Chip taking adjusting device
By integrating the adhesive application and placement stations into the adhesive application and placement machine, and utilizing the material handling adjustment device and vision components, the problems of low efficiency and inaccurate positioning of the adhesive application and placement machine are solved, realizing a high-efficiency and low-cost chip positioning and placement process.
Patent Information
- Application Number
- CN202520207288.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-02-10
AI Technical Summary
In existing adhesive-dip placement machines, the adhesive-dip and placement processes are separated into two stations, which increases the substrate transfer time, increases costs and reduces efficiency, and requires two sets of vision positioning systems, affecting chip positioning accuracy.
The adhesive application and chip mounting stations are integrated into a parallel station. A chip pick-up and adjustment device is used, including a pick-up rotary motor, a pick-up arm, and a pick-up head. Combined with a wafer motion platform and adjustment mechanism, the chip position is adjusted through vision components and motors to ensure accurate positioning.
It improves the efficiency of adhesive bonding and chip placement, reduces costs, ensures accurate chip positioning on the substrate, simplifies the vision positioning system, and improves overall efficiency.
Smart Images
Figure CN223816399U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to new energy automobile power assembly technical field, concretely relates to a chip's material taking adjusting device. BACKGROUND
[0002] The dip glue patching machine is a kind of equipment for accurately patching chip to printed circuit board (or substrate). It is fixed and electrically connected by dipping glue (usually epoxy resin or conductive silver paste etc.) and coating it on substrate, then patching chip to substrate.
[0003] The dip glue patching machine mainly includes dip glue head, patching head, conveying system and control system etc., when carrying out dip glue patching, dip glue process and patching process are completed in two different stations, substrate reaches dip glue station first by conveying system, and glue is coated on substrate by dip glue head, then substrate is further conveyed to patching station by conveying system, and chip is patched on substrate by patching head.
[0004] The above dip glue patching machine has the following problems in actual use: 1, dip glue process and patching process belong to two different stations, so that substrate needs to spend certain time in conveying process, and patching efficiency is greatly reduced.2, substrate needs the auxiliary positioning of visual positioning system when reaching dip glue station and patching station, so that two sets of visual positioning systems are needed, so that cost is increased, and visual positioning system also needs certain time to work, so that patching efficiency is further reduced.
[0005] In order to solve the above problems, the inventor invents a high-speed dip glue patching machine, which integrates dip glue station and patching station together when in use, changes series into parallel in prior art, and substrate is stationary in the whole dip glue patching process, so that glue and chip are moved to the position of substrate by dip glue assembly and patching assembly respectively, so as to improve the efficiency of the whole dip glue patching. But how to ensure that chip can be accurately moved to the position of substrate also becomes a technical problem to be solved urgently. CONTENT OF UTILITY MODEL
[0006] In view of the above problems existing in prior art, the technical problem to be solved by the utility model is: how to provide a chip's material taking adjusting device capable of accurately obtaining chip and adjusting chip to accurate position for substrate.
[0007] In order to solve the above technical problem, the utility model adopts the following technical scheme:
[0008] The utility model provides a kind of chip's material taking adjusting device, including installation base, material taking mechanism, adjusting mechanism and round crystal movement platform mechanism, the material taking mechanism, adjusting mechanism and round crystal movement platform mechanism are installed on the installation base, chip is placed on the round crystal movement platform mechanism, the material taking mechanism includes material taking rotary motor, material taking arm and material taking head, the material taking arm one end is connected with the material taking rotary motor, the material taking arm other end is connected with the material taking head, so that the material taking rotary motor can be rotated by the material taking arm and drive the material taking head rotation, the material taking head is used to obtain chip, chip is moved from the round crystal movement platform mechanism to the adjusting mechanism by the rotation of the material taking head;The adjusting mechanism includes transfer platform and adjusting motor, the transfer platform is used to place chip, the adjusting motor's rotating shaft is connected with the transfer platform, to drive the transfer platform rotation by the rotation of the adjusting motor, the transfer platform rotation adjusts the position of chip.
[0009] The working principle of the utility model is: chip is placed on round crystal movement platform mechanism, material taking rotary motor drives material taking head to rotate by material taking arm, when material taking head rotates to chip position, material taking head contacts and obtains chip, after material taking head obtains chip, material taking rotary motor drives the rotation of material taking head again by material taking arm, so that material taking head moves chip from round crystal movement platform mechanism to the transfer platform of adjusting mechanism. When material taking head moves chip to transfer platform, the position of chip may exist deviation at this time, the rotation of transfer platform is driven by adjusting motor at this time, the rotation of transfer platform is used to adjust the position of chip, ensure the accuracy of chip position, finally, chip is moved to substrate by external patch module and can be used.
[0010] Preferably, the round crystal movement platform mechanism includes a round crystal movement platform, a round crystal movement platform axial movement assembly, and a round crystal movement platform longitudinal movement assembly.
[0011] The round crystal movement platform is used to place the chip to be processed.
[0012] The round crystal movement platform axial movement assembly is used to drive the axial movement of the round crystal movement platform, and the round crystal movement platform longitudinal movement assembly is used to drive the longitudinal movement of the round crystal movement platform, so as to drive the axial and longitudinal movement of the chip through the round crystal movement platform.
[0013] Thus, the wafer motion platform is used to place the chip to be pasted, and the wafer motion platform axial motion assembly and the wafer motion platform longitudinal motion assembly are used to drive the wafer motion platform to move axially and longitudinally respectively, so that the position of the wafer motion platform can be adjusted, and the position of the chip on the wafer motion platform can be adjusted, thereby better meeting the use requirements in different situations.
[0014] Preferably, the taking mechanism is installed on the installation base through a taking vertical moving assembly, so that the taking mechanism can move vertically along the installation base.
[0015] Thus, the taking vertical moving assembly can realize the vertical movement of the taking mechanism, so that the taking mechanism can better adapt to the position of the wafer motion platform to obtain the chip.
[0016] Preferably, the taking mechanism further comprises a vertical fine adjustment assembly, the vertical fine adjustment assembly comprises a taking linear motor, a contact sensor and a preload adjusting screw, the taking linear motor is installed at one end of the taking arm close to the taking rotary motor, the taking linear motor is used to drive the taking arm to move vertically, the contact sensor is located at one end of the taking arm close to the taking head, the contact sensor sends a signal to the control mechanism of the taking linear motor when the taking head contacts the chip, so that the taking linear motor drives the taking head to move vertically through the taking arm when the taking head contacts the chip, and the taking head generates a set pressing force on the chip when picking up the chip; the preload adjusting screw is used to pre-adjust the position of the taking head.
[0017] Thus, the taking head needs to exert a certain force on the chip during the process of obtaining and moving the chip, and the vertical fine adjustment assembly is used to fine adjust the vertical position of the taking head to exert the force on the chip. When the taking head contacts the chip, the contact sensor obtains the information and transmits a signal to the control mechanism of the taking linear motor, so that the taking linear motor drives the taking head to move vertically through the taking arm, so as to meet the requirement of exerting a certain force on the chip by the taking head and ensure the stability of the taking head during the process of transferring the chip.
[0018] Preferably, the taking linear motor is arranged vertically, the stator of the taking linear motor is connected with the rotor of the taking rotary motor through a vertical base, so that the taking linear motor is driven to rotate synchronously by the taking rotary motor, and the taking arm is connected with the rotor of the taking linear motor through a vertical moving block, so that the taking arm is driven to move vertically by the rotor of the taking linear motor.
[0019] In this way, when the taking linear motor is in operation, the stator of the taking linear motor is fixed on the vertical base, and the rotor of the taking linear motor drives the taking arm to move vertically through the vertical moving block, and the taking arm further drives the taking head to move vertically.
[0020] Preferably, the adjusting mechanism further comprises an upper visual assembly of the transfer platform and a lower visual assembly of the transfer platform, the upper visual assembly of the transfer platform is located directly above the transfer platform and is used for collecting visual pictures of the chips on the transfer platform from directly above, and the lower visual assembly of the transfer platform is located directly below the transfer platform and is used for collecting visual pictures of the chips on the transfer platform from directly below.
[0021] In this way, by arranging the upper visual assembly of the transfer platform and the lower visual assembly of the transfer platform, the upper visual assembly of the transfer platform and the lower visual assembly of the transfer platform are used to collect visual pictures of the chips on the transfer platform respectively, the collected pictures can be further sent to the image processing program of the back end, the position of the chips can be judged by comparing the collected pictures with the standard pictures, when the collected pictures and the standard pictures have deviations, the rotation of the adjusting motor is controlled to drive the rotation of the transfer platform, and then the rotation of the transfer platform is used to adjust the position of the chips. BRIEF DESCRIPTION OF DRAWINGS
[0022] ATTACHED Figure 1 It is a structure schematic view of the dip-glue paster with the taking adjusting device of the chip of the utility model;
[0023] ATTACHED Figure 2 It is a structure schematic view of the circular crystal movement platform mechanism in the taking adjusting device of the chip of the utility model;
[0024] ATTACHED Figure 3 It is a structure schematic view of the taking mechanism in the taking adjusting device of the chip of the utility model;
[0025] ATTACHED Figure 4 It is a local enlarged schematic view of one visual angle of the position of the taking head in the taking adjusting device of the chip of the utility model;
[0026] ATTACHED Figure 5 It is a local enlarged schematic view of another visual angle of the position of the taking head in the taking mechanism in the taking adjusting device of the chip of the utility model;
[0027] ATTACHED Figure 6 It is a local enlarged schematic view of the position of the taking head in the taking mechanism in the taking adjusting device of the chip of the utility model;
[0028] ATTACHED Figure 7 It is a structure schematic view of the adjusting mechanism in the taking adjusting device of the chip of the utility model;
[0029] Figure 1 is a schematic view of a wafer motion platform mechanism according to the present application. Figure 8 For Figure 7 Figure 1 is a schematic view of a wafer motion platform mechanism according to the present application.
[0030] Reference signs: wafer motion platform mechanism 1, wafer motion platform 101, wafer motion platform longitudinal motion assembly 102, wafer motion platform axial motion assembly 103, material taking mechanism 2, material taking rotary motor 201, material taking linear motor 202, vertical moving block 203, homing spring 204, material taking arm 205, material taking head 206, pre-load adjusting screw 207, pre-load linear guide 208, contact sensor 209, vertical base 210, adjusting mechanism 3, adjusting motor 301, transfer platform 302. DETAILED DESCRIPTION
[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0032] As shown in Figure 1, it is a dip glue patch machine with the material taking adjusting device of the present application. Figure 1 The material taking adjusting device (material taking mechanism 2, adjusting mechanism 3 and wafer motion platform 101 mechanism 1) of the present application finally places the chip on the transfer platform 302 according to the accurate position, and then the chip on the transfer platform 302 is moved to the substrate by the patch component in the dip glue patch machine to perform patching.
[0033] Specifically, the present application provides a chip material taking adjusting device, which comprises a mounting base, a material taking mechanism 2, an adjusting mechanism 3 and a wafer motion platform mechanism 1. Figure 2 As shown in Figure 2, it is a structure schematic view of the wafer motion platform mechanism, and as shown in Figure 3, it is a structure schematic view of the material taking mechanism, and as shown in Figure 4, it is a structure schematic view of the adjusting mechanism. Figure 3 As shown in Figure 3, it is a structure schematic view of the material taking mechanism, and as shown in Figure 4, it is a structure schematic view of the adjusting mechanism. Figure 4 As shown in Figure 3, it is a structure schematic view of the material taking mechanism, and as shown in Figure 4, it is a structure schematic view of the adjusting mechanism. Figure 2 As shown in Figure 3, it is a structure schematic view of the material taking mechanism, and as shown in Figure 4, it is a structure schematic view of the adjusting mechanism. Figure 3As shown, the taking mechanism includes a taking rotary motor 201, a taking arm 205 and a taking head 206, one end of the taking arm 205 is connected with the taking rotary motor 201, the other end of the taking arm 205 is connected with the taking head 206, so that the taking rotary motor 201 can drive the taking head 206 to rotate through the taking arm 205 when rotating, the taking head 206 is used for obtaining the chip, and the chip is moved from the circular crystal motion platform mechanism to the adjusting mechanism through the rotation of the taking head 206; as shown in the accompanying drawings Figure 4 As shown, the adjusting mechanism includes a transfer platform 302 and an adjusting motor 301, the transfer platform 302 is used for placing the chip, and the rotating shaft of the adjusting motor 301 is connected with the transfer platform 302, so as to drive the transfer platform 302 to rotate through the rotation of the adjusting motor 301, and the rotation of the transfer platform 302 adjusts the position of the chip.
[0034] The working principle of the utility model is as follows: the chip is placed on the circular crystal motion platform mechanism, the taking rotary motor 201 drives the taking head 206 to rotate through the taking arm 205, when the taking head 206 rotates to the position of the chip, the taking head 206 contacts and obtains the chip, after the taking head 206 obtains the chip, the taking rotary motor 201 drives the rotation of the taking head 206 again through the taking arm 205, so that the taking head 206 moves the chip from the circular crystal motion platform mechanism to the transfer platform 302 of the adjusting mechanism. When the taking head 206 moves the chip to the transfer platform 302, the position of the chip may be deviated at this time, at this time, the transfer platform 302 is driven to rotate through the rotation of the adjusting motor 301, the position of the chip is adjusted through the rotation of the transfer platform 302, the accuracy of the position of the chip is ensured, finally, the chip is moved to the substrate by the external patch module and can be used.
[0035] As shown in the accompanying drawings Figure 2As shown, in the embodiment, the wafer motion platform mechanism comprises a wafer motion platform 101, a wafer motion platform axial motion assembly 103 and a wafer motion platform longitudinal motion assembly 102; the wafer motion platform 101 is used for placing the chip to be processed; the wafer motion platform axial motion assembly 103 is used for driving the wafer motion platform 101 to move axially, and the wafer motion platform longitudinal motion assembly 102 is used for driving the wafer motion platform 101 to move longitudinally, so as to drive the chip to move axially and longitudinally through the wafer motion platform 101. The wafer motion platform axial motion assembly 103 and the wafer motion platform longitudinal motion assembly 102 can both adopt the structure of a linear motor plus a linear guide rail, which belongs to the prior art and will not be discussed in detail in the present application. In this way, the wafer motion platform 101 is used for placing the chip to be processed, and the wafer motion platform axial motion assembly 103 and the wafer motion platform longitudinal motion assembly 102 are respectively used for driving the wafer motion platform 101 to move axially and longitudinally, so as to conveniently adjust the position of the wafer motion platform 101 and further adjust the position of the chip on the wafer motion platform 101, so as to better meet the use requirements under different conditions.
[0036] For example, as shown in FIG. 1, the wafer motion platform mechanism comprises a wafer motion platform 101, a wafer motion platform axial motion assembly 103 and a wafer motion platform longitudinal motion assembly 102; the wafer motion platform 101 is used for placing the chip to be processed; the wafer motion platform axial motion assembly 103 is used for driving the wafer motion platform 101 to move axially, and the wafer motion platform longitudinal motion assembly 102 is used for driving the wafer motion platform 101 to move longitudinally, so as to drive the chip to move axially and longitudinally through the wafer motion platform 101. The wafer motion platform axial motion assembly 103 and the wafer motion platform longitudinal motion assembly 102 can both adopt the structure of a linear motor plus a linear guide rail, which belongs to the prior art and will not be discussed in detail in the present application. In this way, the wafer motion platform 101 is used for placing the chip to be processed, and the wafer motion platform axial motion assembly 103 and the wafer motion platform longitudinal motion assembly 102 are respectively used for driving the wafer motion platform 101 to move axially and longitudinally, so as to conveniently adjust the position of the wafer motion platform 101 and further adjust the position of the chip on the wafer motion platform 101, so as to better meet the use requirements under different conditions. Figure 3 As shown, in the embodiment, the material taking mechanism is installed on the installation base through a material taking vertical moving assembly, so that the material taking mechanism can move vertically along the installation base. The overall vertical movement of the material taking mechanism can be realized through the material taking vertical moving assembly, so that the material taking mechanism can better adapt to the position of the wafer motion platform 101 mechanism to obtain the chip.
[0037] In the embodiment, the material taking mechanism further comprises a vertical fine adjustment assembly, which comprises a material taking linear motor 202, a contact sensor 209, a preload adjusting screw 207 and a preload linear guide rail 208. The material taking linear motor 202 is installed on one end of the material taking arm 205 close to the material taking rotary motor 201, and is used for driving the material taking arm 205 to move vertically and finely. A homing spring 204 is further arranged on the vertical moving block 203. The contact sensor 209 is located on one end of the material taking arm 205 close to the material taking head 206, and sends a signal to the control mechanism of the material taking linear motor 202 when the material taking head 206 contacts the chip, so that the material taking linear motor 202 drives the material taking head 206 to move vertically and finely through the material taking arm 205 when the material taking head 206 contacts the chip, and the material taking head 206 generates a set pressing force on the chip when picking up the chip. The preload adjusting screw 207 is used for pre-adjusting the position of the material taking head 206.
[0038] In this way, the chip taking head 206 needs to exert a certain force on the chip during the process of taking and moving the chip, and therefore the present scheme adjusts the vertical position of the chip taking head 206 by the vertical fine adjustment assembly to achieve the effect of exerting a force on the chip. When the chip taking head 206 is in contact with the chip, the contact sensor 209 obtains this information and transmits a signal to the control mechanism of the chip taking linear motor 202, so that the chip taking linear motor 202 drives the chip taking arm 205 to move the chip taking head 206 in the vertical fine adjustment movement, so as to meet the requirement of exerting a certain force on the chip by the chip taking head 206 and ensure the stability of the chip taking head 206 during the process of transferring the chip.
[0039] In the present embodiment, the chip taking linear motor 202 is arranged vertically, and the stator of the chip taking linear motor 202 is connected to the rotor of the chip taking rotary motor 201 through the vertical base 210, so as to drive the chip taking linear motor 202 to rotate synchronously by the chip taking rotary motor 201, and the chip taking arm 205 is connected to the rotor of the chip taking linear motor 202 through the vertical moving block 203, so as to drive the chip taking arm 205 to move vertically by the rotor of the chip taking linear motor 202.
[0040] In this way, when the chip taking linear motor 202 is running, the stator of the chip taking linear motor 202 is fixed on the vertical base 210, while the rotor of the chip taking linear motor 202 drives the chip taking arm 205 to move vertically through the vertical moving block 203, and the chip taking arm 205 further drives the chip taking head 206 to move vertically.
[0041] In the present embodiment, the adjusting mechanism further comprises an upper visual assembly of the transfer platform and a lower visual assembly of the transfer platform, the upper visual assembly of the transfer platform is located directly above the transfer platform 302 and is used to collect visual pictures of the chips on the transfer platform 302 from directly above, and the lower visual assembly of the transfer platform is located directly below the transfer platform 302 and is used to collect visual pictures of the chips on the transfer platform 302 from directly below.
[0042] In this way, by arranging the upper visual assembly of the transfer platform and the lower visual assembly of the transfer platform, the upper visual assembly of the transfer platform and the lower visual assembly of the transfer platform are respectively used to collect visual pictures of the chips on the transfer platform 302, and the collected pictures can be further sent to the image processing program of the backend, and by comparing the collected pictures with the standard pictures, the position of the chip can be judged, and when there is a deviation between the collected pictures and the standard pictures, the rotation of the adjusting motor 301 is controlled to drive the rotation of the transfer platform 302, and then the rotation of the transfer platform 302 is used to adjust the position of the chip.
[0043] Finally, it needs to be explained that the above examples are only used to illustrate the technical solutions of the present application, but not to limit the technical solutions, and those of ordinary skill in the art should understand that those who modify or equivalently replace the technical solutions of the present application without departing from the purpose and scope of the present application should be covered in the scope of the claims of the present application.
Claims
1. A chip pick-up conditioning device, characterized by The device comprises a mounting base, a material taking mechanism, an adjusting mechanism and a circular crystal movement platform mechanism, the material taking mechanism, the adjusting mechanism and the circular crystal movement platform mechanism are all installed on the mounting base, the chip is placed on the circular crystal movement platform mechanism, the material taking mechanism comprises a material taking rotary motor, a material taking arm and a material taking head, one end of the material taking arm is connected with the material taking rotary motor, the other end of the material taking arm is connected with the material taking head, so that the material taking rotary motor can drive the material taking head to rotate through the material taking arm when the material taking rotary motor rotates, the material taking head is used for obtaining the chip, and the chip is moved from the circular crystal movement platform mechanism to the adjusting mechanism through the rotation of the material taking head; the adjusting mechanism comprises a transfer platform and an adjusting motor, the transfer platform is used for placing the chip, and the rotating shaft of the adjusting motor is connected with the transfer platform, so that the transfer platform is driven to rotate through the rotation of the adjusting motor, and the position of the chip is adjusted through the rotation of the transfer platform.
2. The chip pick-up conditioning device of claim 1, wherein, The circular crystal movement platform mechanism comprises a circular crystal movement platform, a circular crystal movement platform axial movement assembly and a circular crystal movement platform longitudinal movement assembly; The circular crystal movement platform is used for placing the chip to be taken; The circular crystal movement platform axial movement assembly is used for driving the circular crystal movement platform to move axially, and the circular crystal movement platform longitudinal movement assembly is used for driving the circular crystal movement platform to move longitudinally, so that the chip is driven to move axially and longitudinally through the circular crystal movement platform.
3. The chip pick-up conditioning device of claim 1, wherein, The material taking mechanism is installed on the mounting base through a material taking vertical movement assembly, so that the material taking mechanism can move vertically along the mounting base.
4. The chip pick-up adjustment device of claim 1, wherein The material taking mechanism further comprises a vertical fine adjustment assembly, the vertical fine adjustment assembly comprises a material taking linear motor, a contact sensor and a preloading adjusting screw, the material taking linear motor is installed at one end of the material taking arm close to the material taking rotary motor, the material taking linear motor is used for driving the material taking arm to move in vertical fine adjustment, the contact sensor is located at the other end of the material taking arm close to the material taking head, the contact sensor sends a signal to the control mechanism of the material taking linear motor when the material taking head contacts the chip, so that the material taking linear motor drives the material taking head to move in vertical fine adjustment through the material taking arm when the material taking head contacts the chip, and the material taking head generates a set pressing force on the chip when the chip is picked up; and the preloading adjusting screw is used for pre-adjusting the position of the material taking head.
5. The chip pick-up adjustment device according to claim 4, wherein The material taking linear motor is arranged vertically, the stator of the material taking linear motor is connected with the rotor of the material taking rotary motor through a vertical base, so that the material taking linear motor is driven to rotate synchronously through the material taking rotary motor, and the material taking arm is connected with the rotor of the material taking linear motor through a vertical moving block, so that the material taking arm is driven to move in vertical fine adjustment through the rotor of the material taking linear motor.
6. The chip pick-up adjustment device of claim 1, wherein The adjusting mechanism further comprises an upper visual assembly of the transfer platform and a lower visual assembly of the transfer platform, the upper visual assembly of the transfer platform is located directly above the transfer platform and is used for collecting visual pictures of the chips on the transfer platform from directly above, and the lower visual assembly of the transfer platform is located directly below the transfer platform and is used for collecting visual pictures of the chips on the transfer platform from directly below.