Power supply chip with heat dissipation structure

Abstract

The utility model discloses a power supply chip with a heat dissipation structure, and relates to the technical field of electronic components. Comprising a plastic package shell, a lead frame is installed in the plastic package shell, pins are arranged on the two sides of the lead frame, a bonding pad is arranged on the lead frame, a power supply wafer is welded to the bonding pad, an inner vapor chamber is installed at the bottom of the bonding pad, and a heat conduction copper sheet is embedded in the bottom of the plastic package shell. The top of the heat conduction copper sheet is attached to the bottom of the inner vapor chamber through heat conduction paste. According to the power supply chip with the heat dissipation structure, the inner vapor chamber is arranged at the bottom of the bonding pad of the lead frame, the outer vapor chamber is arranged at the top of the plastic package shell, according to the heat dissipation characteristic of the vapor chamber, heat generated during operation of the power supply wafer can be uniformly distributed, local overheating is prevented, the safety of the power supply wafer can be improved, and the service life of the power supply wafer can be prolonged. The heat is conducted to the external environment through the heat-conducting medium, so that rapid diffusion of the heat is realized, and optimization of the overall heat dissipation efficiency of the chip is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component technical field, concretely is a power supply chip with heat dissipation structure. BACKGROUND

[0002] As the key component of electronic equipment, the core function of power supply chip is to accurately control voltage and current to ensure stable operation of the equipment. It can not only stabilize the unstable power supply voltage to the required value, but also realize the conversion from high voltage to low voltage, improve the power supply efficiency, and provide overcurrent and overvoltage protection for the equipment. It is widely used in various electronic equipment such as smart phones, notebooks, tablets, televisions, and new energy fields such as electric vehicles and energy storage batteries. It is an indispensable basic component in modern electronic industry.

[0003] The power supply chip needs to provide voltage to various module circuits. The power supply chip will generate a large amount of heat. If the heat dissipation is not good, the high temperature environment will cause electromagnetic interference between the various module circuits connected to the power supply chip, the signal frequency of the various module circuits will be reduced, and various problems will occur. SUMMARY

[0004] The utility model provides a power supply chip with heat dissipation structure to solve the problem in the background art.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: a power supply chip with heat dissipation structure, comprising a plastic sealing shell, a lead frame is installed in the plastic sealing shell, and pins are arranged on both sides of the lead frame, a solder pad is arranged on the lead frame, and a power supply chip is welded on the solder pad, an inner heat plate is installed at the bottom of the solder pad, a heat-conducting copper sheet is embedded at the bottom of the plastic sealing shell, the top of the heat-conducting copper sheet is matched with the bottom of the inner heat plate through heat-conducting paste, a heat-conducting silica gel sheet is pasted on the top of the power supply chip, and an outer heat plate is embedded at the top of the plastic sealing shell, and the bottom of the outer heat plate is matched with the top of the heat-conducting silica gel sheet.

[0006] Further, the lower part of the lead frame is provided with a hollow cavity, and the inner heat plate is installed in the hollow cavity.

[0007] Further, the two side walls of the plastic sealing shell are provided with a clearance, and the pins extend outward from the clearance.

[0008] Further, the bottom of the plastic sealing shell is provided with a first stepped opening, and the heat-conducting copper sheet is embedded in the first stepped opening.

[0009] Further, the bottom of the heat-conducting copper sheet protrudes from the bottom of the plastic sealing shell, and the bottom of the heat-conducting copper sheet is flush with the bottom of the pin.

[0010] Further, the top of the plastic sealing shell is provided with a second stepped opening, the outer heat plate is embedded in the second stepped opening, and the top of the outer heat plate protrudes from the top of the plastic sealing shell.

[0011] Compared with the prior art, the power chip with the heat dissipation structure has the following beneficial effects:

[0012] The power chip with the heat dissipation structure is provided with the inner heat plate at the bottom of the pad of the lead frame and the outer heat plate at the top of the plastic sealing shell, and according to the heat dissipation characteristics of the heat plate, the heat generated during the operation of the power chip can be evenly distributed, local overheating is prevented, the safety and service life of the power chip are improved, the heat is conducted to the external environment through the heat conduction medium, the rapid diffusion of the heat is realized, and the overall heat dissipation efficiency of the chip is optimized. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 It is a structural schematic view of the utility model;

[0014] Fig. 2 It is a side view of the utility model;

[0015] Fig. 3 It is a top view of the utility model.

[0016] In the drawing: 1, plastic sealing shell; 2, lead frame; 3, pin; 4, pad; 5, power chip; 6, inner heat plate; 7, heat conduction copper sheet; 8, heat conduction silica gel sheet; 9, outer heat plate; 10, hollow cavity; 11, accommodation opening; 12, first stepped opening; 13, second stepped opening. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0018] Please refer to Figs. 1-3The utility model discloses a power supply chip with heat dissipation structure, including plastic package shell 1, the plastic package shell 1 is installed with lead frame 2, and the both sides of lead frame 2 are equipped with pin 3, be equipped with pad 4 on lead frame 2, and pad 4 is welded with power supply wafer 5, the bottom of pad 4 is installed with inner heat plate 6, the bottom of plastic package shell 1 is embedded with heat conduction copper sheet 7, and the top of heat conduction copper sheet 7 is pasted with the bottom of inner heat plate 6 through heat conduction paste, the top of power supply wafer 5 is pasted with heat conduction silica gel piece 8, the top of plastic package shell 1 is embedded with outer heat plate 9, and the bottom of outer heat plate 9 is pasted with the top of heat conduction silica gel piece 8, set up inner heat plate 6 in the bottom of pad 4 of lead frame 2, set up outer heat plate 9 in the top of plastic package shell 1, according to the heat dissipation characteristic of heat plate, it can evenly distribute the heat of power supply wafer 5 when operating, prevent local overheating, help to improve the security and service life of power supply wafer 5, through heat conduction medium, heat is conducted to the outside environment, realizes the rapid diffusion of heat, is favorable to optimizing the overall heat dissipation efficiency of chip.

[0019] Specifically, the lower part of the lead frame 2 is provided with a hollow cavity 10, and the inner heat plate 6 is installed in the hollow cavity 10.

[0020] In the embodiment, the lead frame 2 serves as a chip carrier of an integrated circuit, is a key structural member for realizing electrical connection between an internal circuit lead-out end of a chip and an external lead by means of a bonding material (gold wire, aluminum wire, copper wire), and forms an electrical loop. The lead frame 2 plays a role of a bridge for connecting with an external wire. The main role of the inner heat plate 6 is to realize efficient heat transfer through liquid-vapor phase change. The inner heat plate 6 has a vacuum cavity and a microstructure on the inner wall, is usually made of a high-thermal-conductivity material such as copper, and when heat acts on a heat source, the cooling liquid in the cavity evaporates into vapor under the heat, the vapor rapidly diffuses to a relatively cold area and condenses into liquid to release heat, and the condensed liquid returns to the heat source through capillary action to complete a cycle, thereby realizing efficient heat transfer.

[0021] Specifically, the both side walls of the plastic package shell 1 are provided with a clearance 11, and the pin 3 extends outward from the clearance 11.

[0022] In the embodiment, the clearance 11 is designed to avoid the pin 3, so as to facilitate use of the pin 3. The main function of the pin 3 is to realize electrical connection between the chip and the external world and to transmit electrical signals of the chip to an external circuit or device.

[0023] Specifically, the bottom of the plastic package shell 1 is provided with a first stepped opening 12, and the heat conduction copper sheet 7 is embedded in the first stepped opening 12.

[0024] In the embodiment, the first stepped opening 12 is a mounting structure for mounting and fixing the heat-conducting copper sheet 7, which is a material for heat dissipation of various electronic devices and mainly functions to improve heat dissipation effect and protect the device.

[0025] Specifically, the bottom of the heat-conducting copper sheet 7 protrudes from the bottom of the plastic package shell 1, and the bottom of the heat-conducting copper sheet 7 is flush with the bottom of the pin 3.

[0026] In the embodiment, the protrusion of the heat-conducting copper sheet 7 is to provide a certain overhanging height for the power chip when mounted on the circuit board, so as to facilitate air circulation at the bottom of the power chip.

[0027] Specifically, the top of the plastic package shell 1 is provided with a second stepped opening 13, the outer heat spreader 9 is embedded in the second stepped opening 13, and the top of the outer heat spreader 9 protrudes from the top of the plastic package shell 1.

[0028] In the embodiment, the second stepped opening 13 is a mounting structure for mounting and fixing the outer heat spreader 9, and the main function of the outer heat spreader 9 is to perform efficient heat transfer through liquid-vapor phase change.

[0029] In use, the inner heat spreader 6 is arranged at the bottom of the pad 4 of the lead frame 2, and the outer heat spreader 9 is arranged at the top of the plastic package shell 1, according to the heat dissipation characteristics of the heat spreader, the heat generated during operation of the power chip 5 can be uniformly distributed, local overheating is prevented, the safety and service life of the power chip 5 are improved, heat is conducted to the external environment through the heat-conducting medium, rapid heat diffusion is achieved, and the overall heat dissipation efficiency of the chip is optimized.

[0030] In summary, the power chip with the heat dissipation structure is provided with the inner heat spreader 6 at the bottom of the pad 4 of the lead frame 2 and the outer heat spreader 9 at the top of the plastic package shell 1, according to the heat dissipation characteristics of the heat spreader, the heat generated during operation of the power chip 5 can be uniformly distributed, local overheating is prevented, the safety and service life of the power chip 5 are improved, heat is conducted to the external environment through the heat-conducting medium, rapid heat diffusion is achieved, and the overall heat dissipation efficiency of the chip is optimized.

[0031] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A power chip with a heat dissipation structure, comprising a plastic encapsulation shell (1), characterized in that: The lead frame (2) is installed in the plastic package shell (1), and the lead frame (2) is provided with pins (3) on both sides, the lead frame (2) is provided with a solder pad (4), the power chip (5) is welded on the solder pad (4), the bottom of the solder pad (4) is provided with an inner heat plate (6), the bottom of the plastic package shell (1) is embedded with a heat-conducting copper sheet (7), the top of the heat-conducting copper sheet (7) is combined with the bottom of the inner heat plate (6) through heat-conducting paste, the top of the power chip (5) is pasted with a heat-conducting silica gel sheet (8), the top of the plastic package shell (1) is embedded with an outer heat plate (9), and the bottom of the outer heat plate (9) is combined with the top of the heat-conducting silica gel sheet (8).

2. The power supply chip with heat dissipation structure according to claim 1, characterized in that: The lower part of the lead frame (2) is provided with a hollow cavity (10), and the inner heat plate (6) is installed in the hollow cavity (10).

3. The power supply chip with heat dissipation structure according to claim 1, characterized in that: Both side walls of the plastic package shell (1) are provided with a gap (11), and the pins (3) extend outward from the gap (11).

4. The power supply chip with heat dissipation structure according to claim 1, characterized in that: The bottom of the plastic package shell (1) is provided with a first step opening (12), and the heat-conducting copper sheet (7) is embedded in the first step opening (12).

5. The power supply chip with heat dissipation structure according to claim 1, characterized in that: The bottom of the heat-conducting copper sheet (7) protrudes from the bottom of the plastic package shell (1), and the bottom of the heat-conducting copper sheet (7) is flush with the bottom of the pin (3).

6. The power supply chip with heat dissipation structure according to claim 1, characterized in that: The top of the plastic package shell (1) is provided with a second step opening (13), the outer heat plate (9) is embedded in the second step opening (13), and the top of the outer heat plate (9) protrudes from the top of the plastic package shell (1).

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