Clamp of semiconductor device
By designing a semiconductor device fixture and using a lead screw drive mechanism and a rotating shaft to adjust the device angle and position, the problem of inflexible adjustment in existing technologies has been solved, and accurate grinding of semiconductor devices has been achieved.
Patent Information
- Application Number
- CN202422937264.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2034-11-29
AI Technical Summary
In existing technologies, semiconductor devices cannot be flexibly adjusted in position and orientation during grinding, making it difficult to accurately grind the required surfaces.
A fixture for semiconductor devices is designed, comprising a base frame, a rotating shaft, a fixture base, a clamping plate, and a lead screw drive mechanism. The angle and position of the device are adjusted by the lead screw drive mechanism and the rotating shaft, and the device is fixedly connected by inner and outer sleeves to ensure stable clamping.
It enables flexible adjustment of the position and orientation of semiconductor devices during the grinding process, ensuring accurate grinding of the required surface, and has a simple structure that is easy to operate.
Smart Images
Figure CN223820305U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing technology, and in particular to a fixture for a semiconductor device. Background Technology
[0002] As the demands for semiconductor device performance continue to increase, performance research, including material microstructure and morphology, interface properties, and the causes of various defects, has become a trend. For example, observing and analyzing the interface morphology, material composition distribution, current, work function, contact voltage, piezoelectricity, capacitance differences, and other electrical distributions of device cross-sections, using atomic force microscopy and electron probe microanalysis as important tools for modern material microscopic analysis and testing.
[0003] When conducting performance studies on semiconductor devices, it is necessary to grind the devices. However, in the existing technology, the fixtures used for grinding the devices cannot flexibly adjust the orientation and position of the devices, which is not conducive to accurately grinding the surfaces of the devices that need to be ground. Summary of the Invention
[0004] In order to address the shortcomings of the existing technology, the purpose of this application is to provide a fixture for semiconductor devices that facilitates the adjustment of the position and orientation of semiconductor devices during grinding.
[0005] To achieve the above objectives, this application provides a fixture for a semiconductor device, comprising:
[0006] A base frame is provided, through which a rotating shaft is passed. A clamp base is fixedly connected to the rotating shaft. A placement groove is provided on the clamp base, and a clamping plate is provided in the placement groove. The clamping plate is connected to a lead screw transmission mechanism extending out of the clamp base.
[0007] Furthermore, a base fixing mechanism is provided inside the base frame. The base fixing mechanism includes a bracket, which is connected to a screw drive mechanism extending out of the base frame. A clamping block is fixed on the bracket.
[0008] Furthermore, the base frame is fixed inside an inner sleeve by bolts, and an outer sleeve is threadedly connected to the outer side of the inner sleeve.
[0009] Furthermore, the outer sleeve and the inner sleeve are also fixedly connected by bolts.
[0010] Furthermore, the base frame is annular, and the clamp base is cylindrical.
[0011] Furthermore, the upper end of the clamping plate extends out of the clamping base, and the lower end of the clamping plate is away from the bottom of the placement groove.
[0012] Furthermore, at least one clamping plate is provided.
[0013] Further, the outer sleeve is provided with a ceramic ring at the port.
[0014] The clamp for the semiconductor device of the present application is convenient for adjusting the position and direction of the semiconductor device, and is beneficial to accurately grinding the surface of the device that needs to be ground.
[0015] The clamp for the semiconductor device of the present application is simple in structure, and is convenient for the staff to hold and grind.
[0016] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or can be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0017] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, illustrate the present application, and are used to explain the present application together with the embodiments of the present application, and do not constitute a limitation on the present application. In the drawings:
[0018] Figure 1 It is a structural schematic view of the clamp for the semiconductor device of the present application embodiment 1;
[0019] Figure 2 It is an exploded view of the clamp for the semiconductor device of the present application embodiment 1;
[0020] Figure 3 It is an axial side view of the clamp base;
[0021] Figure 4 It is an axial side view of the clamp base from another angle;
[0022] Figure 5 It is a connection schematic view of the inner sleeve and the outer sleeve;
[0023] Figure 6 It is a front view of Figure 5 ;
[0024] Figure 7 It is a top view of Figure 6 ;
[0025] Figure 8 It is a plan view of Figure 5 ;
[0026] Figure 9 It is a sectional view of Figure 8 in the direction of C-C;
[0027] Figure 10 It is a sectional view of Figure 8 in the direction of D-D;
[0028] BRIEF DESCRIPTION OF DRAWINGS: 1-base frame, 2-rotating shaft, 3-clamp base, 4- placement slot, 5-clamping plate, 6-screw transmission mechanism, 7-base fixing mechanism, 71-bracket, 72-clamping block, 8-inner sleeve, 9-outer sleeve, 10-ceramic ring, 11- threaded hole. DETAILED DESCRIPTION
[0029] Embodiments of the present application will be described in more detail with reference to the drawings. While certain embodiments of the present application will be shown and described in the drawings, it is understood that the present application can be embodied in various forms and should not be construed as limited to the embodiments set forth in the drawings. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the present application to those skilled in the art.
[0030] It should be understood that the various steps of the method embodiments of the present application can be performed in different orders and / or in parallel. In addition, the method embodiments can include additional steps and / or omit performing the steps shown. The scope of the present application is not limited in this regard.
[0031] The term "comprising" and variations thereof as used in the present application are open-ended, that is, "including, but not limited to." The term "based on" is meant to mean "based, at least in part, on." The term "one embodiment" is meant to mean "at least one embodiment"; the term "another embodiment" is meant to mean "at least one additional embodiment"; and the term "some embodiments" is meant to mean "at least some embodiments." Related terms are defined as follows.
[0032] It should be noted that the use of "a", "an", "the" and similar referents in the application are intended to be illustrative of the application and are not intended to be limiting. It will be understood by those skilled in the art that, unless otherwise specified, "a", "an", "the" and similar referents are to be construed as "one or more" of the referenced elements. "Multiple" is to be construed as two or more.
[0033] Embodiments of the present application will be described in more detail with reference to the drawings.
[0034] Example 1
[0035] One embodiment of the present application provides a clamp for a semiconductor device that facilitates adjusting the position and orientation of the semiconductor device during polishing. Reference will be made to Figures 1-10 A clamp for a semiconductor device of the present application will be described in detail:
[0036] A clamp for a semiconductor device, comprising:
[0037] The base frame 1 is provided with a rotating shaft 2, the rotating shaft 2 is fixedly connected with a clamp base 3, the clamp base 3 is provided with a placing groove 4, the placing groove 4 is provided with a clamping plate 5, the clamping plate 5 is connected with a lead screw transmission mechanism 6 extending out of the clamp base 3.
[0038] When using the clamp, first, the clamping plate 5 is moved by the lead screw transmission mechanism 6 to clamp the semiconductor device, and then the clamp base 3 is rotated by the rotating shaft 2 to adjust the angle and position of the semiconductor device clamped in the placing groove 4 by the clamping plate 5.
[0039] In order to fix the clamp base 3 with the adjusted angle, in the embodiment, a base fixing mechanism 7 is arranged inside the base frame, the base fixing mechanism 7 includes a support 71 connected with a lead screw transmission mechanism (not shown) extending out of the base frame 1, and a clamping block 72 fixed on the support 71, when it is needed to fix the clamp base 3, the support 71 is moved inward by the lead screw transmission mechanism, and then the clamping block 72 is moved until the clamping block 72 clamps the clamp base 3.
[0040] It can be understood that the lead screw transmission mechanism is a mechanical transmission mechanism, which converts rotary motion into linear motion through helical rotation, the main principle of the lead screw transmission mechanism is to convert the rotary motion of a screw into linear force to move the connected load, generally through the interaction of the thread profile of the lead screw and the complementary nut, the rotary motion is converted into linear displacement to achieve, in the application, the specific structure of the lead screw transmission mechanism is not the point of the application, the lead screw transmission mechanism can be any kind of lead screw transmission mechanism which can move the clamping plate 5 and the support 71 by rotation.
[0041] In the embodiment, two lead screw transmission mechanisms are used to clamp the semiconductor device and clamp the clamp base 3 respectively.
[0042] In the embodiment, in order to facilitate the staff to hold the clamp, the base frame 1 is fixed in the inside of an inner sleeve 8 by bolts, the outer side of the inner sleeve 8 is threadedly connected with an outer sleeve 9.
[0043] It can be understood that by rotating between the inner sleeve 8 and the outer sleeve 9, the distance from the clamp base 3 fixedly connected with the inner sleeve to the port of the outer sleeve 9 can be adjusted, that is, the distance from the semiconductor device clamped on the clamp base 3 by the clamping plate 5 to the port of the outer sleeve 9 can be adjusted.
[0044] It can be understood that the port of the outer sleeve 9 close to one end of the placing groove 4 is the corresponding grinding end.
[0045] In the embodiment, the outer sleeve 9 and the inner sleeve 8 can also be fixedly connected by bolts.
[0046] It is understandable that when the connection is fixed by bolts, threaded holes 11 are provided on the outer sleeve 9 and the inner sleeve 8 respectively.
[0047] In this embodiment, in order to protect the exposed polished portion of the semiconductor device, a ceramic ring 10 is provided at the port of the outer sleeve 9 corresponding to the polished end.
[0048] In this embodiment, the base frame 1 is annular, and the clamp base 3 is cylindrical.
[0049] In some other embodiments, the base frame can also be rectangular, and the clamp base 3 can also be cubic.
[0050] In this embodiment, the upper end of the clamping plate 5 extends into the clamping base 3, and the lower end of the clamping plate 5 is away from the bottom of the placement groove 4.
[0051] In this embodiment, when clamping the semiconductor device, a clamping plate 5 and the groove wall of the placement groove 4 are used for clamping.
[0052] In some other embodiments, two clamping plates 5 may be provided, and the two clamping plates 5 are used together to clamp the semiconductor device.
[0053] The above description is merely a partial embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.
[0054] Furthermore, while the operations are described in a specific order, this should not be construed as requiring these operations to be performed in the specific order shown or in sequential order. Multitasking and parallel processing may be advantageous in certain environments. Similarly, while several specific implementation details are included in the above discussion, these should not be construed as limiting the scope of this application. Certain features described in the context of individual embodiments may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments.
[0055] Although the subject matter has been described using language specific to structural features and / or methodological logic, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. Rather, the specific features and actions described above are merely illustrative examples of implementing the claims.
Claims
1. A fixture for a semiconductor device, characterized in that, include: A base frame, through which a rotating shaft passes, is fixedly connected to a clamp base, the clamp base is provided with a placement groove, a clamping plate is placed in the placement groove, and the clamping plate is connected to a lead screw transmission mechanism extending out of the clamp base; A base fixing mechanism is provided inside the base frame. The base fixing mechanism includes a bracket, which is connected to a screw drive mechanism extending out of the base frame. A clamping block is fixed on the bracket.
2. The fixture for a semiconductor device according to claim 1, characterized in that, The base frame is fixed inside an inner sleeve by bolts, and an outer sleeve is threaded to the outside of the inner sleeve.
3. The fixture for a semiconductor device according to claim 2, characterized in that, The outer sleeve and the inner sleeve are also fixedly connected by bolts.
4. The fixture for a semiconductor device according to claim 1, characterized in that, The base frame is annular, and the clamp base is cylindrical.
5. The fixture for a semiconductor device according to claim 1, characterized in that, The upper end of the clamping plate extends from the clamping base, and the lower end of the clamping plate is away from the bottom of the placement slot.
6. The fixture for a semiconductor device according to claim 1, characterized in that, At least one clamping plate is provided.
7. The fixture for a semiconductor device according to claim 2, characterized in that, A ceramic ring is provided at the port of the outer sleeve.