Intelligent management system for mold

Abstract

An intelligent management system for a mold comprises a mold structure body, a temperature sensor (1), a pressure sensor (2) and a main control unit, wherein the temperature sensor (1) and the pressure sensor (2) are laid on the mold structure body, and the main control unit is connected with the temperature sensor (1) and the pressure sensor. The main control unit comprises a first single-chip microcomputer (2), a sensor processing unit (3) connected with the first single-chip microcomputer (2), an RFID card reader (4), a first wireless communication module (5), and a first power supply module (6) supplying power to the main control unit. According to the technical scheme provided by the utility model, real-time monitoring on parameters such as temperature in a mold heating process and pressure in a forming process is realized by applying the sensor and the monitoring system, so that the heating efficiency can be improved, the energy consumption can be reduced, the product quality and the production efficiency can be improved, and the operation safety and the equipment reliability can be improved.

Description

Technical Field

[0001] This utility model relates to the field of mold technology, and in particular to an intelligent management system for molds. Background Technology

[0002] In the machining industry, molds play an important role. By processing products through molds, production efficiency can be greatly improved, raw materials can be saved, energy consumption and costs can be reduced, and high product consistency can be maintained.

[0003] Current technologies for controlling and monitoring the production process during mold use primarily focus on controlling the material parameters input to the mold. For example, temperature control mainly involves regulating the temperatures of the heating and cooling media. However, there is a widespread lack of real-time monitoring technology for various control points within the mold, making real-time monitoring and control impossible. This results in imprecise and unintelligent production control. Furthermore, existing technologies suffer from situations where localized heating temperatures within the mold are unsuitable. For instance, excessively high temperatures in certain areas may lead to scorching, deformation, melting, or excessive thermal stress in the product. Conversely, excessively low temperatures in certain areas may result in incomplete melting, incomplete filling, or unsatisfactory surface quality.

[0004] In view of this, there is an urgent need for an intelligent management system for molds to at least address the above-mentioned shortcomings. Utility Model Content

[0005] To overcome the shortcomings of existing technologies, the purpose of this invention is to provide an intelligent management system for molds. By installing sensors inside the mold, mold parameters can be monitored and tested in real time, and the data can be transmitted to terminal devices via the Internet of Things, making the mold more intelligent.

[0006] To solve the above-mentioned technical problems, the present invention provides an intelligent management system for molds, including a mold structure, a plurality of temperature sensors and a plurality of pressure sensors laid on the mold structure, and a main control unit connected to the temperature sensors and pressure sensors via a wired or wireless module; the main control unit includes a first microcontroller, a sensor processing unit connected to the first microcontroller, an RFID reader, a first wireless communication module, and a first power supply module for powering the main control unit.

[0007] The temperature sensor is used to detect the temperature at each control point of the mold, and the signal is sent to the sensor processing unit through the signal acquisition device;

[0008] The pressure sensor includes an internal pressure sensor for detecting the pressure inside the mold cavity and an external pressure sensor for detecting the pressure outside the mold cavity; the internal pressure sensor sends a signal to the sensor processing unit via a signal acquisition unit; the external pressure sensor sends a signal to the first microcontroller via a wireless pressure sensor unit.

[0009] In one embodiment, the intelligent management system for molds provided by this utility model further includes a water quality sensor installed on the water supply pipeline of the mold structure for detecting water quality. The water quality sensor sends a signal to the sensor processing unit through a signal acquisition device.

[0010] In one embodiment, the intelligent management system for molds provided by this utility model further includes a counting unit connected to the mold structure; the counting unit includes a second microcontroller, a magnetic induction counter connected to the second microcontroller, an LCD display, a second wireless communication module, and a second power supply module for powering the counting unit.

[0011] In one embodiment, the intelligent management system for molds provided by this utility model further includes a data processing platform connected to the first wireless communication module and the second wireless communication module, and a terminal device connected to the data processing platform; the data processing platform receives uploaded data from the first wireless communication module and the second wireless communication module.

[0012] Where there is no conflict, the above improvements can be implemented individually or in combination.

[0013] The technical solution provided by this utility model, through the application of sensors and monitoring systems, enables real-time monitoring of parameters such as temperature during mold heating and pressure during molding, which can improve heating efficiency, reduce energy consumption, improve product quality and production efficiency, and enhance operational safety and equipment reliability. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the present invention and constitute a part of this application. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0015] Figure 1 This is a schematic diagram of the intelligent management system for molds, as shown in the embodiment.

[0016] Figure 2 This is a schematic diagram of the main control unit in the embodiment;

[0017] Figure 3 This is a schematic diagram of the counting unit in the embodiment. Implementation

[0018] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0019] Please see Figure 1 An intelligent management system for molds includes a mold structure (not shown in the figure), several temperature sensors 1 and several pressure sensors laid on the mold structure, and a main control unit connected to the temperature sensors 1 and pressure sensors via a wired or wireless module; the main control unit includes a first microcontroller 2, a sensor processing unit 3, an RFID reader 4, a first wireless communication module 5, and a first power supply module 6 that supplies power to the main control unit, all connected to the first microcontroller 2.

[0020] The temperature sensor 1 is used to detect the temperature of each control point of the mold, and the signal is sent to the sensor processing unit 3 through the signal acquisition device;

[0021] The pressure sensor includes an internal pressure sensor 7 for detecting the pressure inside the mold cavity and an external pressure sensor 8 for detecting the pressure outside the mold cavity; the internal pressure sensor 7 sends the signal to the sensor processing unit 3 through a signal acquisition device; the external pressure sensor 8 sends the signal to the first microcontroller 2 through a wireless pressure sensor unit 9.

[0022] Specifically, according to the control requirements of each structural part during mold forming, temperature sensor 1 and cavity pressure sensor 7 are installed at various process control points on the mold structure. Temperature sensor 1 and cavity pressure sensor 7 are flush with the forming surface of the mold, so that the sensors do not affect the formed shape of the product. Cavity pressure sensor 8 is installed on the outside of the mold structure. In this embodiment, temperature sensor 1 is a B3950 temperature sensor, pressure sensor is a diffused silicon chip pressure transmitter, and the first microcontroller 2 uses a TLSR8232F series chip to be responsible for the logic control of the intelligent mold main control unit and communicates with the data processing platform 16 in real time through the first wireless communication module 5. Sensor processing unit 3 uses an AT32F421 series chip to convert the sensed values ​​of each temperature sensor and pressure sensor into actual temperature and pressure values, and communicates with the BLE SoC chip to realize real-time data transmission. The RFID reader 4 uses an MFRC-522 to read information from each external pressure sensor 8 and bind its ID. Communication between the wireless pressure sensors and the first microcontroller 2 is achieved via an AS01-ML01D 2.4G module connected to the SPI bus. This 2.4G module facilitates communication with the main control unit, which then uploads data. The first wireless communication module 5 uses an AIR780E4G 4G module, responsible for communication between the first microcontroller 2 and the data processing platform 16, base station positioning, and data reporting.

[0023] Based on this, the intelligent management system for molds can monitor the temperature and pressure values ​​of each control point of the mold in real time. At the same time, it can monitor the pressure outside the cavity in real time by binding with the ID of the pressure sensor. The data of the data processing platform 16 can be uploaded through the first wireless communication module 5 and can be transmitted to the terminal device 17 through the Internet of Things, so that customers can share the field data remotely, know the field production situation, and easily know the operation of the mold.

[0024] In summary, the intelligent management system for molds provided in this application embodiment, through the application of sensors and monitoring systems, enables real-time monitoring of parameters such as temperature during the mold heating process and pressure during the molding process. This can improve heating efficiency, reduce energy consumption, improve product quality and production efficiency, and enhance operational safety and equipment reliability.

[0025] Please see Figure 1 In this embodiment, the intelligent management system for the mold also includes a water quality sensor 10 installed on the water supply pipeline of the mold structure for detecting water quality. The water quality sensor 10 transmits signals to the sensor processing unit 3 via a signal acquisition device. The water quality sensor 10 is an SH-900 pH sensor, responsible for real-time detection of the acidity or alkalinity of the water in the mold. The sensor processing unit 3 converts the pH sensor's readings into actual pH values ​​and communicates with the BLE SoC to achieve real-time data transmission. By monitoring the acidity or alkalinity of the water in the mold, the process water for the mold meets quality requirements, extending the mold's service life and preventing scaling in the water flow channels of heat exchange devices.

[0026] Please see Figure 3 In this embodiment, the intelligent management system for the mold also includes a counting unit connected to the mold structure; the counting unit includes a second microcontroller 11, a magnetic induction counter 12 connected to the second microcontroller 11, an LCD display 13, a second wireless communication module 14, and a second power supply module 15 that supplies power to the counting unit.

[0027] Specifically, the second microcontroller 11 uses a TLSR8232F series BLE SoC, responsible for the logic control of the mold counting unit, and communicates with the platform in real time through the second wireless communication module 14. The second wireless communication module 14 uses an AIR780E 4G module, responsible for communication between the mold and the data processing platform, base station positioning, and data reporting. The magnetic induction counter 12 senses the counting count through the action of an external magnet. The LCD display 13 uses a segmented LCD for counting display.

[0028] The magnetic induction counter 12 attracts and releases due to magnetic force, counting the number of times the magnetic force is applied and displaying the count in real time on the LCD display 13. Data is then uploaded to the data processing platform via the second wireless communication module 14, allowing customers to remotely share on-site data and monitor production conditions. Data from the data processing platform can also be uploaded to backend terminal devices 17 (including computers and mobile phones).

[0029] Please see Figure 1 In this embodiment, the intelligent management system for the mold also includes a data processing platform that communicates with the first wireless communication module 5 and the second wireless communication module 14. The data processing platform receives uploaded data from the first wireless communication module 5 and the second wireless communication module 14. The data from the data processing platform can be uploaded to a backend terminal device 17 (including computers and mobile phones, etc.). The data processing platform accepts uploaded data from the main control unit and the counting unit and communicates with them in real time. It can display and manage various data through various charts. The data processing platform can achieve a binding relationship with the mold through the 4G module ID number, thereby realizing one-to-one management.

[0030] This utility model is not limited to the preferred embodiments described above. Various modifications and improvements can be made within the spirit of the claims and specification to solve the same technical problem and achieve the expected technical effects; therefore, these will not be repeated. All solutions that can be directly or indirectly conceived by those skilled in the art from the disclosure of this utility model, as long as they are within the spirit of the claims, also fall within the protection scope of this utility model.

Claims

1. An intelligent management system for molds, comprising a mold structure, characterized in that, It also includes: a number of temperature sensors (1) and a number of pressure sensors laid on the mold structure, and a main control unit connected to the temperature sensors (1) and pressure sensors via wired or wireless modules; the main control unit includes a first microcontroller (2), a sensor processing unit (3) connected to the first microcontroller (2), an RFID reader (4), a first wireless communication module (5), and a first power supply module (6) that supplies power to the main control unit. The temperature sensor (1) is used to detect the temperature of each control point of the mold and sends the signal to the sensor processing unit (3) through the signal acquisition device. The pressure sensor includes an intracavity pressure sensor (7) for detecting the pressure inside the mold cavity and an extracavity pressure sensor (8) for detecting the pressure outside the mold cavity; the intracavity pressure sensor (7) sends the signal to the sensor processing unit (3) through a signal acquisition unit; the extracavity pressure sensor (8) sends the signal to the first microcontroller (2) through a wireless pressure sensor unit (9).

2. The intelligent management system for molds according to claim 1, characterized in that: It also has a water quality sensor (10) installed on the water supply pipeline of the mold structure for detecting water quality. The water quality sensor (10) sends the signal to the sensor processing unit (3) through a signal collector.

3. The intelligent management system for molds according to claim 1, characterized in that: It also has a counting unit connected to the mold structure; the counting unit includes a second microcontroller (11), a magnetic induction counter (12) connected to the second microcontroller (11), an LCD display (13), a second wireless communication module (14), and a second power supply module (15) for powering the counting unit.

4. The intelligent management system for molds according to claim 3, characterized in that: It also has a data processing platform (16) connected to the first wireless communication module (5) and the second wireless communication module (14), and a terminal device (17) connected to the data processing platform (16); the data processing platform (16) receives the uploaded data from the first wireless communication module (5) and the second wireless communication module (14).

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