Baking system

Abstract

The utility model relates to a baking system, which comprises a baking oven, which is provided with a plurality of baking boxes, each baking box is internally provided with a heating device, the baking boxes are configured to bake a circuit board, and the heating devices are configured to heat the baking boxes to bake the circuit board; the transfer mechanism is located on one side of the baking oven and is configured to feed a circuit board to be baked into each baking oven or take out the circuit board which is baked from each baking oven; the feeding mechanism is located on the side, away from the baking oven, of the transferring mechanism and is configured to transport the circuit board to be baked to a first target position, so that the transferring mechanism takes down the circuit board to be baked at the first target position and sends the circuit board to be baked into the corresponding baking oven; the discharging mechanism is located on the side, away from the baking oven, of the transferring mechanism and is configured to receive the baked circuit board taken out by the transferring mechanism and convey the baked circuit board to a second target position. And the baking oven is provided with a plurality of baking boxes, so that the efficiency is improved, and the application range is wide.

Description

Technical Field

[0001] This application relates to the field of heating equipment technology, and more particularly to a baking system. Background Technology

[0002] In related technologies, tunnel-type curing ovens are commonly used for baking circuit boards. When baking products in a tunnel-type curing oven, the products enter the oven via a track, and the finished products are transported out from the other end. The number of products that can be baked simultaneously is relatively small. Furthermore, the temperature is generally uniform throughout the tunnel, and the baking time for products baked in the same batch is also generally the same. Therefore, it is possible that some products baked in the same batch may not reach the required baking temperature and time. In addition, tunnel-type curing ovens typically use conveyor belts to transport products into the oven, which makes it difficult to control the position of the products. Utility Model Content

[0003] This application provides a baking system that can set different baking environments for different circuit boards, and a transfer mechanism that can accurately transport the circuit boards, thereby at least partially solving the above-mentioned technical problems.

[0004] To achieve the above objectives, this application provides a baking system, comprising:

[0005] An oven having multiple baking ovens, each equipped with a heating device, the baking ovens being configured to bake circuit boards, and the heating devices being configured to heat the baking ovens to bake the circuit boards.

[0006] The transfer mechanism, located on one side of the baking oven, is configured to feed circuit boards to be baked into each baking oven, or to remove circuit boards that have finished baking from each baking oven.

[0007] The feeding mechanism, located on the side of the transfer mechanism away from the baking oven, is configured to transport the circuit board to be baked to the first target position, so that the transfer mechanism can remove the circuit board to be baked at the first target position and send it into the corresponding baking oven.

[0008] The unloading mechanism, located on the side of the transfer mechanism away from the baking oven, is configured to receive the baked circuit boards removed by the transfer mechanism and transport the baked circuit boards to the second target position.

[0009] Optionally, the baking oven has multiple baking chambers arranged in an array.

[0010] Optionally, the transshipment agency includes:

[0011] The pick-and-place component is configured to pick up the circuit board to be baked from the loading mechanism and place it into the baking oven, or to take out the baked circuit board from the baking oven and place it onto the unloading mechanism.

[0012] A moving component, connected to a pick-and-place component, is configured to control the pick-and-place component to move horizontally or vertically.

[0013] Optionally,

[0014] The mobile components include:

[0015] First track;

[0016] The second track is connected to the first track and is configured to move along the first track;

[0017] The pick-and-place assembly is connected to the second track and configured to move along the second track. The pick-and-place assembly has a loading surface configured to carry a circuit board. The loading surface is parallel to the first track and perpendicular to the second track.

[0018] Optionally, the second track has a connecting portion that connects to the first track.

[0019] The mobile component also includes:

[0020] The first driving component is disposed on the connecting part;

[0021] The second driving component is disposed on the connecting part;

[0022] The first transmission component, connected to the first driving member, is configured to operate under the drive of the first driving member to drive the second track to move along the first track;

[0023] The second transmission component, connected to the second drive member, is configured to operate under the drive of the second drive member to move the pick-and-place component along the second track.

[0024] Optionally,

[0025] The pick-and-place components include:

[0026] A support plate is connected to a second track and is configured to move along the second track. The surface of the support plate facing away from the first track is the support surface, which is perpendicular to the second track.

[0027] The slide rail, disposed on the bearing surface, is configured to slide in a direction perpendicular to the sliding direction of the second rail;

[0028] The tray, connected to the slide rail, is configured to carry the circuit board and move along the slide rail in the sliding direction;

[0029] The second drive component, connected to the slide rail, is configured to drive the slide rail to move.

[0030] Optionally, the baking system also includes a sensing mechanism disposed inside the baking oven and configured to sense the temperature of the circuit board inside the baking oven, as well as the temperature inside the baking oven.

[0031] Optionally, the oven has a door, and the baking system also includes a timing component located on the side of the oven with the door and configured to start timing when the door is closed.

[0032] Optionally, the feeding mechanism and the unloading mechanism are located on the same side of the transfer mechanism, and the baking system also includes:

[0033] The protective component is located on the side of the transfer mechanism near the feeding mechanism and is enclosed by the baking oven.

[0034] Optionally, the protective component is provided with a first transport port and a second transport port, the position of the first transport port corresponding to the position of the feeding mechanism, and the position of the second transport port corresponding to the position of the unloading mechanism.

[0035] In this embodiment, the baking oven has multiple baking chambers, enabling simultaneous baking of multiple circuit boards, which helps improve efficiency. Furthermore, different baking chambers can be set with different baking environments, making it suitable for various circuit boards and offering a wide range of applications. In addition, the baking system provided in this application also includes a transfer mechanism, which can transport the circuit boards to the target location, achieving precise transport of the circuit boards.

[0036] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0039] Figure 1 This is a three-dimensional structural diagram of the baking system provided in the embodiments of this application;

[0040] Figure 2 yes Figure 1 Top view of the baking system in the middle;

[0041] Figure 3 yes Figure 1 A three-dimensional structural diagram of the transfer mechanism in the process;

[0042] Figure 4 yes Figure 3 Enlarged 3D schematic diagram of some of the structures;

[0043] Figure 5 yes Figure 3 A three-dimensional schematic diagram of a portion of the transfer mechanism from another perspective;

[0044] Figure 6 yes Figure 3 An enlarged three-dimensional diagram of another part of the structure;

[0045] Figure 7 yes Figure 1 A front view of the baking system in the middle;

[0046] Figure 8 Yes, yes Figure 1 Left view of the baking system in the image.

[0047] Explanation of reference numerals in the attached figures:

[0048] 1. Baking oven; 11. Baking box; 111. Box door;

[0049] 2. Transfer mechanism; 21. Picking and placing assembly; 211. Loading surface; 211a. Roller; 211b. Mounting hole; 212. Support plate; 212a. Loading surface; 213. Slide rail; 214. Pallet; 215. Second drive assembly; 22. Moving assembly; 221. First track; 222. Second track; 223. Connecting part; 224. First drive component; 225. Second drive component; 226. First transmission assembly; 226a. First gear; 226b. First rack; 227. Second transmission assembly; 227a. Second gear; 227b. Second rack;

[0050] 3. Feeding mechanism;

[0051] 4. Feeding mechanism;

[0052] 5. Protective components; 51. First transport port; 52. Second transport port;

[0053] 6. First sensing component;

[0054] 7. Second sensing component;

[0055] 8. Third sensing component;

[0056] 9. Scanning component. Detailed Implementation

[0057] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0058] Please see Figure 1 and Figure 2 , Figure 1 This is a three-dimensional structural diagram of the baking system provided in the embodiments of this application. Figure 2 yes Figure 1 A top view of a baking system. This application provides a baking system comprising: a baking oven 1 having a plurality of baking chambers 11, each baking chamber 11 having a heating device (not shown in the figure) disposed therein, the baking chamber 11 being configured to bake circuit boards, and the heating device being configured to heat the baking chamber 11 to bake the circuit boards; a transfer mechanism 2 located on one side of the baking oven 1, configured to feed circuit boards to be baked into each baking chamber 11, or to remove baked circuit boards from each baking chamber 11; a loading mechanism 3 located on the side of the transfer mechanism 2 away from the baking oven 1, configured to transport the circuit boards to be baked to a first target position, such that the transfer mechanism 2 removes the circuit boards to be baked at the first target position and feeds them into the corresponding baking chamber 11; and a unloading mechanism 4 located on the side of the transfer mechanism 2 away from the baking oven 1, configured to receive the baked circuit boards removed by the transfer mechanism 2 and transport the baked circuit boards to a second target position.

[0059] In this embodiment, the baking oven 1 has multiple baking chambers 11, which can bake multiple circuit boards simultaneously, thus improving efficiency. Different baking chambers 11 can be configured with different baking environments. For example, the internal moisture and stress of the circuit boards vary, requiring different baking environments. Furthermore, the storage time of the circuit boards is also related to the baking environment. Therefore, the baking system with multiple baking chambers 11 provided in this embodiment is applicable to various circuit boards and has a wide range of applications. In addition, the baking system in this embodiment also has a transfer mechanism 2, which can transport the circuit boards to a first target position and a second target position, achieving precise transport of the circuit boards. For example, the feeding mechanism 3 transports the circuit boards to be baked to a preset distance in front of the baking oven 1. This preset distance is sufficient for the transfer mechanism 2 to remove the circuit boards from the feeding mechanism 3. After the circuit boards in the baking chambers 11 have finished baking, the transfer mechanism 2 removes the baked circuit boards from the baking chambers 11 and places them on the unloading mechanism 4, so that the unloading mechanism 4 transports the baked circuit boards to the next processing station or a circuit board storage compartment, etc.

[0060] In some embodiments of this application, the baking oven 1 has a plurality of baking chambers 11 arranged in an array.

[0061] Please see Figure 3 , Figure 3 yes Figure 1 The schematic diagram of the three-dimensional structure of the transfer mechanism in this application shows that, in some embodiments, the transfer mechanism 2 includes: a pick-and-place component 21, configured to pick up the circuit board to be baked from the loading mechanism 3 and place it into the baking oven 11, or to take out the baked circuit board from the baking oven 11 and place it onto the unloading mechanism 4; and a moving component 22, connected to the pick-and-place component 21 and configured to control the pick-and-place component 21 to move in the horizontal or vertical direction.

[0062] In this embodiment, by connecting the pick-and-place component 21 and the moving component 22, the pick-and-place component 21 can move in the horizontal or vertical direction. Therefore, the transfer mechanism 2 provided in this embodiment can remove the circuit board to be baked from the loading mechanism 3 and accurately transport the circuit board to the baking oven 11, or take out the circuit board from the baking oven 11 and place it on the unloading mechanism 4, and use the unloading mechanism 4 to transport the circuit board to the second target position, so that the transportation result is accurate and controllable, which helps to improve the baking efficiency.

[0063] Please continue reading. Figure 3 In some embodiments of this application, the moving component 22 includes: a first track 221; a second track 222 connected to the first track 221 and configured to move along the first track 221; and a pick-and-place component 21 connected to the second track 222 and configured to move along the second track 222. The pick-and-place component 21 has a loading surface 211 configured to carry a circuit board. The loading surface 211 is parallel to the first track 221 and perpendicular to the second track 222.

[0064] In this embodiment, the second track 222 is movable along the first track 221, and the transport mechanism is also movable along the second track 222. This allows the circuit board on the transport mechanism to be transported to the target location by moving the second track 222 and the transport mechanism. Furthermore, the carrying surface 211 of the transport mechanism is parallel to the first track 221 and perpendicular to the second track 222, meaning the first track 221 is perpendicular to the second track 222. Thus, by moving the second track 222 and the pick-and-place component 21, the circuit board on the pick-and-place component 21 can be transported to any position within the area enclosed by the first track 221 and the second track 222. For example, with the first track 221 as the Y-axis and the second track 222 as the Z-axis, moving the second track 222 along the first track 221 can change the coordinates of the circuit board on the pick-and-place component 21 on the Y-axis. Similarly, moving the pick-and-place component 21 along the second track 222 will also change the coordinates of the circuit board on the pick-and-place component 21 on the Z-axis. Therefore, the transfer mechanism 2 provided in this embodiment can transport the circuit board carried by the pick-and-place component 21 to any position within the area enclosed by the first track 221 and the second track 222. Moreover, it has a simple structure, low manufacturing cost, and helps to reduce costs.

[0065] Please see Figure 4 , Figure 4 yes Figure 3 The enlarged three-dimensional schematic diagram of a portion of the structure is shown in some embodiments of this application. The second track 222 has a connecting portion 223, which is connected to the first track 221. The moving component 22 further includes: a first driving member 224 disposed on the connecting portion 223; a second driving member 225 disposed on the connecting portion 223; a first transmission component 226 connected to the first driving member 224 and configured to operate under the drive of the first driving member 224 to drive the second track 222 to move along the first track 221; and a second transmission component 227 connected to the second driving member 225 and configured to operate under the drive of the second driving member 225 to drive the pick-and-place component 21 to move along the second track 222.

[0066] In this embodiment, the first driving member 224 and the second driving member 225 drive the first transmission component 226 and the second transmission component 227 to move, respectively, so that the movement of the two transmission components is independent. That is, while the first driving member 224 drives the first transmission component 226, the second driving member 225 can drive the second transmission component 227 to move, so that the movement of the second track 222 and the movement of the pick-and-place component 21 can be carried out simultaneously, which helps to reduce the time for transporting the circuit board to the target position, thereby improving production efficiency.

[0067] Please continue reading. Figure 4In some embodiments of this application, the first transmission component 226 includes a first gear 226a and a first rack 226b. The first gear 226a meshes with the first rack 226b. The first gear 226a is connected to the first drive member 224. The first rack 226b is disposed on one side of the first track 221 and is disposed along the length direction of the first track 221.

[0068] In this embodiment, the first transmission component 226 is a first gear 226a and a first rack 226b. Gear transmission not only has high transmission efficiency but also a wide range of applications, suitable for high-speed, medium-speed, and low-speed transmissions. Therefore, using the first transmission component 226 as a first gear 226a and a first rack 226b can expand the applicability of the baking system provided in this embodiment. Furthermore, gear transmission is relatively simple to maintain and has low cost, which helps reduce production costs.

[0069] Please see Figure 5 , Figure 5 yes Figure 3 Another perspective perspective of the structure of the transfer mechanism in this application. In some embodiments, the second transmission component 227 includes a second gear 227a and a second rack 227b. The second gear 227a meshes with the second rack 227b. The second gear 227a is connected to the second drive member 225. The second rack 227b is disposed on the second track 222.

[0070] The technical effects of the second transmission assembly 227, including the second gear 227a and the second rack 227b, are similar to or the same as those of the first transmission assembly 226, including the first gear 226a and the first rack 226b, and will not be described in detail here.

[0071] Please see Figure 6 , Figure 6 yes Figure 3 The enlarged three-dimensional schematic diagram of another part of the structure is shown in some embodiments of this application. The pick-and-place component 21 includes: a support plate 212 connected to a second track 222, the support plate 212 being configured to move along the second track 222, the surface of the support plate 212 facing away from the first track 221 being a support surface 212a, the support surface 212a being perpendicular to the second track 222; a slide rail 213 disposed on the support surface 212a and configured to slide in a direction perpendicular to the sliding direction of the second track 222; a tray 214 connected to the slide rail 213 and configured to support the circuit board and move along the sliding direction of the slide rail 213; and a second drive component 215 connected to the slide rail 213 and configured to drive the slide rail 213 to move.

[0072] In this embodiment, by providing a slide rail 213 and a tray 214 on the support plate 212, and by allowing the slide rail 213 to slide in a direction perpendicular to the sliding direction of the second track 222, the position of the tray 214 in a direction perpendicular to both the first track 221 and the second track 222 can be adjusted. For example, still taking the first track 221 as the Y-axis and the second track 222 as the Z-axis, the moving direction of the tray 214 is parallel to the X-axis. When using the transfer mechanism 2 to carry the circuit board, the position of the tray 214 on the X-axis can be adjusted, thus expanding the applicability of the baking system provided in this embodiment. Furthermore, the position of the tray 214 in the X-axis direction is adjustable, allowing the tray 214 to be positioned below the circuit board when carrying it. The tray 214 can then support the circuit board, and the position of the tray 214 in the X-axis can be adjusted using the slide rail 213 to retract the tray 214, thus completing the retrieval of the circuit board. This eliminates the need for a robotic arm to grasp the circuit board, reducing costs and preventing the circuit board from falling and being damaged during the robotic arm's grasping process, thereby lowering the probability of circuit board damage.

[0073] It is understandable that the operation of unloading the circuit board in tray 214 is the reverse of the operation of taking it out using tray 214, and will not be described again here.

[0074] Please continue reading. Figure 6 In some embodiments of this application, a roller 211a is provided on the carrying surface 211. The roller 211a is configured to contact the circuit board and rotate when the relative position between the circuit board and the tray 214 changes. The rotation direction of the roller 211a is the same as or opposite to the movement direction of the tray 214.

[0075] In this embodiment, rollers 211a are provided on the loading surface 211 of the tray 214, and the rotation direction of the rollers 211a is the same as or opposite to the movement direction of the tray 214. This allows the rolling of the rollers 211a to reduce friction between the circuit board and the loading surface 211 when unloading the circuit board from the tray 214, thereby reducing the possibility of damage to the circuit board surface. Furthermore, if the circuit board is pushed out of the tray 214, the rollers 211a can also reduce the force required to push the circuit board, increasing the convenience of unloading the circuit board.

[0076] Please continue reading. Figure 6 In some embodiments of this application, a mounting hole 211b is provided on the carrying surface 211, and a roller 211a is installed in the mounting hole 211b. In this way, the distance between the circuit board and the carrying surface 211 can be reduced, avoiding the situation where the circuit board tilts or even slips and is damaged due to the roller 211a.

[0077] In some embodiments of this application, the transfer mechanism 2 further includes: a first sensing component 6, disposed on the support plate 212 and configured to sense the position of the tray 214; and a second sensing component 7, disposed on the support plate 212 and configured to sense whether a circuit board is present on the tray 214.

[0078] This approach avoids moving the pick-and-place component 21 and / or the second track 222 before the tray 214 is returned to its initial position (i.e., the distance moved on the X-axis is zero), which reduces the possibility of the circuit board falling off the tray 214 and being damaged, and also reduces the possibility of the tray 214 colliding with other equipment and being damaged.

[0079] Please continue reading. Figure 6 In some embodiments of this application, the transfer mechanism 2 further includes a third sensing component 8, which is disposed on the carrier plate 212 and configured to sense the distance between the carrier surface and the device carrying the circuit board when the tray 214 receives the circuit board.

[0080] In this embodiment, the tray 214 can be moved under the circuit board and the circuit board can be picked up by supporting the circuit board with the tray 214. In order to avoid the circuit board falling and being damaged due to the change in the position of the pick-up and put-down component 21 and / or the second track 222 during this process, a third sensing component 8 is provided on the carrier plate 212. The third sensing component 8 is used to sense the distance between the carrier surface and the device carrying the circuit board in real time.

[0081] Please continue reading. Figure 6 In some embodiments of this application, the transfer mechanism 2 further includes: a scanning component 9, which is disposed on the carrier plate 212 and configured to scan the circuit board information on the circuit board; and a control mechanism (not shown in the figure), which is connected to the scanning component 9 and the second drive component 215 and is configured to control the second drive component 215 to adjust the position of the pick-up and place component 21 according to the circuit board information.

[0082] This approach automates the transportation of circuit boards, improving efficiency. Furthermore, by reducing manual labor, it also enhances the accuracy of transportation results.

[0083] In some embodiments of this application, the circuit board information may include target location information and circuit board size information. The movement distance of the tray 214 on the X-axis can be controlled according to the circuit board size information, so that the tray 214 is located in the middle area of ​​the circuit board, reducing the possibility of the circuit board slipping during transportation.

[0084] In some embodiments of this application, the baking system further includes a sensing mechanism (not shown in the figure), which is disposed inside the baking oven 11 and configured to sense the temperature of the circuit board inside the baking oven 11, as well as the temperature inside the baking oven 11.

[0085] When baking circuit boards using the baking oven 11, the baking environment within the oven 11 is closely related to the type of circuit board and its parameter information, such as the different levels of moisture and stress inside the circuit board, and the length of time the circuit board has been stored. Therefore, to accurately control the baking environment within the baking oven 11, the baking oven 11 in this embodiment is equipped with a sensing mechanism. This sensing mechanism can sense the temperature inside the baking oven 11, preventing problems such as oxidation of the circuit board surface plating and aging of the circuit board material due to excessively high temperatures, or insufficient removal of moisture inside the circuit board due to excessively low temperatures, which could affect soldering quality and product reliability, or degrade the electrical performance of the circuit board material, or even cause embrittlement and cracking. In addition, the sensing mechanism can also sense the temperature of the circuit board, allowing the temperature inside the baking oven 11 to be adjusted according to the temperature of the circuit board itself, thus improving the accuracy of the baking temperature.

[0086] In some embodiments of this application, the baking oven 11 has a door 111, and the baking system further includes a timing component (not shown in the figure), which is disposed on the side of the baking oven 1 having the door 111 and is configured to start timing when the door 111 is closed.

[0087] In this embodiment, the baking system includes a timing component that can precisely control the baking time of the circuit board, ensuring that the circuit board meets the requirements for subsequent use or processing after baking. Furthermore, in this embodiment, the timing component is associated with the closing operation of the oven door 111. Timing begins after the oven door 111 is closed, ensuring the accuracy of the timing and preventing the situation where timing continues normally even when the oven door 111 is not closed and the temperature inside the oven 11 does not meet the requirements.

[0088] In some embodiments of this application, the baking system further includes an opening and closing device configured to control the opening and closing of the oven door 111. Thus, the oven door 111 can be closed using the opening and closing device in conjunction with the sensing results of the sensing mechanism. For example, when the temperature of the circuit board sensed by the sensing mechanism is lower than a preset temperature (the preset temperature can be the temperature inside the baking oven 11), the oven door 111 is kept closed.

[0089] Please see Figure 7 and Figure 8 , Figure 7 yes Figure 1 A front view of the baking system in the middle. Figure 8 Yes, yes Figure 1 The left view of the baking system in this application shows that, in some embodiments, the feeding mechanism 3 and the unloading mechanism 4 are located on the same side of the transfer mechanism 2. The baking system also includes a protective component 5, which is disposed on the side of the transfer mechanism 2 near the feeding mechanism 3 and surrounds the baking oven 1.

[0090] With this design, the protective component 5 is enclosed by the baking oven 1, which can prevent personnel from being burned by the high temperature when the baking oven 1 is used to bake the circuit board. At the same time, it can also prevent the circuit board from falling off the transfer mechanism 2 due to personnel colliding with it.

[0091] Please continue reading. Figure 7 and Figure 8 In some embodiments of this application, the protective component 5 is provided with a first transport port 51 and a second transport port 52. The position of the first transport port 51 corresponds to the position of the loading mechanism 3, and the position of the second transport port 52 corresponds to the position of the unloading mechanism 4. In this way, in order to avoid burns to personnel and the circuit board falling, the first transport port 51 and the second transport port 52 can be used to transport the circuit board, avoiding the influence of the protective component 5 on the transport of the circuit board.

[0092] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0093] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0094] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0095] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A baking system, characterized in that, include: An oven having multiple baking ovens, each of which is equipped with a heating device, the baking ovens being configured to bake circuit boards, and the heating devices being configured to heat the baking ovens to bake the circuit boards; A transfer mechanism, located on one side of the baking oven, is configured to feed circuit boards to be baked into each of the baking ovens, or to remove circuit boards that have been baked from each of the baking ovens. The feeding mechanism, located on the side of the transfer mechanism away from the baking oven, is configured to transport the circuit board to be baked to a first target position, so that the transfer mechanism removes the circuit board to be baked at the first target position and sends it into the corresponding baking oven. The unloading mechanism, located on the side of the transfer mechanism away from the baking oven, is configured to receive the baked circuit board removed by the transfer mechanism and transport the baked circuit board to a second target position.

2. The baking system according to claim 1, characterized in that, The baking oven has a plurality of baking chambers arranged in an array.

3. The baking system according to claim 2, characterized in that, The transfer mechanism includes: The pick-and-place component is configured to pick up the circuit board to be baked from the loading mechanism and place it into the baking oven, or to take out the baked circuit board from the baking oven and place it onto the unloading mechanism. A movable component, connected to the pick-and-place component, is configured to control the pick-and-place component to move in a horizontal or vertical direction.

4. The baking system according to claim 3, characterized in that, The moving component includes: First track; A second track is connected to the first track and is configured to move along the first track; The pick-and-place component is connected to the second track and configured to move along the second track. The pick-and-place component has a loading surface configured to carry a circuit board. The loading surface is parallel to the first track and perpendicular to the second track.

5. The baking system according to claim 4, characterized in that, The second track has a connecting portion that connects to the first track, and the moving component further includes: A first driving component is disposed on the connecting portion; A second driving component is disposed on the connecting portion; A first transmission component, connected to the first driving member, is configured to operate under the drive of the first driving member to drive the second track to move along the first track; The second transmission component, connected to the second drive member, is configured to operate under the drive of the second drive member to move the pick-and-place component along the second track.

6. The baking system according to claim 4 or 5, characterized in that, The pick-and-place component includes: A support plate is connected to the second track and is configured to move along the second track. The surface of the support plate facing away from the first track is a support surface, which is perpendicular to the second track. A slide rail, disposed on the bearing surface, is configured to slide in a direction perpendicular to the sliding direction of the second rail; A tray, connected to the slide rail, is configured to carry the circuit board and move along the sliding direction of the slide rail; The second drive component, connected to the slide rail, is configured to drive the slide rail to move.

7. The baking system according to any one of claims 1 to 5, characterized in that, The baking system also includes a sensing mechanism disposed inside the baking oven and configured to sense the temperature of the circuit board inside the baking oven, as well as the temperature inside the baking oven.

8. The baking system according to any one of claims 1 to 5, characterized in that, The baking oven has a door, and the baking system further includes a timing component disposed on the side of the baking oven having the door, configured to start timing when the door is closed.

9. The baking system according to any one of claims 1 to 5, characterized in that, The feeding mechanism and the unloading mechanism are located on the same side of the transfer mechanism, and the baking system further includes: A protective component is disposed on the side of the transfer mechanism near the feeding mechanism and encloses the baking oven.

10. The baking system according to claim 9, characterized in that, The protective component has a first transport port and a second transport port. The position of the first transport port corresponds to the position of the feeding mechanism, and the position of the second transport port corresponds to the position of the unloading mechanism.

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