Transfer press-fit welding mechanism and transfer press-fit welding device

Abstract

The utility model discloses a transfer press-fit welding mechanism and a transfer press-fit welding device. The transfer press-fit welding mechanism comprises a laser optical system group, a transfer head and a visual identification group, the visual identification group is arranged on the laser optical system group, and the visual identification group is used for identifying a chip position and a target position in a substrate; the transfer head is provided with a perspective area, and the perspective area allows laser of the laser optical system set to penetrate through and provides shot images for the visual recognition set. The transfer head is used for picking up the chip and pressing the chip on a target repair substrate; and the laser optical system group is arranged on the transfer head and is used for welding a chip on the substrate. When the transfer head presses the chip, the position of the perspective area is adjacent to the chip, and then laser penetrates through the perspective area to complete welding, so that the position of the chip can be kept fixed under the pressing of the transfer head even if the chip tends to deviate in the laser welding process, and the chip transfer precision can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the repair field of micro LED or other micro device, concretely relates to a transfer compression welding mechanism and transfer compression welding device. BACKGROUND

[0002] At present, in the field of micro LED new display, one of the process means for mass transfer is as follows: the solder is coated in advance on the position of the solder pad needing repair on the lower substrate, then the selective transfer equipment is used to transfer the single micro LED chip to the position needing repair, and then the welding equipment is moved to the chip to weld the transferred chip, but in this process, the chip will be offset during welding, and the position accuracy of the chip during welding cannot be guaranteed. SUMMARY

[0003] In order to overcome the defects of the prior art, the utility model provides a transfer compression welding mechanism and transfer compression welding device capable of improving the single-point transfer accuracy of the chip.

[0004] The first technical solution adopted by the utility model to solve the technical problem is:

[0005] A transfer compression welding mechanism comprises a laser optical system group, a transfer head and a visual identification group.

[0006] The visual identification group is arranged on the transfer head, and is used to identify the position of the chip and the target position in the substrate.

[0007] A perspective area is arranged on the transfer head, and the laser emitted by the laser optical system group passes through the perspective area to provide a shooting image for the visual identification group.

[0008] The transfer head is used to pick up the chip and compress the chip on the substrate.

[0009] The laser optical system group is arranged on the transfer head, and is used to weld the chip on the substrate.

[0010] The transfer compression welding mechanism described above, wherein the laser optical system group and the visual identification group are coaxially arranged.

[0011] The transfer compression welding mechanism described above further comprises a multi-dimensional adjustment group, the laser optical system group and the visual identification group are arranged on the fixed end of the multi-dimensional adjustment group, the transfer head is arranged on the output end of the multi-dimensional adjustment group, and the multi-dimensional adjustment group is used to drive the transfer head to move along the X-axis, Y-axis and Z-axis directions.

[0012] The multi-dimensional adjusting group comprises up-down adjusting platform, front-rear adjusting platform, and the like.

[0013] The fixed end of the up-down adjusting platform is connected with the visual identification group.

[0014] The output end of the up-down adjusting platform is connected with the fixed end of the front-rear adjusting platform.

[0015] The transfer head is connected with the output end of the front-rear adjusting platform.

[0016] The multi-dimensional adjusting group further comprises arc-shaped sliding platform, the output end of the front-rear adjusting platform is connected with the fixed end of the arc-shaped sliding platform, and the transfer head is arranged on the output end of the arc-shaped sliding platform.

[0017] The multi-dimensional adjusting group further comprises rotary driving member.

[0018] The output end of the up-down adjusting platform is connected with the fixed end of the rotary driving member.

[0019] The output end of the rotary driving member is connected with the fixed end of the front-rear adjusting platform.

[0020] The multi-dimensional adjusting group further comprises arc-shaped sliding platform, the output end of the front-rear adjusting platform is connected with the fixed end of the arc-shaped sliding platform, and the transfer head is arranged on the output end of the arc-shaped sliding platform.

[0021] The transfer pressure welding mechanism further comprises pressure sensor, and the pressure sensor is arranged on the arc-shaped sliding platform.

[0022] The transfer pressure welding mechanism further comprises connecting seat, the connecting seat is arranged between the transfer head and the laser optical system group and the visual identification group, the connecting seat is provided with pressure sensor, and the pressure sensor is used for detecting the pressure applied by the transfer head to the chip.

[0023] The transfer head is provided with temperature sensor on one side, and the temperature sensor is used for detecting the temperature of the chip during welding.

[0024] The second technical scheme adopted by the utility model to solve the technical problems is:

[0025] The transfer pressure welding device comprises the transfer pressure welding mechanism and lifting driving member, the transfer pressure welding mechanism is arranged on the output end of the lifting driving member, and the lifting driving member is used for driving the transfer pressure welding mechanism to lift along the Z-axis direction.

[0026] The utility model discloses the beneficial effect is:

[0027] Meanwhile, the visual identification group identifies the chip position through the perspective area, at this time, the transfer head and the perspective area are adjacent to the chip, and the transfer head grabs the chip, when the visual identification group identifies the chip vacancy on the substrate through the perspective, after the transfer head places the chip on the substrate, the transfer head carries out the compression operation, at this time, the position of the transfer head is fixed relative to the chip, the laser optical system group is started, and the laser acts on the chip through the perspective area, thereby welding the chip on the substrate. When the transfer head compresses the chip, the position of the perspective area is adjacent to the chip, and then the laser passes through the perspective area to complete welding, therefore, even in the process of laser welding, even if the chip has a tendency of deviation, the chip will keep the position fixed under the compression of the transfer head, and therefore the chip transfer precision can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0028] The utility model is further illustrated below in connection with the drawings and examples.

[0029] Figure 1 It is one of the perspective structure schematic diagram of transfer compression welding device;

[0030] Figure 2 It is one of the front view of transfer compression welding device;

[0031] Figure 3 It is the second perspective structure schematic diagram of transfer compression welding device;

[0032] Figure 4 It is the second front view of transfer compression welding device;

[0033] The signs are as follows:

[0034] 100-transfer compression welding mechanism;1-laser optical system group;2-transfer head;3-visual identification group;41-multidimensional adjustment group;411-rotary drive part;412-up and down adjustment platform;413-forward and backward adjustment platform;414-arc slide;5-pressure sensor;6-temperature sensor;7-connection seat;

[0035] 200-lifting drive part. DETAILED DESCRIPTION

[0036] The concept, specific structure and generated technical effects of the present application will be clearly and completely described below in combination with the embodiments and drawings, so as to fully understand the purposes, features and effects of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments, and other embodiments obtained by those skilled in the art without creative labor based on the embodiments of the present application all belong to the scope of protection of the present application. In addition, all the coupling / connection relationships involved in the patent do not mean that the components are directly connected, but that a better coupling structure can be composed by adding or reducing coupling auxiliary components according to the specific implementation situation. The various technical features in the present application can be interactively combined without mutual contradiction and conflict.

[0037] In the prior art, a selective transfer device is used to transfer a single Micro LED chip to a position requiring repair, and then a welding device is moved to the chip to weld the transferred chip. During the movement of the welding device, slight shaking may occur, causing the position of the un-welded Micro LED chip to shift, or local force may be generated during laser welding, causing the Micro LED chip to shift during welding. In order to solve the above technical problems, the present application provides the following embodiments:

[0038] Embodiment one:

[0039] With reference to Figures 1-4 The present embodiment provides a transfer compression welding mechanism, which comprises: a laser optical system group 1, a transfer head 2 and a visual identification group 3; the visual identification group 3 is arranged on the transfer head 2, and the visual identification group is used to identify the chip position and the target position in the substrate; the transfer head 2 is provided with a perspective area, the perspective area is used for the laser emitted by the laser optical system group 1 to pass through, and provides a shooting image for the visual identification group 3; the transfer head 2 is used to pick up the chip and compress the chip on the substrate; the laser optical system group 1 is arranged on the transfer head 2, and the laser optical system group 1 is used to weld the chip on the substrate.

[0040] In use, the target position of the substrate is coated with solder, the visual recognition group 3 recognizes the chip position through the perspective area, at this time, the transfer head 2 and the perspective area are adjacent to the chip, the transfer head 2 picks up the chip, when the visual recognition group 3 recognizes the chip vacancy position on the substrate through the perspective, the transfer head 2 places the chip on the substrate, the transfer head 2 performs the pressing operation, at this time, the position of the transfer head 2 relative to the chip is fixed, the laser optical system group 1 is started, and the laser acts on the chip through the perspective area, so as to weld the chip on the substrate. When the transfer head 2 presses the chip, the position of the perspective area is adjacent to the chip, and then the laser passes through the perspective area, and after the solder is melted and solidified, the welding is completed. Therefore, even during the laser welding process, even if the chip has a tendency to shift, the chip will remain fixed in position under the pressing of the transfer head 2, so as to improve the chip transfer accuracy.

[0041] In the laser optical system group 1, a near-infrared laser is used, the spot is a flat-top light, and the spot size can be continuously adjusted in the range of 10*10um-58*58um, which can cope with different sizes of chips.

[0042] Embodiment two:

[0043] With reference to Figures 1-4 , this embodiment is further improved on the basis of embodiment one, the laser optical system group 1 and the visual recognition group 3 are coaxially arranged. It can not only align the picked chip, but also monitor the state of the picked material of the transfer head 2 in real time, and press after placing the chip after picking up the chip by the transfer head 2, to prevent displacement of the chip during welding.

[0044] Embodiment three:

[0045] With reference to Figures 1-2 , on the basis of embodiment two, further development is made, which further comprises a multi-dimensional adjustment group 41, the laser optical system group 1 and the visual recognition group 3 are arranged on the fixed end of the multi-dimensional adjustment group 41, and the transfer head 2 is arranged on the output end of the multi-dimensional adjustment group 41, and the multi-dimensional adjustment group 41 is used to drive the transfer head 2 to move and rotate along the X-axis, Y-axis and Z-axis directions.

[0046] The multi-dimensional adjustment group 41 can adjust the angle of the transfer head 2, indirectly adjust the angle and the coordinate position of the chip on the X-axis and Y-axis when placing the chip to the target substrate repair point, adjust the pressure when pressing the chip along the Z-axis direction, and fine-tune the rotation of the chip, so as to ensure that the position of the long and wide edges of the chip is parallel to the position of the long and wide edges of the pad, which can greatly improve the pressing position accuracy of the chip and further improve the welding yield.

[0047] Embodiment four:

[0048] With reference to Figures 1-2Further extended based on Embodiment Three, the multi-dimensional adjustment group 41 in this embodiment comprises up-down adjustment stage 412 and front-back adjustment stage 413;

[0049] The fixed end of the up-down adjustment stage 412 is connected with the visual identification group 3;

[0050] The output end of the up-down adjustment stage 412 is connected with the fixed end of the rotary driving member 411;

[0051] The transfer head 2 is connected with the output end of the front-back adjustment stage 413.

[0052] As an example, the up-down adjustment stage 412 and the front-back adjustment stage 413 are Z-axis adjustment slide stage and X-axis adjustment slide stage respectively.

[0053] Embodiment Five:

[0054] With reference to Figures 1-2 Further extended based on Embodiment Four, the multi-dimensional adjustment group 41 further comprises rotary driving member 411;

[0055] The output end of the up-down adjustment stage 412 is connected with the fixed end of the rotary driving member 411;

[0056] The output end of the rotary driving member 411 is connected with the fixed end of the front-back adjustment stage 413.

[0057] The rotary driving member 411 can drive the transfer head 2 to rotate, ensuring the alignment of the target position of the chip length and the pad, and further improving the welding yield.

[0058] Embodiment Six:

[0059] With reference to Figures 1-2 Further extended based on Embodiment Five, the multi-dimensional adjustment group 41 further comprises arc-shaped slide stage 414, the output end of the front-back adjustment stage 413 is connected with the fixed end of the arc-shaped slide stage 414, and the transfer head 2 is arranged on the output end of the arc-shaped slide stage 414. The arc-shaped slide stage 414 can drive the transfer head 2 to move in the Y-axis direction, providing a smooth and continuous movement path for the transfer head 2, reducing the vibration and impact during the movement, and improving the stability and reliability of the equipment.

[0060] Embodiment Seven:

[0061] With reference to Figure 2, in order to reduce the pressure during the process, the pressure is too large and the chip is damaged, and to prevent the displacement of the chip during the process of pressing, the embodiment is added on the basis of embodiment five, the pressure sensor 5 is arranged on the arc-shaped sliding table 414 to prevent the damage of the chip caused by the excessive pressure during the pressing process or the insufficient pressure, and the electrode of the chip is not in contact with the substrate welding.

[0062] As a further improvement of the embodiment, specifically, the pressure sensor 5 is in communication with the up-down adjusting table 412, and the pressure feedback accuracy of the pressure sensor 5 is 9.81x10 -4 N. During the laser welding process, the up-down adjusting table 412 cooperates with the pressure sensor 5 to accurately apply pressure to the chip, accurately apply the appropriate pressure value, and further improve the welding yield.

[0063] The use method of the transfer pressing and welding mechanism in the embodiment is as follows: the pressure setting value during the pressing of the chip is set, the transfer head 2 is aligned after passing through the visual recognition group 3 on the substrate, the transfer head 2 picks up the chip on the substrate, the transfer head 2 places the chip on the target position of the substrate, and the pressure sensor 5 feeds back the pressure applied to the chip by the transfer head 2 in real time during the pressing process, and feeds back the pressure value to the up-down adjusting table 412. The up-down adjusting table 412 adjusts the size of the output force according to the set value, so as to ensure that the pressure during the pressing of the chip is consistent with the pressure setting value.

[0064] Embodiment eight:

[0065] Referring to Figures 3-4 , on the basis of embodiment one to embodiment five, the transfer pressing and welding mechanism is provided with a connecting seat 7, the connecting seat 7 is arranged between the transfer head 2 and the laser optical system group 1 and the visual recognition group 3, the connecting seat 7 is provided with a pressure sensor 5, and the pressure sensor 5 is used to detect the pressure applied to the chip by the transfer head 2. In order to prevent the damage of the chip caused by the excessive pressure during the pressing process or the insufficient pressure, and the electrode of the chip is not in contact with the substrate welding.

[0066] Embodiment nine:

[0067] When the laser optical system group 1 emits laser to weld the chip, the solder on the substrate will be melted by heat. If the temperature control is not proper, the high temperature will cause damage to the substrate and the chip. In order to solve this problem, referring to Figures 1-4 , on the basis of embodiment one to embodiment eight, one side of the transfer head 2 is provided with a temperature sensor 6, and the temperature sensor 6 is used to detect the temperature of the chip during welding.

[0068] Embodiment ten:

[0069] Referring to Figures 1-4A transfer compression welding device comprises the transfer compression welding mechanism 100 as described in the above embodiment 1 to embodiment 9 and a lifting driving member 200, the transfer compression welding mechanism 100 is arranged on the output end of the lifting driving member 200, and the lifting driving member 200 is used for driving the transfer compression welding mechanism 100 to reciprocatingly lift along the Z-axis direction.

[0070] The lifting driving member 200 drives the transfer compression welding mechanism 100 to reciprocatingly lift along the Z-axis direction, drives the transfer head 2 to pick up the chip and unload the chip into the target position of the substrate, and realizes the high-precision welding repair operation at high speed and continuously.

[0071] Specifically, in the above embodiment 1 to embodiment 10, the transfer head 2 is a micro-nano pattern stamp.

[0072] The above is a specific description of the preferred embodiment of the utility model, but the utility model is not limited to the above-mentioned embodiment, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the utility model, and these equivalent modifications or replacements are all included in the range defined by the claims of the present application.

Claims

1. A transfer press bonding mechanism characterized by, It comprises a laser optical system group (1), a transfer head (2) and a visual identification group (3). The visual identification group (3) is arranged on the transfer head (2) and used for identifying the chip position and the target position in the substrate. The transfer head (2) is provided with a perspective area, the perspective area is used for the laser emitted by the laser optical system group (1) to pass through, and provides a shooting image for the visual identification group (3). The transfer head (2) is used for picking up the chip and pressing the chip on the substrate. The laser optical system group (1) is arranged on the transfer head (2) and used for welding the chip on the substrate.

2. The transfer press welding mechanism of claim 1, wherein: The laser optical system group (1) and the visual identification group (3) are coaxially arranged.

3. The transfer press welding mechanism of claim 1, wherein: It further comprises a multi-dimensional adjustment group (41), the laser optical system group (1) and the visual identification group (3) are arranged on the fixed end of the multi-dimensional adjustment group (41), the transfer head (2) is arranged on the output end of the multi-dimensional adjustment group (41), and the multi-dimensional adjustment group (41) is used to drive the transfer head (2) to move and rotate along the X-axis, Y-axis and Z-axis directions.

4. The transfer press welding mechanism of claim 3, wherein: The multi-dimensional adjustment group (41) comprises an up-down adjustment table (412) and a front-rear adjustment table (413). The fixed end of the up-down adjustment table (412) is connected with the visual identification group (3). The output end of the up-down adjustment table (412) is connected with the fixed end of the front-rear adjustment table (413). The transfer head (2) is connected with the output end of the front-rear adjustment table (413).

5. The transfer press welding mechanism of claim 4, wherein: The multi-dimensional adjustment group (41) further comprises an arc-shaped sliding table (414), the output end of the front-rear adjustment table (413) is connected with the fixed end of the arc-shaped sliding table (414), and the transfer head (2) is arranged on the output end of the arc-shaped sliding table (414).

6. The transfer press welding mechanism of claim 5, wherein: The multi-dimensional adjustment group (41) further comprises a rotary driving member (411). The output end of the up-down adjustment table (412) is connected with the fixed end of the rotary driving member (411). The output end of the rotary driving member (411) is connected with the fixed end of the front-rear adjustment table (413).

7. The transfer press welding mechanism of claim 6, wherein: It further comprises a pressure sensor (5), which is arranged on the arc-shaped sliding table (414).

8. The transfer press welding mechanism of claim 1, wherein: It further comprises a connecting seat (7), which is arranged between the transfer head (2) and the laser optical system group (1) and the visual identification group (3), and the connecting seat (7) is provided with the pressure sensor (5), which is used to detect the pressure applied by the transfer head (2) to the chip.

9. The transfer press welding mechanism according to any one of claims 1 to 8, wherein: One side of the transfer head (2) is provided with a temperature sensor (6), which is used to detect the temperature of the chip during welding.

10. A transfer press bonding apparatus characterized by: It comprises the transfer and pressing welding mechanism (100) and a lifting driving member (200), the transfer and pressing welding mechanism (100) is arranged on the output end of the lifting driving member (200), and the lifting driving member (200) is used to drive the transfer and pressing welding mechanism (100) to lift along the Z-axis direction.

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