Charging tray
By designing the base plate and cover plate structure of the material tray, stable fixation and precise cutting of chip shell pins are achieved, solving the problem of expensive and complex shell pin cutting equipment in small and medium-sized enterprises, and improving production efficiency and product quality.
Patent Information
- Application Number
- CN202520200898.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-08
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-02-08
AI Technical Summary
In the existing technology, the equipment for cutting off the shell leads during chip processing is expensive and complex, resulting in high costs, low efficiency, and difficult maintenance for small and medium-sized enterprises, which affects the welding quality and product qualification rate.
Design a material tray that, through the cooperation of a base plate and a cover plate, includes a receiving groove and a limiting groove, to achieve stable fixation and precise cutting of chip shell pins, reduce labor and equipment costs, and improve production efficiency.
It improved chip production efficiency and product qualification rate, reduced labor and equipment procurement costs, simplified the maintenance process, and ensured the stability and accuracy of the cutting process.
Smart Images
Figure CN223822334U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip processing, and more specifically, to a material tray. Background Technology
[0002] In the field of chip manufacturing, before wire bonding, a process called lead removal is performed on the chip casing. The quality of this step directly affects the yield rate of subsequent chip processing. The lead casing acts as a bridge connecting the chip to external circuits and plays a crucial role in the packaging process. However, if the excess lead casing is not accurately removed, it may interfere with the soldering process, causing a series of problems such as short circuits and signal interference, thereby significantly reducing the product qualification rate and increasing production costs.
[0003] Currently, most of the equipment for cutting off the leads of the chip casing is imported, which is expensive and not suitable for small and medium-sized chip processing enterprises in China. At the same time, due to the complex structure of this device, it is easy to cause inconvenience in later maintenance, resulting in reduced production efficiency. Utility Model Content
[0004] In view of the above problems, the purpose of this application is to provide a material tray, which allows chip shell pins to be stored in the tray through the design of the base plate and cover plate, and realizes efficient removal of chip shell pins based on the material tray; thereby not only reducing labor costs and equipment procurement costs, but also greatly improving chip production efficiency.
[0005] In a first aspect, embodiments of this application provide a material tray, the material tray comprising: a base plate having a plurality of first positioning parts and a plurality of receiving slots, a cover plate having a plurality of second positioning parts and a plurality of limiting slots, and a first direction, a second direction, and a third direction perpendicular to each other; the arrangement of the receiving slots on the base plate is consistent with the arrangement of the limiting slots on the cover plate, the receiving slots are configured to receive chip housings and housing pins, and the limiting slots are configured to clamp the chip housings in the first direction; the first positioning parts cooperate with the second positioning parts, and the first positioning parts and the second positioning parts are configured to position the base plate and the cover plate; wherein, the number of receiving slots and the number of limiting slots are the same, and the number of first positioning parts and the number of second positioning parts are the same.
[0006] In the above implementation process, the tray provided in this application embodiment can stably limit the chip shell pins in the tray through the cooperation of the base plate with the receiving groove and the cover plate with the limiting groove. The accurate assembly of the base plate and the cover plate can be achieved through the cooperation of the first limiting part on the base plate and the second limiting part on the cover plate. The tray provided in this application embodiment has high overall stability and assembly accuracy, and can efficiently and accurately realize the cutting of chip shell pins.
[0007] Optionally, in this embodiment, the receiving groove includes a first receiving cavity, a step, and a second receiving space; the first receiving cavity and the second receiving space are connected in a first direction by the step, and the radial dimension of the first receiving cavity is smaller than the radial dimension of the second receiving space; the first receiving cavity is configured to receive a chip casing, and the second receiving space is configured to receive casing pins.
[0008] In the above implementation process, the receiving groove of the tray base plate provided in this application embodiment has a first receiving cavity and a second receiving space. The size of the two receiving spaces is set according to the outer size of the chip shell pins, which can accurately accommodate the chip shell, thereby realizing the effective fixation and support of the chip shell pins, and ensuring the stability and accuracy of the chip shell during the processing of the tray.
[0009] Optionally, in this embodiment, the second accommodating space includes a reserved cutout; the reserved cutout is located on one side of the second accommodating space in the second direction or the third direction, and is configured to reserve accommodating space for the cutout of the tube shell pin.
[0010] In the above implementation process, the tray provided in this application embodiment has a reserved cut in the second accommodating space. The tray can not only effectively fix and support the shell pins, but also safely and orderly accommodate the cut-off pins, thereby improving the overall space utilization and processing efficiency of the tray, while ensuring the smooth progress of the chip processing.
[0011] Optionally, in this embodiment, the base plate includes a receiving hole; the maximum radial dimension of the receiving groove is smaller than the radial dimension of the receiving hole; one side of the reserved cut of the receiving groove is connected to one side of the receiving hole, and the remaining side of the receiving hole and the remaining side of the receiving groove form a pin receiving gap; wherein, the pin receiving gap is configured to receive the shell pin to be cut off.
[0012] In the above implementation process, the tray provided in this application provides a more efficient and reliable solution for pin processing in chip manufacturing by designing receiving holes and receiving grooves with different sizes on the base plate and cleverly utilizing the gap between them to receive and release the shell pins to be cut off. This not only optimizes the pin processing flow but also significantly improves processing efficiency and accuracy.
[0013] Optionally, in this embodiment, the limiting groove includes a limiting surface and an elastic element; the limiting surface is disposed opposite to the limiting surface in a second direction and / or a third direction, and the limiting surface is configured to limit the position of the chip housing; the elastic element is disposed on the side of the limiting surface that contacts the chip housing, and the elastic element is configured to provide an elastic margin between the chip housing and the limiting surface.
[0014] Optionally, in this embodiment, the elastic element includes a silicone pad; the silicone pad has a convex arc at the center in the first direction toward the chip housing.
[0015] In the above implementation process, the limiting groove of this application embodiment, through the ingenious combination of the limiting surface and the elastic element design, not only achieves precise positioning of the chip casing, but also provides appropriate elastic adaptability. The convex arc design of the silicone pad further enhances the stability and protection of the limiting groove, enabling the chip casing to maintain a precise position and be protected from damage during processing.
[0016] Optionally, in this embodiment of the application, the cover plate includes a clamping portion, which is configured to be clamped by a clamping mechanism.
[0017] In the above implementation process, by setting the clamping part, the embodiments of this application not only achieve stable clamping of the cover plate, but also significantly improve the convenience of operation and production efficiency.
[0018] Optionally, in this embodiment of the application, the tray further includes an identification mark and a positioning element; the identification mark and the positioning element are configured for the identified device to identify the initial positioning of the tray.
[0019] In the above implementation process, the tray in this embodiment is equipped with a clearly readable identification mark, which enables accurate identification of the current tray's ID, facilitating tracking and management. Simultaneously, the positioning components (such as limiting holes), whether located on the base plate or the cover plate, are positioned to be precisely captured by a dedicated pin-cutting device, thereby achieving initial position positioning of the tray and significantly improving the identification and positioning efficiency of the tray on the automated production line.
[0020] Optionally, in this embodiment, the base plate further includes an identification strip and a light source; the identification strip is disposed on the lower surface of the base plate along the second direction and configured to identify the position of the tray in the second direction after the initial positioning is completed; the light source is disposed on the upper surface of the base plate and configured to provide light to the tray after the position identification in the second direction is completed.
[0021] In the above implementation process, the tray provided in this application embodiment significantly improves the accuracy and efficiency of the lead cutting device in identifying the tray position by cleverly integrating an identification strip and a light source on the base plate. The identification strip, as an auxiliary tool for precise positioning, features a scale design on its natural acrylic plate, enabling external devices to quickly and accurately capture the tray's specific position information in the second direction. The light source not only enhances the visual visibility of the tray but also further optimizes the working environment of the lead cutting device, allowing it to operate under sufficient lighting conditions, thereby effectively improving the accuracy and stability of the cutting operation.
[0022] Optionally, in this embodiment, the base plate further includes a conductive patch; the conductive patch is disposed on the end face of the base plate along the second direction and configured to provide power to the light source.
[0023] In the above implementation process, the embodiment of this application provides a conductive patch on the end face of the base plate in the second direction, which not only ensures that the light source can obtain a stable and continuous power supply when needed, but also makes the entire tray structure more compact and efficient.
[0024] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description
[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of the structure of the material tray provided in an embodiment of this application;
[0027] Figure 2 This is a schematic diagram of the structure of the base plate provided in the embodiments of this application;
[0028] Figure 3 This is a schematic diagram of the structure of the cover plate provided in an embodiment of this application;
[0029] Figure 4 A schematic diagram of the structure of the receiving groove is provided for the embodiments of this application;
[0030] Figure 5 A schematic diagram of the chip casing provided in an embodiment of this application;
[0031] Figure 6 Provided for the embodiments of this application Figure 2 Enlarged schematic diagram of region C in the middle;
[0032] Figure 7 A schematic diagram of the limiting groove provided in an embodiment of this application;
[0033] Figure 8 This is a schematic diagram of the structure of the identification band provided in an embodiment of this application;
[0034] Figure 9 A schematic diagram showing the installation positions of the identification strip and the light source provided in an embodiment of this application;
[0035] Figure 10 This is a schematic diagram of the tray operation provided in an embodiment of this application;
[0036] Reference numerals: Tray - 1000; First direction - X direction; Second direction - Y direction; Third direction - Z direction; Base plate - 100; Receiving groove - 110; First receiving cavity - 111; Step - 112; Second receiving space - 113; Reserved cut - C; First positioning part - 120; Receiving hole - 130; Pin receiving gap - 131; Identification strip - 140; Light source - 150; Conductive patch - 160; Positioning groove - 170; Cover plate - 200; Limiting groove - 210; Limiting surface - 211; Elastic element - 212; Second positioning part - 220; Clamping part - 230; Identification mark - 300; Positioning component - 400; First limiting hole - 410; Second limiting hole - 420; Reflective target - 430; Slotted window - 500. Detailed Implementation
[0037] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0038] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0039] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0040] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0041] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0042] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0043] In the highly precise and competitive field of chip manufacturing, every minute process step is crucial, especially the lead removal process before wire bonding. Quality control at this stage directly impacts the yield rate of subsequent chip processing and the performance stability of the final product. Leads, acting as a bridge connecting the chip to external circuitry, play a critical role in the packaging process. However, if excess lead is not precisely removed, it can interfere with the soldering process, causing short circuits, signal interference, and a series of other problems, significantly reducing product yield and increasing production costs.
[0044] Currently, most of the equipment for cutting off the leads of chip casings in the market relies on imports. The procurement cost of this equipment is a heavy burden for most small and medium-sized chip processing enterprises. Therefore, small and medium-sized enterprises face the dual pressure of cost control and improving production efficiency.
[0045] On the other hand, existing equipment for cutting off tube leads is quite complex, and once a malfunction occurs, it often requires specialized technicians for repair, which is time-consuming and costly. For companies lacking professional maintenance teams and technical support, this can severely impact production efficiency and cost control.
[0046] Based on this, this application provides a material tray, which, through the design of a base plate and a cover plate, enables the storage of chip package pins and achieves efficient removal of chip package pins based on the material tray; thereby not only reducing labor costs and equipment procurement costs, but also greatly improving chip production efficiency.
[0047] Please refer to Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of the material tray provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of the base plate provided in the embodiments of this application; Figure 3This is a schematic diagram of the structure of the cover plate provided in an embodiment of this application. This application provides a tray 1000, which includes: a base plate 100 having a plurality of first positioning portions 120 and a plurality of receiving grooves 110; a cover plate 200 having a plurality of second positioning portions 220 and a plurality of limiting grooves 210; and as shown in the figure. Figures 1 to 3 As shown, there are three mutually perpendicular directions: the first direction (X direction), the second direction (Y direction), and the third direction (Z direction).
[0048] The arrangement of the receiving grooves 110 on the base plate 100 is consistent with the arrangement of the limiting grooves 210 on the cover plate 200. The receiving grooves 110 are configured to receive the chip housing and housing pins, and the limiting grooves 210 are configured to clamp the chip housing in the first direction (X direction). For example... Figures 1 to 3 As shown, in the embodiments of this application, the number of receiving grooves 110 and limiting grooves 210 are the same, the number of the first positioning part 120 and the second positioning part 220 is the same, and the first positioning part 120 and the second positioning part 220 are matched with each other to realize the alignment and positioning of the bottom plate 100 and the cover plate 200 of the material tray 1000.
[0049] like Figures 1 to 3 As shown, the arrangement of the receiving groove 110 on the base plate 100 is the same as the arrangement of the limiting groove 210 on the cover plate 200, both being a regular 14*3 arrangement. In practical applications, the arrangement of the receiving groove 110 and the limiting groove 210 can be adjusted according to actual needs, but it is required that the arrangement of the two on the base plate 100 and the cover plate 200 be the same to achieve the fixation of the chip shell.
[0050] The above implementation process can be understood as follows: during the chip casing pin removal process, the casing pin is first placed in the receiving groove 110 on the base plate 100; then the cover plate 200 is placed on the base plate 100, and the limiting groove 210 on the cover plate 200 can further clamp and limit the casing pin in the receiving groove 110. After completion, based on the material tray 1000 and the corresponding pin removal equipment, the efficient removal of the casing pin can be achieved.
[0051] The first positioning part 120 cooperates with the second positioning part 220, and the first positioning part 120 and the second positioning part 220 are configured to position the base plate 100 and the cover plate 200. Please continue reading. Figure 2 and Figure 3 The first positioning part 120 on the base plate 100 can be as follows: Figure 2 The second limiting part on the cover plate 200 can be as shown in the limiting hole. Figure 3The limiting cylinder shown; during the processing, the limiting cylinder is aligned and clamped in the limiting hole, thereby realizing the direct positioning of the base plate 100 and the cover plate 200; the first positioning part 120 and the second positioning part 220 are usually provided in more than one way, and can be appropriately set at different positions on the plane formed by the second direction (Y direction) and the third direction (Z direction) of the entire material tray 1000, such as the edge position of the base plate 100 and the cover plate 200.
[0052] For example, in the embodiments of this application, the first and second limiting parts, in addition to the limiting holes and limiting cylinders described above, can also be designed as snap-fit and slots. When the cover plate 200 and the base plate 100 are assembled, the snap-fit will elastically engage with the slot, thereby achieving a stable positioning of the two.
[0053] For example, the first limiting part and the second limiting part provided in the embodiments of this application, in addition to the limiting hole and limiting cylinder, as well as the buckle and the slot summarized in the above implementation process, can also be configured as a sliding rail and a sliding groove. During assembly, the cover plate 200 slides into place along the sliding rail of the base plate 100 through the sliding groove. When it reaches the predetermined position, the cover plate 200 can be fixed on the base plate 100 by a locking mechanism (such as screws, buckles, etc.).
[0054] For example, in addition to providing the first positioning part and the second positioning part, the embodiments of this application may also provide a positioning groove 170, such as... Figure 2 The positioning grooves 170 are located at both ends of the base plate and can play a positioning role during assembly.
[0055] Of course, in practical applications, the first positioning part 120 and the second limiting part can be either a limiting cylinder and a limiting hole, or a buckle and a slot, or a slide rail and a slide groove. That is, the structural settings of the first limiting part and the second limiting part can be interchanged, as long as the base plate 100 and the cover plate 200 can be well positioned.
[0056] pass Figures 1 to 2 As can be seen, the tray 1000 provided in this application embodiment can stably limit the chip shell pins in the tray 1000 through the cooperation of the base plate 100 with the receiving groove 110 and the cover plate 200 with the limiting groove 210. The accurate assembly of the base plate 100 and the cover plate 200 can be achieved through the cooperation of the first limiting part on the base plate 100 and the second limiting part on the cover plate 200. The tray 1000 provided in this application embodiment has high overall stability and assembly accuracy, and can efficiently and accurately realize the cutting of chip shell pins.
[0057] Please refer to the following: Figure 4This application provides a schematic diagram of the structure of the receiving groove; in an optional embodiment, the receiving groove 110 includes a first receiving cavity 111, a step 112, and a second receiving space 113. Figure 4 for Figure 2 (Enlarged view of region B in the middle).
[0058] The first receiving cavity 111 and the second receiving space 113 are connected in the first direction (X direction) by the step 112, and the radial dimension of the first receiving cavity 111 is smaller than the radial dimension of the second receiving space.
[0059] The first receiving cavity 111 is configured to receive the chip housing, and the second receiving space 113 is configured to receive the housing pins.
[0060] In the above implementation process, from the bottom of the base plate 100 to near the cover plate 200, the sequence is: first receiving cavity 111, step 112, and second receiving space 113. Please refer to the following: Figure 5 , Figure 5 A schematic diagram of the chip casing provided in an embodiment of this application; Figure 5 The diagram shows an inverted schematic of the chip casing, with casing leads on both sides. During chip fabrication, some of the casing leads on both sides need to be removed.
[0061] based on Figure 4 and Figure 5 It is understood that the first receiving cavity 111 of the receiving groove 110 in the material tray 1000 provided in this application embodiment can accommodate Figure 5 The A portion of the chip casing, transitioning via step 112 to a larger second receiving space 113, is used to accommodate... Figure 5 The B section of the chip casing has pins that extend from both sides.
[0062] pass Figure 4 and Figure 5 As can be seen, the receiving groove 110 of the base plate 100 of the material tray 1000 provided in this application embodiment has a first receiving cavity 111 and a second receiving space 113. The size of the two receiving spaces is set according to the outer size of the chip shell pins, which can accurately accommodate the chip shell, thereby realizing the effective fixation and support of the chip shell pins, and ensuring the stability and accuracy of the chip shell during the processing of the material tray 1000.
[0063] Please continue reading. Figure 4 The second receiving space 113 includes a reserved cutout C. The reserved cutout C is located on one side of the second receiving space 113 in the second direction (Y direction) or the third direction (Z direction), and is configured to reserve receiving space for the cutout of the tube shell pin.
[0064] Therefore, it can be seen that the receiving groove 110 of the material tray 1000 provided in this application embodiment, by setting a reserved cut C in the second receiving space 113, can not only effectively fix and support the shell pins, but also safely and orderly accommodate the cut-off pins, thereby improving the overall space utilization and processing efficiency of the material tray 1000, while ensuring the smooth progress of the chip processing process.
[0065] Please refer to Figure 6 , Figure 6 Provided for the embodiments of this application Figure 2 Enlarged schematic diagram of region C; in an optional embodiment of this application, the base plate 100 includes a receiving hole 130 ( Figure 6 for Figure 2 (Enlarged view of region C).
[0066] like Figure 6 As shown, the maximum radial dimension of the receiving groove 110 is smaller than the radial dimension of the receiving hole 130.
[0067] One side of the reserved cut C of the receiving groove 110 is connected to one side of the receiving hole 130, and the remaining side of the receiving hole 130 and the remaining side of the receiving groove 110 form a pin receiving gap 131. The pin receiving gap 131 is configured to receive the shell pin to be cut off.
[0068] In the above implementation process, such as Figure 6 As shown, the receiving hole 130 is located on the base plate 100. The purpose of the receiving hole 130 is to accommodate the aforementioned receiving groove 110 and fix the receiving groove 110 to the position on the base plate 100. However, only one side of the receiving groove 110 is fixedly connected to the receiving hole 130, and the other three sides form the pin receiving gap 131. When the tube shell pin is cut off, it can fall out of the entire tray 1000 from the pin receiving gap 131, thereby avoiding the problem of the cut part remaining inside the tray 1000 or interfering with other pins.
[0069] pass Figure 6 As can be seen, the tray 1000 provided in this application embodiment, by designing receiving holes 130 and receiving grooves 110 with different sizes on the base plate 100, and cleverly utilizing the gap between them to receive and release the shell pins to be cut off, not only optimizes the pin processing flow, but also significantly improves processing efficiency and accuracy, providing a more efficient and reliable solution for pin processing in the chip manufacturing process.
[0070] Please refer to Figure 7 , Figure 7 This is a schematic diagram of a limiting groove provided in an embodiment of this application; in an optional embodiment of this application, the limiting groove 210 includes a limiting surface 211 and an elastic element 212. Figure 7 for Figure 3 (Enlarged view of region A in the middle).
[0071] The limiting surface 211 is disposed opposite to each other in the second direction (Y direction) and / or the third direction (Z direction), and the limiting surface 211 is configured to limit the position of the chip casing.
[0072] The elastic element 212 is disposed on the side of the limiting surface 211 that contacts the chip housing, and the elastic element 212 is configured to provide an elastic margin between the chip housing and the limiting surface 211.
[0073] Optionally, the elastic element 212 includes a silicone pad; the silicone pad has a convex arc at the center in the first direction (X direction) that faces the chip housing.
[0074] Alternatively, the elastic element 212 may also be a rubber pad or other material with good elasticity and wear resistance, suitable for manufacturing materials that need to withstand certain pressure and vibration.
[0075] pass Figure 7 As can be seen, the limiting groove 210 in this embodiment of the application, through the ingenious combination of the limiting surface 211 and the elastic element 212, not only achieves precise positioning of the chip casing, but also provides appropriate elastic adaptability. The convex arc design of the silicone pad further enhances the stability and protection of the limiting groove 210, enabling the chip casing to maintain a precise position and be protected from damage during processing.
[0076] Please continue reading. Figure 3 In an optional embodiment, the cover plate 200 includes a clamping portion 230 configured to be clamped by a clamping mechanism. For example... Figure 3 In the embodiment shown in this application, the clamping part 230 is configured as a pickup hole (through hole). The robotic arm can clamp the cover plate 200 by gripping the pickup hole.
[0077] Optionally, the clamping part 230, in addition to being configured as follows: Figure 3 The pick-up hole shown can also be designed with a protrusion or groove structure at a specific position on the cover plate 200, which can be matched with the gripper or suction cup of the clamping mechanism to achieve a stable clamping effect.
[0078] Optionally, the clamping part 230 provided in this application embodiment may also be provided with a buckle or locking structure on the cover plate 200, which can cooperate with the corresponding parts of the clamping mechanism to achieve clamping by clamping or locking.
[0079] Therefore, by setting the clamping part 230, the embodiment of this application not only achieves stable clamping of the cover plate 200, but also significantly improves the convenience of operation and production efficiency.
[0080] Please refer to the following: Figure 2 In an optional embodiment, the tray 1000 further includes an identification mark 300 and a positioning element 400.
[0081] The identification mark 300 and the positioning element 400 are configured to enable the identified device to identify the initial positioning of the tray 1000.
[0082] by Figure 2 For example, the identification mark 300 is set on the upper surface of the base plate 100; correspondingly, the position of the cover plate 200 corresponding to the identification mark 300 should be set to a state where it does not obstruct the base plate 100. (For example) Figure 3 The slotted window 500 shown in the illustration, identification mark 300, can be understood in this embodiment as an identifier used to identify the identity ID of the current tray 1000.
[0083] The positioning element 400 can be one or more special structures disposed on the tray 1000. This structure can be visually identified, and the tray 1000 can be positioned based on the position of this structure. (Continuing with...) Figure 2 and Figure 3 For example, Figure 2 The base plate 100 and Figure 3 Each cover plate 200 is provided with a positioning element 400, specifically a first limiting hole 410 and a second limiting hole 420. The positioning element 400 can be configured with a dedicated pin cutting device to achieve the initial positioning of the material tray 1000.
[0084] For example, in this embodiment of the application, the positioning element 400 further includes a reflective target 430, which is capable of reflecting infrared light emitted by an external device, thereby achieving positioning.
[0085] Therefore, it can be seen that the tray 1000 in this embodiment is equipped with a clearly readable identification mark 300, which enables accurate identification of the current tray 1000's identity ID, facilitating tracking and management. Simultaneously, the positioning element 400 (such as a limiting hole), whether located on the base plate 100 or the cover plate 200, is positioned to be precisely captured by a dedicated pin-cutting device, thereby achieving initial positioning of the tray 1000 and significantly improving the identification and positioning efficiency of the tray 1000 on the automated production line.
[0086] Please refer to Figure 8 and Figure 9 , Figure 8 This is a schematic diagram of the structure of the identification band provided in an embodiment of this application; Figure 9 A schematic diagram of the installation positions of the identification strip and the light source provided in the embodiments of this application ( Figure 9 for Figure 2(Enlarged view of region D); In an optional embodiment, the base plate 100 also includes an identification strip 140 and a light source 150.
[0087] The identification band 140 is disposed on the lower surface of the base plate 100 along the second direction (Y direction) and is configured to identify the position of the tray 1000 in the second direction (Y direction) after the initial positioning is completed.
[0088] like Figure 8 As shown in the embodiment of this application, the identification strip is a natural acrylic sheet with scales from 1 to N. When an external device identifies the corresponding position of the identification strip, it can convert the specific scale value into the position information of the material tray 1000 in the second direction (Y direction).
[0089] The light source 150 is disposed on the upper surface of the base plate 100 and configured to provide the light source 150 to the tray 1000 when the position recognition in the second direction (Y direction) is completed.
[0090] like Figure 9 As shown, the identification strip 140 is disposed on the lower surface of the base plate 100, and the identification strip 140 is accommodated in the strip-shaped receiving groove 110 of the base plate 100. The light source 150 is disposed on the upper surface of the base plate 100. In this embodiment, the light source 150 is a strip light source 150, and the dimension of the strip light source 150 in the length direction is the same as the dimension of the base in the length direction (see reference). Figure 1 or Figure 2 ).
[0091] In the above implementation process, after the pin cutting device determines the basic information and initial position of the tray 1000 based on the identification mark 300 and the positioning member 400, it then identifies the position of the tray 1000 in the second direction (Y direction) through the identification strip. After successful identification, the light source 150 is turned on to enhance the visual effect of the tray 1000 and assist the pin cutting device in achieving more precise cutting.
[0092] pass Figure 8 and Figure 9As can be seen, the tray 1000 provided in this application embodiment significantly improves the accuracy and efficiency of the pin cutting device in identifying the position of the tray 1000 by cleverly integrating an identification strip 140 and a light source 150 on the base plate 100. The identification strip 140, as an auxiliary tool for precise positioning, features a scale design on its natural acrylic plate, enabling external devices to quickly and accurately capture the specific position information of the tray 1000 in the second direction (Y direction). The light source 150 not only enhances the visual visibility of the tray 1000 but also further optimizes the working environment of the pin cutting device, allowing it to operate under sufficient lighting conditions, thereby effectively improving the accuracy and stability of the cutting operation.
[0093] Please continue reading. Figure 9 In an optional embodiment, the base plate 100 further includes a conductive patch 160.
[0094] The conductive patch 160 is disposed on the end face of the base plate 100 along the second direction (Y direction) and configured to provide power to the light source 150.
[0095] Therefore, it can be seen that the conductive patch 160 is provided on the end face of the base plate 100 in the second direction (Y direction) in this embodiment of the application, which not only ensures that the light source 150 can obtain a stable and continuous power supply when needed, but also makes the entire tray 1000 structure more compact and efficient.
[0096] Please refer to Figure 10 , Figure 10 A schematic diagram of the operation of the material tray 1000 provided in this application embodiment; exemplarily illustrating the processing of the memory chip casing pins in the material tray 1000:
[0097] First, the chip housing, after its pins have been bent, is placed into the chip receiving slot 110 on the base plate 100 using a dedicated pick-up device. Then, a clamping device is used to engage the first positioning part 120 and the second positioning part 220 through the clamping part 230 (pick-up hole). At this time, the limiting groove 210 contacts the chip housing, and the elastic element 212 begins to restrict the degree of freedom of the chip (silicone pad) housing.
[0098] Furthermore, the tray 1000 is placed on the production line, which then carries it into a dedicated lead-cutting device. The identification mark 300 exposed on the tray 1000 is recognized by the dedicated lead-cutting device, and the positioning component 400 cooperates with it to achieve initial positioning. After initial positioning, the position of the tray 1000 in the second direction (Y direction) is determined by the identification band 140. When positioning is successful, the conductive patches 160 on both sides of the light source 150 become conductive, and the light source 150 illuminates. Further, the dedicated lead-cutting device emits infrared light onto the reflective target 430 and reads the position information.
[0099] Through the above three position confirmations, the position of the tray 1000 is precisely located on the dedicated pin-cutting device. When the tray 1000 moves in the prescribed direction on the pin-cutting device, the infrared light source 150 system on the device starts emitting light source 150. The light source 150 is captured again by the infrared light source 150 system through the reflective target 430 of the tray 1000. At this time, the terminal will determine the displacement of the storage tray by calculating the angle between the reflected light source 150 and the tray 1000, with the formula being displacement S=D*tan(β1-α1).
[0100] In summary, the tray 1000 provided in this application embodiment includes a base plate 100 and a cover plate 200. The tray 1000, through the cooperation of the base plate 100 with a receiving groove 110 and the cover plate 200 with a limiting groove 210, can stably confine the chip casing pins within the tray 1000. The accurate assembly of the base plate 100 and the cover plate 200 is achieved through the cooperation of the first limiting part on the base plate 100 and the second limiting part on the cover plate 200. The tray 1000, through the design of the base plate 100 and the cover plate 200, allows the chip casing pins to be stored within it, and enables efficient removal of the chip casing pins based on the tray 1000; thereby not only reducing labor costs and equipment procurement costs, but also greatly improving chip production efficiency.
[0101] The above are merely embodiments of this application and are not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. A tray characterized in that, The tray comprises a bottom plate with a plurality of first positioning parts and a plurality of accommodating grooves, a cover plate with a plurality of second positioning parts and a plurality of limiting grooves, and a first direction, a second direction and a third direction perpendicular to each other; The arrangement of the accommodating grooves on the bottom plate is consistent with the arrangement of the limiting grooves on the cover plate, the accommodating grooves are configured to accommodate chip tubes and tube pins, and the limiting grooves are configured to clamp the chip tubes in the first direction; The first positioning part cooperates with the second positioning part, and the first positioning part and the second positioning part are configured to position the bottom plate and the cover plate; The number of the accommodating grooves and the limiting grooves is consistent, and the number of the first positioning part and the second positioning part is consistent.
2. The tray of claim 1, wherein, The accommodating groove comprises a first accommodating cavity, a step and a second accommodating space; The first accommodating cavity and the second accommodating space are connected in the first direction through the step, and the radial dimension of the first accommodating cavity is smaller than the radial dimension of the second accommodating space; The first accommodating cavity is configured to accommodate the chip tube, and the second accommodating space is configured to accommodate the tube pin.
3. The tray of claim 2, wherein, The second accommodating space comprises a reserved cutout; The reserved cutout is arranged on one side of the second accommodating space in the second direction or the third direction, and is configured to reserve the accommodating space of the tube pin cutting part.
4. The tray of claim 3, wherein, The bottom plate comprises an accommodating hole; The maximum radial dimension of the accommodating groove is smaller than the radial dimension of the accommodating hole; One side of the reserved cutout of the accommodating groove is connected with one side of the accommodating hole, and the remaining side of the accommodating hole and the remaining side of the accommodating groove form a pin accommodating gap; wherein the pin accommodating gap is configured to accommodate the tube pin to be cut off.
5. The tray of claim 1, wherein, The limiting groove comprises a limiting surface and an elastic element; The limiting surfaces are oppositely arranged in the second direction and / or the third direction, and the limiting surfaces are configured to limit the position of the chip tube; The elastic element is arranged on the side of the limiting surface in contact with the chip tube, and the elastic element is configured to provide an elastic allowance between the chip tube and the limiting surface.
6. The tray of claim 5, wherein, The elastic element comprises a silica gel gasket; The silica gel gasket has a convex arc in the middle part in the first direction, which faces the chip tube.
7. The tray of claim 1, wherein, The cover plate comprises a clamping part, and the clamping part is configured to be clamped by a clamping mechanism.
8. The tray of claim 1, wherein, The tray further comprises an identification mark and a positioning part; The identification mark and the positioning part are configured to be identified by an identification device to preliminarily position the tray.
9. The tray of claim 8, wherein, The bottom plate further comprises an identification belt and a light source; The identification belt is arranged on the lower surface of the bottom plate in the second direction, and is configured to identify the position of the tray in the second direction when the preliminary positioning is completed; The light source is arranged on the upper surface of the bottom plate, and is configured to provide light source for the tray when the position identification in the second direction is completed.
10. The tray of claim 9, wherein, The bottom plate further comprises a conductive patch; The conductive patch is arranged on the end surface of the bottom plate in the second direction, and is configured to provide electric energy for the light source.