Information system integrated memory

By designing an i-shaped protective plate and a moisture-proof mechanism on the integrated memory, the problem of pins being susceptible to dust and oxidation is solved, achieving clean and dry protection of the pins, and improving signal transmission reliability and service life.

CN223828232UActive Publication Date: 2026-01-23SHENZHEN SPEED STAR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520007902.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-03
Publication Date
2026-01-23
Estimated Expiration
2035-01-03

AI Technical Summary

Technical Problem

The pins of existing integrated memory lack dust protection, making them susceptible to short circuits caused by metal particles in dust, and they are also prone to oxidation in humid environments, affecting signal transmission.

Method used

Design an information system integrated memory that adopts an inverted shield and cover structure, combined with a moisture-proof mechanism including an L-shaped plate and a desiccant, to prevent the pins from getting damp and keep them dry.

Benefits of technology

It effectively prevents pins from getting dusty and oxidized, ensures pins are clean and dry, improves signal transmission reliability, and extends service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an information system integrated memory, which belongs to the technical field of electronic components and comprises an integrated memory outer shell and pins uniformly arranged on two sides of the integrated memory outer shell. A connecting mechanism is arranged between the [-shaped protective plate and the end of the integrated memory outer shell, a shielding plate attached to the top of the integrated memory outer shell is fixed to the top of the [-shaped protective plate, and a damp-proof mechanism is arranged in the [-shaped protective plate. According to the utility model, the [-shaped protective plates are clamped and mounted at the positions, close to the pins, of the two sides of the integrated memory outer shell, and the shielding plates attached to the top of the integrated memory outer shell are fixed at the tops of the [-shaped protective plates, so that the pins can be protected in the use process of the integrated memory, and the cleanness of the pins is ensured.
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Description

Technical Field

[0001] This utility model relates to an integrated memory, and more particularly to an integrated memory for an information system, belonging to the field of electronic components technology. Background Technology

[0002] In the prior art, such as the utility model with application number 202222149779.6, an integrated memory is disclosed. To solve the problems of pins not being able to stick to the circuit board when soldering to it, resulting in cold solder joints, and the poor heat dissipation of integrated memory electronic components, which shortens the service life of the components, the present invention provides through holes on the pins. Solder paste melts into liquid under high temperature heating, and using the capillary principle, the solder paste climbs upward through the through holes, increasing the solder paste area on the pins, thereby enhancing the soldering effect and avoiding cold solder joints. The heat dissipation component is driven by the input power of the memory body, and the heat dissipation component heats the memory body, effectively extending the service life of the memory body. This utility model effectively enhances the soldering effect and has a heat dissipation function, effectively extending the service life of the device.

[0003] The above-mentioned applications still have shortcomings:

[0004] During use, the pins lack dust protection. If the dust contains metal particles, it may cause a short circuit. In addition, it is impossible to ensure that the area around the pins is dry. In a humid environment, the pins are easily oxidized, which increases the contact resistance and affects signal transmission.

[0005] To address this issue, an information system integrated memory is designed to optimize the aforementioned problems. Utility Model Content

[0006] The main objective of this invention is to provide an integrated storage device for information systems to solve the problems mentioned in the background section.

[0007] The objective of this utility model can be achieved by adopting the following technical solution:

[0008] An integrated memory for an information system includes an integrated memory housing and pins evenly arranged on both sides of the integrated memory housing. Both sides of the integrated memory housing are fitted with a C-shaped protective plate, and a connecting mechanism is provided between the C-shaped protective plate and the end of the integrated memory housing. A cover plate that fits against the top of the C-shaped protective plate is fixed to the top of the integrated memory housing, and a moisture-proof mechanism is provided inside the C-shaped protective plate.

[0009] Preferably, the connecting mechanism includes guide grooves, slots, and blocks. The guide grooves are symmetrically opened at both ends of the integrated memory housing. The length of the guide grooves is the same as the thickness of the integrated memory housing. Slots are opened at the bottom of the guide grooves. Blocks that cooperate with the slots are provided at both ends of the inner side of the integrated memory housing.

[0010] Preferably, the shape of the card block is a conical protrusion, and the card block is made of rubber.

[0011] Preferably, the moisture-proof mechanism includes an L-shaped plate, a through hole, and a desiccant. The L-shaped plate is fixed between the C-shaped protective plate and the baffle. The outer side of the L-shaped plate has a through hole. The cavity formed by the L-shaped plate, the C-shaped protective plate, and the baffle is filled with a desiccant.

[0012] Preferably, both the bottom of the baffle and the bottom of the L-shaped plate are fixed with sealing strips along their length.

[0013] Preferably, the two ends of the U-shaped protective plate are symmetrically provided with filling ports, and each filling port is provided with a sealing plug.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This utility model has a C-shaped protective plate that is snapped onto both sides of the integrated memory housing near the pins, and a cover plate that fits against the top of the integrated memory housing is fixed on the top of the C-shaped protective plate. This can protect the pins during the use of the integrated memory and ensure the cleanliness of the pins.

[0016] 2. This utility model provides an L-shaped plate between the C-shaped plate and the cover, with through holes on the L-shaped plate, and fills the cavity composed of the C-shaped plate, the cover, and the L-shaped cover with a desiccant, so that the integrated memory has a certain moisture-proof function for the pins during use, effectively preventing the pins from getting damp and oxidizing. Attached Figure Description

[0017] Figure 1 This is an overall structural diagram of the present invention;

[0018] Figure 2 This is a diagram illustrating the protective state of this utility model.

[0019] Figure 3 For the present utility model Figure 1 Enlarged view of point A in the middle;

[0020] Figure 4 This is a cross-sectional view of the end of the C-shaped guard plate of this utility model.

[0021] In the diagram: 1. Integrated memory casing;

[0022] 2. C-shaped guardrail;

[0023] 3. Sheath;

[0024] 4. Moisture-proof mechanism; 401. L-shaped plate; 402. Through hole; 403. Desiccant; 404. Sealing plug;

[0025] 5. Connecting mechanism; 501. Guide groove; 502. Slot; 503. Block. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model.

[0027] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0028] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] In the description of this utility model, it should be noted that the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. These terms are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. Example 1

[0031] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, this embodiment proposes an integrated memory for an information system, including an integrated memory housing 1 and pins evenly arranged on both sides of the integrated memory housing 1. A U-shaped protective plate 2 is snapped onto both sides of the integrated memory housing 1. A connecting mechanism 5 is provided between the U-shaped protective plate 2 and the end of the integrated memory housing 1. A cover plate 3, which fits against the top of the integrated memory housing 1, is fixed to the top of the U-shaped protective plate 2. A moisture-proof mechanism 4 is provided inside the U-shaped protective plate 2. During installation and use, the pins are first soldered, and then the U-shaped protective plate 2 is snapped onto both sides of the integrated memory housing 1 through the connecting mechanism 5 to protect the pins. In addition, the moisture-proof mechanism 4 inside the U-shaped protective plate 2 can absorb moisture around the pins to prevent pin corrosion. Example 2

[0032] The following section provides a further description of the scheme in Example 1, focusing on its specific working method. See the description below for details:

[0033] like Figure 2 and Figure 4 As shown, in a preferred embodiment, based on the above method, the connecting mechanism 5 further includes a guide groove 501, a slot 502, and a locking block 503. The guide groove 501 is symmetrically opened at both ends of the integrated memory housing 1. The length of the guide groove 501 is the same as the thickness of the integrated memory housing 1. The bottom end of each guide groove 501 is provided with a slot 502. Both ends of the inner side of the integrated memory housing 1 are provided with locking blocks 503 that cooperate with the slot 502. During the installation of the C-shaped protective plate 2, the locking block 503 is aligned with the top of the guide groove 501, and then the C-shaped protective plate 2 is pressed down vertically. The locking block 503 moves down along the guide groove 501 and then locks into the inside of the slot 502, thus completing the positioning of the C-shaped protective plate 2.

[0034] like Figure 4 As shown, in a preferred embodiment, based on the above method, the shape of the locking block 503 is a conical protrusion, and the locking block 503 is made of rubber. When the locking block 503 passes through the inside of the guide groove 501, it can be squeezed and deformed, and when it passes through the inside of the locking groove 502, it can be reset, which facilitates the locking and installation of the U-shaped guard plate 2.

[0035] like Figure 4 As shown, in a preferred embodiment, based on the above method, the moisture-proof mechanism 4 further includes an L-shaped plate 401, a through hole 402, and a desiccant 403. The L-shaped plate 401 is fixed between the U-shaped protective plate 2 and the shield 3. The through hole 402 is provided on the outer side of the L-shaped plate 401. The cavity formed by the L-shaped plate 401, the U-shaped protective plate 2, and the shield 3 is filled with desiccant 403. During use, the desiccant 403 can remove moisture around the pins, keeping the ambient humidity at a relatively low level, thereby reducing the possibility of the pins oxidizing due to moisture.

[0036] like Figure 4 As shown, in a preferred embodiment, based on the above method, a sealing strip is further fixed along the length direction at the bottom of the shield 3 and the bottom of the L-shaped plate 401. The sealing strip can ensure that the area around the pin is in a relatively sealed state, and the protection and moisture-proof effect is better.

[0037] like Figure 1 , Figure 2 and Figure 3 As shown, in a preferred embodiment, based on the above method, the two ends of the C-shaped protective plate 2 are symmetrically provided with filling ports, and each filling port is provided with a sealing plug 404. After the desiccant 403 is saturated with moisture, the sealing plug 404 can be removed, and the desiccant 403 can be pushed out by inserting a steel wire through the filling port to replace the desiccant 403. Example 3

[0038] The solutions in Embodiments 1 and 2 will be further described below with reference to their specific working methods.

[0039] During installation and use, first solder the pins, then align the locking block 503 above the guide groove 501, and then press the inverted U-shaped protective plate 2 vertically down. The locking block 503 moves down along the guide groove 501 and then locks into the inside of the locking slot 502, completing the positioning of the inverted U-shaped protective plate 2. During use, the desiccant 403 can be used to remove moisture around the pins, keeping the ambient humidity at a relatively low level, thereby reducing the possibility of pins oxidizing due to moisture.

[0040] The above description is only a further embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the scope disclosed by the present utility model, based on the technical solution and concept of the present utility model, shall fall within the protection scope of the present utility model.

Claims

1. An integrated memory for an information system, comprising an integrated memory housing (1) and pins uniformly disposed on both sides of the integrated memory housing (1), characterized in that: Both sides of the integrated memory housing (1) are fitted with a U-shaped protective plate (2). A connecting mechanism (5) is provided between the U-shaped protective plate (2) and the end of the integrated memory housing (1). A cover plate (3) that fits against the top of the integrated memory housing (1) is fixed on the top of the U-shaped protective plate (2). A moisture-proof mechanism (4) is provided inside the U-shaped protective plate (2).

2. The information system integrated storage device according to claim 1, characterized in that: The connecting mechanism (5) includes a guide groove (501), a slot (502) and a block (503). The guide groove (501) is symmetrically opened at both ends of the integrated memory housing (1). The length of the guide groove (501) is the same as the thickness of the integrated memory housing (1). The bottom end of the guide groove (501) is provided with a slot (502). Both ends of the inner side of the integrated memory housing (1) are provided with blocks (503) that cooperate with the slot (502).

3. The information system integrated storage device according to claim 2, characterized in that: The shape of the card block (503) is a conical protrusion, and the card block (503) is made of rubber.

4. The information system integrated storage device according to claim 1, characterized in that: The moisture-proof mechanism (4) includes an L-shaped plate (401), a through hole (402), and a desiccant (403). The L-shaped plate (401) is fixed between the U-shaped guard plate (2) and the baffle (3). The through hole (402) is provided on the outer side of the L-shaped plate (401). The cavity formed by the L-shaped plate (401), the U-shaped guard plate (2), and the baffle (3) is filled with desiccant (403).

5. An information system integrated storage device according to claim 4, characterized in that: Both the bottom of the cover plate (3) and the bottom of the L-shaped plate (401) are fixed with sealing strips along the length direction.

6. An information system integrated storage device according to claim 4, characterized in that: The two ends of the U-shaped guard plate (2) are symmetrically provided with filling ports, and each filling port is provided with a sealing plug (404).

Citation Information

Patent Citations

  • Integrated memory

    CN218122996U