Multi-runner notebook computer heat dissipation cold plate
By employing a multi-channel water-cooling plate design in laptops, combined with multiple heat pipes and heat dissipation fin arrays, the problem of insufficient heat dissipation efficiency in high-performance laptops is solved, achieving efficient heat dissipation and improving device stability and user experience.
Patent Information
- Application Number
- CN202520371992.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-03-04
AI Technical Summary
Current laptops face bottlenecks in heat dissipation efficiency when dealing with the high power consumption demands of high-performance processors and graphics cards, especially designs that rely on air cooling, which are unable to meet high-performance requirements.
The laptop cooling plate adopts a multi-channel design, which increases the contact area between the water flow and the chip by setting multiple water channels inside the water cooling plate. It also uses multiple heat pipes and heat dissipation fin arrays for heat conduction and heat dissipation, combined with the fan blowing out the heat to achieve efficient heat dissipation.
It improves heat dissipation efficiency, ensures the stability and comfort of the laptop when running at high performance, extends the device's lifespan, and enhances the user experience.
Smart Images
Figure CN223815538U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to notebook computer heat dissipation technical field, concretely to a notebook computer heat dissipation cold plate of multichannel. BACKGROUND
[0002] The power consumption of the existing market game book is higher and higher, and light weight is guaranteed, and the challenge of notebook computer radiator comes, the power consumption also rises while pursuing higher performance, which puts forward higher requirements to notebook computer heat dissipation system, and the heat dissipation performance of notebook computer directly influences its running stability, performance and service life, and also influences user experience and product competitiveness to a great extent.
[0003] Although different kinds of notebook computers with water-cooling heat dissipation appear in the existing market, most designs still finally rely on air-cooling heat dissipation, and this kind of hybrid heat dissipation mode solves the heat dissipation problem of notebook computer to a certain extent, but when facing the high power consumption demand of high-performance processor and display card, the heat dissipation efficiency still has a bottleneck, therefore, it is particularly important to further improve the heat dissipation power of the water-cooling module on the basis of the existing water-cooling notebook computer. UTILITY MODEL CONTENT
[0004] In view of the defects of the prior art, the utility model provides a notebook computer heat dissipation cold plate of multichannel, which has the advantages of high heat dissipation efficiency, solves the problem that although different kinds of notebook computers with water-cooling heat dissipation appear in the existing market, most designs still finally rely on air-cooling heat dissipation, and this kind of hybrid heat dissipation mode solves the heat dissipation problem of notebook computer to a certain extent, but when facing the high power consumption demand of high-performance processor and display card, the heat dissipation efficiency still has a bottleneck.
[0005] To achieve the above object, the utility model provides the following technical scheme: a notebook computer heat dissipation cold plate of multichannel, including the upper cover plate, the left and right ends of the upper surface of the upper cover plate are all fixed with chip contact steps, the upper surface of the upper cover plate is provided with water flow channel;
[0006] The rear end of the lower side of the upper cover plate is equipped with a heat pipe, the lower side of the upper cover plate and the front side of the heat pipe are equipped with a second heat pipe, the left end of the lower side of the upper cover plate and the front side of the second heat pipe are equipped with a third heat pipe, the left end of the upper surface of the first heat pipe, the second heat pipe and the third heat pipe is fixed with same heat dissipation fin a, the right end of the upper surface of the first heat pipe and the second heat pipe is fixed with same heat dissipation fin b.
[0007] Further, the upper side of the upper cover plate is equipped with the lower cover plate, the left and right ends of the upper surface of the lower cover plate are all provided with the through hole that is suitable for the size of chip contact step.
[0008] Further, the water flow channel is arranged around the upper surface of the upper cover plate, and multiple protrusions are fixed in the inner cavities of the four sides of the water flow channel.
[0009] Further, one side of the upper cover plate is provided with a water nozzle, which is in communication with the inlet and outlet of the water flow channel.
[0010] Further, the heat dissipation fins a and the heat dissipation fins b are each composed of multiple single fins.
[0011] Further, the upper surface of the left end of the heat dissipation fins is provided with a square hole.
[0012] Further, the upper surface of the right end of the heat dissipation fins is provided with an arc-shaped hole, and the sizes of the inner cavities of the square hole and the arc-shaped hole are greater than the size of the chip contact step.
[0013] Compared with the prior art, the technical scheme has the following beneficial effects:
[0014] The notebook computer heat dissipation cold plate with multiple water flow channels is provided with multiple water flow channels in the water cooling plate, which can not only increase the contact area of the water flow in the water cooling plate and the water cooling plate, but also enable more water flow channels to pass below the heat pipe, so that the heat is conducted to the heat pipe through the chip, and the heat on the heat pipe is taken away by the water flow, thereby increasing the overall heat dissipation efficiency and enabling the water flow channels below to no longer rely on the water flow to cool the chip contact surface. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is a structural schematic view of the utility model;
[0016] Figure 2 It is a structural schematic view of the utility model;
[0017] Figure 3 It is a bottom view of the three heat pipe structures of the utility model.
[0018] In the figure: 1 upper cover plate, 2 chip contact step, 3 water flow channel, 4 No. 1 heat pipe, 5 No. 2 heat pipe, 6 No. 3 heat pipe, 7 heat dissipation fin a, 8 heat dissipation fin b, 9 lower cover plate, 10 water nozzle, 11 heat dissipation fin, 12 square hole, 13 arc-shaped hole. DETAILED DESCRIPTION
[0019] The technical scheme in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0020] Please refer to Figure 1 The notebook cooling cold plate with multiple flow channels in the embodiment comprises an upper cover plate 1, chip contact steps 2 are fixed at the left and right ends of the upper surface of the upper cover plate 1, and water flow channels 3 are arranged on the upper surface of the upper cover plate 1.
[0021] In the embodiment, the upper side of the upper cover plate 1 is provided with a lower cover plate 9, through holes that are suitable in size for the chip contact steps 2 are arranged at the left and right ends of the upper surface of the lower cover plate 9, to ensure good contact and heat conduction, and the water flow channels 3 are arranged around the upper surface of the upper cover plate 1, and a plurality of protrusions are fixed in the inner cavities of the four sides of the water flow channels 3.
[0022] It should be noted that the upper cover plate 1 is designed as a whole, and the multiple water flow channels 3 on the upper surface increase the heat dissipation area, and the water flow is used to preferentially cool the first heat pipe 4, the second heat pipe 5 and the third heat pipe 6, so that the water flow channels 3 no longer only rely on the water flow to cool the chip contact surface, and more water flow channels 3 pass under the first heat pipe 4, the second heat pipe 5 and the third heat pipe 6, so that the heat on the surfaces of the first heat pipe 4, the second heat pipe 5 and the third heat pipe 6 is taken away by the water flow.
[0023] Please refer to Figures 2 to 3 In order to greatly improve the heat dissipation power of the water cooling module, the rear end of the lower side of the upper cover plate 1 in the embodiment is provided with the first heat pipe 4, the lower side of the upper cover plate 1 and located in front of the first heat pipe 4 is provided with the second heat pipe 5, the lower side of the upper cover plate 1 and located in front of the left end of the second heat pipe 5 is provided with the third heat pipe 6, the left end of the upper surfaces of the first heat pipe 4, the second heat pipe 5 and the third heat pipe 6 is fixed with the same heat dissipation fin a7, and the right end of the upper surfaces of the first heat pipe 4 and the second heat pipe 5 is fixed with the same heat dissipation fin b8, the upper cover plate 1, the lower cover plate 9 and the water nozzle 10 form a water cooling plate, the water cooling plate is connected with the chip contact water cooling plate and the three heat pipes, the heat pipes are connected with the heat dissipation fin a7 and the heat dissipation fin b8, the chip is placed on the chip contact steps 2, the heat on the surface of the chip is conducted to the water cooling plate through the chip contact steps 2, the heat on the water cooling plate is conducted to the three heat pipes, part of the heat on the three heat pipes is taken away by the water flow, and part of the heat is conducted to the heat dissipation fin a7 and the heat dissipation fin b8, the heat on the heat dissipation fin a7 and the heat dissipation fin b8 is blown out by the fan, and the water cooling plate and the three heat pipes can cool the temperature on the surface of the chip.
[0024] The upper cover plate 1 in the embodiment is provided with a water nozzle 10 on one side, the water nozzle 10 is in communication with the inlet and outlet of the water flow channel 3, the heat dissipation fins a7 and the heat dissipation fins b8 are each composed of a plurality of single fins, the middle part of the upper surface of the lower cover plate 9 is provided with two heat dissipation fins 11, the upper surface of the left end heat dissipation fin 11 is provided with a square hole 12, when the water flow passes through the water nozzle 10, the water flow surrounds the chip contact step 2 for one round, the water flow absorbs the heat on the surfaces of the three heat pipes, so that the surfaces of the three heat pipes are lowered, the temperature of the surface of the overall body of the notebook computer is lowered synchronously, so that the use temperature of the body of the notebook computer is more comfortable.
[0025] The upper surface of the right end heat dissipation fin 11 is provided with an arc-shaped hole 13, the sizes of the inner cavities of the square hole 12 and the arc-shaped hole 13 are greater than the size of the chip contact step 2.
[0026] In addition, the heat dissipation fins a7 and the heat dissipation fins b8 are each composed of a plurality of single fins to form a dense heat dissipation fin array, the contact area with air is increased, the heat dissipation efficiency is improved, the top and the bottom of each single fin are fixed with the same top plate and bottom plate, the top plate and the bottom plate are used for fixing the single fins and providing structural support, the overall stability is ensured, a through hole is formed in one side of the single fin, the heat on the surfaces of the heat dissipation fins a7 and the heat dissipation fins b8 is taken away, the air flow blown by the fan can smoothly pass through, the air flow resistance is avoided, the cooling effect is improved, there is enough space between adjacent single fins, air can smoothly flow, the uniform distribution of the heat dissipation fins a7 and the heat dissipation fins b8 on the whole heat dissipation module is ensured, and local area poor heat dissipation is avoided.
[0027] It should be noted that a plurality of water flow channels 3 are arranged in the water cooling plate, not only the contact area of the water flow in the water cooling plate with the water cooling plate can be increased, but also more water flow channels 3 can pass from below the three heat pipes, the heat is conducted to the three heat pipes through the chip, the heat on the three heat pipes is taken away by the water flow from below, the overall heat dissipation efficiency is increased, and the water flow channels 3 below no longer only rely on the water flow to cool the chip contact surface.
[0028] The working principle of the above embodiment is as follows:
[0029] (1) the upper cover plate 1 and the lower cover plate 9 and the water nozzle 10 constitute a water cooling plate, the chip contacts the water cooling plate, and the water cooling plate is connected by three heat pipes, the heat pipes are connected with the heat dissipation fins a7 and the heat dissipation fins b8, the chip is placed on the chip contact step 2, the heat on the surface of the chip is conducted to the water cooling plate through the chip contact step 2, the heat on the water cooling plate is conducted to the first heat pipe 4, the second heat pipe 5 and the third heat pipe 6, part of the heat on the first heat pipe 4, the second heat pipe 5 and the third heat pipe 6 is taken away by the water flow, and part of the heat is conducted to the heat dissipation fins a7 and the heat dissipation fins b8, the heat on the heat dissipation fins a7 and the heat dissipation fins b8 is blown out by the fan, and the water cooling plate and the first heat pipe 4, the second heat pipe 5 and the third heat pipe 6 can cool the temperature on the surface of the chip, when the water flow passes through the water nozzle 10, the water flow surrounds the chip contact step 2, and the water flow absorbs the heat on the surfaces of the first heat pipe 4, the second heat pipe 5 and the third heat pipe 6, so that the surfaces of the first heat pipe 4, the second heat pipe 5 and the third heat pipe 6 are reduced, and the temperature on the surface of the whole body of the notebook computer is synchronously reduced, so that the use temperature of the notebook computer body is more comfortable.
[0030] (2) the heat dissipation fins a7 and the heat dissipation fins b8 are formed by a plurality of single pieces to form a dense heat dissipation fin array, a through hole is formed on one side of the single piece, the heat on the surfaces of the heat dissipation fins a7 and the heat dissipation fins b8 is taken away, the air flow blown out by the fan can smoothly pass through, air resistance is avoided, the cooling effect is improved, there is enough space between adjacent single pieces, air can smoothly flow, and uniform distribution of the heat dissipation fins a7 and the heat dissipation fins b8 on the whole heat dissipation module is ensured.
[0031] It should be noted that, in the present text, relational terms such as first and second and the like can only be used to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Moreover, the terms "comprising", "containing" or any other variant thereof are intended to cover non-exclusive inclusions, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such a process, method, article or device. Without more limitations, the element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, article or device including the element.
[0032] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application.
Claims
1. A multi-channel notebook cooling cold plate comprising an upper cover plate (1), characterized in that: Chip contact steps (2) are fixed at the left and right ends of the upper surface of the upper cover plate (1), and a water flow channel (3) is arranged on the upper surface of the upper cover plate (1); A first heat pipe (4) is arranged at the rear end of the lower side of the upper cover plate (1), a second heat pipe (5) is arranged at the front side of the lower side of the upper cover plate (1) and located at the front side of the first heat pipe (4), a third heat pipe (6) is arranged at the left end of the front side of the second heat pipe (5) and the lower side of the upper cover plate (1), the left end of the upper surfaces of the first heat pipe (4), the second heat pipe (5) and the third heat pipe (6) is fixed with the same heat dissipation fin a (7), and the right end of the upper surfaces of the first heat pipe (4) and the second heat pipe (5) is fixed with the same heat dissipation fin b (8).
2. The multi-channel notebook cooling cold plate of claim 1, wherein: A lower cover plate (9) is arranged on the upper side of the upper cover plate (1), and a through hole with a size suitable for the chip contact step (2) is arranged at the left and right ends of the upper surface of the lower cover plate (9).
3. The multi-channel notebook cooling cold plate of claim 1, wherein: The water flow channel (3) is arranged around the upper surface of the upper cover plate (1), and a plurality of protrusions are fixed in the inner cavities of the four sides of the water flow channel (3).
4. The multi-channel notebook cooling cold plate of claim 1, wherein: A water nozzle (10) is arranged on one side of the upper cover plate (1), and the water nozzle (10) is in communication with the inlet and outlet of the water flow channel (3).
5. The multi-channel notebook cooling cold plate of claim 1, wherein: The heat dissipation fin a (7) and the heat dissipation fin b (8) are each composed of a plurality of single fins.
6. The multi-channel notebook cooling cold plate of claim 2, wherein: Two heat dissipation fins (11) are arranged on the middle part of the upper surface of the lower cover plate (9), and a square hole (12) is arranged on the upper surface of the left end of the heat dissipation fin (11).
7. The multi-channel notebook cooling cold plate of claim 6, wherein: An arc-shaped hole (13) is arranged on the upper surface of the right end of the heat dissipation fin (11), and the sizes of the inner cavities of the square hole (12) and the arc-shaped hole (13) are greater than the size of the chip contact step (2).