Vacuum cooling temporary storage mechanism and thin film deposition equipment

Abstract

The utility model discloses a vacuum cooling temporary storage mechanism and thin film deposition equipment, and relates to the technical field of semiconductor equipment. The vacuum cooling temporary storage mechanism comprises a temporary storage bin, a sealing gate valve, a storage box, a vacuumizing assembly and a cooling module. The vacuumizing assembly is connected with the temporary storage bin, the storage box is arranged in the temporary storage bin, the temporary storage bin is provided with a conveying opening, the sealing gate valve is used for closing or opening the conveying opening, the cooling module is connected with the temporary storage bin, and the cooling module is used for cooling the temporary storage bin. Compared with the prior art, the vacuum cooling temporary storage mechanism provided by the utility model adopts the vacuumizing assembly connected with the temporary storage bin and the sealing gate valve mounted in the temporary storage bin, so that the cleanliness of the temporary storage bin can be ensured, the temporary storage bin is prevented from being influenced by the transmission bin, gas in the temporary storage bin can be directly pumped out, and the service life of the temporary storage bin is prolonged. And heat emitted by the wafer is rapidly taken away, and the cooling efficiency is high.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor equipment technical field, specifically, a kind of vacuum cooling temporary storage mechanism and thin film deposition equipment. BACKGROUND

[0002] At present, thin film deposition equipment generally includes cooling temporary storage mechanism, transmission mechanism and deposition mechanism, wherein, transmission mechanism includes transmission bin and manipulator, manipulator is installed in transmission bin, transmission bin is connected with cooling temporary storage mechanism and deposition mechanism simultaneously.In wafer coating process, deposition mechanism is used for depositing wafer, manipulator is used to take out and place in cooling temporary storage mechanism for the wafer deposition completion, cooling temporary storage mechanism is used for temporary storage and cooling wafer, manipulator is also used to take out and discharge wafer for the cooling completion.

[0003] For cooling temporary storage mechanism, if wafer is placed in atmospheric condition and cooled naturally, then wafer partial oxidation film will react with gas in atmosphere, destroy oxidation film performance, and cooling speed is slow, resulting in lower production efficiency.Therefore, wafer is generally placed in temporary storage chamber (vacuum chamber) for cooling at present, but the temporary storage chamber of present is generally communicated with transmission chamber, and the cleanliness of temporary storage chamber can be affected by other chambers, and in the cooling process, the gas in temporary storage chamber needs to be pumped away by the vacuum pump of transmission chamber to take out the heat emitted by wafer, and the cooling efficiency is low.

[0004] Therefore, it is particularly important to design and manufacture a vacuum cooling temporary storage mechanism with high cleanliness and high cooling efficiency, especially in semiconductor production. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of vacuum cooling temporary storage mechanism, can guarantee the cleanliness of temporary storage bin, avoid its influence by transmission bin, and can directly pump out the gas in temporary storage bin, quickly take away the heat emitted by wafer, and the cooling efficiency is high.

[0006] Another purpose of the utility model is to provide a kind of thin film deposition equipment, can guarantee the cleanliness of temporary storage bin, avoid its influence by transmission bin, and can directly pump out the gas in temporary storage bin, quickly take away the heat emitted by wafer, and the cooling efficiency is high.

[0007] The utility model is realized by using the following technical solutions.

[0008] The vacuum cooling temporary storage mechanism comprises a temporary storage bin, a sealing gate valve, a storage box, a vacuumizing assembly and a cooling module, the vacuumizing assembly is connected with the temporary storage bin, the storage box is arranged in the temporary storage bin, the temporary storage bin is provided with a transmission port, the sealing gate valve is used for closing or opening the transmission port, and the cooling module is connected with the temporary storage bin and used for cooling the temporary storage bin.

[0009] Optionally, the vacuumizing assembly comprises an air exhaust pipeline and a vacuum angle valve, the air exhaust pipeline is connected with the temporary storage bin, and the vacuum angle valve is arranged on the air exhaust pipeline.

[0010] Optionally, the cooling module comprises an air cooling assembly, the air cooling assembly comprises a fan and an air pipe, the fan is connected with the air pipe, the air pipe is arranged in the temporary storage bin, the air pipe is provided with an air outlet, and the position of the air outlet corresponds to the position of the storage box.

[0011] Optionally, the cooling module comprises a water cooling assembly, the water cooling assembly comprises a water tank, a water pump and a cooling water path, the cooling water path is installed on the inner wall of the temporary storage bin, and the water tank is connected with the cooling water path through the water pump.

[0012] Optionally, the vacuum cooling temporary storage mechanism further comprises a lifting assembly, the lifting assembly comprises a driving piece and a lifting rod, one end of the lifting rod is connected with the driving piece, the other end of the lifting rod is arranged in the temporary storage bin and connected with the storage box.

[0013] Optionally, the lifting rod is detachably connected with the storage box through a joint.

[0014] Optionally, the storage box comprises a box body and a plurality of bearing grids, the bearing grids are uniformly and spacedly arranged in the box body, each layer of the bearing grids is used for bearing a wafer, and one side of the bearing grids close to the transmission port is provided with a notch for placing or taking out the wafer.

[0015] Optionally, the height of the bearing grid ranges from 5mm to 15mm.

[0016] Optionally, the temporary storage bin is provided with an observation window and / or a maintenance door.

[0017] The thin film deposition equipment comprises the vacuum cooling temporary storage mechanism.

[0018] The vacuum cooling temporary storage mechanism and the thin film deposition equipment have the following beneficial effects:

[0019] The vacuum cooling temporary storage mechanism provided by the utility model, vacuumizing assembly and temporary storage bin are connected, the storage box is arranged in the temporary storage bin, the temporary storage bin is provided with a transmission port, the sealing gate valve is used for closing or opening the transmission port, the cooling module is connected with the temporary storage bin, and the cooling module is used for cooling the temporary storage bin.

[0020] The thin film deposition equipment provided by the utility model can guarantee the cleanliness of the temporary storage bin, avoid the influence of the transmission bin, directly extract the gas in the temporary storage bin, quickly take away the heat emitted by the wafer, and has high cooling efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments, and it should be understood that the following drawings only show some embodiments of the utility model, and should not be regarded as the limitation to the scope, and for the ordinary skilled in the art, other related drawings can also be obtained according to these drawings without the creative labor.

[0022] Figure 1 The structure schematic view of the vacuum cooling temporary storage mechanism provided by the utility model embodiment is shown in the figure.

[0023] Figure 2 The structure schematic view of the vacuum cooling temporary storage mechanism provided by the utility model embodiment after the removal of the inspection door is shown in the figure.

[0024] Figure 3 The structure schematic view of the temporary storage bin in the vacuum cooling temporary storage mechanism provided by the utility model embodiment is shown in the figure.

[0025] Figure 4 The structure schematic view of the vacuum cooling temporary storage mechanism provided by the utility model embodiment is shown in the figure.

[0026] Figure 5 The structure schematic view of the air cooling assembly in the vacuum cooling temporary storage mechanism provided by the utility model embodiment is shown in the figure.

[0027] Figure 6 The structure schematic view of the water cooling assembly in the vacuum cooling temporary storage mechanism provided by the utility model embodiment is shown in the figure.

[0028] Figure 7 The structure schematic view of the storage box in the vacuum cooling temporary storage mechanism provided by the utility model embodiment is shown in the figure.

[0029] Figure 8 The structure schematic diagram of the connection between the lifting assembly and the storage box in the vacuum cooling temporary storage mechanism is provided for the embodiment of the utility model.

[0030] Icon: 100-vacuum cooling temporary storage mechanism;110-temporary storage warehouse;111-conveying port;112-pumping port;113-air inlet;114-water inlet;115-water outlet;120-sealing gate valve;130-storage box;131-box body;132-bearing grid;133-notch;140-vacuum pumping assembly;141-pumping pipeline;142-vacuum angle valve;150-air cooling assembly;151-fan;152-air pipe;153-air outlet;160-water cooling assembly;161-water tank;162-water pump;163-cooling waterway;170-lifting assembly;171-driving member;172-lifting rod;173-joint;180-observation window;190-access door. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. The components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the utility model.

[0033] It should be noted that: similar labels and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0034] In the description of the utility model, it needs to explain, the term "inner", "outer", "upper", "lower", "horizontal" and so on indicate the orientation or position relation is based on the orientation or position relation shown in the drawing, or it is the orientation or position relation of the utility model product when using commonly placed, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply the device or element must have a particular orientation, with a particular orientation structure and operation, therefore cannot be understood as the limitation of the utility model. In addition, the term "first", "second", "third" and so on are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0035] In the description of the utility model, it also needs to explain, unless otherwise expressly provided and limited, the term "set", "connected", "installed", "connected" should be broad understanding, for example, can be fixed connection, can be detachable connection, or integrally connected;Can be mechanical connection, can be electrical connection;Can be directly connected, can be indirectly connected through the intermediate medium, can be the communication of two elements inside. For ordinary skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0036] Some embodiments of the utility model will be described in detail below in combination with the drawings. In the case of no conflict, the features in the following examples can be combined with each other.

[0037] Please refer to Figures 1 to 3 The utility model embodiment provides a kind of vacuum cooling temporary storage mechanism 100, for wafer is temporarily stored and cooled.It can guarantee the cleanliness of temporary storage bin 110, avoid its influence by transmission bin, and can directly extract the gas in temporary storage bin 110, quickly take away the heat dissipated by wafer, and cooling efficiency is high.

[0038] The vacuum cooling temporary storage mechanism 100 comprises a temporary storage bin 110, a sealing gate valve 120, a storage box 130, a vacuum pumping assembly 140 and a cooling module (not labeled in the figure). The vacuum pumping assembly 140 is connected with the temporary storage bin 110, and is used to pump out the air in the temporary storage bin 110, so that the temporary storage bin 110 is in a vacuum state. The storage box 130 is arranged in the temporary storage bin 110, and is used to store wafers, so as to realize the temporary storage and cooling of the wafers. The cooling module is connected with the temporary storage bin 110, and is used to cool the temporary storage bin 110. The temporary storage bin 110 is provided with a transmission port 111 in communication with a transmission bin, and a mechanical hand can pass through the transmission port 111 to realize the taking and placing of wafers. The sealing gate valve 120 is installed on the temporary storage bin 110 and closes the transmission port 111, and the sealing gate valve 120 is used to open the transmission port 111 when the wafers are taken and placed, that is, the temporary storage bin 110 is in a normally closed state, and the transmission port 111 is only opened when the wafers are taken and placed, so as to reduce the material interaction between the temporary storage bin 110 and the transmission bin, ensure the cleanliness of the temporary storage bin 110, and avoid the influence of the transmission bin; after the wafers are taken and placed, the sealing gate valve 120 is used to close the transmission port 111, and the vacuum pumping assembly 140 is used to directly pump out the gas in the temporary storage bin 110, so as to quickly take away the heat emitted by the wafers, and the cooling efficiency is high.

[0039] In the embodiment, the sealing gate valve 120 is installed on the temporary storage bin 110, and is used to close or open the transmission port 111. However, it is not limited thereto, and in other embodiments, the sealing gate valve 120 can be installed on the transmission bin in communication with the temporary storage bin 110, or can be arranged in a channel between the temporary storage bin 110 and the transmission bin, and the arrangement position of the sealing gate valve 120 is not limited specifically.

[0040] Preferably, the sealing gate valve 120 is driven by an electric cylinder to open or close the transmission port 111, so as to realize the normally closed function of the temporary storage bin 110, and ensure that the wafers can be normally taken and placed.

[0041] Please refer to Figure 3 and Figure 4 , the vacuum pumping assembly 140 comprises a vacuum pump, a gas pumping pipeline 141 and a vacuum angle valve 142. The vacuum pump is connected with the temporary storage bin 110 through the gas pumping pipeline 141, and the vacuum angle valve 142 is arranged on the gas pumping pipeline 141 and is used to control the opening and closing of the gas pumping pipeline 141. The vacuum pump can be independently arranged, or can be shared with other vacuum pumping pipelines of the thin film deposition equipment. Specifically, the bottom of the temporary storage bin 110 is provided with a gas outlet 112, and the gas pumping pipeline 141 is in communication with the gas outlet 112 through a flange, so as to ensure the sealing property of the pumping process.

[0042] Please refer to Figure 3 and Figure 5Preferably, the cooling module comprises an air cooling assembly 150. The air cooling assembly 150 comprises a fan 151 and an air duct 152, the fan 151 is connected with the air duct 152, the air duct 152 extends into the temporary storage bin 110 and is provided with an air outlet 153 in a trumpet diffuser shape, the air outlet 153 corresponds to the position of the storage box 130. Specifically, the fan 151 is used to blow clean air (nitrogen or other inert gas) into the temporary storage bin 110 through the air duct 152 to air cool the wafer in the storage box 130, quickly take away the heat emitted from the wafer surface, and further improve the cooling efficiency of the wafer. At the same time, the air cooling flow can also blow away the particle contaminants adhered to the wafer, thereby improving the cleanliness of the wafer.

[0043] Further, the bottom of the temporary storage bin 110 is provided with an air inlet 113, the air duct 152 passes through the air inlet 113, and the air inlet 113 is arranged away from the air outlet 112, so that the air cooling flow can blow to every corner of the temporary storage bin 110 and be drawn away from the air outlet 112 under the action of the vacuum pump, avoiding the situation that the air cooling flow cannot blow to the local position in the temporary storage bin 110, and ensuring the air cooling effect.

[0044] Please refer to Figure 3 and Figure 6 Preferably, the cooling module comprises a water cooling assembly 160. The water cooling assembly 160 comprises a water tank 161, a water pump 162 and a cooling water channel 163, the cooling water channel 163 is installed on the inner wall of the temporary storage bin 110, and the water tank 161 is connected with the cooling water channel 163 through the water pump 162. Specifically, the water pump 162 is used to draw the cooling water in the water tank 161 to the cooling water channel 163, and the cooling water takes away the heat in the temporary storage bin 110 during the flowing process in the cooling water channel 163, thereby realizing the water cooling function of the inner wall of the temporary storage bin 110, further reducing the overall temperature of the environment in the temporary storage bin 110, and further improving the cooling efficiency of the wafer.

[0045] Further, the bottom of the temporary storage bin 110 is provided with an air inlet 113, the air duct 152 passes through the air inlet 113, and the air inlet 113 is arranged away from the air outlet 112, so that the air cooling flow can blow to every corner of the temporary storage bin 110 and be drawn away from the air outlet 112 under the action of the vacuum pump, avoiding the situation that the air cooling flow cannot blow to the local position in the temporary storage bin 110, and ensuring the air cooling effect.

[0046] Please refer to Figure 7 and Figure 8The storage box 130 comprises a box body 131 and a plurality of bearing grids 132. The bearing grids 132 are uniformly spaced in the box body 131, and each layer of the bearing grids 132 is used for bearing a wafer. The number of the bearing grids 132 is multiple layers, the multiple layers of the bearing grids 132 are arranged in equal intervals and are connected in the box body 131. Each layer of the bearing grids 132 is used for bearing a wafer, so as to simultaneously achieve temporary storage and cooling of multiple wafers, improve the cooling efficiency of the multiple wafers, and thus improve the production efficiency of the thin film deposition equipment. In the embodiment, the number of the bearing grids 132 is less than or equal to 25 layers, that is, the storage box 130 bears a maximum of 25 wafers, so as to simultaneously achieve temporary storage and cooling of multiple wafers, has a large temporary storage capacity, and has a good cooling effect.

[0047] Further, the bearing grids 132 are provided with notches 133 on one side close to the conveying port 111, and the notches 133 are used for placing or taking out the wafers. The number of the air outlets 153 is the same as that of the bearing grids 132, and the position of each air outlet 153 corresponds to that of one bearing grid 132, so as to simultaneously achieve air cooling of the multiple wafers.

[0048] Preferably, the height of each layer of the bearing grids 132 ranges from 5 mm to 15 mm, so as to ensure that the bearing grids 132 have sufficient space for the air cooling flow to blow in after the wafers are placed, and improve the cooling effect of the air cooling flow on the wafers.

[0049] Preferably, the vacuum cooling and temporary storage mechanism 100 further comprises a lifting assembly 170. The lifting assembly 170 comprises a driving member 171 and a lifting rod 172, one end of the lifting rod 172 is connected with the driving member 171, the other end of the lifting rod 172 extends into the temporary storage bin 110 and is detachably connected with the storage box 130 through a joint 173, and the driving member 171 is used for driving the storage box 130 to ascend or descend through the lifting rod 172, so as to facilitate the robot to place or take the wafers at different heights in the storage box 130.

[0050] In the embodiment, the driving member 171 is an electric cylinder, but is not limited thereto. In other embodiments, the driving member 171 can be a pneumatic cylinder or a hydraulic cylinder, and the type of the driving member 171 is not limited.

[0051] Please refer to Figure 1 and Figure 2 Preferably, the temporary storage bin 110 is provided with an observation window 180, and the observation window 180 is used for allowing the staff to observe the situation in the temporary storage bin 110, so as to timely find problems and handle them.

[0052] Preferably, the temporary storage bin 110 is provided with a maintenance door 190, and the maintenance door 190 is used for allowing the staff to maintain and repair the vacuum cooling and temporary storage mechanism 100, which is convenient and practical.

[0053] This utility model embodiment also provides a thin film deposition apparatus, which includes the vacuum cooling temporary storage mechanism 100 described above.

[0054] The vacuum cooling temporary storage mechanism 100 provided in this embodiment of the utility model includes a vacuum pumping component 140 connected to a temporary storage chamber 110, a storage box 130 disposed within the temporary storage chamber 110 for storing wafers, a transfer port 111 communicating with a transfer chamber in the temporary storage chamber 110, a sealing gate valve 120 installed in the temporary storage chamber 110 and closing the transfer port 111, and the sealing gate valve 120 used to open the transfer port 111 when wafers are picked up or put down, and a cooling module connected to the temporary storage chamber 110 for cooling the temporary storage chamber 110. Compared with the prior art, the vacuum cooling temporary storage mechanism 100 provided by this utility model, due to the use of the vacuum pumping component 140 connected to the temporary storage chamber 110 and the sealing gate valve 120 installed in the temporary storage chamber 110, can ensure the cleanliness of the temporary storage chamber 110, avoid its influence from the transfer chamber, and can directly extract the gas in the temporary storage chamber 110, quickly removing the heat dissipated by the wafers, resulting in high cooling efficiency. This results in high production efficiency and good product quality in thin film deposition equipment.

[0055] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A vacuum cooling temporary storage mechanism, characterized in that, The device includes a temporary storage chamber, a sealing gate valve, a storage box, a vacuuming assembly, and a cooling module. The vacuuming assembly is connected to the temporary storage chamber, the storage box is disposed inside the temporary storage chamber, the temporary storage chamber has a transmission port, the sealing gate valve is used to close or open the transmission port, and the cooling module is connected to the temporary storage chamber and is used to cool the temporary storage chamber.

2. The vacuum cooling temporary storage mechanism according to claim 1, characterized in that, The vacuum assembly includes a vacuum line and a vacuum valve. The vacuum line is connected to the temporary storage chamber, and the vacuum valve is located on the vacuum line.

3. The vacuum cooling temporary storage mechanism according to claim 1, characterized in that, The cooling module includes an air-cooling component, which includes a fan and an air duct. The fan is connected to the air duct, which extends into the temporary storage compartment. The air duct has an air outlet, the position of which corresponds to the position of the storage box.

4. The vacuum cooling temporary storage mechanism according to claim 1, characterized in that, The cooling module includes a water-cooling component, which includes a water tank, a water pump, and a cooling water circuit. The cooling water circuit is installed on the inner wall of the temporary storage compartment, and the water tank is connected to the cooling water circuit through the water pump.

5. The vacuum cooling temporary storage mechanism according to any one of claims 1-4, characterized in that, The vacuum cooling temporary storage mechanism also includes a lifting assembly, which includes a drive component and a lifting rod. One end of the lifting rod is connected to the drive component, and the other end extends into the temporary storage chamber and is connected to the storage box.

6. The vacuum cooling temporary storage mechanism according to claim 5, characterized in that, The lifting rod is detachably connected to the storage box via a connector.

7. The vacuum cooling temporary storage mechanism according to any one of claims 1-4, characterized in that, The storage box includes a box body and a carrier grid. The carrier grids are evenly spaced within the box body. Each layer of the carrier grid is used to hold one wafer. A notch is provided on the side of the carrier grid near the transmission port for inserting or removing the wafer.

8. The vacuum cooling temporary storage mechanism according to claim 7, characterized in that, The height range of the bearing grid is 5mm-15mm.

9. The vacuum cooling temporary storage mechanism according to any one of claims 1-4, characterized in that, The temporary storage compartment is equipped with an observation window and / or an inspection door.

10. A thin film deposition apparatus, characterized in that, Includes the vacuum cooling temporary storage mechanism as described in any one of claims 1 to 9.

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