Directional solidification preparation device for bonding wire blank
By using a directional solidification preparation device, a temperature gradient is formed by a medium-frequency heating coil and a water-cooled base, which solves the problems of low efficiency and environmental pollution in existing bonding copper wire plating technology, and realizes the efficient preparation of silver-clad copper composite rod blanks with uniform grain size.
Patent Information
- Application Number
- CN202423294800.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing bonding copper wire plating technology has low production efficiency, high cost, serious environmental pollution, and the plating layer is easy to peel off.
A directional solidification preparation device was used, in which a specific temperature gradient was formed by the coordinated operation of a medium-frequency heating coil, a lifting platform and a water-cooled base, to control the solidification process of the plated metal and prepare a silver-coated copper composite rod blank with consistent grain orientation and uniform microstructure.
This improved production efficiency, reduced environmental pollution, and resulted in high-quality silver-coated bonded copper wire.
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Figure CN223810139U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of metal directional solidification preparation and electronic packaging, and particularly relates to a directional solidification preparation device for bonding wire blank. BACKGROUND
[0002] In order to improve the poor oxidation resistance and sensitivity to environmental temperature and humidity of the bonding copper wire, the bonding copper wire is usually modified by plating palladium, gold or silver. For example, the bonding copper wire with a pure silver or silver alloy layer has the same conductivity, reflectivity and bonding performance as the bonding silver wire, and the pure copper core material can provide hardness and strength support, thereby reducing the material cost to a certain extent compared with the bonding silver wire. Common coating methods include coating technology, cladding technology, electroplating and magnetron sputtering plating, and the like, and the common process for realizing mechanical fusion between the metal cladding layer and the substrate is complex, and the above methods have large power consumption. The coating process such as surface plating and organic cladding for the bonding wire has high cost and a complex process, low production efficiency, and large environmental pollution, and waste liquid treatment is required. In addition, the cladding layer of the wire material is prone to peeling and falling off during the annealing process. CONTENT OF THE UTILITY MODEL
[0003] The present application aims to provide a directional solidification preparation technology and device for a bonding wire blank with a cladding layer, which can improve the low production efficiency and environmental pollution of the existing plating technology to a certain extent.
[0004] The present application provides a directional solidification preparation device for a bonding wire blank, which comprises a lifting mechanism, a top clamping device, a heating device, a blank mold, a water-cooled base and a lifting platform. The blank mold is formed with a mold cavity capable of accommodating a plated metal.
[0005] The heating device is used for heating the blank mold, so that the plated metal in the mold cavity is melted to form a plated metal liquid.
[0006] The top clamping device is connected with the lifting mechanism, and the top clamping device is used for clamping a metal rod. The lifting mechanism is used for driving the metal rod to move along the depth direction of the mold cavity, so that the metal rod is immersed in the plated metal liquid and a metal composite rod with the surface plated with the metal liquid is formed.
[0007] The water-cooled base is arranged on the lifting platform, and the blank mold is arranged on the water-cooled base. The lifting platform is used for driving the water-cooled base together with the blank mold to lift. The water-cooled base is used for cooling the blank mold, so that a temperature gradient from bottom to top is formed in the mold cavity, and the plated metal liquid on the surface of the metal composite rod is directionally solidified.
[0008] In the above technical solution, further, the directional solidification preparation device of the bonding wire blank further comprises a temperature detection component, which is built-in the blank mold and used for detecting the temperature of the mold cavity.
[0009] In any of the above technical solutions, further, the temperature detection component comprises a top thermocouple and a bottom thermocouple; the top thermocouple is built-in the top of the blank mold and used for detecting the temperature of the top of the mold cavity; the bottom thermocouple is built-in the bottom of the blank mold and used for detecting the temperature of the bottom of the mold cavity.
[0010] In any of the above technical solutions, further, the heating device comprises a medium-frequency heating device and a medium-frequency heating coil; the medium-frequency heating device is electrically connected with the medium-frequency heating coil, and the medium-frequency heating coil is arranged around the outer periphery of the blank mold along a direction perpendicular to the depth direction of the mold cavity.
[0011] In any of the above technical solutions, further, the water-cooling base is formed with a cooling flow channel, and a water inlet and a water outlet which are in communication with the cooling flow channel.
[0012] In any of the above technical solutions, further, the directional solidification preparation device of the bonding wire blank further comprises a water inlet valve and a water outlet valve, and the water inlet valve is arranged at the water inlet and the water outlet valve is arranged at the water outlet.
[0013] In any of the above technical solutions, further, the water-cooling base is formed with a recess, and the blank mold is installed in the recess. In any of the above technical solutions, further, the lifting mechanism comprises a first driving device, a first gear, a first rack, a first support component and a second support component; the fixed end of the first driving device is fixed to the first support component, and the driving end of the first driving device is connected with the first gear;
[0014] The first rack and the top clamping device are both fixed to the second support component, and the first rack is engaged with the first gear; the second support component is slidingly connected with the first support component.
[0015] In any of the above technical solutions, further, the lifting platform comprises a second driving device, a second gear, a second rack, a third support member and a fourth support member; wherein the fixed end of the second driving device is fixed to the third support member, and the driving end of the second driving device is connected with the second gear; the second rack is fixed to the fourth support member, and the second rack is engaged with the second gear; the fourth support member is slidingly connected with the third support member; and the water-cooled base is arranged on the fourth support member.
[0016] In any of the above technical solutions, further, the lifting platform comprises a base, an extension rod and a support platform; wherein the fixed end of the extension rod is connected with the base, the driving end of the extension rod is connected with the support platform, and the water-cooled base is arranged on the support platform.
[0017] In any of the above technical solutions, further, the height direction of the blank mold is the same as the depth direction of the mold cavity, and along the height direction of the blank mold, the water-cooled base is arranged at the bottom of the blank mold, and the lifting platform is arranged at the bottom of the water-cooled base.
[0018] In any of the above technical solutions, further, the heating device is arranged on the outer side of the blank mold.
[0019] Compared with the prior art, the application has the following beneficial effects:
[0020] In the application, the directional solidification device is composed of the intermediate frequency heating coil, the lifting platform and the water-cooled base, wherein the regional temperature control is performed on the molten metal to form a temperature field with a specific temperature gradient, and the power of the intermediate frequency heating coil, the displacement speed of the lifting platform and the water cooling temperature are adjusted to control the temperature difference and the temperature gradient, so that the directional solidification is realized, the metal as-cast structure under the traditional solidification mode can be effectively avoided, the silver-coated copper composite billet with consistent grain orientation and uniform structure can be obtained, and the target diameter silver-coated layer bonding copper wire can be prepared through subsequent drawing. Compared with the existing continuous casting process and electroplating process, the production preparation efficiency is high, and the environmental pollution is small. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the specific embodiments or the prior art, the drawings needed in the description of the specific embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.
[0022] Figure 1The silver-coated copper wire blank directional solidification technology and device structure schematic diagram provided by the embodiment of the application.
[0023] Reference signs:
[0024] 1-lifting mechanism, 2-top clamping device, 3-copper bar, 4-medium frequency heating device, 5-medium frequency heating coil, 6-blank mold, 61-mold cavity, 62-top thermocouple, 63-bottom thermocouple, 7-water-cooled base, 71-water inlet, 72-water outlet, 8-lifting platform. DETAILED DESCRIPTION
[0025] The technical solutions of the application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the application, not all embodiments of the application.
[0026] The components of the embodiments of the application generally described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the application.
[0027] Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the application.
[0028] In the description of the application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0029] In the description of the application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.
[0030] The following refers to Figure 1 A directional solidification preparation device for bonding wire blanks is described according to some embodiments of the application.
[0031] Embodiment one
[0032] Referring to Figure 1 As shown in the drawings, the embodiment of the present application provides a directional solidification preparation device for bonding wire blank, comprising: a lifting mechanism 1, a top clamping device 2, a heating device, a blank mold 6, a water-cooled base 7 and a lifting platform 8; wherein the blank mold 6 is formed with a mold cavity 61 capable of accommodating plated metal;
[0033] The heating device is used for heating the blank mold 6 to melt the plated metal in the mold cavity 61 to form plated metal liquid;
[0034] The top clamping device 2 is connected with the lifting mechanism 1, and the top clamping device 2 is used for clamping a metal rod. It should be noted that the metal rod can be a copper rod 3, which will be described in the following as an example. Of course, the metal rod can also be of other materials, which will not be described in detail here.
[0035] The lifting mechanism 1 is used for driving the copper rod 3 to move along the depth direction of the mold cavity 61, so that the copper rod 3 is immersed in the plated metal liquid, and a metal composite rod with the surface plated with metal liquid is formed;
[0036] The water-cooled base 7 is arranged on the lifting platform 8, the blank mold 6 is arranged on the water-cooled base 7, and the lifting platform 8 is used for driving the water-cooled base 7 together with the blank mold 6 to lift, the water-cooled base 7 is used for cooling the blank mold 6, so that a temperature gradient from bottom to top is formed in the mold cavity 61, and the plated metal liquid on the surface of the metal composite rod is directionally solidified.
[0037] Further, preferably, the heating device comprises a medium frequency heating device 4 and a medium frequency heating coil 5; wherein the medium frequency heating device 4 is electrically connected with the medium frequency heating coil 5, and the medium frequency heating coil 5 is arranged along the direction perpendicular to the depth direction of the mold cavity 61 and around the outer periphery of the blank mold 6. It should be noted that the structure of the heating device is not limited to the above, but can also be other types of heating devices, which can be selected according to actual needs.
[0038] Based on the structure described above, the process of preparing a silver-coated copper composite rod blank by using the directional solidification preparation device for bonding wire blank is as follows:
[0039] First, the blank mold 6 is preheated to a preset temperature, for example, about 900℃, then the copper bar 3 is fixed in the top clamping device 2 in a vertical state, and then the pure silver or silver alloy is poured into the blank mold 6, the intermediate frequency heating device 4 is turned on, and after the melting, the temperature is kept at 980-1010℃, the lifting mechanism 1 is lowered to immerse the copper bar into the metal liquid, the water inlet and outlet valves of the water-cooled base 7 are opened to cool the metal composite bar blank in the mold cavity 61, and the lifting platform 8 is continuously lowered to make the blank mold 6 exit the intermediate frequency heating coil 5 at a proper speed, so that the bar forms a temperature gradient from bottom to top, and is directionally solidified into a bonding copper wire bar blank containing a silver layer.
[0040] Of course, not only the above, but also the process of preparing a single crystal copper bar by using the directional solidification preparation technology and device of the present bonding wire blank is as follows:
[0041] First, the pure copper raw material is placed in the mold cavity 61, the intermediate frequency heating device 4 is turned on for heating, and the temperature is kept within a certain range, for example, 1100-1150℃, the lifting platform 8 is continuously lowered, and the blank mold 6 is cooled by the water-cooled base 7, the pure copper liquid is in a molten liquid state due to the effect of electromagnetic induction heating in the part covered by the intermediate frequency heating coil 5, and the pure copper liquid removed from the coil covered part is cooled by water to form a temperature gradient from bottom to top, and gradually condenses from the bottom to the top, the solid-liquid interface gradually rises along the edge of the coil, and finally directionally solidifies into a single crystal copper bar.
[0042] Based on the principle of directional solidification for preparing a single crystal metal casting bar, the present application provides a process for preparing a composite bonding wire bar blank with a pure copper inner core and a pure silver or silver alloy outer layer by adjusting and controlling the temperature gradient of the bar blank, which mainly uses forced means to establish a specific directional temperature gradient in the solidified metal and the un-solidified melt during the solidification process, so that the melt solidifies in the opposite direction of the heat flow, and a specific oriented structure is obtained, and the melting point difference between pure copper and pure silver or silver alloy is used to coat the pure silver or silver alloy liquid outside the pre-prepared pure copper bar, and the directional solidification technology is used to cool and solidify the coating layer outside the copper core to form a bimetallic composite bar blank, which is subsequently drawn to the required wire diameter.
[0043] Based on the above, in the present application, by continuously lowering the lifting platform 8, and cooperating with the water-cooled base 7, a directional solidification device is formed, in which the molten metal is subjected to regional temperature control to form a temperature field with a specific temperature gradient, and by adjusting the power of the medium frequency heating coil 5, the medium temperature in the water-cooled base 7 and the descending speed of the lifting platform 8, the temperature difference and temperature gradient are controlled to realize directional solidification, which can effectively avoid the appearance of metal as-cast structure under the traditional solidification mode, and can obtain single crystal copper rods and silver-coated copper composite billets with consistent grain orientation and uniform structure, which can be drawn into target diameter silver-coated bonding copper wires through subsequent drawing. Compared with the existing continuous casting process and electroplating process, the production preparation efficiency is high and the environmental pollution is small.
[0044] Further, preferably, during normal use, the blank mold 6 is placed on a horizontal plane, and both the height direction and the depth direction of the mold cavity 61 extend along the vertical direction, and the top of the mold cavity 61 is formed with an opening communicating with the outside, which will be described below as an example, of course, the placement direction of each component can be designed according to actual needs.
[0045] Further, preferably, the diameter of the copper rod 3 is 10-12 mm, and the length is 20-25 cm; the mold cavity 61 is cylindrical, and the diameter is 8-10 mm and the depth is 20-25 cm, and the diameter of the mold cavity 61 is slightly larger than the diameter of the copper rod 3, for example, the mold cavity 61 and the copper rod 3 are matched with a gap of 1-2 mm in diameter, of course, not limited to the above-mentioned size, but can be designed according to actual needs.
[0046] Further, preferably, the directional solidification preparation device of the bonding wire blank includes a temperature detection member built in the blank mold 6, and the temperature detection member includes a top thermocouple 62 and a bottom thermocouple 63.
[0047] Based on the above-described structure, during directional solidification, when forming a single crystal copper rod, the solid-liquid interface front temperature gradient is kept greater than or equal to 5-8 ℃ / mm by water cooling and lowering the blank mold 6, to ensure obtaining a rod billet with uniform structure.
[0048] In this embodiment, preferably, the lifting mechanism 1 includes a first driving device, a first gear, a first rack, a first support member and a second support member (not shown in the figure); wherein the fixed end of the first driving device is fixed to the first support member, and the driving end of the first driving device is connected with the first gear;
[0049] The first rack and the top clamping device 2 are both arranged on the second support member, and the first rack is engaged with the first gear; the second support member is slidingly connected with the first support member.
[0050] According to the structure described above, the first driving device drives the first gear to rotate, the first gear drives the first rack to move, and then drives the second support member and the top clamping device 2 and the copper rod 3 to lift, and the second support member is in sliding connection with the first support member, which has the effect of supporting and guiding the second support member, so that the second support member and the top clamping device 2 are more stable during movement.
[0051] Further, preferably, the first driving device is an electric motor.
[0052] Further, preferably, the first support member and the second support member are both brackets, of course, not limited to this, they can also be plates or columns and the like.
[0053] It should be noted that the structure of the lifting mechanism 1 is not limited to the above, and devices such as linear modules in the prior art can also be used.
[0054] In this embodiment, preferably, as shown in Figure 1 along the depth direction of the mold cavity 61, the water-cooled base 7 is arranged at the bottom end of the blank mold 6, and the water-cooled base 7 has a cooling flow channel, and a water inlet 71 and a water outlet 72 connected with the cooling flow channel, and the cooling liquid can be introduced into the cooling flow channel through the water inlet 71, the cooling liquid flows along the cooling flow channel, and finally flows out from the water outlet 72.
[0055] According to the structure described above, since the lifting platform 8 is lowered from top to bottom, the water-cooled base 7 is arranged at the bottom of the blank mold 6, and the molten metal in the mold cavity 61 can be directionally cooled from bottom to top.
[0056] Further, preferably, the top of the water-cooled base 7 in the height direction thereof is formed with a groove, and the blank mold 6 is installed in the groove, which has the effect of fixing and limiting the blank mold 6 to avoid displacement, of course, not limited to this, the structure of the water-cooled base 7 is not limited to the above, it can also be a flat plate structure, and a cooling flow channel, a water inlet 71 and a water outlet 72 connected with the cooling flow channel are arranged inside.
[0057] Further, preferably, the cooling flow channel is located below the bottom of the blank mold 6, has one number and extends in a bent shape, which can increase the heat exchange area and improve the cooling effect, of course, not limited to this, the number of cooling flow channels is multiple and located at the bottom of the blank mold 6.
[0058] Further, preferably, the water-cooled base 7 can be used with a water-cooled machine to adjust the circulating temperature of the cooling medium.
[0059] It should be noted that when the device is used to prepare the bonding copper wire rod blank with a silver layer, the uncoated portions at both ends can be cut off, that is, the excess material is cut off.
[0060] In this embodiment, preferably, as shown in Figure 1 The second driving device is fixed to the third support member at a fixed end, and the second driving device is engaged with the second gear at a strip. The fourth support member is in sliding connection with the third support member at a driving end and is connected with the second gear. The second rack is fixed to the fourth support member and is engaged with the second gear. The water-cooled base 7 is arranged on the fourth support member.
[0061] According to the above-described structure, the second driving device drives the second gear to rotate, the second gear drives the second rack to move, thereby driving the fourth support member, the water-cooled base 7 and the blank mold 6 to lift and lower, thereby changing the insertion depth of the copper bar 3 in the liquid in the mold cavity 61, and the fourth support member is in sliding connection with the third support member, which has the effect of supporting and guiding the fourth support member, so that the fourth support member, the water-cooled base 7 and the blank mold 6 are more stable during lifting and lowering.
[0062] Further, preferably, the second driving device is a motor.
[0063] Further, preferably, the third support member and the fourth support member are both supports, of course, not limited thereto, and can also be plates or columns and the like.
[0064] Further, preferably, under the driving of the lifting platform 8, the moving speed of the blank mold 6 can be in the range of 0.02m / s-0.05m / s, of course, not limited thereto, and can also be designed according to actual needs.
[0065] It should be noted that the structure of the lifting platform 8 is not limited to the above, and other structures can also be used, for example: the lifting platform 8 comprises a base, a telescopic rod and a support platform; wherein the fixed end of the telescopic rod is connected with the base, the driving end of the telescopic rod is connected with the support platform, and the water-cooled base 7 is arranged on the support platform.
[0066] In this embodiment, preferably, as shown in Figure 1 The intermediate frequency heating coil 5 is arranged around the outer periphery of the blank mold 6, which increases the heating area and improves the heating effect.
[0067] Further, preferably, the intermediate frequency heating coil 5 is an induction heating coil and is arranged in a spiral upward manner around the outer periphery of the blank mold 6, of course, not limited thereto, and the structure can also be a single ring coil, or the intermediate frequency heating coil 5 is a plurality of single ring coils, and is arranged in sequence from bottom to top along the depth direction of the mold cavity 61, and is provided with a support.
[0068] Of course, the structure of the heating device is not limited to the above, and can also be a heating pipe, the number of which is multiple, and which is sequentially arranged around the outer periphery of the blank mold 6, which is specifically selected according to actual needs.
[0069] In summary, the directional solidification preparation device for bonding wire blank provided by the application has the following structure and advantages:
[0070] The device comprises a blank mold 6, a top clamping device 2, a medium-frequency heating coil 5, a lifting mechanism 1, a temperature measurement system, a water-cooled base 7, and a lifting platform 8; wherein the blank mold 6 is formed with a mold cavity and an opening communicating with the mold cavity;
[0071] The medium-frequency heating coil 5 is uniformly wound outside the blank mold 6, and the caliber is matched with the caliber of the blank mold 6.
[0072] The top clamping device 2 is connected with the lifting mechanism 1 and located above the blank mold 6, used for clamping the round bar copper core to fix it in the vertical direction, and the axis corresponds to the center axis of the blank mold 6, and the copper core is controlled to move along the depth direction of the mold cavity of the blank mold 6 by the lifting mechanism 1.
[0073] The water-cooled base 7 is located at the bottom of the blank mold 6 and in contact with it, and provides a cold source for the directional solidification device by controlling the water temperature in the cooling pipe, and cooperates with the medium-frequency heating coil 5 and the lifting platform 8 to control the directional solidification temperature gradient.
[0074] The lifting platform 8 is located at the bottom of the water-cooled base 7, and controls the heating position of the blank mold 6 in the medium-frequency heating coil 5 by vertical lifting displacement and speed.
[0075] The temperature measurement system comprises a top thermocouple 62 and a bottom thermocouple 63, which are built into the blank mold 6, used for providing real-time temperature measurement results of the top and bottom of the blank mold 6, assisting in adjusting the power of the medium-frequency heating coil 5 and controlling the lifting speed of the lifting platform 8 of the water-cooled base 7.
[0076] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the application, but not to limit them; although the application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the application.
Claims
1. A directional solidification production apparatus for bonding a wire blank, characterized by, The device comprises a lifting mechanism, a top clamping device, a heating device, a blank mold, a water-cooled base and a lifting platform. The blank mold is formed with a mold cavity capable of accommodating plated metal. The heating device is used to heat the blank mold so that the plated metal in the mold cavity melts to form plated metal liquid. The top clamping device is connected with the lifting mechanism, and is used to clamp a metal rod. The lifting mechanism is used to drive the metal rod to move along the depth direction of the mold cavity so that the metal rod is immersed in the plated metal liquid and a metal composite rod with the surface plated with metal liquid is formed. The water-cooled base is arranged on the lifting platform, and the blank mold is arranged on the water-cooled base. The lifting platform is used to drive the water-cooled base together with the blank mold to lift. The water-cooled base is used to cool the blank mold so that a temperature gradient is formed from bottom to top in the mold cavity, and the plated metal liquid on the surface of the metal composite rod is directionally solidified. The device for directionally solidifying preparation of bonded wire blank further comprises a temperature detection member which is built-in the blank mold and is used to detect the temperature of the mold cavity. The temperature detection member comprises a top thermocouple and a bottom thermocouple. The top thermocouple is built-in the top of the blank mold and is used to detect the temperature of the top of the mold cavity. The bottom thermocouple is built-in the bottom of the blank mold and is used to detect the temperature of the bottom of the mold cavity. The heating device comprises a medium-frequency heating device and a medium-frequency heating coil. The medium-frequency heating device is electrically connected with the medium-frequency heating coil. The medium-frequency heating coil is arranged around the outer periphery of the blank mold along a direction perpendicular to the depth direction of the mold cavity. The water-cooled base is formed with a cooling flow channel, and a water inlet and a water outlet which are in communication with the cooling flow channel.
2. A directional solidification production apparatus for bonding wire blanks according to claim 1, characterized in that The device for directionally solidifying preparation of bonded wire blank further comprises a water inlet valve and a water outlet valve. The water inlet valve is arranged at the water inlet, and the water outlet valve is arranged at the water outlet.
3. A directional solidification apparatus for the preparation of bonded wire blanks according to claim 2, characterized in that The water-cooled base is formed with a groove, and the blank mold is installed in the groove.
4. The apparatus for directional solidification preparation of bonded wire blanks according to claim 1, wherein, The lifting mechanism comprises a first driving device, a first gear, a first rack, a first support member and a second support member. The fixed end of the first driving device is fixed to the first support member, and the driving end of the first driving device is connected with the first gear. The first rack and the top clamping device are both fixed to the second support member, and the first rack is engaged with the first gear. The second support member is slidingly connected with the first support member.
5. The apparatus for directional solidification preparation of bonded wire blanks according to claim 1, wherein, 6. A directional solidification apparatus for the preparation of bonded wire blanks according to claim 5, characterized in that 7. A directional solidification production apparatus for bonding wire blanks according to claim 6, characterized in that 8. The apparatus for directional solidification preparation of bonded wire blanks according to claim 1, wherein, 9. The directional solidification apparatus for preparing a bonded wire blank of claim 1, wherein, The lifting platform comprises a second driving device, a second gear, a second rack, a third supporting member and a fourth supporting member; wherein the fixed end of the second driving device is fixed to the third supporting member, the driving end of the second driving device is connected with the second gear; the second rack is fixed to the fourth supporting member, and the second rack is engaged with the second gear; the fourth supporting member is slidingly connected with the third supporting member; the water-cooled base is arranged on the fourth supporting member; and / or The lifting platform comprises a base, an extension rod and a supporting platform; wherein the fixed end of the extension rod is connected with the base, the driving end of the extension rod is connected with the supporting platform, and the water-cooled base is arranged on the supporting platform.
10. A directional solidification production apparatus of bonded wire blanks according to any one of claims 1 to 9, characterized in that, The height direction of the blank mold is the same as the depth direction of the mold cavity, and along the height direction of the blank mold, the water-cooled base is arranged at the bottom of the blank mold, and the lifting platform is arranged at the bottom of the water-cooled base; and / or The heating device is arranged on the outer side of the blank mold.