Heat dissipation structure and power device heat dissipation module
By setting heat dissipation denticles on a recessed surface in the heat dissipation structure, the problem of low heat dissipation efficiency in the prior art is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202423152112.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2034-12-19
AI Technical Summary
In the existing technology, water-cooled plates with rhomboid or elliptical tooth shapes cannot fully utilize their heat dissipation effect, resulting in low heat dissipation efficiency.
Multiple heat dissipation teeth are provided in the heat dissipation structure. Each heat dissipation tooth protrudes from the first plate and at least one surface is recessed inward to increase the contact area between the heat dissipation medium and the heat dissipation teeth.
The increased contact area between the heat dissipation medium and the heat dissipation fins improves heat dissipation efficiency and capacity.
Smart Images
Figure CN223816407U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation structure technology, and in particular to a heat dissipation structure and a heat dissipation module for power devices. Background Technology
[0002] Currently, water-cooled plates with multiple serrations are commonly used to dissipate heat from high-heat-generating power devices. However, in related technologies, the tooth shape is usually rhomboid or elliptical, which cannot fully utilize the optimal heat dissipation effect of the toothed plates, resulting in low heat dissipation efficiency. Utility Model Content
[0003] This application provides a heat dissipation structure and a power device heat dissipation module, which can help improve the heat dissipation efficiency of the heat dissipation structure and the power device heat dissipation module.
[0004] In a first aspect, embodiments of this application provide a heat dissipation structure, which includes: a first plate and heat dissipation teeth, the heat dissipation teeth being disposed on one side of the first plate, the other side of the first plate being thermally coupled to a power device, any heat dissipation tooth protruding from the first plate, and at least one surface of at least one heat dissipation tooth being recessed inward.
[0005] The technical solution of this application adopts a method of setting multiple heat dissipation teeth in the heat dissipation structure, with any heat dissipation tooth protruding from the first plate and at least one surface of at least one heat dissipation tooth being recessed inward. Compared with rhomboid or elliptical heat dissipation teeth, when the heat dissipation medium flows through the heat dissipation teeth, it is beneficial to increase the heat dissipation contact area between the heat dissipation medium and the heat dissipation teeth, thereby improving the heat dissipation efficiency and heat dissipation capacity of the heat dissipation structure.
[0006] According to the aforementioned embodiments of the first aspect of this application, the heat dissipation structure includes a plurality of heat dissipation teeth, which are arranged in an array on the first plate.
[0007] According to the aforementioned embodiments of the first aspect of this application, the array of multiple heat dissipation teeth includes: a first heat dissipation tooth and a second heat dissipation tooth, the first heat dissipation tooth and the second heat dissipation tooth are arranged adjacent to each other, at least one surface of the first heat dissipation tooth is a concave surface, at least one surface of the second heat dissipation tooth is a convex surface, and the concave surface and the convex surface are arranged opposite to each other.
[0008] Secondly, embodiments of this application provide a power device heat dissipation module, which includes: a cover plate and a heat dissipation structure according to any of the foregoing embodiments of the first aspect of this application, wherein a receiving cavity is provided between the cover plate and the first plate body, and the receiving cavity can accommodate a heat dissipation medium.
[0009] The technical scheme of the present application sets the heat dissipation structure in the power device heat dissipation module, sets multiple heat dissipation teeth in the heat dissipation structure, any heat dissipation tooth protrudes from the first plate body, and at least one surface of at least one heat dissipation tooth is recessed inward, compared with the rhombic or elliptical heat dissipation tooth, when the heat dissipation medium flows through the heat dissipation tooth, the heat dissipation medium and the heat dissipation tooth are beneficial to improve the heat dissipation contact area, thereby being beneficial to improve the heat dissipation efficiency and heat dissipation capacity of the power device.
[0010] According to the foregoing embodiment of the second aspect of the present application, the accommodation cavity includes a first region and a second region, the distance between the end face of the heat dissipation tooth away from the first plate body and the inner surface of the cover plate in the first region is greater than the distance between the end face of the heat dissipation tooth away from the first plate body and the inner surface of the cover plate in the second region.
[0011] According to the foregoing embodiment of the second aspect of the present application, the forming mode of the distance includes that the cover plate has a first step surface and a second step surface, the distance between the heat dissipation tooth in the first region and the first step surface is greater than the distance between the heat dissipation tooth in the second region and the second step surface; or, the length of the heat dissipation tooth in the first region is greater than the length of the heat dissipation tooth in the second region; or, the first plate body has a third step surface and a fourth step surface, the distance between the heat dissipation tooth on the third step surface and the cover plate is greater than the distance between the heat dissipation tooth on the fourth step surface and the cover plate.
[0012] According to the foregoing embodiment of the second aspect of the present application, the tooth arrangement density of the heat dissipation tooth in the first region is greater than the tooth arrangement density of the heat dissipation tooth in the second region.
[0013] According to the foregoing embodiment of the second aspect of the present application, the first plate body includes multiple water channels arranged in parallel, the heat dissipation medium can flow in the water channel to dissipate heat for the power device, and the adjacent two water channels have a partition plate.
[0014] According to the foregoing embodiment of the second aspect of the present application, the accommodation cavity includes a third region, and the heat dissipation structure further includes multiple third heat dissipation teeth, and the multiple third heat dissipation teeth dissipate heat for the third region.
[0015] According to the foregoing embodiment of the second aspect of the present application, the third heat dissipation tooth has an elliptical cross section. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is a structural schematic diagram of an embodiment of the heat dissipation structure of the present application;
[0017] Figure 2 It is a structural schematic diagram of an embodiment of the heat dissipation structure of the present application; Figure 1 It is a local enlarged view of A in FIG. 4;
[0018] Figures 3A-3D It is a schematic diagram of the first heat dissipation tooth and the second heat dissipation tooth in other embodiments of the heat dissipation structure of the present application;
[0019] Figure 4 A top view of an embodiment of the power device heat dissipation module of the present application;
[0020] Figure 5 A top view of an embodiment of the power device heat dissipation module of the present application; Figure 4 A cross-sectional view of the structure of the A-A plane in the embodiment of the power device heat dissipation module of the present application;
[0021] Figure 6 A schematic view of the first plate in another embodiment of the power device heat dissipation module of the present application;
[0022] Figure 7 A schematic view of the first plate in another embodiment of the power device heat dissipation module of the present application;
[0023] Figure 8 A bottom view of an embodiment of the power device heat dissipation module of the present application.
[0024] BRIEF DESCRIPTION OF THE DRAWINGS
[0025] First plate-100, heat dissipation tooth-200, cover plate-300, accommodating cavity-400;
[0026] Third step surface-110, fourth step surface-120, water channel-130, partition-140, liquid inlet-150, liquid outlet-160, first heat dissipation tooth-210, second heat dissipation tooth-220, third heat dissipation tooth-230, first step surface-310, second step surface-320, first region-410, second region-420, third region-430;
[0027] Recessed surface-S1, convex surface-S2. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.
[0029] It should be noted that all directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directionality indications also change accordingly.
[0030] In addition, the descriptions involving "first", "second" and the like in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor within the protection scope required by the present application.
[0031] The embodiment of the present application provides a heat dissipation structure and a power device heat dissipation module, which can improve the heat dissipation efficiency of the heat dissipation structure and the power device heat dissipation module.
[0032] As shown in Figure 1 The embodiment of the present application provides a heat dissipation structure, which comprises: a first plate body 100 and a heat dissipation tooth 200, the heat dissipation tooth 200 is arranged on one side of the first plate body 100, the other side of the first plate body 100 is thermally coupled with a power device, and the power device can include an Insulate-Gate Bipolar Transistor (IGBT). Any heat dissipation tooth 200 protrudes from the first plate body 100, and at least one surface of at least one heat dissipation tooth 200 is recessed inward.
[0033] The technical scheme of the present application adopts the arrangement of multiple heat dissipation teeth 200 in the heat dissipation structure, any heat dissipation tooth 200 protrudes from the first plate body 100, and at least one surface of at least one heat dissipation tooth 200 is recessed inward. Compared with the outward protruding arrangement of the outer surface of the rhombus or oval heat dissipation tooth 200, by arranging the at least one surface of the heat dissipation tooth 200 to be recessed inward, when the heat dissipation medium flows through the heat dissipation tooth 200, the recessed surface can improve the heat dissipation contact area between the heat dissipation medium and the heat dissipation tooth 200, thereby improving the heat dissipation efficiency and heat dissipation capacity of the heat dissipation structure.
[0034] As shown in Figures 1-2 The heat dissipation structure comprises multiple heat dissipation teeth 200, and the multiple heat dissipation teeth 200 are arranged in an array on the first plate body 100. The multiple heat dissipation teeth 200 arranged in an array comprise: a first heat dissipation tooth 210 and a second heat dissipation tooth 220, the first heat dissipation tooth 210 and the second heat dissipation tooth 220 are arranged adjacent to each other, at least one surface of the first heat dissipation tooth 210 is a recessed surface S1, at least one surface of the second heat dissipation tooth 220 is a protruding surface S2, and the recessed surface S1 and the protruding surface S2 are arranged oppositely.
[0035] It is understood that, preferably, the second heat dissipation tooth 220 can have the same shape as the first heat dissipation tooth 210, such as... Figure 2 , Figures 3B-3D As shown, both the second heat dissipation tooth 220 and the first heat dissipation tooth 210 have a concave surface S1. When the heat dissipation medium flows through the first heat dissipation tooth 210 and the second heat dissipation tooth 220, the concave surface S1 can help increase the heat dissipation contact area between the heat dissipation medium and the first heat dissipation tooth 210 and the second heat dissipation tooth 220, thereby helping to improve the heat dissipation efficiency and heat dissipation capacity of the heat dissipation structure.
[0036] In other embodiments, the second heat dissipation tooth 220 may also have a protruding surface S2 that protrudes from the recessed surface S1 of the first heat dissipation tooth 210, such as... Figures 3A-3B As shown, the location of the recessed surface of the first heat dissipation tooth 210 is not limited. By setting at least one surface of the first heat dissipation tooth 210 to be recessed inward, it is beneficial to increase the heat dissipation contact area between the heat dissipation medium and the heat dissipation tooth 200 when the heat dissipation medium flows through the heat dissipation tooth 200, thereby improving the heat dissipation efficiency and heat dissipation capacity of the heat dissipation structure.
[0037] It is understood that the accompanying drawings only show some optional embodiments of this application. The specific structural forms of the first heat dissipation tooth 210 and the second heat dissipation tooth 220 are not limited, as long as the first heat dissipation tooth 210 includes at least one recessed surface S1.
[0038] like Figure 4 As shown, this application embodiment also provides a power device heat dissipation module, which includes: a cover plate 300 and a heat dissipation structure according to any of the foregoing embodiments of this application, such as... Figure 5 As shown, a receiving cavity 400 is provided between the cover plate 300 and the first plate 100, and the receiving cavity 400 can accommodate a heat dissipation medium. Figure 1 As shown, this application embodiment provides a heat dissipation structure, which includes: a first plate 100 and heat dissipation teeth 200. The heat dissipation teeth 200 are disposed on one side of the first plate 100, and the other side of the first plate 100 is thermally coupled to a power device. Any heat dissipation tooth 200 protrudes from the first plate 100, and at least one surface of at least one heat dissipation tooth 200 is recessed inward.
[0039] The technical solution of this application adopts a heat dissipation structure in the heat dissipation module of the power device. The heat dissipation structure is provided with multiple heat dissipation teeth 200. Each heat dissipation tooth 200 protrudes from the first plate 100, and at least one surface of at least one heat dissipation tooth 200 is recessed inward. Compared with the rhomboid or elliptical heat dissipation teeth 200, the recessed surface S1 is beneficial to increasing the heat dissipation contact area between the heat dissipation medium and the heat dissipation tooth 200 when the heat dissipation medium flows through the heat dissipation tooth 200, thereby improving the heat dissipation efficiency and heat dissipation capacity of the power device.
[0040] As shown in Figure 5 The accommodating cavity 400 includes a first region 410 and a second region 420, the first region 410 corresponds to the upper bridge region of the power device, and the second region 420 corresponds to the lower bridge region of the power device. Since the heat generated by the upper bridge region of the power device is greater than the heat generated by the lower bridge region, the distance between the end face of the heat dissipation fin 200 away from the first plate body 100 and the inner surface of the cover plate 300 in the first region 410 can be greater than the distance between the end face of the heat dissipation fin 200 away from the first plate body 100 and the inner surface of the cover plate 300 in the second region 420. By increasing the distance between the end face of the heat dissipation fin 200 away from the first plate body 100 and the inner surface of the cover plate 300 in the first region 410, the flow rate of the heat dissipation medium in the first region 410 can be increased, and the heat dissipation efficiency of the first region 410 can be improved, thereby achieving better heat dissipation effect.
[0041] As shown in Figure 5 In an embodiment, the cover plate 300 has a first step surface 310 and a second step surface 320. The distance between the heat dissipation fin 200 in the first region 410 and the first step surface 310 is greater than the distance between the heat dissipation fin 200 in the second region 420 and the second step surface 320. Therefore, the distance between the end face of the heat dissipation fin 200 away from the first plate body 100 and the inner surface of the cover plate 300 in the first region 410 is greater than the distance between the end face of the heat dissipation fin 200 away from the first plate body 100 and the inner surface of the cover plate 300 in the second region 420. Therefore, the flow rate of the heat dissipation medium in the first region 410 can be increased, and the heat dissipation efficiency of the first region 410 can be improved, thereby achieving better heat dissipation effect.
[0042] As shown in Figure 6 In another embodiment, the length of the heat dissipation fin 200 in the first region 410 is greater than the length of the heat dissipation fin 200 in the second region 420. Therefore, the distance between the end face of the heat dissipation fin 200 away from the first plate body 100 and the inner surface of the cover plate 300 in the first region 410 is greater than the distance between the end face of the heat dissipation fin 200 away from the first plate body 100 and the inner surface of the cover plate 300 in the second region 420. Therefore, the flow rate of the heat dissipation medium in the first region 410 can be increased, and the heat dissipation efficiency of the first region 410 can be improved, thereby achieving better heat dissipation effect.
[0043] As shown in Figure 7As shown, in another embodiment, the first plate 100 has a third stepped surface 110 and a fourth stepped surface 120. The distance between the heat dissipation teeth 200 on the third stepped surface 110 and the cover plate 300 is greater than the distance between the heat dissipation teeth 200 on the fourth stepped surface 120 and the cover plate 300. This makes the distance between the end face of the heat dissipation teeth 200 away from the first plate 100 and the inner surface of the cover plate 300 in the first region 410 greater than the distance between the end face of the heat dissipation teeth 200 away from the first plate 100 and the inner surface of the cover plate 300 in the second region 420. This can increase the flow rate of the heat dissipation medium in the first region 410, thereby improving the heat dissipation efficiency of the first region 410 and achieving a better heat dissipation effect.
[0044] It should be noted that the method of forming the gap includes, but is not limited to, the above-mentioned content. Those skilled in the art can determine the method of forming the gap according to actual needs, so as to achieve that the flow rate of the heat dissipation medium in the first region 410 is greater than the flow rate in the second region 420, thereby improving the heat dissipation efficiency of the first region 410 and achieving a better heat dissipation effect.
[0045] It is understandable that by setting the tooth arrangement density of the heat dissipation teeth 200 in the first region 410 to be greater than that in the second region 420, the flow rate of the heat dissipation medium in the first region 410 can be greater than that in the second region 420, thereby improving the heat dissipation efficiency of the first region 410 and achieving a better heat dissipation effect.
[0046] like Figure 1 As shown, the first plate 100 includes multiple parallel water channels 130. A heat dissipation medium can flow within the water channels 130 to dissipate heat from the power devices. A partition 140 separates adjacent water channels 130. By arranging multiple water channels 130 in parallel, the heat dissipation medium can be evenly distributed across different heat source areas, maintaining a balanced heat dissipation efficiency. This reduces the flow resistance of the heat dissipation medium and helps to make the temperatures of the upper and lower bridge regions of the power devices similar, thereby improving heat dissipation efficiency and capability.
[0047] like Figure 8 As shown, the first plate 100 also includes an inlet 150 and an outlet 160. The inlet 150 and the outlet 160 are located on the left and right sides of the first plate 100, respectively. The inlet 150 is located in the first region 410, and the outlet 160 is located in the second region 420. The inlet 150 and the outlet 160 are arranged diagonally. When the heat dissipation medium flows out from the outlet 160, it is beneficial to increase the flow rate of the heat dissipation medium to the outlet 160, which is beneficial to achieving a uniform heat dissipation effect.
[0048] Preferably, the edges of the heat dissipation teeth 200 are arranged in a streamlined manner to facilitate the reduction of resistance when the heat dissipation medium flows in the water channel 130, thereby optimizing the flow rate. The gap between the adjacent first heat dissipation teeth 210 and the second heat dissipation teeth 220 is greater than 0.9 mm, which ensures smooth flow of the heat dissipation medium while increasing the number of the first heat dissipation teeth 210 and the second heat dissipation teeth 220 on the first plate body 100 with limited space, thereby facilitating the increase of the heat dissipation contact area between the heat dissipation medium and the first heat dissipation teeth 210, and improving the heat dissipation efficiency and the heat dissipation capacity. In addition, during the production and processing of the heat dissipation structure, the distance between the first heat dissipation teeth 210 and the second heat dissipation teeth 220 can be set in advance on the processing mold of the first plate body 100, so as to process and produce the heat dissipation structure in batches, which meets the actual production requirements and improves the production efficiency.
[0049] As shown in Figures 6-7 , the accommodation cavity 400 includes a third region 430 corresponding to the non-heat source region of the power device, and the heat dissipation structure further includes a plurality of third heat dissipation teeth 230 for dissipating heat from the third region 430, and the cross section of the third heat dissipation teeth 230 is in an elliptical shape. In an embodiment, as shown in Figure 1 , the tooth arrangement density of the third heat dissipation teeth 230 is less than that of the first heat dissipation teeth 210 and the second heat dissipation teeth 220, and it can be understood that the number of the first heat dissipation teeth 210 and the second heat dissipation teeth 220 is also greater than that of the third heat dissipation teeth 230, so that the heat dissipation effect of the heat source region is better than that of the non-heat source region, thereby improving the heat dissipation efficiency of the heat source region and achieving better overall heat dissipation effect. Those skilled in the art can also set the cross-sectional area of the third heat dissipation teeth 230 to be rhombic, square, etc. according to actual needs, so as to optimize the heat dissipation effect of the non-heat source region.
[0050] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation based on the inventive concept of the present application, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.
Claims
1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: First plate (100); and Heat dissipation teeth (200) are disposed on one side of the first plate (100), and the other side of the first plate (100) is thermally coupled to the power device. Any heat dissipation tooth (200) is disposed protruding from the first plate (100), and at least one surface of at least one heat dissipation tooth (200) is recessed inward.
2. The heat dissipation structure as described in claim 1, characterized in that, The heat dissipation structure includes a plurality of heat dissipation teeth (200), which are arranged in an array on the first plate (100).
3. The heat dissipation structure as described in claim 2, characterized in that, The array of multiple heat dissipation teeth (200) includes: The first heat dissipation tooth (210) and the second heat dissipation tooth (220) are arranged adjacent to each other. At least one surface of the first heat dissipation tooth (210) is a concave surface (S1), and at least one surface of the second heat dissipation tooth (220) is a convex surface (S2). The concave surface (S1) and the convex surface (S2) are arranged opposite to each other.
4. A heat dissipation module for power devices, characterized in that, The power device heat dissipation module includes: Cover plate (300); and According to any one of claims 1 to 3, the heat dissipation structure has a receiving cavity (400) between the cover plate (300) and the first plate (100), and the receiving cavity (400) can contain a heat dissipation medium.
5. The power device heat dissipation module as described in claim 4, characterized in that, The receiving cavity (400) includes a first region (410) and a second region (420). The distance between the end face of the heat dissipation tooth (200) away from the first plate (100) and the inner surface of the cover plate (300) in the first region (410) is greater than the distance between the end face of the heat dissipation tooth (200) away from the first plate (100) and the inner surface of the cover plate (300) in the second region (420).
6. The power device heat dissipation module as described in claim 5, characterized in that, The method of forming the spacing includes: The cover plate (300) has a first stepped surface (310) and a second stepped surface (320), and the distance between the heat dissipation tooth (200) in the first region (410) and the first stepped surface (310) is greater than the distance between the heat dissipation tooth (200) in the second region (420) and the second stepped surface (320). Alternatively, the length of the heat dissipation teeth (200) in the first region (410) is greater than the length of the heat dissipation teeth (200) in the second region (420); Alternatively, the first plate (100) has a third step surface (110) and a fourth step surface (120), wherein the distance between the heat dissipation teeth (200) on the third step surface (110) and the cover plate (300) is greater than the distance between the heat dissipation teeth (200) on the fourth step surface (120) and the cover plate (300).
7. The power device heat dissipation module as described in claim 5, characterized in that, The tooth arrangement density of the heat dissipation teeth (200) in the first region (410) is greater than that of the heat dissipation teeth (200) in the second region (420).
8. The power device heat dissipation module as described in claim 5, characterized in that, The first plate (100) includes multiple parallel water channels (130), and a heat dissipation medium can flow in the water channels (130) to dissipate heat from the power devices. There is a partition (140) between two adjacent water channels (130).
9. The power device heat dissipation module as described in claim 4, characterized in that, The cavity (400) includes a third region (430), and the heat dissipation structure further includes a plurality of third heat dissipation teeth (230), which dissipate heat to the third region (430).
10. The power device heat dissipation module as described in claim 9, characterized in that, The cross-section of the third heat dissipation tooth (230) is elliptical.