Substrate cutting machine for producing and processing SMD (Surface Mount Device) LED (Light Emitting Diode) lamp beads

Abstract

The utility model relates to the technical field of substrate cutting devices, in particular to a substrate cutting machine for producing and processing SMD (Surface Mount Device) LED (Light Emitting Diode) lamp beads, which comprises a processing table, a rack is arranged at the top of the machining table, and a cutting assembly is arranged at the bottom of the rack. And a moving frame is movably arranged at the top of the machining table, and the base plates to be cut are placed in different second clamping frames correspondingly according to needs. Then, the electric push rod is started, and the movable end of the electric push rod drives the movable plate and the first clamping frame to move in the direction where the fixed plate and the second clamping frame are located till the movable plate and the first clamping frame make close contact with the base plate in the second clamping frame. Through the synergistic effect of the first clamping frame and the second clamping frame, stable limiting of the base plate needing to be cut can be achieved, the base plate is effectively prevented from shaking in the cutting process, and therefore cutting errors are avoided. And afterwards, the hydraulic rod is used for driving the cutter to move downwards, so that synchronous cutting of the multiple substrates is achieved, and the working efficiency of substrate cutting is remarkably improved.

Description

Technical Field

[0001] This utility model relates to the technical field of substrate cutting devices, specifically to a substrate cutting machine for the production and processing of surface mount LED beads. Background Technology

[0002] LED beads are the abbreviation for Light Emitting Diode, a common name. LED beads use low-voltage power supplies, with a supply voltage between 2-4V, depending on the product. Therefore, they are driven by a safer power supply than high-voltage power supplies, making them particularly suitable for public places. They utilize the terminal voltage of the PN junction to create a certain potential barrier. When a forward bias voltage is applied, the potential barrier decreases, and the majority carriers in the P and N regions diffuse to each other. The beads need to be mounted on the surface of the substrate, and the substrate needs to be cut to a certain quantity before use.

[0003] Chinese Patent Publication No. CN217395094U discloses a substrate cutting device for LED lamp bead production, including a frame, a connecting platform, a connecting column connected to the surface of the connecting platform, a cutting device connected to the surface of the connecting column, and a fixing mechanism connected to the surface of the connecting platform. The fixing mechanism includes a slide rod connected to the inner surface of the connecting platform, a slider movably connected to the surface of the slide rod, a fixing column connected to the surface of the slider, a tension spring connected to the surface of the fixing column, and a limit rod connected to the surface of the tension spring. This invention utilizes the cooperation of the slide rod, slider, fixing column, tension spring, limit rod, fixing port, screw, clamp, anti-slip pad, telescopic rod, and rotating rod. By having the operator move the screw to adjust the position of the clamp, and then by adjusting the rotating rod, the device can fix substrates of different models, ensuring the stability of the substrates during cutting, and thus effectively ensuring that the substrates meet production specifications during production.

[0004] The aforementioned equipment is limited to cutting a single substrate during operation. However, the LED chip production process requires a large number of substrates, all of which must undergo cutting. Therefore, this equipment is significantly inefficient when handling large-scale substrate cutting tasks, making it difficult to meet actual production needs. Utility Model Content

[0005] To address the aforementioned issues, a substrate cutting machine for SMD LED chip manufacturing is provided. The machine utilizes the movable end of an electric push rod to drive a movable plate and a first clamping frame towards the fixed plate and a second clamping frame, until they make tight contact with the substrate within the second clamping frame. Through the coordinated action of the first and second clamping frames, the substrate to be cut is stably positioned, effectively preventing substrate movement during cutting and thus avoiding cutting errors. Subsequently, a hydraulic rod drives the cutting blades downwards to simultaneously cut multiple substrates, significantly improving the efficiency of substrate cutting.

[0006] To address the problems in the prior art, this utility model provides a substrate cutting machine for manufacturing and processing surface-mount LED beads, including a processing table; a frame is provided on the top of the processing table, and a cutting assembly is provided at the bottom of the frame; a movable frame is movably arranged on the top of the processing table; a fixed plate is provided on the top of the movable frame, and a plurality of second clamping frames are provided on the side wall of the fixed plate; an electric push rod is also provided on the top of the movable frame; a movable plate is provided at the telescopic end of the electric push rod and movably connected to the top of the movable frame; and a first clamping frame, the same number as the second clamping frames, is provided on the side wall of the movable plate.

[0007] Preferably, limit blocks are provided on both sides of the bottom of the movable plate; a limit groove is provided on the top of the movable frame for the limit blocks to move.

[0008] Preferably, the bottom of the movable plate is provided with a cleaning brush for cleaning up debris; the top of the movable frame is provided with several through slots for debris to fall off; and a debris collection drawer is movably provided inside the movable frame for collecting debris.

[0009] Preferably, the cutting assembly includes a hydraulic rod disposed at the bottom of the frame; the movable end of the hydraulic rod is provided with a cutting blade for cutting the substrate.

[0010] Preferably, electromagnetic slide rails are provided on both sides of the top of the processing table; an electromagnetic slider that works in conjunction with the electromagnetic slide rails is provided at the bottom of the moving frame; a scale for measuring the cutting length of the substrate is provided on the front side wall of the moving frame; and an indicator block that works in conjunction with the scale is provided on the top of the processing table, with the indicator block and the cutting shears on the same vertical horizontal line.

[0011] Preferably, a first placement frame for placing an uncut substrate is provided on one side of the outer wall of the processing table; a second placement frame for placing a cut substrate is provided on the other side of the outer wall of the processing table; and a plurality of partitions for separating the cut substrates are provided inside the second placement frame.

[0012] The advantages of this utility model compared to the prior art are:

[0013] 1. Multiple substrates to be cut are placed inside different second clamping frames. Then, an electric push rod is activated, driving the movable plate and the first clamping frame towards the fixed plate and the second clamping frame until they are in close contact with the substrates inside the second clamping frames. The coordinated action of the first and second clamping frames ensures stable positioning of the substrates to be cut, effectively preventing wobbling during the cutting process and avoiding cutting errors. Subsequently, a hydraulic rod drives the cutting blades downwards to simultaneously cut multiple substrates, significantly improving the efficiency of substrate cutting.

[0014] 2. Through the coordinated operation of electromagnetic slide rail and electromagnetic slider, the moving frame and substrate are driven to move. At the same time, by observing the indication information of the indicator block and scale, the cutting length of the substrate can be precisely controlled to meet the personalized needs of different LED lamp bead production. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a substrate cutting machine for manufacturing and processing surface mount LED beads.

[0016] Figure 2 This is a side view of a substrate cutting machine for manufacturing and processing surface mount LED beads.

[0017] Figure 3 yes Figure 1 A magnified structural diagram of point A in the middle.

[0018] Figure 4 This is a schematic diagram of the moving frame in a substrate cutting machine for manufacturing and processing surface-mount LED beads.

[0019] Figure 5 This is a schematic diagram of the chip collection tray in a substrate cutting machine used for manufacturing and processing surface mount LED beads.

[0020] Figure 6 This is a schematic diagram of the structure of a cleaning brush in a substrate cutting machine used for manufacturing and processing surface mount LED beads.

[0021] The following are the labels in the diagram: 1. Processing table; 2. First placement frame; 3. Moving frame; 4. Frame; 5. Electromagnetic slide rail; 6. Second placement frame; 7. Divider plate; 8. Hydraulic rod; 9. Cutting shears; 10. Chip collection drawer; 11. Ruler; 12. Indicator block; 13. Electric push rod; 14. Movable plate; 15. First clamping frame; 16. Fixed plate; 17. Second clamping frame; 18. Electromagnetic slider; 19. Limiting block; 20. Cleaning brush. Detailed Implementation

[0022] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments.

[0023] like Figures 1 to 6 As shown, this utility model provides:

[0024] A substrate cutting machine for manufacturing and processing surface mount LED beads includes a processing table 1; a frame 4 is provided on the top of the processing table 1, and a cutting assembly is provided at the bottom of the frame 4; a movable frame 3 is movably provided on the top of the processing table 1; a fixed plate 16 is provided on the top of the movable frame 3, and a plurality of second clamping frames 17 are provided on the side wall of the fixed plate 16; an electric push rod 13 is also provided on the top of the movable frame 3; a movable plate 14 is provided at the telescopic end of the electric push rod 13 and is movably connected to the top of the movable frame 3; a first clamping frame 15 is provided on the side wall of the movable plate 14, the number of which is the same as the number of second clamping frames 17.

[0025] Multiple substrates to be cut are placed inside different second clamping frames 17. Then, the electric push rod 13 is activated, driving the movable plate 14 and the first clamping frame 15 towards the fixed plate 16 and the second clamping frame 17 until they are in close contact with the substrates within the second clamping frame 17. Through the coordinated action of the first clamping frame 15 and the second clamping frame 17, the substrates to be cut are stably positioned, effectively preventing them from shaking during the cutting process and thus avoiding cutting errors. Subsequently, the cutting assembly is used to simultaneously cut multiple substrates, significantly improving the efficiency of substrate cutting.

[0026] like Figure 5 and Figure 6 As shown, limit blocks 19 are provided on both sides of the bottom of the movable plate 14; the top of the movable frame 3 is provided with a limit groove for the limit blocks 19 to move.

[0027] The movement of the limiting block 19 within the limiting groove ensures the stability of the movable plate 14 during movement, effectively preventing the movable plate 14 from shifting position, and making the first clamping frame 15 and the second clamping frame 17 more stable when limiting the substrate.

[0028] like Figure 4 , Figure 5 and Figure 6 As shown, the bottom of the movable plate 14 is provided with a cleaning brush 20 for cleaning up debris; the top of the movable frame 3 is provided with several through slots for debris to fall; and the interior of the movable frame 3 is provided with a debris collection tray 10 for collecting debris.

[0029] By using the cleaning brush 20, the debris generated during the cutting process can be effectively collected through the slot and guided into the debris collection drawer 10, thus facilitating subsequent processing. This not only makes debris cleaning more convenient but also prevents a large amount of debris from accumulating on the surfaces of the moving frame 3 and the processing table 1.

[0030] like Figure 2 As shown, the cutting assembly includes a hydraulic rod 8 disposed at the bottom of the frame 4; the movable end of the hydraulic rod 8 is provided with a cutting blade 9 for cutting the substrate.

[0031] The hydraulic rod 8 drives the cutting blade 9 to move downwards, so as to achieve simultaneous cutting of multiple substrates, which significantly improves the efficiency of substrate cutting.

[0032] like Figure 1 , Figure 3 and Figure 5 As shown, electromagnetic slide rails 5 are provided on both sides of the top of the processing table 1; an electromagnetic slider 18 that works in conjunction with the electromagnetic slide rails 5 is provided at the bottom of the moving frame 3; a scale 11 for measuring the cutting length of the substrate is provided on the front side wall of the moving frame 3; an indicator block 12 that works in conjunction with the scale 11 is provided on the top of the processing table 1, and the indicator block 12 and the cutting scissors 9 are on the same vertical horizontal line.

[0033] Through the coordinated operation of electromagnetic slide rail 5 and electromagnetic slider 18, the moving frame 3 and substrate are driven to move. At the same time, by observing the indication information of indicator block 12 and scale 11, the cutting length of the substrate can be precisely controlled to meet the personalized needs of different LED lamp bead production.

[0034] like Figure 1 As shown, a first placement frame 2 for placing an uncut substrate is provided on one side of the outer wall of the processing table 1; a second placement frame 6 for placing a cut substrate is provided on the other side of the outer wall of the processing table 1; and a plurality of partition plates 7 for separating the cut substrate are provided inside the second placement frame 6.

[0035] The substrate to be cut can be placed inside the first placement frame 2, which facilitates the subsequent cutting of the substrate. Then, the cut substrate can be collected inside the second placement frame 6 for later use. At the same time, the separator 7 can be used to store substrates of different lengths separately to avoid mixing substrates of different sizes together.

[0036] Working Principle: When multiple substrates need to be cut simultaneously, the substrates to be cut are placed inside different second clamping frames 17. Then, the electric push rod 13 is activated, driving the movable plate 14 and the first clamping frame 15 towards the fixed plate 16 and the second clamping frame 17 until they are in close contact with the substrates inside the second clamping frame 17. Through the coordinated operation of the first clamping frame 15 and the second clamping frame 17, the substrates to be cut are stably positioned, effectively preventing them from shaking during the cutting process and thus avoiding cutting errors. Afterwards, the hydraulic rod 8 drives the cutting shears 9 downwards to achieve simultaneous cutting of multiple substrates, significantly improving the efficiency of substrate cutting. During the cutting process, the electromagnetic slide rail 5 and the electromagnetic slider 18 can work together to drive the moving frame 3 and the substrates to move. Simultaneously, by observing the indication information of the indicator block 12 and the scale 11, the cutting length of the substrates can be precisely controlled to meet the personalized needs of different LED bead production.

[0037] The above embodiments merely illustrate one or several implementation methods of a substrate cutting machine for manufacturing and processing SMD LED beads according to this utility model. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

[0038] In this utility model, unless otherwise explicitly specified and limited, for example, it can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components or an interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

Claims

1. A substrate cutting machine for manufacturing and processing surface mount LED beads, characterized in that, Includes a processing table (1); The processing table (1) is provided with a frame (4) on the top and a cutting component is provided at the bottom of the frame (4); A movable frame (3) is movably provided on the top of the processing table (1); The top of the movable frame (3) is provided with a fixing plate (16), and the side wall of the fixing plate (16) is provided with a number of second clamping frames (17). The top of the movable frame (3) is also provided with an electric push rod (13); The telescopic end of the electric push rod (13) is provided with a movable plate (14) that is movably connected to the top of the movable frame (3); The side wall of the movable plate (14) is provided with a first clamping frame (15) in the same number as the second clamping frame (17).

2. The substrate cutting machine for manufacturing and processing SMD LED beads according to claim 1, characterized in that, Limiting blocks (19) are provided on both sides of the bottom of the movable plate (14); The top of the movable frame (3) is provided with a limiting groove for the movement of the limiting block (19).

3. The substrate cutting machine for manufacturing and processing SMD LED beads according to claim 1, characterized in that, The bottom of the movable plate (14) is provided with a cleaning brush (20) for cleaning up debris; The top of the movable frame (3) is provided with several through slots for debris to fall off; The movable frame (3) is equipped with a chip collection drawer (10) for collecting debris.

4. The substrate cutting machine for manufacturing and processing SMD LED beads according to claim 1, characterized in that, The cutting assembly includes a hydraulic rod (8) disposed at the bottom of the frame (4); The movable end of the hydraulic rod (8) is provided with a cutting tool (9) for cutting the substrate.

5. The substrate cutting machine for manufacturing and processing SMD LED beads according to claim 1, characterized in that, Electromagnetic slide rails (5) are provided on both sides of the top of the processing table (1); The bottom of the movable frame (3) is provided with an electromagnetic slider (18) that works in conjunction with the electromagnetic slide rail (5); The front sidewall of the movable frame (3) is provided with a scale (11) for measuring the cutting length of the substrate; The top of the processing table (1) is provided with an indicator block (12) that works in conjunction with the scale (11), and the indicator block (12) and the cutting shears (9) are on the same vertical horizontal line.

6. The substrate cutting machine for manufacturing and processing SMD LED beads according to claim 1, characterized in that, The processing table (1) has a first placement frame (2) on one side of its outer wall for placing an uncut substrate; The processing table (1) has a second placement frame (6) on the outer wall of the other side for placing the cut substrate; The second placement frame (6) is provided with several partitions (7) for separating the cut substrates.

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