Complete machine heat dissipation structure of projector

Abstract

The utility model discloses a complete machine heat radiation structure of a projector. The complete machine heat radiation structure comprises an optical machine heat radiation system, a light source heat radiation system and a PCB heat radiation system. The light source heat dissipation system comprises a light source machine body, and a laser heat dissipation system is arranged outside the light source machine body. A fluorescent wheel heat dissipation system is arranged in the light source machine body; the laser heat dissipation system comprises a heat pipe air cooling radiator or a water cooling radiator. The fluorescent wheel cooling system comprises a fluorescent wheel radiator; wherein the PCB heat dissipation system comprises a complete machine fan. The ray machine heat dissipation system is used for dissipating heat of ray machine elements; the light source cooling system is used for cooling the light source element; the PCB heat dissipation system is used for heat dissipation of PCB elements and the whole machine. Independent heat dissipation systems are designed for all important systems through reasonable heat dissipation layout, heat dissipation is conducted on the high-power projector by adding space structure heat dissipation devices and combining different heat dissipation modes, all important heat dissipation devices of the projector can be considered as a whole, and design requirements are met.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation structure, especially a whole machine heat dissipation structure of projector. BACKGROUND

[0002] The laser projector device generates a lot of heat during operation, the traditional whole machine heat dissipation mode is ordinary air cooling mode, and heat dissipation is carried out through increasing heat pipe radiator or other kinds of radiator and heat dissipation fan mode, the whole machine is not reasonably arranged, the heat dissipation effect is poor, the temperature of important components in the machine cannot be effectively controlled, and thus the overall operation of the machine is protected. UTILITY MODEL CONTENTS

[0003] The utility model solves the technical problem in the prior art and provides a whole machine heat dissipation structure of projector, which dissipates heat from the high-power projector through the combination of the space structure radiator and different heat dissipation modes, and takes into account all important heat dissipation devices as a whole to meet design requirements.

[0004] To solve the above technical problems, the utility model adopts the technical scheme of a whole machine heat dissipation structure of projector, which comprises a light machine heat dissipation system, a light source heat dissipation system and a PCB heat dissipation system.

[0005] The light machine heat dissipation system comprises a light machine body, a PCB and an integrated heat dissipation structure, the PCB is arranged at the bottom end of the side of the light machine body, the lower surface of the PCB is provided with a groove for placing an imaging chip.

[0006] The integrated heat dissipation structure comprises a heat-conducting cold head, a thermoelectric refrigeration sheet and a water-cooled radiator.

[0007] The heat-conducting cold head is connected to the imaging chip in a bonded manner and is used to conduct heat from the imaging chip.

[0008] The thermoelectric refrigeration sheet has two end faces, one end face is a hot face, and the other end face is a cold face.

[0009] The cold face of the thermoelectric refrigeration sheet is connected to the heat-conducting cold head in a bonded manner, and the heat-conducting cold head conducts heat to the cold face of the thermoelectric refrigeration sheet.

[0010] The water-cooled radiator is connected to the hot face of the thermoelectric refrigeration sheet in a bonded manner, and the hot face of the thermoelectric refrigeration sheet is cooled by the water-cooled radiator.

[0011] The light source heat dissipation system comprises a light source body, and the light source body is externally provided with a laser heat dissipation system; the light source body is internally provided with a fluorescent wheel heat dissipation system.

[0012] The laser heat dissipation system comprises a heat pipe air-cooled radiator or a water-cooled heat dissipation device.

[0013] The fluorescent wheel heat dissipation system comprises a fluorescent wheel radiator.

[0014] The PCB heat dissipation system comprises a whole machine fan.

[0015] Further, the heat-conducting cold head comprises a plate body and an integrally formed cold head protrusion, the plate body is provided with a sensor, the cold head protrusion is formed on a side of the plate body close to the PCB, the cold head protrusion is inserted and assembled with the groove, so that the cold head protrusion is connected with the imaging chip in a pasting mode; the heat-conducting cold head can adopt an integrally formed heat sink or a pre-embedded heat pipe heat sink.

[0016] Further, a cold face of the thermoelectric refrigeration piece is connected with a side of the plate body far away from the PCB in a pasting mode.

[0017] Further, the integrally formed heat dissipation structure further comprises a cold head fixing seat, the cold head fixing seat is a hollow frame structure, an L-shaped protrusion is formed on a side of the plate body far away from the PCB; an L-shaped groove is formed on an inner circumferential edge of the cold head fixing seat far away from the PCB; the plate body is assembled with the L-shaped groove of the cold head fixing seat in a clamping mode through the L-shaped protrusion; the thermoelectric refrigeration piece is further assembled in the inner circumferential frame of the cold head fixing seat; and the cold head fixing seat is closely assembled on the circumferential side of the heat-conducting cold head and the thermoelectric refrigeration piece.

[0018] Further, the water-cooled radiator comprises a heat dissipation cold head and a radiator water exhaust, a side of the heat dissipation cold head is connected with a hot face of the thermoelectric refrigeration piece in a pasting mode, and the other side is assembled with a water storage tank; a water inlet pipe head and a water outlet pipe head are arranged on a side of the water storage tank far away from the heat dissipation cold head; a water exhaust fan is arranged on a side of the radiator water exhaust, and the water exhaust of the radiator is connected with the water inlet pipe head of the water storage tank through a water inlet pipe arranged on the bottom surface, and the water exhaust of the radiator is connected with the water outlet pipe head of the water storage tank through a water outlet pipe arranged on the bottom surface.

[0019] Further, the outer circumferential side of the heat dissipation cold head is flush with the outer circumferential side of the cold head fixing seat; a first foam sealing layer is assembled between the heat dissipation cold head and the cold head fixing seat, the first foam sealing layer is arranged circumferentially and circumferentially, and the outer circumferential side of the first foam sealing layer is flush with the outer circumferential side of the cold head fixing seat.

[0020] Further, the PCB further comprises a PCB fixing pressing plate for pressing the PCB; the PCB fixing pressing plate is a hollow frame structure, the outer circumferential side of the PCB fixing pressing plate is flush with the outer circumferential side of the cold head fixing seat, and the inner circumferential side of the PCB fixing pressing plate is closely assembled with the outer circumferential side of the plate body of the heat-conducting cold head; a rubber pad is arranged between the PCB fixing pressing plate and the PCB, and the rubber pad is arranged circumferentially; a second foam sealing layer is arranged between the gap between the PCB fixing pressing plate and the cold head fixing seat, and the second foam sealing layer is arranged circumferentially.

[0021] Further, the light machine body is a closed cavity, the closed cavity comprises a main flow cavity and a branch flow cavity; the turbine fan A is arranged at a corner of the main flow cavity, a radiator is arranged at the low pressure side of the turbine fan A, and a prism is arranged at the high pressure side of the turbine fan A; the radiator comprises a circulation area and a heat dissipation area, the circulation area is arranged in the main flow cavity, and the heat dissipation area is arranged outside the main flow cavity and communicates with external air.

[0022] Further, the light machine body is a closed cavity, the closed cavity comprises a main flow cavity and a branch flow cavity; the turbine fan A is arranged at a corner of the main flow cavity, a radiator is arranged at the low pressure side of the turbine fan A, and a prism is arranged at the high pressure side of the turbine fan A; the radiator comprises a circulation area and a heat dissipation area, the circulation area is arranged in the main flow cavity, and the heat dissipation area is arranged outside the main flow cavity and communicates with external air.

[0023] Further, the light machine body is a closed cavity, the closed cavity comprises a main flow cavity and a branch flow cavity; the turbine fan A is arranged at a corner of the main flow cavity, a radiator is arranged at the low pressure side of the turbine fan A, and a prism is arranged at the high pressure side of the turbine fan A; the radiator comprises a circulation area and a heat dissipation area, the circulation area is arranged in the main flow cavity, and the heat dissipation area is arranged outside the main flow cavity and communicates with external air.

[0024] The utility model has the advantages of the following beneficial effects:

[0025] 1. The utility model discloses a reasonable heat dissipation layout for the design of independent heat dissipation systems for each important system, including a light machine heat dissipation system for heat dissipation of light machine components, a light source heat dissipation system for heat dissipation of light source components, and a PCB heat dissipation system for heat dissipation of PCB components and the whole machine. By increasing the space structure radiator and different heat dissipation mode combination, the high-power projector is heat dissipated, the important heat dissipation devices of the projector are considered as a whole, and the design requirements are met.

[0026] 2. For the imaging chip, an integrated heat dissipation structure is arranged for temperature reduction and control. The heat is led out to the cold face of the thermoelectric refrigeration piece through the heat-conducting cold head in contact with the imaging chip, so that the temperature of the imaging chip is reduced and controlled. The hot face of the thermoelectric refrigeration piece is cooled through the water-cooled radiator, and the circulation is formed.

[0027] 3. During the heat dissipation process of the imaging chip, the temperature of the heat-conducting cold head is very low due to the working of the thermoelectric refrigeration piece, and condensation phenomenon is easy to occur. Therefore, the first foam sealing layer, the heat insulation layer, the second foam sealing layer and the rubber pad are arranged at the gap of each layer of the integrated heat dissipation structure and the PCB fixed pressing plate, so as to close and cover the low-temperature part, one layer after another, to realize overall sealing assembly, and external moisture can be effectively prevented from entering the low-temperature area, so as to prevent condensation.

[0028] 4. The turbine fan A and the radiator are arranged in the closed cavity of the light machine body, and the internal cavity is kept in thermal balance through the turbine fan A and the radiator. Meanwhile, the fins are arranged in the shell, and the temperature of the light machine is comprehensively reduced.

[0029] 5. The axial flow fan is introduced to the outside cold wind through the gap of the light machine cover, thereby reducing the temperature of the lens rear group, the fins are increased at the lens rear group, and the heat of the lens rear group is absorbed to cool the whole lens rear group cavity. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is a structure schematic view of the whole machine heat dissipation structure of the projector.

[0031] Figure 2 It is a structure schematic view of the light machine heat dissipation system.

[0032] Figure 3 It is a bottom view of the PCB plate in the light machine heat dissipation system.

[0033] Figure 4 It is a bottom view of the light machine heat dissipation system installed with the integral heat dissipation structure.

[0034] Figure 5 It is an enlarged view of the light machine heat dissipation system installed with the integral heat dissipation structure.

[0035] Figure 6 It is a sectional view of the integral heat dissipation structure and the PCB pressing plate in the light machine heat dissipation system.

[0036] Figure 7 It is an assembly effect schematic view of the heat conduction cold head and the cold head fixing seat in the light machine heat dissipation system.

[0037] Figure 8 It is an installation structure schematic view of the turbine fan A and the radiator in the light machine heat dissipation system.

[0038] Figure 9 It is a main air duct effect schematic view in the light machine heat dissipation system.

[0039] Figure 10 It is an installation structure schematic view of the color wheel and the light guide pipe in the light machine heat dissipation system.

[0040] Figure 11 It is an internal circulation flow channel effect schematic view of the light machine heat dissipation system.

[0041] Figure 12 It is an installation structure schematic view of the lens rear group and the axial flow fan in the light machine heat dissipation system.

[0042] Figure 13 It is a structure schematic view of the light source heat dissipation system.

[0043] Figure 14It is the structure schematic view of the fluorescent wheel heat dissipation system in the light source heat dissipation system.

[0044] Figure 15 It is the structure schematic view of another perspective of the fluorescent wheel heat dissipation system in the light source heat dissipation system.

[0045] Figure 16 It is the structure schematic view of another perspective of the fluorescent wheel heat dissipation system in the light source heat dissipation system.

[0046] Among them:

[0047] 100. Light machine heat dissipation system;200. Light source heat dissipation system;300. PCB heat dissipation system.

[0048] 1. Light machine body;2. PCB board;2.1 groove;2.2 PCB fixed pressing plate;3. Imaging chip;4. Heat conduction cold head;4.1 plate body;4.2 cold head bump;4.3 sensor;5. Thermoelectric refrigeration piece;6. Water-cooled radiator;6.1 radiator cold head;6.2 water inlet pipe head;6.3 water outlet pipe head;6.4 water inlet pipe;6.5 water outlet pipe;6.6 radiator water exhaust;6.7 water exhaust fan;6.8 water storage tank;7. Cold head fixing base;8. Integrated heat dissipation structure;9. First foam sealing layer;10. Second foam sealing layer;11. Rubber pad surface;12. Prism;13. Light pipe;14. Color wheel;15. Lens rear group;15.1 fan cavity;15.2 notch;16. Turbine fan A;17. Axial flow fan;18. Radiator;18.1 circulation area;18.2 heat dissipation area;19. Light source body;20. Laser heat dissipation system;21. Red light heat dissipation system;22. Green light heat dissipation system;23. Fluorescent wheel heat dissipation system;23.1 fluorescent wheel heat dissipation system;23.2 turbine fan B. DETAILED DESCRIPTION

[0049] The utility model will be further explained in detail below in combination with the drawings and specific preferred embodiments.

[0050] In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "left side", "right side", "upper part", "lower part" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and "first", "second" and the like do not represent the importance of the parts, so it cannot be understood as a limitation on the utility model. The specific size adopted in the embodiment is only for example to illustrate the technical scheme, and does not limit the protection scope of the utility model.

[0051] As Figures 1-14As shown, a projector whole machine heat dissipation structure, including light machine heat dissipation system 100, light source heat dissipation system 200 and PCB heat dissipation system 300.

[0052] Wherein, light machine heat dissipation system 100 includes light machine body 1, PCB board 2 and integrated heat dissipation structure 8, light machine body side bottom is equipped with PCB board, the lower surface of PCB board is provided with groove 2.1, for placing imaging chip 3.

[0053] Wherein, light machine body is the carrier of bearing optical device and optical path.

[0054] Wherein, imaging chip: DMD chip, is the imaging photoelectric component of machine, is also important heat source, needs to control in certain temperature.

[0055] Wherein, PCB board is the board for placing imaging chip.

[0056] Further, integrated heat dissipation structure 8 includes heat conduction cold head 4, thermoelectric refrigeration piece 5 and water-cooled radiator 6.

[0057] Heat conduction cold head and imaging chip are connected, for exporting the heat of imaging chip.

[0058] Wherein, heat conduction cold head is the device for exporting the heat of imaging chip.

[0059] Thermoelectric refrigeration piece has two end faces, one end face is hot face, and the other end face is cold face.

[0060] Wherein, thermoelectric refrigeration piece is an active electric drive cooling device, one end cold face one end hot face when electrified.

[0061] The cold face of thermoelectric refrigeration piece and heat conduction cold head are connected, and heat conduction cold head exports heat to the cold face of thermoelectric refrigeration piece.

[0062] Water-cooled radiator and the hot face of thermoelectric refrigeration piece are connected, and the hot face of thermoelectric refrigeration piece is cooled by water-cooled radiator.

[0063] Wherein, water-cooled radiator cold head is used to cool the hot face of thermoelectric refrigeration piece, so as to greatly cool the chip.

[0064] Further, heat conduction cold head 4 includes plate body 4.1 and integrally formed cold head boss 4.2, sensor 4.3 is arranged in the plate body, cold head boss is formed on the side face of plate body close to PCB board, and cold head boss and groove are inserted and assembled, so that cold head boss and imaging chip are connected.

[0065] Understandably, cold head boss needs to directly contact imaging chip, and cold head boss and groove are matched in size to realize sealed insertion assembly, and cold head boss leads away the heat of imaging chip arranged in groove.

[0066] Preferably, the cold head bumps can be formed at the edge of a long side of the plate body for easy docking and installation.

[0067] Furthermore, the cold surface of the thermoelectric cooler is adhesively connected to the side of the plate body away from the PCB board.

[0068] Understandably, the cold surface of the thermoelectric cooler and the plate body are dimensionally matched to achieve a sealed and adhesively connected state.

[0069] Furthermore, in order to improve the heat conduction effect, the heat conduction cold head can adopt an integrated heat pipe or a pre-embedded heat pipe heat pipe.

[0070] Furthermore, the integrated heat dissipation structure further includes a cold head fixing seat 7, and the heat conduction cold head is installed and assembled through the cold head fixing seat.

[0071] The cold head fixing seat is a hollow frame structure in the shape of a "hui" character. The plate body of the heat conduction cold head is assembled within its hollow frame structure, and the cold head fixing seat is tightly assembled on the periphery of the plate body.

[0072] Furthermore, in order to improve the assembly and fixing effect of the cold head fixing seat on the heat conduction cold head, an L-shaped boss is formed on the periphery of the plate body away from the PCB board; an L-shaped groove is formed on the inner peripheral edge of the cold head fixing seat away from the PCB board; the plate body is snap-fitted with the L-shaped groove of the cold head fixing seat through the L-shaped boss; a thermoelectric cooler is also assembled within the inner peripheral frame of the cold head fixing seat.

[0073] Furthermore, one or more thermoelectric coolers are provided and arranged in combination according to the actual working area.

[0074] Furthermore, two thermoelectric coolers are provided and combined in parallel.

[0075] Understandably, the thermoelectric cooler should cover the entire inner peripheral frame of the cold head fixing seat and be in large-area contact and adhesion with the plate body. Thus, the cold head fixing seat is tightly assembled on the peripheries of the heat conduction cold head and the thermoelectric cooler.

[0076] Furthermore, the water-cooled radiator includes a heat dissipation cold head 6.1 and a radiator water row 6.6. One side of the heat dissipation cold head is adhesively connected to the hot surface of the thermoelectric cooler, and a water storage tank 6.8 is assembled on the other side; a water inlet head 6.2 and a water outlet head 6.3 are installed on one side of the water storage tank away from the heat dissipation cold head; a water row fan 6.7 is installed on the side of the radiator water row, and the bottom surface of the radiator water row is connected to the water inlet head of the water storage tank through a water inlet pipe 6.4, and the bottom surface of the radiator water row is connected to the water outlet head of the water storage tank through a water outlet pipe 6.5.

[0077] Among them, the hot surface of the thermoelectric cooler is in contact and assembled with the heat dissipation cold head. Thus, the hot surface of the thermoelectric cooler is cooled by the heat dissipation cold head.

[0078] Among them, the radiator water block is used to cool down the liquid of the cooling head; the water pipe is the waterway pipeline of the water-cooled radiator and is used for the water circulation of the water-cooled radiator; the liquid at the cooling head is stored in the water storage tank assembled on the side of the cooling head; a water block fan is installed on the side of the radiator water block, and the water block fan is used to directly cool down the radiator water block. Specifically: the cold water in the radiator water block flows into the water inlet pipe head through the water inlet pipe, and then enters the water storage tank at the cooling head, taking away the heat at the cooling head, realizing the cooling of the liquid of the cooling head, and the heated water flows out through the water outlet pipe head and flows back into the radiator water block through the water outlet pipe; the water block fan directly cools down the water in the radiator water block efficiently.

[0079] Furthermore, due to the requirement of the overall assembly of the integrated heat dissipation structure, the outer peripheral side of the cooling head is flush with the outer peripheral side of the cold head fixing seat.

[0080] Furthermore, in order to prevent condensation, the cold head fixing seat is made of heat-insulating material.

[0081] Furthermore, a foam can be arranged between the contact surfaces of the L-shaped boss and the L-shaped groove.

[0082] Furthermore, a first foam sealing layer 9 is assembled between the cooling head and the cold head fixing seat. The first foam sealing layer is circumferentially arranged, and its outer peripheral side is flush with the outer peripheral side of the cold head fixing seat.

[0083] Among them, the setting of the first foam sealing layer can effectively prevent the conduction cooling head from contacting with air to generate condensation.

[0084] Furthermore, an insulating layer can also be arranged at the first foam sealing layer. The insulating layer is circumferentially arranged, and its outer peripheral side is flush with the outer peripheral side of the cold head fixing seat.

[0085] Among them, the insulating layer and the first foam sealing layer act together to be used for the closed use of the integrated heat dissipation structure, thereby effectively preventing the conduction cooling head from contacting with air to generate condensation.

[0086] Furthermore, the PCB board also includes a PCB fixing pressure plate 2.2 for pressing the PCB board; the PCB fixing pressure plate is a hollow frame structure in the shape of a "hui" character. Considering the requirement of overall assembly, its outer peripheral side is flush with the outer peripheral side of the cold head fixing seat, and its inner peripheral side is tightly assembled with the outer peripheral side of the board body of the conduction cooling head; a rubber pad surface 11 is installed between the PCB fixing pressure plate and the PCB board, and the rubber pad surface is circumferentially arranged.

[0087] Among them, the rubber pad surface is used for insulating electricity from the PCB board; and, realizing the sealing effect between the PCB fixing pressure plate and the PCB board.

[0088] Furthermore, a second foam sealing layer 10 is installed between the gaps of the PCB fixing pressure plate and the cold head fixing seat. The second foam sealing layer is circumferentially arranged and plays a role in the overall sealing and heat insulation of the system.

[0089] When the optical machine is running, the imaging chip absorbs a large amount of heat while working, and a large amount of heat is also generated by the loss of the internal optical path of the optical machine. For the imaging chip, the heat is conducted to the cold surface of the thermoelectric refrigeration piece through the heat-conducting cold head in contact with the imaging chip, so as to reduce and control the temperature of the imaging chip. The hot surface of the thermoelectric refrigeration piece is cooled by the heat dissipation cold head of the water-cooled radiator, and the cycle is formed to dissipate heat from the imaging chip. During the heat dissipation process of the imaging chip, due to the working of the thermoelectric refrigeration piece, the temperature of the heat-conducting cold head is very low, and condensation phenomenon is easy to occur. Therefore, the first foam sealing layer, the heat insulation layer, the second foam sealing layer and the rubber pad are arranged in the gap of the integrated heat dissipation structure and the PCB fixing plate, so as to close and cover the low-temperature parts, one layer by one layer, so as to realize overall sealing assembly, which can effectively prevent external water vapor from entering the low-temperature area, thereby preventing condensation.

[0090] The optical machine body is used to carry optical devices and optical paths, and the internal body of the optical machine body is a closed cavity. A large number of components are arranged in the closed cavity, and the main optical elements include a prism 12, a light guide pipe 13 and a color wheel 14. A large amount of heat is also generated by the loss of the internal optical path of the optical machine. The gap between the components in the internal body of the optical machine body forms an internal circulation flow channel.

[0091] As shown in Figures 8-12 , the internal body of the optical machine body is a closed cavity, and the closed cavity includes a main flow cavity and a branch flow cavity. A turbine fan A 16 is arranged at a corner of the main flow cavity. A heat sink 18 is arranged on the low-pressure side of the turbine fan A. A prism 12 is arranged on the high-pressure side of the turbine fan A.

[0092] Among them, the prism: optical device, used for optical path reflection.

[0093] Among them, the turbine fan A is used to provide power for the internal airflow movement of the optical machine. The heat in the internal body of the optical machine is circulated internally through the wind path driven by the turbine fan A arranged internally. The heat sink is used for heat exchange between the inside and outside of the optical machine.

[0094] Further, the heat sink 18 is composed of a circulation zone 18.1 and a heat dissipation zone 18.2. The circulation zone is arranged in the main flow cavity, and the heat dissipation zone is arranged outside the main flow cavity. The heat dissipation zone is in communication with the external air.

[0095] Among them, the air on the high-pressure side of the turbine fan A in the main flow cavity blows to the prism, and the prism is cooled by the air. The heated air flows through the circulation zone of the heat sink and is reabsorbed into the turbine fan A.

[0096] Further, the light guide pipe and the color wheel are arranged in the branch flow cavity.

[0097] Further, the branch flow cavity is provided with a through port A in communication with the low pressure side of the turbo fan A, and a through port B in communication with the high pressure side of the turbo fan A.

[0098] The air on the high pressure side of the turbo fan A flows through the prism and is blown into the branch flow cavity through the through port B to cool the elements in the branch flow cavity, and is then sucked into the low pressure side of the turbo fan A through the through port A to realize the circulation of the air in the branch flow cavity.

[0099] The light guide pipe is a light path component capable of uniformly distributing light.

[0100] The color wheel is a light path component mainly for optimizing the color performance of projection.

[0101] The specific steps are as follows: when the turbo fan A rotates, the air pressure at the air inlet of the turbo fan A is reduced, and the air in the main flow cavity and the branch flow cavity moves to the low pressure side of the turbo fan A and is sucked into the turbo fan A, and the air in the branch flow cavity flows into the low pressure side of the turbo fan A through the through port A; the air in the main flow cavity and the branch flow cavity converges in the turbo fan A.

[0102] The mixed air in the turbo fan A is discharged from the high pressure side of the turbo fan A and blown to the prism in the main flow cavity to cool the prism, and then part of the air moves to the circulation area of the radiator in the main flow cavity, and the other part moves to the branch flow cavity through the through port B and is blown to the light guide pipe and the color wheel to cool the light guide pipe and the color wheel.

[0103] Due to the movement of the turbo fan A, the internal system continuously circulates the air, and the air exchanges heat with the internal air through the radiator to cool the internal cavity of the light machine, so as to maintain the heat balance of the internal cavity and transfer the heat to the external air through the heat dissipation area of the radiator.

[0104] Further, fins are arranged in the light machine body to comprehensively reduce the temperature of the light machine.

[0105] As shown in Figure 12 The light machine body is provided with a rear lens group 15, a fan cavity 15.1 is formed in the light machine body near the rear lens group, an axial flow fan 17 is arranged in the fan cavity, and a gap 15.2 is formed in the light machine body for communication between the fan cavity and the external air. The axial flow fan introduces external cold air into the fan cavity through the gap to continuously blow cold air to the rear lens group to cool it. Fins can also be arranged at the rear lens group to absorb the hot air of the rear lens group and cool the entire rear lens group cavity.

[0106] The axial flow fan introduces external cold air into the fan cavity through the gap of the light machine cover to reduce the temperature of the rear lens group. Fins are added at the rear lens group to absorb the hot air of the rear lens group and cool the entire rear lens group cavity.

[0107] Further, as Figure 1 、 13 -14 shows, the light source heat dissipation system 200 includes a light source body 19, and a laser heat dissipation system 20 is arranged outside the light source body; a fluorescent wheel heat dissipation system 23 is arranged inside the light source body.

[0108] The laser heat dissipation system 20 includes a heat pipe air-cooled radiator or a water-cooled heat dissipation device.

[0109] The laser heat dissipation system is used for dissipating heat of a laser, and the heat dissipation is specifically achieved by the heat pipe air-cooled radiator or the water-cooled heat dissipation device.

[0110] The light source body outside can also be arranged with a red light heat dissipation system 21 and / or a green light heat dissipation system 22 according to the arrangement of actual optical elements.

[0111] The red light heat dissipation system 21 includes an air-cooled radiator A and a semiconductor refrigerator.

[0112] The red light heat dissipation system is used for dissipating heat of red light, and the heat dissipation is specifically achieved by the air-cooled radiator A and the semiconductor refrigerator.

[0113] The green light heat dissipation system 22 includes an air-cooled radiator B.

[0114] The green light heat dissipation system is used for dissipating heat of green light, and the heat dissipation is specifically achieved by the heat pipe air-cooled radiator.

[0115] The fluorescent wheel heat dissipation system includes a fluorescent wheel radiator 23.1.

[0116] The fluorescent wheel heat dissipation system 23 is used for dissipating heat of a fluorescent wheel.

[0117] Further, the fluorescent wheel radiator 23.1 is divided into upper and lower layers, and both of them include inner radiator fins and outer radiator fins; the inner radiator fins are arranged inside the fluorescent wheel, and the outer radiator fins are arranged outside the fluorescent wheel.

[0118] Further, a fan is arranged inside the fluorescent wheel, and the heat dissipation is achieved by the fluorescent wheel radiator 23.1 and the fan.

[0119] Preferably, the fan is a turbine fan B23.2.

[0120] The fan can also be an axial fan or other fan.

[0121] Preferably, the inner radiator fins of the upper fluorescent wheel radiator are arranged vertically along both sides of one end of a fluorescent wheel disc surface.

[0122] Preferably, the inner radiator fins of the lower fluorescent wheel radiator are arranged vertically along both sides of the other end of the fluorescent wheel disc surface.

[0123] The fan is arranged on the inner heat sink fin side of the upper layer fluorescent wheel heat sink, and the air outlet is aligned with the upper layer fluorescent wheel heat sink. The inner heat sink fin of the upper layer fluorescent wheel heat sink is perpendicular to the fluorescent wheel disc surface and parallel to the air outlet direction of the fan. The inner heat sink fins of the stacked upper layer fluorescent wheel heat sinks form parallel gaps in the upper layer space. When the fan works, the air is blown out from the air outlet, flows in the parallel gaps formed in the upper layer space, and is blown axially to the fluorescent wheel disc surface from the gaps to take the heat on the fluorescent wheel disc surface to the air. The air flow passes through the gaps around the fluorescent wheel and flows radially along the disc surface to the lower layer fluorescent wheel heat sink, and then circulates to the fan air inlet through the inner heat sink fin of the lower layer fluorescent wheel heat sink and the lower layer air duct, thereby forming a circulating loop of the fan air flow in the fluorescent wheel.

[0124] In this process, the inner heat sink fins of the upper and lower layer fluorescent wheel heat sinks absorb the heat of the air flow and conduct the heat to the outer heat sink fins through the heat pipes, thereby conducting the heat out.

[0125] Further, the PCB heat dissipation system 300 comprises a whole machine fan.

[0126] Further, the light machine heat dissipation system, the light source heat dissipation system and the PCB heat dissipation system are arranged in the whole machine.

[0127] In the process, the heat absorbed by the inner heat sink fins of the fluorescent wheel is transmitted to the outer heat sink fins through the heat pipes, and then dissipated to the air by the whole machine fan. The air in the fluorescent wheel is circulated by the turbine fan B.

[0128] In the process, the heat absorbed by the inner heat sink fins of the fluorescent wheel is transmitted to the outer heat sink fins through the heat pipes, and then dissipated to the air by the whole machine fan. The air in the fluorescent wheel is circulated by the turbine fan B.

[0129] When the projector machine is running, a large amount of heat is generated by each component. Through the reasonable placement of the light machine heat dissipation system and the light source heat dissipation system, the hot air is discharged to the external air by the whole machine fan, thereby forming a circulation and maintaining the internal air thermal balance.

[0130] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not exist, they should be considered as within the scope of the present disclosure.

[0131] The preferred embodiments of the present application are described in detail above, but the present application is not limited to the specific details of the above-described embodiments, and within the technical concept of the present application, various equivalent transformations of the technical solutions of the present application can be made, and these equivalent transformations all belong to the protection scope of the present application.

Claims

1. A heat dissipation structure for a projector, characterized in that: The light machine heat dissipation system, the light source heat dissipation system and the PCB heat dissipation system are included. The light machine heat dissipation system includes a light machine body, a PCB board and an integrated heat dissipation structure. The integrated heat dissipation structure includes a heat conduction cold head, a thermoelectric refrigeration piece and a water-cooled radiator. The heat conduction cold head is connected with the imaging chip for conducting heat of the imaging chip. The thermoelectric refrigeration piece has two end faces, one of which is a hot face and the other is a cold face. The cold face of the thermoelectric refrigeration piece is connected with the heat conduction cold head. The water-cooled radiator is connected with the hot face of the thermoelectric refrigeration piece. The light source heat dissipation system includes a light source body. The light source body is externally provided with a laser heat dissipation system. The laser heat dissipation system includes a heat pipe air-cooled radiator or a water-cooled radiator. The light source body is internally provided with a fluorescent wheel heat dissipation system.

2. The projector heat dissipation structure according to claim 1, wherein: The fluorescent wheel heat dissipation system includes a fluorescent wheel radiator.

3. The projector heat dissipation structure according to claim 2, wherein: The PCB heat dissipation system includes a whole machine fan.

4. The projector heat dissipation structure according to claim 2, wherein: The heat conduction cold head includes a plate body and an integrally formed cold head protrusion.

5. The projector heat dissipation structure according to claim 1, wherein: The plate body is internally provided with a sensor.

6. The projector heat dissipation structure according to claim 5, wherein: The cold head protrusion is formed on a side of the plate body close to the PCB board.

7. The projector heat dissipation structure according to claim 4, wherein: The cold head protrusion is insertedly assembled with the recess, so that the cold head protrusion is connected with the imaging chip. The heat conduction cold head can adopt an integrated heat conduction plate or a pre-buried heat pipe heat conduction plate. The cold face of the thermoelectric refrigeration piece is connected with a side of the plate body away from the PCB board. The integrated heat dissipation structure further includes a cold head fixing seat. The cold head fixing seat is a hollow frame structure. A side of the plate body away from the PCB board is formed with an L-shaped protrusion. An inner circumferential edge of the cold head fixing seat away from the PCB board is formed with an L-shaped recess. The plate body is snap-fitted with the L-shaped recess of the cold head fixing seat through the L-shaped protrusion. The inner circumferential frame of the cold head fixing seat is further assembled with the thermoelectric refrigeration piece. The cold head fixing seat is tightly assembled with the heat conduction cold head and the thermoelectric refrigeration piece. The water-cooled radiator includes a heat dissipation cold head and a radiator water discharge. A side of the heat dissipation cold head away from the thermoelectric refrigeration piece is assembled with a water storage tank. A side of the water storage tank away from the heat dissipation cold head is provided with a water inlet pipe head and a water outlet pipe head. A water discharge fan is installed on a side of the radiator water discharge. The heat dissipation cold head is flush with the outer circumferential side of the cold head fixing seat. A first foam sealing layer is assembled between the heat dissipation cold head and the cold head fixing seat. The first foam sealing layer is circumferentially arranged and flush with the outer circumferential side of the cold head fixing seat. The PCB board further includes a PCB fixing pressing plate for pressing the PCB board. The PCB fixing pressing plate is a hollow frame structure. Its outer circumferential side is flush with the outer circumferential side of the cold head fixing seat. Its inner circumferential side is tightly assembled with the plate body of the heat conduction cold head. A rubber pad is assembled between the PCB fixing pressing plate and the PCB board. The rubber pad is circumferentially arranged. A second foam sealing layer is assembled between the PCB fixing pressing plate and the cold head fixing seat. The second foam sealing layer is circumferentially arranged.

8. The projector heat sink structure of claim 1, wherein: The inside of the light machine body is a closed cavity, which includes a main flow cavity and a branch flow cavity; the turbine fan A is arranged at a corner of the main flow cavity, a radiator is arranged on the low pressure side of the turbine fan A, and a prism is arranged on the high pressure side of the turbine fan A; the radiator is composed of a circulation area and a heat dissipation area, the circulation area is arranged in the main flow cavity, and the heat dissipation area is arranged outside the main flow cavity and communicates with external air.

9. The projector heat dissipation structure according to claim 8, wherein: The light guide pipe and the color wheel are arranged in the branch flow cavity, the branch flow cavity is provided with a through port A communicating with the low pressure side of the turbine fan A and a through port B communicating with the high pressure side of the turbine fan A; and fins are arranged inside the closed cavity.

10. The projector heat dissipation structure according to claim 1, wherein: The light machine heat dissipation system, the light source heat dissipation system and the PCB heat dissipation system are all arranged inside the whole machine; and a red light heat dissipation system and / or a green light heat dissipation system can also be arranged outside the light source body.

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