Semiconductor refrigeration module, refrigeration system and air conditioner

Abstract

The utility model belongs to the technical field of compressor refrigeration, and particularly relates to a semiconductor refrigeration module, a refrigeration system and an air conditioner. A semiconductor refrigeration module comprises a refrigerant inlet pipe, a refrigerant outlet pipe and a micro-channel pipe row communicated between the refrigerant inlet pipe and the refrigerant outlet pipe, and a plurality of P-N knots are connected to the side wall of the micro-channel pipe row in series to cool the micro-channel pipe row. During use, the refrigeration module is connected to a pipeline between a condenser and an electronic expansion valve in parallel through the refrigerant inlet pipe and the refrigerant outlet pipe. The refrigerating effect of the whole air conditioning system is improved by utilizing a refrigerating mode of combining semiconductor refrigeration with a heat pump of an existing air conditioning system, and the experience requirement of a user is met.

Description

Technical Field

[0001] This utility model belongs to the field of compressor refrigeration technology, specifically relating to a semiconductor refrigeration module, a refrigeration system, and an air conditioner. Background Technology

[0002] Traditional heat pump air conditioners have some disadvantages when cooling at high temperatures. For example, when the air conditioner operates in cooling mode under high-temperature conditions, the pressure on the high-pressure side of the air conditioning system will rise significantly. This not only places higher demands on the pressure resistance and reliability of the compressor and various pipelines, but also significantly increases the compressor discharge temperature, which can easily lead to deterioration of the compressor oil quality. In addition, the high ambient temperature will also cause the compressor cylinder temperature to rise, which can easily lead to shutdown due to high-temperature protection. In severe cases, it can even cause the compressor rotor enameled wire to melt, the compressor rotor coil to short-circuit, or even the compressor to burn out.

[0003] In high-temperature external environments, the energy efficiency ratio (EER) of traditional air conditioners typically decreases. The refrigerant's heat absorption capacity in the evaporator weakens, affecting cooling performance and potentially preventing the indoor temperature from reaching the set value. Simultaneously, the condenser's heat dissipation efficiency also decreases, leading to a reduction in the refrigeration cycle efficiency and consequently impacting overall cooling capacity, ultimately failing to meet user experience requirements.

[0004] This invention proposes a cooling method that combines a semiconductor refrigeration module with a heat pump in an existing air conditioning system, thereby improving the cooling effect of the entire air conditioning system and meeting the user's experience needs. Utility Model Content

[0005] The purpose of this invention is to address the problems that, in high-temperature external environments, the energy efficiency ratio (EER) of traditional air conditioners usually decreases; the heat absorption capacity of the refrigerant in the evaporator weakens, thus affecting the cooling effect, which may cause the indoor temperature to fail to reach the set value; at the same time, the heat dissipation efficiency of the condenser also decreases, resulting in a decrease in the efficiency of the refrigeration cycle, which in turn affects the overall cooling capacity and makes it difficult to meet the user experience. The invention provides a semiconductor refrigeration module, a refrigeration system, and an air conditioner.

[0006] On one hand, this utility model provides a semiconductor refrigeration module, including a refrigerant inlet pipe, a refrigerant outlet pipe, and a microchannel tube array connecting the refrigerant inlet pipe and the refrigerant outlet pipe. Several PN junctions are connected in series on the sidewall of the microchannel tube array to cool the microchannel tube array. In use, the refrigeration module is connected in parallel to the pipeline between the condenser and the electronic expansion valve through the refrigerant inlet pipe and the refrigerant outlet pipe.

[0007] When the external environment temperature is high, the temperature of the high-pressure liquid refrigerant flowing out of the condenser is still high, the specific enthalpy of the low-temperature low-pressure wet vapor obtained after throttling by the electronic expansion valve is still high, and the final obtained refrigerating capacity can be difficult to meet the demand. The utility model provides a kind of semiconductor refrigeration module, utilize the refrigeration mode of combination of semiconductor refrigeration and existing air conditioning system heat pump, to improve the refrigeration effect of entire air conditioning system, meet the experience demand of user. When using, the semiconductor refrigeration module provided by the utility model is connected in parallel between condenser and electronic expansion valve, high-pressure liquid refrigerant from condenser enters microchannel tube row through refrigerant inlet pipe, realizes rapid refrigeration through P-N junction on microchannel tube row side wall, and then flows to electronic expansion valve throttling from refrigerant outlet pipe, to obtain lower low-temperature low-pressure wet steam, thereby improve refrigerating capacity, meet the demand of user.

[0008] Further, the microchannel tube row is connected with the heat sink through a heat exchange element.

[0009] In the semiconductor refrigeration module provided by the utility model, the microchannel tube row is connected with the heat sink through a heat exchange element, so that the heat generated by the semiconductor refrigeration module can be taken away by the heat exchange element, which is conducive to improving the refrigeration efficiency of the semiconductor refrigeration module.

[0010] Further, the heat exchange element is a heat pipe.

[0011] In the semiconductor refrigeration module provided by the utility model, the heat exchange element is selected as a heat pipe, which is conducive to improving the heat taking away efficiency.

[0012] Further, the heat sink is a wind-cooled heat sink.

[0013] Further, the heat sink is a finned wind-cooled heat sink.

[0014] In the semiconductor refrigeration module provided by the utility model, the heat sink is selected as a finned wind-cooled heat sink, which is conducive to improving the heat dissipation efficiency.

[0015] Further, a ceramic sheet is arranged between the side wall of the microchannel tube row and the P-N junction.

[0016] Further, it further includes a first header and a second header, the refrigerant inlet pipe is connected with the microchannel tube row in communication through the first header, and the refrigerant outlet pipe is connected with the microchannel tube row in communication through the second header.

[0017] On the other hand, the utility model also provides a kind of refrigeration system, including evaporator, condenser, electronic expansion valve, compressor, gas-liquid separator and above-mentioned semiconductor refrigeration module;

[0018] The A port of the gas-liquid separator is connected to the A port of the compressor, the A port of the evaporator and the A port of the condenser are respectively connected to the two ends of the electronic expansion valve, and the B port of the gas-liquid separator, the B port of the compressor, the B port of the evaporator and the B port of the condenser are connected through a four-way valve.

[0019] The semiconductor refrigeration module is connected in parallel to the condenser and the electronic expansion valve via a refrigerant inlet pipe and a refrigerant outlet pipe, and the refrigerant inlet pipe is close to the A port of the condenser.

[0020] Since the refrigeration system provided by this utility model includes the aforementioned semiconductor refrigeration module, the refrigeration system provided by this utility model also utilizes a refrigeration method that combines semiconductor refrigeration with the heat pump of the existing air conditioning system to improve the refrigeration effect of the entire air conditioning system and meet the user's experience needs.

[0021] In operation, when the ambient temperature is high, the refrigeration cycle of this refrigeration system is as follows: low-pressure refrigerant vapor flowing from the evaporator flows to the gas-liquid separator via a four-way valve; after gas-liquid separation, the low-pressure refrigerant vapor is drawn into the compressor and compressed into high-temperature, high-pressure refrigerant vapor; then, the high-temperature, high-pressure refrigerant vapor flows through the condenser via the four-way valve, and transfers heat to the external environment through the condenser, transforming into high-pressure liquid refrigerant; because the semiconductor refrigeration module is connected in parallel between the condenser and the electronic expansion valve in the refrigeration system provided by this invention, the high-pressure liquid refrigerant flowing from the condenser enters the microchannel tube bank through the refrigerant inlet pipe, and after rapid cooling through the PN junction on the side wall of the microchannel tube bank, it flows from the refrigerant outlet pipe to the electronic expansion valve for throttling. At this time, the high-pressure liquid refrigerant is transformed into low-temperature, low-pressure wet vapor through throttling; compared with existing refrigeration systems, the refrigeration system provided by this invention can obtain low-temperature, low-pressure wet vapor with a lower specific enthalpy and can improve the refrigeration capacity to meet user needs. Finally, the low-temperature, low-pressure wet vapor flows through the evaporator to absorb heat from the refrigerant, and then transforms into low-pressure refrigerant vapor, thus completing a refrigeration cycle.

[0022] Furthermore, an evaporation fan is provided on the side of the evaporator.

[0023] Furthermore, a condenser fan is provided on the side of the condenser.

[0024] Furthermore, the A port of the condenser, the inlet end of the condenser pipe, and the port of the refrigerant inlet pipe are connected by a three-way valve.

[0025] In the refrigeration system provided by this utility model, the A port of the condenser, the inlet end of the condenser pipe and the port of the refrigerant inlet pipe are connected by a three-way valve, so that the refrigeration system provided by this utility model can have two working modes to adapt to the refrigeration needs of suitable external ambient temperature and high external ambient temperature.

[0026] When the ambient temperature is suitable, the heat pump alone can meet the cooling needs. Only the heat pump is operating, and the semiconductor refrigeration module is not working. The refrigeration cycle at this time is as follows: Low-pressure refrigerant vapor flowing from the evaporator flows through a four-way valve to the gas-liquid separator. After gas-liquid separation, the low-pressure refrigerant vapor is drawn into the compressor, where it is compressed into high-temperature, high-pressure refrigerant vapor. It then flows through the condenser via the four-way valve. Here, the high-temperature, high-pressure refrigerant vapor transfers heat to the external environment through the condenser, transforming into high-pressure liquid refrigerant. It then flows directly to the electronic expansion valve through a three-way valve. At this point, the high-pressure liquid refrigerant is throttled into low-temperature, low-pressure wet vapor, and finally flows through the evaporator to absorb heat from the refrigerant, thus transforming into low-pressure refrigerant vapor, completing one refrigeration cycle.

[0027] When the ambient temperature is high, the low-pressure refrigerant vapor flowing from the evaporator flows to the gas-liquid separator via a four-way valve. After gas-liquid separation, the low-pressure refrigerant vapor is drawn into the compressor and compressed, transforming into high-temperature, high-pressure refrigerant vapor. Then, the high-temperature, high-pressure refrigerant vapor flows through the condenser via the four-way valve, transferring heat to the external environment and transforming into high-pressure liquid refrigerant. In the refrigeration system provided by this invention, the semiconductor refrigeration module is connected in parallel between the condenser and the electronic expansion valve. Thus, the high-pressure liquid refrigerant flowing from the condenser enters the microchannel tube bank through the refrigerant inlet pipe. After rapid cooling via the PN junction on the side wall of the microchannel tube bank, it flows from the refrigerant outlet pipe to the electronic expansion valve for throttling. At this point, the high-pressure liquid refrigerant is throttled and transformed into low-temperature, low-pressure wet vapor. Compared to existing refrigeration systems, the refrigeration system provided by this invention can obtain low-temperature, low-pressure wet vapor with a lower specific enthalpy and can increase the cooling capacity to meet user needs. Finally, the low-temperature, low-pressure wet vapor flows through the evaporator to absorb heat from the refrigerant, and then transforms into low-pressure refrigerant vapor, thus completing a refrigeration cycle.

[0028] Furthermore, this utility model also provides an air conditioner, including the aforementioned refrigeration system.

[0029] Since the air conditioner provided by this utility model includes the above-mentioned refrigeration system, the air conditioner provided by this utility model also utilizes a refrigeration method that combines semiconductor refrigeration with the heat pump of the existing air conditioning system to improve the refrigeration effect of the entire air conditioning system and meet the user's experience needs.

[0030] In operation, when the ambient temperature is high, the refrigeration cycle of this air conditioner is as follows: low-pressure refrigerant vapor flowing from the evaporator flows to the gas-liquid separator via a four-way valve; after gas-liquid separation, the low-pressure refrigerant vapor is drawn into the compressor and compressed into high-temperature, high-pressure refrigerant vapor; then, the high-temperature, high-pressure refrigerant vapor flows through the condenser via the four-way valve, and transfers heat to the external environment through the condenser, transforming into high-pressure liquid refrigerant; because the semiconductor refrigeration module is connected in parallel between the condenser and the electronic expansion valve in the refrigeration system provided by this invention, the high-pressure liquid refrigerant flowing from the condenser enters the micro-channel tube bank through the refrigerant inlet pipe, and after rapid cooling through the PN junction on the side wall of the micro-channel tube bank, it flows from the refrigerant outlet pipe to the electronic expansion valve for throttling. At this time, the high-pressure liquid refrigerant is throttled into low-temperature, low-pressure wet vapor; compared with existing refrigeration systems, the refrigeration system provided by this invention can obtain low-temperature, low-pressure wet vapor with a lower specific enthalpy and can improve the cooling capacity to meet user needs. Finally, the low-temperature, low-pressure wet vapor flows through the evaporator to absorb heat from the refrigerant, and then transforms into low-pressure refrigerant vapor, thus completing a refrigeration cycle.

[0031] The beneficial effects of this utility model are as follows:

[0032] When the ambient temperature is high, the high-pressure liquid refrigerant flowing from the condenser remains at a high temperature. Even after being throttled directly by the electronic expansion valve, the resulting low-temperature, low-pressure wet vapor still has a high specific enthalpy, potentially making it difficult to meet the cooling demand. This invention utilizes a cooling method that combines semiconductor refrigeration with the heat pump of existing air conditioning systems to improve the overall cooling effect of the air conditioning system and meet user experience requirements.

[0033] Meanwhile, in the semiconductor refrigeration module provided by this utility model, the microchannel tube array is connected to the heat sink through a heat exchange element, so that the heat generated by the semiconductor refrigeration module can be carried away by the heat exchange element, which is beneficial to improving the refrigeration efficiency of the semiconductor refrigeration module. Furthermore, the heat exchange element is selected as a heat pipe, which is beneficial to improving the heat removal efficiency; the heat sink is preferably a finned air-cooled heat sink, which is beneficial to improving the heat dissipation efficiency. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of Example 1 (including a three-way valve).

[0035] Figure 2 for Figure 1 A top-down view.

[0036] Figure 3 This is a schematic diagram of the connection structure of the first manifold, the second manifold, and the microchannel tube array.

[0037] Figure 4 for Figure 3A side view diagram.

[0038] Figure 5 This is a schematic diagram of the connection structure of the microchannel tube array, heat exchange elements and radiator.

[0039] Figure 6 This is a schematic diagram showing the connection of a semiconductor refrigeration module in parallel between the condenser and the electronic expansion valve.

[0040] Figure 7 This is a schematic diagram of the structure of Example 2.

[0041] Figure label:

[0042] 11—Refrigerant inlet pipe, 12—Refrigerant outlet pipe, 13—Microchannel tube bank, 14—PN junction, 15—Heat exchange element, 16—Radiator, 17—Ceramic fin, 18—First manifold, 19—Second manifold;

[0043] 21 - Evaporator, 22 - Condenser, 23 - Electronic expansion valve, 24 - Compressor, 25 - Liquid separator, 26 - Four-way valve, 27 - Condensation piping, 28 - Three-way valve, 29 - Evaporator fan, 210 - Condenser fan. Detailed Implementation

[0044] The present invention will be further described in detail below with reference to experimental examples and specific embodiments. However, this should not be construed as limiting the scope of the above-mentioned subject matter of the present invention to the following embodiments. All technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0045] Example 1

[0046] In response to the problem that the energy efficiency ratio (EER) of traditional air conditioners typically decreases in high-temperature environments, the heat absorption capacity of the refrigerant in the evaporator 21 weakens, thus affecting the cooling effect and potentially preventing the indoor temperature from reaching the set value, and the heat dissipation efficiency of the condenser 22 also decreases, leading to a decrease in the refrigeration cycle efficiency and consequently affecting the overall cooling capacity, making it difficult to meet user experience requirements, this embodiment 1 provides a semiconductor refrigeration module that can be combined with the heat pump of an existing air conditioning system. By combining traditional heat pump technology with semiconductor refrigeration, the energy efficiency ratio of the air conditioner can be improved in high-temperature environments.

[0047] like Figures 1 to 5 As shown, this embodiment 1 provides a semiconductor cooling module, including a refrigerant inlet pipe 11, a refrigerant outlet pipe 12, and a microchannel array 13.

[0048] The refrigerant inlet pipe 11 is connected to the microchannel pipe array 13 via the first manifold 18, and the refrigerant outlet pipe 12 is connected to the microchannel pipe array 13 via the second manifold 19. During use, liquid refrigerant enters the microchannel pipe array through the refrigerant inlet pipe 11 and flows out through the refrigerant outlet pipe 12.

[0049] In this embodiment 1, a plurality of PN junctions 14 are connected in series on the sidewall of the microchannel array 13 to cool the microchannel array 13. Further, in this embodiment 1, a ceramic sheet 17 is provided between the sidewall of the microchannel array 13 and the PN junctions 14. Preferably, in Figure 4 In the view shown, ceramic plates 17 can be placed on both the top and bottom sides of the PN junction 14.

[0050] In use, in this embodiment 1, the refrigerant inlet pipe 11 and the refrigerant outlet pipe 12 are connected in parallel on the pipeline between the condenser 22 and the electronic expansion valve 23.

[0051] When the ambient temperature is high, the temperature of the high-pressure liquid refrigerant flowing out of the condenser 22 is still high. The enthalpy of the low-temperature, low-pressure wet vapor obtained after throttling by the electronic expansion valve 23 is still high, which may make it difficult to meet the demand for the final cooling capacity.

[0052] This embodiment 1 provides a semiconductor refrigeration module that combines semiconductor refrigeration with the heat pump of an existing air conditioning system to improve the overall cooling effect of the air conditioning system and meet user experience requirements. In use, the semiconductor refrigeration module provided in this embodiment 1 is connected in parallel between the condenser 22 and the electronic expansion valve 23. The high-pressure liquid refrigerant flowing from the condenser 22 enters the micro-channel tube bank through the refrigerant inlet pipe 11. After rapid cooling via the PN junction 14 on the side wall of the micro-channel tube bank, it flows from the refrigerant outlet pipe 12 to the electronic expansion valve 23 for throttling, resulting in low-temperature, low-pressure wet vapor with a lower specific enthalpy, thereby increasing the cooling capacity and meeting user needs.

[0053] Furthermore, in this embodiment 1, the microchannel tube array 13 is connected to the heat exchange element 15 and the radiator 16.

[0054] In the semiconductor refrigeration module provided in Embodiment 1, the microchannel array 13 is connected to the heat sink 16 via a heat exchange element 15, allowing the heat generated by the semiconductor refrigeration module to be carried away by the heat exchange element 15, which is beneficial to improving the refrigeration efficiency of the semiconductor refrigeration module. In the semiconductor refrigeration module provided in Embodiment 1, the heat exchange element 15 is selected as a heat pipe, which further helps to improve the heat removal efficiency.

[0055] Furthermore, in the semiconductor cooling module provided in Embodiment 1, the heat sink 16 is preferably an air-cooled heat sink 16. To improve heat dissipation efficiency, in the semiconductor cooling module provided in Embodiment 1, the heat sink 16 can be further selected as a finned air-cooled heat sink 16.

[0056] Example 2

[0057] In response to the problem that the energy efficiency ratio (EER) of traditional air conditioners typically decreases in high-temperature external environments, the heat absorption capacity of the refrigerant in the evaporator 21 weakens, thus affecting the cooling effect, which may cause the indoor temperature to fail to reach the set value; at the same time, the heat dissipation efficiency of the condenser 22 also decreases, resulting in a decrease in the efficiency of the refrigeration cycle, which in turn affects the overall cooling capacity and makes it difficult to meet the user experience, this embodiment 1 provides a refrigeration system that can be combined with the heat pump of the existing air conditioning system during use. By combining traditional heat pump technology and semiconductor refrigeration, the energy efficiency ratio of the air conditioner can be improved in high-temperature external environments.

[0058] like Figure 6 and Figure 7 As shown, this embodiment 2 provides a refrigeration system, including an evaporator 21, a condenser 22, an electronic expansion valve 23, a compressor 24, a gas-liquid separator 25, and the semiconductor refrigeration module in embodiment 1.

[0059] The gas-liquid separator 25 has its A port connected to the compressor 24, the evaporator 21 has its A port connected to both ends of the electronic expansion valve 23, and the gas-liquid separator 25, the compressor 24, the evaporator 21 and the condenser 22 have their B ports connected by a four-way valve 26.

[0060] Furthermore, in this embodiment 2, an evaporation fan 29 is provided on the side of the evaporator 21; and a condenser fan 210 is provided on the side of the condenser 22.

[0061] In this embodiment 2, the semiconductor refrigeration module is connected in parallel to the condenser pipe 27 between the condenser 22 and the electronic expansion valve 23 via the refrigerant inlet pipe 11 and the refrigerant outlet pipe 12, and the refrigerant inlet pipe 11 is close to the A port of the condenser 22.

[0062] like Figure 6 and Figure 7 As shown, the A port of condenser 22, the inlet end of condenser pipe 27 and the port of refrigerant inlet pipe 11 are connected by a three-way valve 28.

[0063] In the refrigeration system provided in this embodiment 2, the A port of the condenser 22, the inlet end of the condenser pipe 27 and the port of the refrigerant inlet pipe 11 are connected by a three-way valve 28, so that the refrigeration system provided in this embodiment 2 can have two working modes to adapt to the refrigeration needs of suitable external ambient temperature and high external ambient temperature.

[0064] When the ambient temperature is suitable, the heat pump alone can meet the cooling needs. Only the heat pump is operating, and the semiconductor refrigeration module is not working. The refrigeration cycle at this time is as follows: Low-pressure refrigerant vapor flowing from evaporator 21 flows through four-way valve 26 to gas-liquid separator 25. After gas-liquid separation, the low-pressure refrigerant vapor is drawn into compressor 24, where it is compressed and transformed into high-temperature, high-pressure refrigerant vapor. It then flows through four-way valve 26 to condenser 22. Here, the high-temperature, high-pressure refrigerant vapor transfers heat to the external environment through condenser 22, transforming into high-pressure liquid refrigerant. It then flows directly through three-way valve 28 to electronic expansion valve 23, where the high-pressure liquid refrigerant is throttled and transformed into low-temperature, low-pressure wet vapor. Finally, it flows through evaporator 21 to absorb heat from the refrigerant, transforming back into low-pressure refrigerant vapor, thus completing one refrigeration cycle.

[0065] Since the refrigeration system provided in this embodiment 2 includes the semiconductor refrigeration module in embodiment 1, the refrigeration system provided in this embodiment 2 also utilizes a refrigeration method that combines semiconductor refrigeration with the heat pump of the existing air conditioning system to improve the refrigeration effect of the entire air conditioning system and meet the user's experience needs.

[0066] When the ambient temperature is high, the refrigeration cycle of the refrigeration system provided in this embodiment 2 is as follows: the low-pressure refrigerant vapor flowing out of the evaporator 21 flows to the gas-liquid separator 25 through the four-way valve 26; after gas-liquid separation, the low-pressure refrigerant vapor is drawn into the compressor 24 and compressed by the compressor 24 into high-temperature and high-pressure refrigerant vapor; then, the high-temperature and high-pressure refrigerant vapor flows through the condenser 22 through the four-way valve 26, and transfers heat to the external environment through the condenser 22, transforming into high-pressure liquid refrigerant; due to the refrigeration provided in this embodiment 2... In the system, a semiconductor refrigeration module is connected in parallel between the condenser 22 and the electronic expansion valve 23. The high-pressure liquid refrigerant flowing from the condenser 22 enters the micro-channel tube bank via the refrigerant inlet pipe 11. After rapid cooling via the PN junction 14 on the sidewall of the micro-channel tube bank, it flows from the refrigerant outlet pipe 12 to the electronic expansion valve 23 for throttling. At this point, the high-pressure liquid refrigerant is throttled and becomes low-temperature, low-pressure wet vapor. Compared to existing refrigeration systems, the refrigeration system provided in this embodiment 2 can produce low-temperature, low-pressure wet vapor with a lower specific enthalpy and can increase the cooling capacity to meet user needs. Finally, the low-temperature, low-pressure wet vapor flows through the evaporator 21 to absorb heat from the refrigerant, thus transforming into low-pressure refrigerant vapor, completing one refrigeration cycle.

[0067] Example 3

[0068] In response to the problem that the energy efficiency ratio (EER) of traditional air conditioners typically decreases in high-temperature external environments, the heat absorption capacity of the refrigerant in the evaporator 21 weakens, thus affecting the cooling effect, which may cause the indoor temperature to fail to reach the set value; at the same time, the heat dissipation efficiency of the condenser 22 also decreases, resulting in a decrease in the cooling cycle efficiency, which in turn affects the overall cooling capacity and makes it difficult to meet the user experience, this embodiment 3 provides an air conditioner that can be combined with the heat pump of the existing air conditioning system during use, and by combining traditional heat pump technology and semiconductor refrigeration, the energy efficiency ratio of the air conditioner can be improved in high-temperature external environments.

[0069] This embodiment 3 provides an air conditioner, including the refrigeration system of embodiment 2.

[0070] Since the air conditioner provided in Embodiment 3 includes the above-mentioned refrigeration system, the air conditioner provided in Embodiment 3 also utilizes a refrigeration method that combines semiconductor refrigeration with the heat pump of the existing air conditioning system to improve the refrigeration effect of the entire air conditioning system and meet the user's experience needs.

[0071] In use, when the ambient temperature is high, the refrigeration cycle of this air conditioner is as follows: low-pressure refrigerant vapor flowing from the evaporator 21 flows to the gas-liquid separator 25 via the four-way valve 26; after gas-liquid separation, the low-pressure refrigerant vapor is drawn into the compressor 24 and compressed by the compressor 24 into high-temperature, high-pressure refrigerant vapor; then, the high-temperature, high-pressure refrigerant vapor flows through the condenser 22 via the four-way valve 26, and transfers heat to the external environment through the condenser 22, transforming into high-pressure liquid refrigerant; since the refrigeration system provided in this embodiment 3... A semiconductor refrigeration module is connected in parallel between the condenser 22 and the electronic expansion valve 23. The high-pressure liquid refrigerant flowing from the condenser 22 enters the micro-channel tube bank via the refrigerant inlet pipe 11. After rapid cooling via the PN junction 14 on the sidewall of the micro-channel tube bank, it flows from the refrigerant outlet pipe 12 to the electronic expansion valve 23 for throttling. At this point, the high-pressure liquid refrigerant is throttled and becomes low-temperature, low-pressure wet vapor. Compared to existing refrigeration systems, the refrigeration system provided in this embodiment 3 can obtain low-temperature, low-pressure wet vapor with a lower specific enthalpy and can increase the cooling capacity to meet user needs. Finally, the low-temperature, low-pressure wet vapor flows through the evaporator 21 to absorb heat from the refrigerant, thus transforming into low-pressure refrigerant vapor, completing one refrigeration cycle.

[0072] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor cooling module, characterized in that: It includes a refrigerant inlet pipe, a refrigerant outlet pipe, and a microchannel tube array connecting the refrigerant inlet pipe and the refrigerant outlet pipe. Several PN junctions are connected in series on the sidewall of the microchannel tube array to cool the microchannel tube array. In use, the refrigeration module is connected in parallel to the pipeline between the condenser and the electronic expansion valve through the refrigerant inlet pipe and the refrigerant outlet pipe.

2. The semiconductor cooling module according to claim 1, characterized in that: The microchannel tube array is connected to the radiator via heat exchange elements.

3. The semiconductor cooling module according to claim 2, characterized in that: The heat exchange element is a heat pipe.

4. The semiconductor cooling module according to claim 2, characterized in that: The radiator is an air-cooled radiator.

5. The semiconductor cooling module according to claim 4, characterized in that: The radiator is a finned air-cooled radiator.

6. The semiconductor cooling module according to claim 1, characterized in that: A ceramic plate is provided between the sidewall of the microchannel array and the PN junction.

7. The semiconductor cooling module according to any one of claims 1-6, characterized in that: It also includes a first manifold and a second manifold, wherein the refrigerant inlet pipe is connected to the microchannel pipe array through the first manifold, and the refrigerant outlet pipe is connected to the microchannel pipe array through the second manifold.

8. A refrigeration system, characterized in that: It includes an evaporator, a condenser, an electronic expansion valve, a compressor, a gas-liquid separator, and a semiconductor refrigeration module according to any one of claims 1-7; The A port of the gas-liquid separator is connected to the A port of the compressor, the A port of the evaporator and the A port of the condenser are respectively connected to the two ends of the electronic expansion valve, and the B port of the gas-liquid separator, the B port of the compressor, the B port of the evaporator and the B port of the condenser are connected through a four-way valve. The semiconductor refrigeration module is connected in parallel to the condenser and the electronic expansion valve via a refrigerant inlet pipe and a refrigerant outlet pipe, and the refrigerant inlet pipe is close to the A port of the condenser.

9. The refrigeration system according to claim 8, characterized in that: An evaporation fan is provided on the side of the evaporator.

10. The refrigeration system according to claim 8, characterized in that: A condenser fan is provided on the side of the condenser.

11. The refrigeration system according to claim 8, characterized in that: The A port of the condenser, the inlet end of the condenser pipe, and the port of the refrigerant inlet pipe are connected by a three-way valve.

12. An air conditioner, characterized in that: Includes the refrigeration system according to any one of claims 8-11.

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