL CONTENTS

[0004] Based on the above, the utility model aims at providing a kind of chip testing device and sorting machine, maintain the blowing heat exchange mode of original test seat when testing;After testing, the temperature control of test environment is realized, temperature control gas is fully utilized, and waste is reduced.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme:

[0006] On the one hand, a kind of chip testing device is provided, comprising:

[0007] Test seat, the test seat is used to place the chip to be tested;

[0008] Gas distribution block is provided with first gas path, second gas path, test cavity and first guide hole, the test seat is located in the cavity bottom of test cavity, the first gas path flows through the test seat, the first end of the second gas path is communicated with the test cavity;

[0009] Adjusting block is slidably connected to the first guide hole, the fourth gas path is arranged in the adjusting block, the adjusting block can be slid to first station, so that the second end of the second gas path is communicated with the first gas path through the fourth gas path.

[0010] As a preferred technical scheme of a kind of chip testing device, the gas distribution block is further provided with third gas path, the first end of the third gas path is communicated with the outside, the adjusting block can be slid to second station, so that the second end of the third gas path is communicated with the first gas path through the fourth gas path.

[0011] As a preferred technical scheme of the chip testing device, the chip testing device further comprises a testing pressure head, the testing pressure head is provided with a testing part, the testing part can extend into the testing cavity to press the chip on the testing seat, and / or the testing part can suck the chip.

[0012] As a preferred technical scheme of the chip testing device, the chip testing device further comprises a driving assembly, the driving assembly is drivingly connected to the adjusting block, and the driving assembly is used to drive the adjusting block to move between the first working position and the second working position.

[0013] As a preferred technical scheme of the chip testing device, the driving assembly comprises a driving part, the driving part comprises a jacking rod, the jacking rod is connected to the testing pressure head, when the testing pressure head presses the chip on the testing seat, the jacking rod is pressed on the adjusting block to make the adjusting block be located at the second working position.

[0014] As a preferred technical scheme of the chip testing device, the driving part further comprises a first elastic piece, the testing pressure head is provided with a second guide hole coaxial with the first guide hole, the side of the testing pressure head away from the gas distribution block is provided with an adapter plate, the adapter plate blocks the second guide hole, the jacking rod is slidingly connected to the second guide hole, one end of the first elastic piece is abutted against one end of the jacking rod away from the adjusting block, and the other end of the first elastic piece is abutted against the adapter plate.

[0015] As a preferred technical scheme of the chip testing device, the inner wall of the second guide hole is provided with a first flange, one end of the jacking rod away from the adjusting block is provided with a second flange, the first elastic piece can drive the jacking rod to extend out of the second guide hole, and the first flange is used to stop the second flange.

[0016] As a preferred technical scheme of the chip testing device, the driving assembly further comprises a second elastic piece, one end of the second elastic piece is connected to the first guide hole, and the other end of the second elastic piece is connected to the adjusting block, and the elastic force of the second elastic piece can drive the adjusting block to move to the first working position.

[0017] As a preferred technical scheme of the chip testing device, the second elastic piece is a tension spring, the tension spring is located at the side of the adjusting block close to the driving part, the inner wall of the first guide hole is provided with a third flange, the side wall of the adjusting block is in a stepped shape, the adjusting block comprises a small-diameter section, a stepped surface and a large-diameter section, the small-diameter section is arranged in the tension spring and extends out of the first guide hole, one end of the tension spring is connected to the third flange, and the other end of the tension spring is connected to the stepped surface.

[0018] In another aspect, a handler is provided, comprising a feeding device for supplying chips to be tested, a receiving device, a conveying device for conveying the chips to be tested in the feeding device to the test seat, and the chip testing device according to any one of the preceding aspects for testing the chips to be tested, and the conveying device is further used for conveying the tested products to the receiving device.

[0019] The chip testing device has the following beneficial effects:

[0020] The chip testing device and the handler have the following beneficial effects: when the test seat tests the chip, the temperature control gas flows in the first gas path, and when flowing through the test seat, the temperature control gas can exchange heat with the test seat, and the test seat exchanges heat with the chip, so that the temperature of the chip and the test seat is controlled; when the chip is not tested, the adjusting block is slid to the first station, so that the second end of the second gas path is connected to the first gas path through the fourth gas path, and at this time, the temperature control gas after heat exchange with the test seat is conveyed into the test cavity through the fourth gas path and the second gas path, so that the environmental temperature of the test cavity when the chip is not tested is maintained, the regional environmental temperature control is realized, and the high-response temperature control performance of the chip is improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the description of the embodiments of the present application will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present application and the drawings without creative labor.

[0022] Figure 1 is a structural schematic diagram of the chip testing device provided by the embodiment of the present application;

[0023] Figure 2 is a sectional view of the adjusting block located at the first station provided by the embodiment of the present application;

[0024] Figure 3 is a sectional view of the adjusting block located at the second station provided by the embodiment of the present application;

[0025] Figure 4 is Figure 2 is a sectional view at A-A;

[0026] Figure 5is a structural schematic view of the adjusting block provided by the embodiment of the utility model.

[0027] The figure is marked as follows:

[0028] 10, chip;

[0029] 1, test seat; 11, flow passage; 12, test probe;

[0030] 2, gas distribution block; 21, first gas path; 22, second gas path; 23, test cavity; 24, first guide hole; 241, third flange; 25, third gas path;

[0031] 3, adjusting block; 31, fourth gas path; 32, small diameter section; 33, stepped surface; 34, large diameter section;

[0032] 4, test pressure head; 41, second guide hole; 411, first flange; 42, test part;

[0033] 5, driving assembly; 51, driving part; 511, ejector rod; 5111, second flange; 512, first elastic member; 52, second elastic member. Embodiment

[0034] The utility model will be further explained in detail in combination with the drawings and examples. It can be understood that the specific examples described here are only used to explain the utility model, and not limited to the utility model. In addition, it should be noted that, in order to facilitate the description, only the part related to the utility model is shown in the drawings, not all structures.

[0035] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the communication or interaction of two elements inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0036] In the utility model, unless another definite provision and limitation, first feature is in second feature "on" or "under" can include that first and second features are in direct contact, also can include that first and second features are not in direct contact but contact through other feature between them. Moreover, first feature is in second feature "on", "above" and "upper surface" include that first feature is in second feature directly above and obliquely above, or only indicate that first feature horizontal height is higher than second feature. First feature is in second feature "under", "below" and "under surface" include that first feature is in second feature directly below and obliquely below, or only indicate that first feature horizontal height is less than second feature.

[0037] In the description of the present embodiment, the terms "upper", "lower", "left", "right" and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0038] As shown in Figure 1 And Figure 2 The present embodiment provides a chip testing device, which comprises a test seat 1, a gas distribution block 2 and an adjusting block 3. Specifically, the test seat 1 is used for placing a chip 10 to be tested; the gas distribution block 2 is provided with a first gas path 21, a second gas path 22, a test cavity 23 and a first guide hole 24, the test seat 1 is located at the cavity bottom of the test cavity 23, the first gas path 21 flows through the test seat 1, and the first end of the second gas path 22 is communicated with the test cavity 23; the adjusting block 3 is slidingly connected with the first guide hole 24, the fourth gas path 31 is arranged in the adjusting block 3, and the adjusting block 3 can be slid to a first station, so that the second end of the second gas path 22 is communicated with the first gas path 21 through the fourth gas path 31. In the present embodiment, the first guide hole 24 and the first gas path 21 are located on both sides of the test cavity 23.

[0039] When the test seat 1 tests the chip 10, the temperature control gas flows in the first gas path 21, and when flowing through the test seat 1, the temperature control gas can exchange heat with the test seat 1, and the test seat 1 exchanges heat with the chip 10, so that the temperature of the chip 10 and the test seat 1 is controlled. When not testing, the adjusting block 3 is slid to the first working position, so that the second end of the second gas path 22 is communicated with the first gas path 21 through the fourth gas path 31. At this time, the temperature control gas after exchanging heat with the test seat 1 is transported into the test cavity 23 through the fourth gas path 31 and the second gas path 22, so as to maintain the ambient temperature of the test cavity 23 when not testing, realize the regional ambient temperature control, and improve the high response temperature control performance of the chip 10. The embodiment ensures that the original blowing and heat exchange mode of the test seat 1 is maintained when testing, and the temperature of the chip 10 is controlled; after testing, the temperature control gas after heat exchange is blown back to the test cavity 23 in the gas distribution block 2, so as to realize the temperature control of the test environment, fully utilize the temperature control gas, and reduce waste.

[0040] In the embodiment, the test seat 1 is provided with a flow-through air duct 11 and a test probe 12. One end of the flow-through air duct 11 is communicated with the first gas path 21, and the other end is communicated with the fourth gas path 31. One end of the test probe 12 extends into the flow-through air duct 11, and the other end is used for electrically connecting to the chip 10. The temperature control gas in the flow-through air duct 11 exchanges heat with the chip 10 through the test probe 12, so as to realize the temperature control of the test probe 12 and the chip 10.

[0041] Preferably, the second gas path 22 is inclinedly arranged, and the first end of the second gas path 22 gradually deviates from the test seat 1 to the second end of the second gas path 22 along the axial direction of the test cavity 23. When the temperature control gas after exchanging heat with the test seat 1 is transported to the test cavity 23 through the second gas path 22, the temperature control gas output by the second gas path 22 is directly blown to the test seat 1, so as to improve the heat exchange efficiency of the test seat 1, and further improve the high response temperature control performance of the chip 10.

[0042] Preferably, as shown in the figure, Figures 2-4 The gas distribution block 2 is further provided with a third gas path 25. The first end of the third gas path 25 is communicated with the outside, and the adjusting block 3 can be slid to the second working position, so that the second end of the third gas path 25 is communicated with the first gas path 21 through the fourth gas path 31. In the embodiment, the third gas path 25 and the second gas path 22 are respectively communicated with the first guide hole 24, and the first working position is located above the second working position. The fourth gas path 31 is T-shaped, the lower part of the T-shaped is communicated with the first gas path 21, and the upper part of the T-shaped has two ends respectively used for communicating the second gas path 22 and the third gas path 25. Further, in the embodiment, the third gas path 25 is V-shaped, and in the process of testing the chip 10, the adjusting block 3 can be slid to the second working position, and the temperature control gas after exchanging heat with the test seat 1 is discharged through the fourth gas path 31 and the third gas path 25.

[0043] Further, the chip testing device further comprises a testing head 4, the testing head 4 is provided with a testing part 42, the testing part 42 is capable of extending into the testing cavity 23 to press the chip 10 against the testing seat 1; and / or the testing part 42 is capable of sucking the chip 10. In the embodiment, the testing part 42 is a testing column, the bottom end of the testing column is capable of sucking the chip 10.

[0044] Preferably, the chip testing device further comprises a driving assembly 5, the driving assembly 5 is drivingly connected to the adjusting block 3, the driving assembly 5 is used to drive the adjusting block 3 to move between the first working position and the second working position, so that the adjusting block 3 is selectively communicated with the second gas path 22 or the third gas path 25.

[0045] Further, the driving assembly 5 comprises a driving component 51, the driving component 51 comprises a top rod 511, the top rod 511 is connected to the testing head 4, when the testing head 4 presses the chip 10 against the testing seat 1, the top rod 511 is pressed against the adjusting block 3, so that the adjusting block 3 is located at the second working position. In the process that the testing part 42 extends into the testing cavity 23, the top rod 511 moves downward with the testing head 4, when the testing head 4 presses the chip 10 against the testing seat 1, the top rod 511 drives the adjusting block 3 to move downward to the second working position.

[0046] Preferably, the driving component 51 further comprises a first elastic member 512, the testing head 4 is provided with a second guide hole 41 coaxial with the first guide hole 24, the side of the testing head 4 away from the gas distribution block 2 is provided with an adapter plate, the adapter plate blocks the second guide hole 41, the top rod 511 is slidingly connected to the second guide hole 41, one end of the first elastic member 512 is abutted against the end of the top rod 511 away from the adjusting block 3, and the other end is abutted against the adapter plate. In the process that the testing part 42 of the testing head 4 extends into the testing cavity 23, the top rod 511 is first pressed against the adjusting block 3, the testing head 4 continues to move downward, the top rod 511 compresses the first elastic member 512, until the top rod 511 is abutted against the adapter plate, the testing head 4 continues to move downward, the top rod 511 drives the adjusting block 3 to move downward to the second working position, after the testing is completed, the testing part 42 of the testing head 4 exits the testing cavity 23, the first elastic member 512 is capable of driving the top rod 511 to reset.

[0047] In the embodiment, the inner wall of the second guide hole 41 is provided with a first flange 411, the end of the ejector rod 511 away from the adjusting block 3 is provided with a second flange 5111, the first elastic member 512 can drive the ejector rod 511 to extend out of the second guide hole 41, and the first flange 411 is used for stopping the second flange 5111. When the test indenter 4 is not pressed, the first elastic member 512 drives the end of the ejector rod 511 close to the adjusting block 3 to extend out of the second guide hole 41, at this time, the first flange 411 stops the second flange 5111, preventing the ejector rod 511 from disengaging from the second guide hole 41. In the embodiment, the first elastic member 512 is a spring, the end of the ejector rod 511 close to the first elastic member 512 is provided with a mounting groove, one end of the spring is embedded in the mounting groove, and the other end abuts against the adapter plate.

[0048] Further, as shown in Figure 2 、 Figure 3 、 Figure 5 , the driving assembly 5 further includes a second elastic member 52, one end of the second elastic member 52 is connected to the first guide hole 24, and the other end is connected to the adjusting block 3, and the elastic force of the second elastic member 52 can drive the adjusting block 3 to move to the first station. When the ejector rod 511 is not pressed to adjust the block 3, the second elastic member 52 drives the adjusting block 3 to move to the first station.

[0049] In the embodiment, the second elastic member 52 is a tension spring, and the tension spring is located on the side of the adjusting block 3 close to the driving component 51; the inner wall of the first guide hole 24 is provided with a third flange 241, the side wall of the adjusting block 3 is in a stepped shape, and the adjusting block 3 includes a small-diameter section 32, a stepped surface 33 and a large-diameter section 34; the small-diameter section 32 is provided through the tension spring and extends out of the first guide hole 24; one end of the tension spring is connected to the third flange 241, and the other end is connected to the stepped surface 33. In the process that the ejector rod 511 presses the adjusting block 3, the ejector rod 511 presses the part of the small-diameter section 32 extending out of the first guide hole 24, and drives the adjusting block 3 to move from the first station to the second station. When the ejector rod 511 is not pressed to adjust the block 3, the tension spring generates a pulling force on the adjusting block 3, so that the adjusting block 3 moves from the second station to the first station.

[0050] It should be noted that the embodiment also provides working steps of the chip testing device, which are as follows:

[0051] When the chip 10 is tested, the test head 4 sucks the chip 10, or the chip 10 is sucked by an additional pickup component, the test head 4 is pressed down, the test head 4 drives the top rod 511 to press down, the top rod 511 contacts the adjusting block 3 to start pushing the adjusting block 3 to slide and move down during the pressing down process, when the test head 4 is pressed down to the limit position, the chip 10 is pressed and connected to the test seat 1, the top rod 511 and the adjusting block 3 reach the limit position at the same time, at this time, the adjusting block 3 moves to the second working position, the first gas path 21 of the gas distribution block 2 is communicated with the third gas path 25 through the fourth gas path 31 of the adjusting block 3, the temperature control gas enters the inside of the test seat 1 through the first gas path 21, exchanges heat with the test probe 12, the test probe 12 exchanges heat with the chip 10, the bottom of the chip 10 is controlled at high and low temperatures, and the temperature control gas after heat exchange is blown out to the outside through the fourth gas path 31 and the third gas path 25; after the chip 10 is tested, the test head 4 is lifted to drive the top rod 511 to move upwards, the top rod 511 starts to reset under the pushing force of the first elastic member 512, after the test head 4 is reset, the top rod 511 also returns to the original position, at the same time, the adjusting block 3 slides and moves up to the first working position under the pulling force of the second elastic member 52, the third gas path 25 is closed by the adjusting block 3, the first gas path 21 is communicated with the second gas path 22 through the fourth gas path 31, at this time, the temperature control gas flows through the test seat 1, and is transported to the test cavity 23 through the fourth gas path 31 of the adjusting block 3 and the second gas path 22 of the gas distribution block 2, so that the environment temperature of the test cavity 23 during non-testing is maintained.

[0052] The embodiment also provides a sorting machine, which comprises a feeding device, a collecting device, a conveying device and the chip testing device.

[0053] It should be noted that the above only describes the preferred embodiments of the present application and the technical principles applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, re-adjustments and substitutions without departing from the protection scope of the present application. Therefore, although the present application has been described in detail through the above embodiments, the present application is not limited to the above embodiments, and more other equivalent embodiments can be included without departing from the concept of the present application, and the scope of the present application is determined by the appended claims.

Claims

1. A chip testing apparatus characterized by comprising: The chip testing device comprises a test seat (1) for placing a chip (10) to be tested, a gas distribution block (2) provided with a first gas path (21), a second gas path (22), a test cavity (23) and a first guide hole (24), the test seat (1) being located at the cavity bottom of the test cavity (23), the first gas path (21) flowing through the test seat (1), the first end of the second gas path (22) being communicated with the test cavity (23), an adjusting block (3) being slidingly connected to the first guide hole (24), the adjusting block (3) being provided with a fourth gas path (31) therein, the adjusting block (3) being capable of sliding to a first station so that the second end of the second gas path (22) is communicated with the first gas path (21) through the fourth gas path (31). The gas distribution block (2) is further provided with a third gas path (25), the first end of the third gas path (25) being communicated with the outside, the adjusting block (3) being capable of sliding to a second station so that the second end of the third gas path (25) is communicated with the first gas path (21) through the fourth gas path (31). The chip testing device further comprises a test pressure head (4) provided with a test part (42) capable of extending into the test cavity (23) to press the chip (10) against the test seat (1) and / or capable of sucking the chip (10). The chip testing device further comprises a driving assembly (5) drivingly connected to the adjusting block (3), the driving assembly (5) being used to drive the adjusting block (3) to move between the first station and the second station.

2. The chip testing apparatus according to claim 1, wherein The driving assembly (5) comprises a driving part (51) comprising a jacking rod (511) connected to the test pressure head (4), the test pressure head (4) pressing the chip (10) against the test seat (1), the jacking rod (511) being pressed against the adjusting block (3) so that the adjusting block (3) is located at the second station.

3. The chip testing apparatus according to claim 2, wherein The driving part (51) further comprises a first elastic member (512), the test pressure head (4) being provided with a second guide hole (41) coaxial with the first guide hole (24), the side of the test pressure head (4) away from the gas distribution block (2) being provided with an adapter plate, the adapter plate plugging the second guide hole (41), the jacking rod (511) being slidingly connected to the second guide hole (41), one end of the first elastic member (512) abutting against one end of the jacking rod (511) away from the adjusting block (3) and the other end abutting against the adapter plate.

4. The chip testing apparatus according to claim 3, wherein The inner wall of the second guide hole (41) is provided with a first flange (411), one end of the jacking rod (511) away from the adjusting block (3) is provided with a second flange (5111), the first elastic member (512) being capable of driving the jacking rod (511) to extend out of the second guide hole (41), the first flange (411) being used to stop the second flange (5111).

5. The chip testing apparatus according to claim 4, wherein ​ 6. The chip testing apparatus according to claim 5, wherein ​ 7. The chip testing apparatus according to claim 6, wherein ​ 8. The chip testing apparatus according to claim 5, wherein The driving assembly (5) further comprises a second elastic member (52), one end of the second elastic member (52) is connected to the first guide hole (24), the other end is connected to the adjusting block (3), and the elastic force of the second elastic member (52) can drive the adjusting block (3) to move to the first station.

9. The chip testing apparatus according to claim 8, wherein The second elastic member (52) is a tension spring, the tension spring is located on one side of the adjusting block (3) close to the driving component (51), an inner wall of the first guide hole (24) is provided with a third flange (241), a side wall of the adjusting block (3) is in a stepped shape, and the adjusting block (3) comprises a small-diameter section (32), a stepped surface (33) and a large-diameter section (34); the small-diameter section (32) is arranged through the tension spring and extends out of the first guide hole (24); one end of the tension spring is connected to the third flange (241), and the other end is connected to the stepped surface (33).

10. A sorter characterized by The chip testing device comprises a feeding device, a receiving device, a conveying device and the chip testing device according to any one of claims 1-9, the feeding device is used for supplying the chip (10) to be tested, the conveying device is used for conveying the chip (10) to be tested in the feeding device to the test seat (1), the chip testing device is used for testing the chip (10) to be tested, and the conveying device is further used for conveying the tested chip (10) to the receiving device.

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