Cleaning device and semiconductor equipment

By designing a cleaning device that uses gas to drive the support component to rotate, the cleaning process is automated, solving the problem of low efficiency in existing manual cleaning, improving cleaning efficiency, reducing costs, and avoiding product yield loss.

CN223811351UActive Publication Date: 2026-01-20VERTILITE CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202520167963.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-24
Publication Date
2026-01-20
Estimated Expiration
2035-01-24

AI Technical Summary

Technical Problem

Existing manual cleaning methods are time-consuming, inefficient, and ineffective, resulting in a loss of product yield.

Method used

A cleaning device is designed, which uses a first air inlet, a second air inlet, and an exhaust port to drive the support component to rotate, thereby simultaneously cleaning the part to be cleaned. Impurities and particles are discharged through the exhaust port, achieving automated cleaning.

Benefits of technology

It improved cleaning efficiency, reduced labor costs, improved cleaning results, and avoided product yield loss.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223811351U_ABST
    Figure CN223811351U_ABST
Patent Text Reader

Abstract

The utility model belongs to the technical field of MOCVD (Metal Organic Chemical Vapor Deposition) epitaxial wafer production, and discloses a cleaning device and semiconductor equipment. The cleaning device comprises a base, an upper cover and a bearing part, a first air inlet is formed in the side wall of the base, the upper cover is rotationally connected with the base, the upper cover can be arranged on the base in a sealing and covering mode, a containing space is defined by the upper cover and the base, a second air inlet and an exhaust port are formed in the top face of the upper cover, and the bearing part is rotationally installed on the base and contained in the containing space. The first air inlet directly faces the side face of the bearing piece, and the bearing piece is used for bearing a to-be-cleaned piece. Through the arrangement of the first air inlet, the second air inlet and the exhaust port, blowing and cleaning of the to-be-cleaned part are synchronously completed under rotation of the to-be-cleaned part, meanwhile, blown impurities are discharged from the exhaust port, the cleaning efficiency of the to-be-cleaned part is improved, the labor cost is reduced, the cleaning effect is improved, and then the product yield loss is avoided. The semiconductor equipment provided by the utility model comprises the cleaning device.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to MOCVD epitaxial wafer production technical field especially relates to a cleaning device and semiconductor equipment. BACKGROUND

[0002] Metal Organic Chemical Vapor Deposition (MOCVD) or Metal Organic Vapor Phase Epitaxy (MOVPE) is a new technology that uses H2 gas as a carrier gas to send the reaction material in the form of gas molecules to the reaction chamber for thermal decomposition to form a compound semiconductor. It is easy to change the composition and doping concentration of the compound by controlling the gas flow, and the equipment used is relatively simple, the growth speed is fast, the cycle is short, and batch production is possible. It has been applied and valued in semiconductor device technology.

[0003] After the epitaxial process is completed, the small tray tray carrying the epitaxial wafer is transferred out to the wafer loading chamber by the robot. During the epitaxial process, coating material is generated, and the epitaxial wafer is prone to warping, which can cause small particles of coating material on the small tray tray. If these particles are not removed, it can cause the newly placed epitaxial wafer to slide and cause backside scratches, or the small particles can jam the small tray, causing the small tray to not rotate, which can cause yield loss and cause the epitaxial wafer to be scrapped.

[0004] Currently, the small tray is usually cleaned manually. Before cleaning, the workers need to be trained and actually operate to increase their proficiency. This cleaning method wastes time and increases labor consumption. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a cleaning device and semiconductor equipment, which can solve the problem of time waste, low cleaning efficiency and poor cleaning effect of the existing manual cleaning method. The cleaning device and semiconductor equipment can automatically clean the parts to be cleaned, effectively improve the cleaning efficiency, reduce the labor cost, improve the cleaning effect, and avoid product yield loss.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A cleaning device comprises:

[0008] The side wall of the base is provided with a first air inlet;

[0009] An upper cover is rotatably connected with the base, and can be tightly capped on the base to form a containing space together with the base. A top surface of the upper cover is provided with a second air inlet and an air outlet.

[0010] A supporting member is rotatably installed in the base and accommodated in the containing space. The first air inlet is arranged opposite to a side surface of the supporting member. The supporting member is used for supporting the cleaning object.

[0011] In some possible embodiments, the supporting member is rotatably installed in a rotating shaft bearing seat arranged on the base through a rotating shaft. The supporting member is arranged as a rotating wheel. A side surface of the rotating wheel is concavely provided with a plurality of uniformly distributed sector-shaped recesses.

[0012] In some possible embodiments, a circumferential edge of the rotating wheel is convexly provided with a limiting protrusion. The limiting protrusion is used for limiting the cleaning object.

[0013] In some possible embodiments, the base is provided with a first recess. The supporting member is installed in the first recess. The upper cover is provided with a second recess. The first recess and the second recess form the containing space together. A bottom surface of the upper cover is provided with a clamping protrusion part which can be inserted into the first recess and tightly fitted to a side wall of the first recess.

[0014] In some possible embodiments, an axial direction of the second air inlet is arranged at an angle with respect to a supporting surface of the supporting member.

[0015] In some possible embodiments, the cleaning device further comprises a first adapter block which is detachably installed on the top surface of the upper cover. The first adapter block is provided with a blowing port which is in communication with the second air inlet. The first adapter block is used for being connected with an external air supply device.

[0016] In some possible embodiments, the cleaning device further comprises a second adapter block which is detachably installed on the top surface of the upper cover. The second adapter block is provided with a vacuum cleaner interface which is in communication with the air outlet. The second adapter block is used for being connected with an external vacuum cleaner.

[0017] In some possible embodiments, the upper cover is further provided with an observation window. The observation window is used for observing a cleaning progress of the cleaning object.

[0018] In some possible embodiments, the cleaning device further comprises an elastic buckle. The elastic buckle is installed on a circumferential side of the upper cover. After the upper cover is tightly capped on the base, a bottom end of the elastic buckle can be tightly fitted to a circumferential side of the base.

[0019] A semiconductor device comprises the cleaning device according to any one of the above-mentioned embodiments.

[0020] The utility model discloses a cleaning device, through setting first air inlet, second air inlet and exhaust port, when using, the piece of waiting for cleaning is supported in the supporting part, and the gas is passed into the containing space through the first air inlet, and under the impetus of this way gas, the supporting part rotates, and the supporting part drives the piece of waiting for cleaning to rotate, the gas is passed into the containing space through the second air inlet, and this way gas sweeps the surface of the piece of waiting for cleaning, simultaneously, the impurity particle of sweeping is discharged containing space through the exhaust port.

[0021] The utility model discloses a semiconductor equipment, including above -mentioned cleaning device, through using above -mentioned cleaning device, this semiconductor equipment can effectively avoid product yield loss. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is the overhead view of the cleaning device provided by the utility model embodiment;

[0023] Figure 2 It is Figure 1 Sectional view at A-A in

[0024] Figure 3 It is the cross section view of the cleaning device provided by the utility model embodiment;

[0025] Figure 4 It is the overhead view of the base and the rotating wheel assembly provided by the utility model embodiment.

[0026] In the drawing,

[0027] 10, cleaning device;20, the piece of waiting for cleaning;30, epitaxial wafer;

[0028] 100, base;110, first air inlet;120, first recess;200, upper cover;210, second air inlet;220, exhaust port;230, second recess;240, clamping protruding portion;300, rotating wheel;310, fan-shaped recess;320, limiting protrusion;400, rotating bearing seat;500, threaded part;600, first adapter block;610, sweeping port;700, second adapter block;710, dust collector interface;800, observation window;900, elastic buckle;1000, sealing gasket. DETAILED DESCRIPTION

[0029] The utility model will be described in further detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are merely intended to explain the utility model and not to limit the utility model. In addition, it should be noted that only the parts related to the utility model are shown in the drawings for ease of description, not all the structures.

[0030] In the description of the utility model, unless explicitly defined and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0031] In the utility model, unless explicitly defined and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0032] In the description of the embodiment, the terms "up", "down", "right", etc. orientation or position relationship is based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" are only used to distinguish in description and have no special meaning.

[0033] The embodiment provides a cleaning device and semiconductor equipment, and aims to solve the problems of time waste, low cleaning efficiency and poor cleaning effect of the existing manual cleaning mode. The cleaning device and semiconductor equipment can realize automatic cleaning of the cleaning piece, effectively improve the cleaning efficiency, reduce the labor cost, improve the cleaning effect, and avoid product yield loss. The embodiment takes a graphite small disc as an example to describe the cleaning device in detail.

[0034] As Figures 1 to 4As shown, the cleaning device 10 comprises a base 100, an upper cover 200 and a supporting member. The upper cover 200 and the supporting member can be made of aluminum, and the base 100 can be made of stainless steel. The sidewall of the base 100 is provided with a first air inlet 110. The upper cover 200 is rotationally connected with the base 100. The upper cover 200 can be tightly arranged on the base 100 and forms a containing space together with the base 100. The top surface of the upper cover 200 is provided with a second air inlet 210 and an air outlet 220. As preferred, a sealing gasket 1000 is arranged between the upper cover 200 and the base 100. The sealing gasket 1000 is arranged on the top surface of the base 100. The second air inlet 210 and the air outlet 220 can be provided with multiple ones. For example, the second air inlet 210 is provided with four ones, and the air outlet 220 is provided with three ones. Alternatively, other numbers can be provided according to the needs. In addition, the diameter of the air outlet 220 is preferably 20 mm. The supporting member is rotationally arranged on the base 100 and is contained in the containing space. The first air inlet 110 is arranged opposite to the side surface of the supporting member. The supporting member is used for supporting the cleaning object 20.

[0035] The cleaning device 10 described above is provided with the first air inlet 110, the second air inlet 210 and the air outlet 220. When in use, after the cleaning object 20 is supported by the supporting member, the gas is introduced into the containing space through the first air inlet 110. Under the pushing of the gas, the supporting member rotates, and the supporting member drives the cleaning object 20 to rotate. The gas is introduced into the containing space through the second air inlet 210, and the gas blows the surface of the cleaning object 20. At the same time, the impurity particles blown are discharged from the containing space through the air outlet 220. That is, under the rotation of the cleaning object 20, the blowing and cleaning of the cleaning object 20 are simultaneously completed. At the same time, the impurities blown are discharged from the air outlet 220 without manual cleaning, which improves the cleaning efficiency of the cleaning object 20, reduces the labor cost, improves the cleaning effect, and further avoids the loss of product yield. When the cleaning object 20 is a graphite small disc, the gas can be nitrogen, and the nitrogen pressure is 2 bar.

[0036] Alternatively, the supporting member is rotationally arranged in the rotating bearing seat 400 arranged on the base 100 through a rotating shaft. The supporting member is provided as a rotating wheel 300. The side surface of the rotating wheel 300 is concavely provided with multiple fan-shaped recesses 310 which are uniformly distributed. In the initial position, the first air inlet 110 is preferably opposite to the sidewall of the fan-shaped recess 310, which is beneficial to rapidly pushing the rotating wheel 300 to rotate by the gas introduced from the first air inlet 110. Alternatively, a stainless steel quick connector can be used at the first air inlet 110 to connect with a gas supply assembly. In actual processing, the material of the rotating bearing seat 400 can be stainless steel.

[0037] Further, the periphery of the rotating wheel 300 is provided with a limiting protrusion 320 for limiting the displacement of the cleaning object 20. The graphite small disc in the embodiment can be provided with a disc structure for fixing the epitaxial wafer 30. Alternatively, the graphite small disc can be provided with a suction disc structure for adsorbing and fixing the epitaxial wafer 30. For example, the graphite small disc can be made of silicon carbide, which has high heat resistance and corrosion resistance and can withstand the deposition environment.

[0038] In the embodiment, the base 100 is provided with a first groove 120, the supporting member is installed in the first groove 120, the upper cover 200 is provided with a second groove 230, the first groove 120 and the second groove 230 jointly form a containing space, and the bottom surface of the upper cover 200 is provided with a clamping protrusion 240 which can be inserted into the first groove 120 and abut against the side wall of the first groove 120. This arrangement can protect the supporting member from other components in the external environment, thereby improving the safety in use. The bottom surface of the upper cover 200 is provided with the clamping protrusion 240 which can be inserted into the first groove 120. After the upper cover 200 is installed on the base 100, the clamping protrusion 240 is inserted into the first groove 120 and abuts against the side wall of the first groove 120, thereby avoiding the relative displacement between the upper cover 200 and the base 100 and improving the stability of the cover. Preferably, the distance between the upper surface of the graphite small disc and the bottom surface of the second groove 230 is 10.5-11.5 mm, and more preferably 11 mm.

[0039] Preferably, the axis of the second air inlet 210 is arranged at an angle to the supporting surface of the supporting member. This arrangement can make the gas entering the containing space from the second air inlet 210 directly blow against the surface of the cleaning object 20, thereby improving the cleaning efficiency. For example, the axis of the second air inlet 210 can be arranged at an angle of 60 degrees to the supporting surface of the supporting member. In other embodiments, the axis of the second air inlet 210 can be arranged at other angles, such as 45 degrees or 30 degrees, to the supporting surface of the supporting member, which can be set as required.

[0040] Optionally, the cleaning device 10 further comprises a first adapter block 600 detachably mounted on the top surface of the upper cover 200, the first adapter block 600 is provided with a purge port 610 in communication with the second air inlet 210, the first adapter block 600 is used to be connected with an external air supply device, so as to facilitate quick assembly of the upper cover 200 and the external air supply device, and improve the disassembly convenience. Optionally, the cleaning device 10 further comprises a second adapter block 700 detachably mounted on the top surface of the upper cover 200, the second adapter block 700 is provided with a dust collector interface 710 in communication with the air outlet 220, the second adapter block 700 is used to be connected with an external dust collector, so as to facilitate quick assembly of the upper cover 200 and the dust collector, and improve the disassembly convenience. As a preferred, the first adapter block 600 and the second adapter block 700 are connected with the upper cover 200 through threaded fasteners 500 (such as screws), so as to facilitate disassembly. Optionally, the thickness of the first adapter block 600 and the second adapter block 700 can be set to 28mm-32mm, preferably 30mm; the diameter of the purge port 610 is preferably 6mm, and the diameter of the dust collector interface 710 is preferably 30mm; when the dust collector sucks impurities, the suction force of the dust collector is 10m 3 / h.

[0041] Continuing to refer to Figure 3 The upper cover 200 is further provided with an observation window 800, the observation window 800 is used to observe the cleaning progress of the to-be-cleaned member 20, so as to facilitate the staff to make corresponding actions according to the cleaning progress, such as increasing the ventilation amount or increasing the air suction speed of the air outlet 220, etc.

[0042] As a preferred, the cleaning device 10 further comprises an elastic buckle 900, the elastic buckle 900 is mounted on the circumferential side of the upper cover 200, after the upper cover 200 is sealed and covered on the base 100, the bottom end of the elastic buckle 900 can be tightly fitted on the circumferential side of the base 100. This kind of setting can effectively avoid the gap between the upper cover 200 and the base 100, so that the covering process is stable and reliable. Optionally, the material of the elastic buckle 900 can be selected from stainless steel.

[0043] In this embodiment, the upper cover 200 and the base 100 are both provided in a circular structure, and the elastic buckle 900 is provided in an annular structure, which is sleeved on the circumferential side of the upper cover 200, the diameter of the upper cover 200 and the base 100 is 190mm-194mm, preferably 192mm, the outer diameter of the elastic buckle 900 is set to 218mm-222mm, preferably 220mm; the thickness of the upper cover 200 is set to 8mm-12mm, preferably 10mm; after the upper cover 200 is covered on the base 100, the overall thickness can be set to 54.6-58.6mm, preferably 56.6mm.

[0044] Optionally, the upper cover 200 and the base 100 are rotationally connected by a hinge structure or a hinge structure, which belongs to the mature technology in the related field, and the embodiment will not be described here.

[0045] As preferred, the base 100 can be provided with an inclined baffle for supporting the upper cover 200, and after the upper cover 200 is opened, the upper cover 200 can be abutted to the inclined baffle to avoid bumping.

[0046] Taking the graphite small disc as an example, the use process of the cleaning device 10 includes:

[0047] S1, placing the epitaxial wafer 30 in the storage area of the graphite small disc to be grown, and transferring the graphite small disc to the reaction chamber by the transmission system;

[0048] S2, transmitting the reaction material to the upper side of the graphite small disc by the MOCVD gas delivery system to occur chemical reaction, so as to form a deposition film on the epitaxial wafer 30;

[0049] S3, after the film growth is completed, the graphite small disc is transferred out of the reaction chamber by the mechanical hand, and the epitaxial wafer 30 is taken out;

[0050] S4, placing the graphite small disc on the supporting piece of the cleaning device 10 by the suction cup;

[0051] S5, introducing nitrogen into the containing space through the first gas inlet 110, under the push of the nitrogen, the supporting piece rotates, and the supporting piece drives the graphite small disc to rotate; nitrogen is introduced into the containing space through the second gas inlet 210, the nitrogen blows the surface of the graphite small disc; at the same time, the dust collector blows out the impurity particles in the containing space through the exhaust port 220;

[0052] Optionally, the rotating speed of the supporting piece is 10-30 r / min; during the blowing, the supporting piece can rotate clockwise for 1 minute, and then rotate counterclockwise for 1 minute, and the rotation is repeated for three times; the suction force of the dust collector can be set to 10 m 3 / h; the pressure of the nitrogen is 2 bar.

[0053] S6, after the cleaning is completed, the graphite small disc is adsorbed and placed in the reaction chamber by the suction cup, and a new epitaxial wafer 30 is placed for epitaxial process growth.

[0054] The semiconductor equipment provided in the embodiment includes the cleaning device 10, and by using the cleaning device 10, the semiconductor equipment can effectively avoid the loss of product yield.

[0055] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, various obvious changes, re-adjustments and replacements can be made without departing from the protection scope of the present application. Here, it is not necessary and also impossible to enumerate all the implementation modes. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application claim.

Claims

1. A cleaning device, characterized in that, The cleaning device comprises: a base (100), a side wall of the base (100) is provided with a first air inlet (110); an upper cover (200), rotationally connected with the base (100), the upper cover (200) can be tightly covered on the base (100) and forms a containing space together with the base (100), a top surface of the upper cover (200) is provided with a second air inlet (210) and an air outlet (220); a supporting member, rotationally installed in the base (100) and contained in the containing space, the first air inlet (110) is arranged opposite to a side surface of the supporting member, and the supporting member is used for supporting a to-be-cleaned member (20).

2. The cleaning device of claim 1, wherein, The supporting member is rotationally installed in a rotating shaft bearing seat (400) arranged on the base (100) through a rotating shaft, the supporting member is arranged as a rotating wheel (300), and a side surface of the rotating wheel (300) is concavely provided with a plurality of uniformly distributed sector-shaped recesses (310).

3. The cleaning device of claim 2, wherein, A limiting protrusion (320) is convexly arranged on a peripheral edge of the rotating wheel (300), and the limiting protrusion (320) is used for limiting the to-be-cleaned member (20).

4. The cleaning device of claim 1, wherein, The base (100) has a first recess (120), the supporting member is installed in the first recess (120), the upper cover (200) has a second recess (230), and the first recess (120) and the second recess (230) form the containing space together, and a bottom surface of the upper cover (200) is provided with a clamping protrusion (240) which can be inserted into the first recess (120) and abut against a side wall of the first recess (120).

5. The cleaning device of claim 1, wherein, An axial direction of the second air inlet (210) is arranged at an angle with respect to a supporting surface of the supporting member.

6. The cleaning device of claim 1, wherein, The cleaning device further comprises a first adapter block (600) which is detachably installed on a top surface of the upper cover (200), the first adapter block (600) is provided with a blowing port (610) which is in communication with the second air inlet (210), and the first adapter block (600) is used for being connected with an external gas supply device.

7. The cleaning device of claim 1, wherein, The cleaning device further comprises a second adapter block (700) which is detachably installed on the top surface of the upper cover (200), the second adapter block (700) is provided with a dust collector interface (710) which is in communication with the air outlet (220), and the second adapter block (700) is used for being connected with an external dust collector.

8. The cleaning device of claim 1, wherein, The upper cover (200) is further provided with an observation window (800), and the observation window (800) is used for observing a cleaning progress of the to-be-cleaned member (20).

9. The cleaning device of claim 1, wherein, The cleaning device further comprises an elastic buckle (900), the elastic buckle (900) is installed on a peripheral side of the upper cover (200), after the upper cover (200) is tightly covered on the base (100), a bottom end of the elastic buckle (900) can be tightly abutted against a peripheral side of the base (100).

10. A semiconductor device, characterized by, The cleaning device comprises any one of claims 1-9.