Chip-to-panel cable assembly and circuit board assembly

Abstract

The utility model relates to a chip-to-panel cable assembly and a circuit board assembly. The cable assembly from the chip to the panel at least comprises a first connecting unit and a second connecting unit. The first connecting unit comprises a first flexible circuit board, and a first connector and a second connector which are arranged on the first flexible circuit board; the first connector is used for being electrically connected with an external module, and the second connector is used for being electrically connected with the chip connector; the second connecting unit comprises a second flexible circuit board, and a third connector and a fourth connector which are arranged on the second flexible circuit board; the third connector is used for being electrically connected with an external module, and the fourth connector is used for being electrically connected with the chip connector; at least part of the area, close to the second connector, of the first flexible circuit board and at least part of the area, close to the fourth connector, of the second flexible circuit board are arranged in a stacked mode. The cable assembly and the circuit board assembly can be suitable for high-density and mass-interconnection scenes, and are simple to assemble and small in occupied space.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication, in particular to a chip-to-panel cable assembly and a circuit board assembly. BACKGROUND

[0002] The physical channel of chip-to-module (C2M) is the most important physical layer interconnection of communication equipment, and the topology mainly includes the connection of a master chip and an input output connector (IO connector). In order to meet the data communication requirements, the C2M channel should meet the channel loss requirement, which is generally realized by high-speed copper cable connection. In specific implementation, the two ends of the copper cable can be directly connected to the chip package and the IO connector. However, due to the large size of the copper cable, there are problems of large space occupation and complex assembly process, which are not suitable for high-density and large interconnection scenarios. CONTENT OF THE UTILITY MODEL

[0003] Therefore, it is necessary to provide a chip-to-panel cable assembly and a circuit board assembly suitable for high-density and large interconnection scenarios, and simple assembly and small space occupation.

[0004] The present application provides a chip-to-panel cable assembly, which at least includes a first connection unit and a second connection unit.

[0005] The first connection unit includes a first flexible circuit board, and a first connector and a second connector arranged on the first flexible circuit board; the first connector is used for electrical connection with an external module, and the second connector is used for electrical connection with a chip connector.

[0006] The second connection unit includes a second flexible circuit board, and a third connector and a fourth connector arranged on the second flexible circuit board; the third connector is used for electrical connection with an external module, and the fourth connector is used for electrical connection with a chip connector.

[0007] At least part of the first flexible circuit board close to the second connector and at least part of the second flexible circuit board close to the fourth connector are arranged in a stacked manner.

[0008] In one embodiment, the first flexible circuit board includes a first part and a second part connected to each other and arranged at an angle; the first connector is arranged on the first part, and the second connector is arranged on the second part.

[0009] The second flexible circuit board includes a third part and a fourth part connected to each other and arranged at an angle; the third connector is arranged on the third part, and the fourth connector is arranged on the fourth part.

[0010] The second and fourth parts are arranged to overlap each other to allow the second and fourth connectors to be arranged to overlap each other.

[0011] In one embodiment, the first portion includes a first offset region, and the first connector is disposed in the first offset region;

[0012] The second part includes a second staggered region, and the third connector is located in the second staggered region;

[0013] The projections of the first staggered region and the second staggered region onto the first reference plane do not overlap, and the first reference plane is perpendicular to the stacking direction of the second and fourth parts.

[0014] In one embodiment, the first portion bends toward a first side of the cable assembly relative to the second portion, and the third portion bends toward a second side of the cable assembly relative to the fourth portion. The first side and the second side are opposite to a second reference plane, which is perpendicular to the first reference plane.

[0015] In one embodiment, the first portion bends toward a first side of the cable assembly relative to the second portion, and the third portion also bends toward a first side relative to the fourth portion;

[0016] The first and third parts are arranged to overlap each other to allow the first connector and the third connector to be arranged to overlap each other.

[0017] In one embodiment, the area of ​​the overlapping portion of the second and fourth portions is greater than 80% of the area of ​​the second portion and / or greater than 80% of the area of ​​the fourth portion.

[0018] In one embodiment, the first connector and the third connector are fixed to the optical cage by a first positioning element; and / or

[0019] The second connector and the fourth connector are fixed relative to each other by the second positioning element; and / or

[0020] The first flexible circuit board and the second flexible circuit board are fixed relative to each other by a third positioning member.

[0021] In one embodiment, the second connector and the fourth connector are fixed relative to each other by a second positioning member, and the second connector and the fourth connector have a gap along the thickness direction of the second portion and the fourth portion;

[0022] The second and fourth parts are constructed as long strips, and the second and fourth parts have different lengths.

[0023] In one embodiment, the insertion directions of the second and fourth connectors relative to the chip connector are along the extension direction of the first flexible circuit board in its flat state; or

[0024] The insertion directions of the second and fourth connectors relative to the chip connector are perpendicular to the extension direction of the first flexible circuit board in its flat state.

[0025] This application embodiment also provides a circuit board assembly, including: a first circuit board, a second circuit board, an optical cage, and one or more of the above-described cable assemblies arranged at intervals from each other along a preset direction;

[0026] The first connector of the first connecting unit and the third connector of the second connecting unit are disposed in the optical cage, and the optical cage is disposed on the first circuit board;

[0027] The second circuit board is equipped with a chip connector, and the second connector and the fourth connector are connected to the chip connector.

[0028] In one embodiment, the number of one or more cable assemblies is two, and the two cable assemblies are stacked on top of each other along the thickness direction of the first circuit board;

[0029] In this cable assembly, the second and fourth connectors of one cable assembly, and the second and fourth connectors of another cable assembly, are fixed relative to each other by a second positioning element.

[0030] The beneficial effects of the aforementioned chip-to-panel cable assembly and circuit board assembly are as follows:

[0031] The first connection unit includes a first flexible circuit board, and a first connector and a second connector disposed on the first flexible circuit board. The first connector is used for electrical connection with an external module, and the second connector is used for electrical connection with a chip connector. Thus, partial electrical connection between the external module and the chip connector is achieved through the first connector, the first flexible circuit board, and the second connector. The second connection unit includes a second flexible circuit board, and a third connector and a fourth connector disposed on the second flexible circuit board. The third connector is used for electrical connection with an external module, and the fourth connector is used for electrical connection with the chip connector. Thus, electrical connection between the external module and the chip connector is further achieved through the third connector, the second flexible circuit board, and the fourth connector. Compared with copper cable connections in related technologies, the space occupied is significantly reduced, making it suitable for high-density and high-volume interconnection scenarios.

[0032] At least a portion of the first flexible circuit board near the second connector and at least a portion of the second flexible circuit board near the fourth connector are stacked on top of each other. Since both the first and second flexible circuit boards are thin-plate structures, this stacked arrangement significantly reduces the overall space occupied by the first and second flexible circuit boards compared to their side-by-side arrangement. This frees up heat dissipation space within the electronic device, improving the heat dissipation performance of heat-generating components.

[0033] On the other hand, since copper cable connections are not required, and the relatively complex assembly process is omitted, during connection, it is only necessary to plug the first connector and the third connector into the target's external module, and the second connector and the fourth connector into the chip connector on the target circuit board. It is relatively simple and easy to implement. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the chip-to-panel cable assembly provided in an embodiment of this application;

[0035] Figure 2 A side view of the chip-to-panel cable assembly provided in an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of another structure of the chip-to-panel cable assembly provided in an embodiment of this application;

[0037] Figure 4 This is a schematic diagram of the circuit board assembly provided in an embodiment of this application;

[0038] Figure 5 This is a schematic diagram of another structure of the circuit board assembly provided in an embodiment of this application.

[0039] Explanation of icon numbers:

[0040] 100. Cable assemblies;

[0041] 10. First connecting unit;

[0042] 20. First flexible circuit board; 21. First part; 22. Second part;

[0043] 30. First connector;

[0044] 41. First positioning component; 42. Second positioning component;

[0045] 50. Second connector;

[0046] 60. Second connecting unit;

[0047] 70. Second flexible circuit board; 71. Third part; 72. Fourth part;

[0048] 80. Third connector; 90. Fourth connector;

[0049] 200. Circuit board assembly;

[0050] 210. First circuit board; 220. Second circuit board; 230. Chip connector; 240. Optical cage;

[0051] C1, First staggered area; C2, Second staggered area; S1, First side; S2, Second side. Detailed Implementation

[0052] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0053] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0054] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0055] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0056] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0057] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0058] The following description, in conjunction with the accompanying drawings, describes the chip-to-panel cable assembly 100 and circuit board assembly 200 of the present application embodiments.

[0059] Figure 1 This is a schematic diagram of the chip-to-panel cable assembly provided in an embodiment of this application. Figure 2 A side view of the chip-to-panel cable assembly provided in an embodiment of this application.

[0060] Reference Figure 1 , Figure 2 The chip-to-panel cable assembly 100 (hereinafter referred to as cable assembly 100) in this application embodiment includes at least a first connection unit 10 and a second connection unit 60. Figure 1 The process of assembling the first connecting unit 10 and the second connecting unit 60 into a cable assembly 100 is illustrated in the figure.

[0061] The first connection unit 10 includes a first flexible circuit board 20, and a first connector 30 and a second connector 50 disposed on the first flexible circuit board 20. The first connector 30 is used for electrical connection with an external module, and the second connector 50 is used for electrical connection with the chip connector 230 (described later). The second connection unit 60 includes a second flexible circuit board 70, and a third connector 80 and a fourth connector 90 disposed on the second flexible circuit board 70. The third connector 80 is used for electrical connection with an external module, and the fourth connector 90 is used for electrical connection with the chip connector 230. At least a portion of the first flexible circuit board 20 near the second connector 50 and at least a portion of the second flexible circuit board 70 near the fourth connector 90 are stacked on top of each other.

[0062] The first connection unit 10 includes a first flexible circuit board 20, and a first connector 30 and a second connector 50 disposed on the first flexible circuit board 20. The first connector 30 is used for electrical connection with an external module, and the second connector 50 is used for electrical connection with the chip connector 230 (described later). Thus, partial electrical connection between the external module and the chip connector 230 is achieved through the first connector 30, the first flexible circuit board 20, and the second connector 50. The second connection unit 60 includes a second flexible circuit board 70, and a third connector 80 and a fourth connector 90 disposed on the second flexible circuit board 70. The third connector 80 is used for electrical connection with an external module, and the fourth connector 90 is used for electrical connection with the chip connector 230. Thus, electrical connection between the external module and the chip connector 230 is further achieved through the third connector 80, the second flexible circuit board 70, and the fourth connector 90. Compared with copper cable connections in related technologies, the space occupied is significantly reduced, making it suitable for high-density and high-volume interconnection scenarios.

[0063] In this embodiment, at least a portion of the first flexible circuit board 20 near the second connector 50 and at least a portion of the second flexible circuit board 70 near the fourth connector 90 are stacked on top of each other. Since the first flexible circuit board 20 and the second flexible circuit board 70 are thin plate structures, this stacked arrangement significantly reduces the overall space occupied by the first flexible circuit board 20 and the second flexible circuit board 70 compared to their side-by-side arrangement. This frees up heat dissipation space within the electronic device, improving the heat dissipation performance of heat-generating components.

[0064] On the other hand, since copper cable connection is not required, the relatively complex assembly process is also omitted. When connecting, it is only necessary to plug the first connector 30 and the third connector 80 into the target's external module, and the second connector 50 and the fourth connector 90 into the chip connector 230 on the target circuit board. It is relatively simple and easy to implement.

[0065] In this embodiment of the application, the cable assembly 100 including the first connecting unit 10 and the second connecting unit 60 is used as an example for explanation. The number of connecting units can be set as needed. The same applies to other cases where the number of connecting units is different. That is, the flexible circuit boards in each connecting unit can be stacked one by one in sequence. This will not be described in detail here.

[0066] The first connector 30 and the third connector 80 can be high-density connectors, such as at least one OSFP connector or an OSFP-XD connector, where OSFP is a panel I / O interface widely used in data communication.

[0067] OSFP connectors, also known as Octal Small Form-factor Pluggable (OSFP) connectors, are a type of pluggable package developed by the OSFP Multi-Source Agreement (MSA).

[0068] The OSFP-XD connector, also known as the Octal Small Form-factor Pluggable eXtra Dense (OSFP-XD) connector, is another pluggable package form. Its circuit count is increased from 8 to 16, and it offers 1.6T density with 16 channels at 100GB / s and 3.2Tb / s density with 16 channels at 200GB / s.

[0069] The number of OSFP connectors (OSFP-XD connectors) included in the first connector 30 and the third connector 80 can be set according to actual needs, such as 1, 2, 3 or even more. In this embodiment, the example is that both the first connector 30 and the third connector 80 include two OSFP connectors. The same applies to other cases where the number of OSFP connectors is different, and will not be described again here.

[0070] Of course, the first connector 30 and the third connector 80 can also be other types of connectors. The first connector 30 and the third connector 80 are used for pluggable electrical connection with external modules. For example, if the first connector 30 and the third connector 80 are OSFP connectors, the external module can be an OSFP optical module.

[0071] The first flexible circuit board 20 and the second flexible circuit board 70 can be made of PETE material to reduce losses. PETE material is polytetrafluoroethylene (PTFE), also known as Teflon, a high molecular polymer made by polymerizing tetrafluoroethylene as a monomer. This material has the characteristics of being resistant to acids and alkalis, resistant to various organic solvents, and almost insoluble in all solvents.

[0072] In this embodiment, the cable assembly 100 is applied to the circuit board assembly 200 to realize a physical channel from the chip to the panel. (See also...) Figure 2 The circuit board assembly 200 includes a first circuit board 210 (panel) and a second circuit board 220. The second circuit board 220 may be, for example, a main control circuit board. The second circuit board 220 has chips (not shown) and chip connectors 230 that are electrically connected to each other. A first connector 30 and a third connector 80 are disposed on the first circuit board 210. A second connector 50 and a fourth connector 90 can be plugged into and detached from the chip connector 230. The first connector 30 on the first circuit board 210 (panel) is electrically connected to the chip via a first flexible circuit board 20, a second connector 50, and a chip connector 230, thus establishing a physical channel from the chip to the panel. The third connector 80 on the first circuit board 210 (panel) is electrically connected to the chip via a second flexible circuit board 70, a fourth connector 90, and a chip connector 230, thus establishing a physical channel from the chip to the panel.

[0073] In this embodiment, the second connector 50 and the fourth connector 90 may include gold fingers, which facilitates the plugging and unplugging of the second connector 50 and the fourth connector 90 with the chip connector 230 on the main control circuit board.

[0074] In this embodiment of the application, at least a portion of the first flexible circuit board 20 near the second connector 50 and at least a portion of the second flexible circuit board 70 near the fourth connector 90 are stacked on top of each other, meaning that, when viewed from above (… Figure 1 When viewing the cable assembly 100 from a top-down perspective, the first flexible circuit board 20 and the second flexible circuit board 70 have overlapping areas. The first flexible circuit board 20 and the second flexible circuit board 70 can overlap completely or partially.

[0075] In some embodiments, refer to Figure 1 , Figure 2The first flexible circuit board 20 includes a first portion 21 and a second portion 22 that are connected to each other and arranged at an angle. A first connector 30 is disposed in the first portion 21, and a second connector 50 is disposed in the second portion 22. Here, the second portion 22 may be, for example, a strip that extends in a generally straight line, and the first portion 21 may be arranged at a certain angle relative to the second portion 22.

[0076] The second flexible circuit board 70 may include a third portion 71 and a fourth portion 72 that are connected to each other and arranged at an angle. A third connector 80 is disposed in the third portion 71, and a fourth connector 90 is disposed in the fourth portion 72. Here, the fourth portion 72 may be, for example, a strip that extends in a generally straight line, and the third portion 71 may be disposed at a certain angle relative to the fourth portion 72.

[0077] The second part 22 and the fourth part 72 are arranged overlapping each other to allow the second connector 50 and the fourth connector 90 to be arranged overlapping each other. Figure 1 and Figure 2 The first circuit board 210 and the second circuit board 220 have a gap, which can form a heat dissipation channel for cooling air (indicated by the hollow arrow) to pass through, because the second part 22 and the fourth part 72 are in Figure 2 They are stacked on top of each other in the left-right direction, and the second connector 50 and the fourth connector 90 are in... Figure 2 The first connecting unit 10 and the second connecting unit 60 are stacked on top of each other in the left-right direction, so the first connecting unit 10 and the second connecting unit 60 are perpendicular to each other. Figure 2 In the direction of the diagram, it occupies less space and the frontal area is reduced, resulting in better heat dissipation performance.

[0078] In this embodiment of the application, the first connector 30 and the third connector 80 are not stacked on top of each other. In other embodiments of the application, the first connector 30 and the third connector 80 may also be stacked on top of each other.

[0079] Reference Figure 1 In one possible implementation, the first part 21 includes a first offset region C1, and the first connector 30 is disposed in the first offset region C1. The second part 22 includes a second offset region C2, and the third connector 80 is disposed in the second offset region C2. The projections of the first offset region C1 and the second offset region C2 onto a first reference plane do not overlap, and the first reference plane is perpendicular to the stacking direction of the second part 22 and the fourth part 72. Figure 1 (The direction is perpendicular to the drawing). In this way, the first connectors 30 and the third connectors 80 are laid out apart from each other and are not stacked.

[0080] In this embodiment, the first portion 21 bends relative to the second portion 22 toward the first side S1 of the cable assembly, and the third portion 71 bends relative to the fourth portion 72 toward the second side S2 of the cable assembly. The first side S1 and the second side S2 are opposite to the second reference plane, and the second reference plane is perpendicular to the first reference plane. Figure 1 As shown, the first part 21 is bent upward relative to the second part 22, and the third part 71 is bent downward relative to the fourth part 72.

[0081] Figure 3 This is a schematic diagram illustrating another structure of the chip-to-panel cable assembly provided in an embodiment of this application. Figure 1 The first connector 30 and the third connector 80 shown are not stacked, except that, according to... Figure 3 The first part 21 and the third part 71 are arranged on top of each other to allow the first connector 30 and the third connector 80 to be arranged on top of each other. In this way, the space occupied by the first connector 30 and the third connector 80 on the first circuit board 210 can be saved.

[0082] Furthermore, in Figure 3 In the middle, the first part 21 bends toward the first side S1 of the cable assembly relative to the second part 22, and the third part 71 also bends toward the first side S1 relative to the fourth part 72.

[0083] It is understood that, unless the context otherwise defines, the stacking arrangement mentioned in this application refers to the relative positional relationship in the stacking direction; two stacked objects may or may not touch each other. Figure 3 In the example shown, the first part 21 and the third part 71 overlap each other but do not touch in some areas, and are spaced apart. The second part 22 and the fourth part 72 overlap each other, and touch in some areas but do not touch in others.

[0084] Furthermore, combined Figure 1 and Figure 3 The area of ​​the overlapping portion of the second part 22 and the fourth part 72 is greater than 80% of the area of ​​the second part 22. Alternatively or additionally, the area of ​​the overlapping portion of the second part 22 and the fourth part 72 is greater than 80% of the area of ​​the fourth part 72.

[0085] This arrangement ensures that the second part 22 and the fourth part 72 have a sufficiently large overlapping area, resulting in a sufficiently small footprint. For example, the projections of the second part 22 and the fourth part 72 onto the first reference plane can completely overlap, thus minimizing the footprint.

[0086] In this embodiment of the application, combined with Figure 2 and Figure 3The first connector 30 and the third connector 80 are fixed to the optical cage 240 by the first positioning member 41. In some embodiments, the second connector 50 and the fourth connector 90 are fixed relative to each other by the second positioning member 42. For example, the second connector 50 and the fourth connector 90 can be injection molded to be connected to the second positioning member 42 as an integral structure.

[0087] exist Figure 1 In the example, a 1x4 OSFP cage is formed as optical cage 240, meaning there is one layer with four OSFP connectors in each layer. Figure 3 In the example, a 2x2 OSFP cage is formed as the optical cage 240, which has two layers, with two OSFP connectors in each layer. Of course, this application is not limited to this, and the structure and arrangement of the optical cage 240 can be set according to actual needs.

[0088] Furthermore, the first flexible circuit board 20 and the second flexible circuit board 70 are fixed relative to each other by a third positioning member (not shown). The third positioning member can be, for example, a clip or other fixing member, which can fix the first flexible circuit board 20 and the second flexible circuit board 70 relative to each other by providing mounting holes or other fixing members such as clips or nails on the first flexible circuit board 20 and the second flexible circuit board 70.

[0089] By setting at least two of the first positioning member 41, the second positioning member 42, and the third positioning member, the first flexible circuit board 20 and the second flexible circuit board 70 can be kept in a stacked state.

[0090] Furthermore, combined Figure 2 and Figure 3 The second connector 50 and the fourth connector 90 are fixed relative to each other by the second positioning member 42, and the second connector 50 and the fourth connector 90 are spaced apart along the thickness direction of the second part 22 and the fourth part 72. The second part 22 and the fourth part 72 are constructed as elongated strips, and the lengths of the second part 22 and the fourth part 72 are different.

[0091] With this configuration, when the second part 22 and the fourth part 72 are stacked together, if the first flexible circuit board 20 and the second flexible circuit board 70 are bent, the circuit board segment in the fourth part 72 that is close to the fourth connector 90 and the circuit board segment in the second part 22 that is close to the second connector 50 can be spaced apart from each other.

[0092] In the embodiments of this application, reference can be made to Figure 3The insertion directions of the second connector 50 and the fourth connector 90 relative to the chip connector 230 are perpendicular to the extension direction of the first flexible circuit board 20 in its flat state. Alternatively, the insertion directions of the second connector 50 and the fourth connector 90 relative to the chip connector 230 may be along the extension direction of the first flexible circuit board 20 in its flat state. How they are inserted depends on the orientation of the insertion end of the chip connector 230.

[0093] Figure 4 This is a schematic diagram of the circuit board assembly provided in an embodiment of this application. Figure 5 This is a schematic diagram of another structure of the circuit board assembly provided in an embodiment of this application.

[0094] Reference Figure 4 , Figure 5 This application embodiment also provides a circuit board assembly 200, including a first circuit board 210, a second circuit board 220, an optical cage 240 arranged at intervals from each other along a preset direction, and one or more cable assemblies 100 as described above.

[0095] The first connector 30 of the first connecting unit 10 and the third connector 80 of the second connecting unit 60 are disposed in the optical cage 240, which is disposed in the first circuit board 210. The second circuit board 220 is provided with a chip connector 230, and the second connector 50 and the fourth connector 90 are electrically connected to the chip connector 230. The preset direction here can be, for example, the up and down direction under normal use of the electronic device.

[0096] The first circuit board 210 and the second circuit board 220 have a height difference in a preset direction, so parts of the first flexible circuit board 20 and the second flexible circuit board 70 will be bent, for example, by 90°, to facilitate connection.

[0097] Continue to refer to Figure 2 During the heat dissipation process, as indicated by the arrow, the cooling air blows in through the gap between the first circuit board 210 and the second circuit board 220. Because the second part 22 of the first flexible circuit board 20 and the fourth part 72 of the second flexible circuit board 70 are stacked on top of each other, and the second part 22 and the fourth part 72 are partially twisted by 90°, a... Figure 2 The vertical arrangement shown can further reduce the cross-sectional area of ​​the heat dissipation air duct, thereby reducing airflow resistance and resulting in higher heat dissipation efficiency.

[0098] Furthermore, the number of one or more cable assemblies 100 can be two, and the two cable assemblies 100 are stacked on top of each other along the thickness direction of the first circuit board 210. The second connector 50 and the fourth connector 90 of one cable assembly 100, and the second connector 50 and the fourth connector 90 of the other cable assembly 100 are fixed relative to each other by a second positioning member 42. For example, the respective second connector 50 and fourth connector 90 in the two cable assemblies 100 can be formed into a single unit by injection molding.

[0099] In specific implementations, for example, it could be like this: Figure 4 As shown, different cable assemblies 100 are arranged on one side of the first circuit board 210, or as shown... Figure 5 As shown, the different cable assemblies 100 are positioned on opposite sides of the first circuit board 210. The only difference is the different placement of the first connector 30 end of the cable assembly 100, resulting in a different spacing between the two cable assemblies 100. Figure 5 The setting and structure of other structural components are related to Figure 4 The same applies, so I will not repeat it here.

[0100] In the specific connection process, first connect one end of the first connector 30 and the third connector 80 of the cable assembly 100 to the first circuit board 210, and then connect one end of the second connector 50 and the fourth connector 90 to the chip connector 230. At this time, the first flexible circuit board 20 and the second flexible circuit board 70 are partially bent by 90 degrees to achieve the connection.

[0101] In some other embodiments, it is also possible to... Figure 3 Figure 3 Based on the embodiment shown, the chip connector 230 is configured with the insertion direction along the horizontal direction, that is, the second connector 50 and the fourth connector 90 are inserted into the chip connector 230 along the horizontal direction. At this time, the second part 22 of the first flexible circuit board 20 and the fourth part 72 of the second flexible circuit board 70 do not bend.

[0102] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0103] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A chip-to-panel cable assembly, characterized in that, It includes at least a first connecting unit (10) and a second connecting unit (60); The first connection unit (10) includes a first flexible circuit board (20), and a first connector (30) and a second connector (50) disposed on the first flexible circuit board (20); the first connector (30) is used for electrical connection with an external module, and the second connector (50) is used for electrical connection with a chip connector (230); The second connection unit (60) includes a second flexible circuit board (70), and a third connector (80) and a fourth connector (90) disposed on the second flexible circuit board (70); the third connector (80) is used for electrical connection with the external module, and the fourth connector (90) is used for electrical connection with the chip connector (230); Wherein, at least a portion of the first flexible circuit board (20) near the second connector (50) and at least a portion of the second flexible circuit board (70) near the fourth connector (90) are stacked on top of each other.

2. The cable assembly according to claim 1, characterized in that, The first flexible circuit board (20) includes a first part (21) and a second part (22) that are connected to each other and arranged at an angle; the first connector (30) is disposed in the first part (21) and the second connector (50) is disposed in the second part (22); The second flexible circuit board (70) includes a third part (71) and a fourth part (72) that are connected to each other and arranged at an angle; the third connector (80) is disposed in the third part (71) and the fourth connector (90) is disposed in the fourth part (72). The second part (22) and the fourth part (72) are arranged to overlap each other to allow the second connector (50) and the fourth connector (90) to overlap each other.

3. The cable assembly according to claim 2, characterized in that, The first part (21) includes a first offset region (C1), and the first connector (30) is disposed in the first offset region (C1); The second part (22) includes a second offset region (C2), and the third connector (80) is disposed in the second offset region (C2); Wherein, the projections of the first offset region (C1) and the second offset region (C2) onto the first reference plane do not overlap, and the first reference plane is perpendicular to the stacking direction of the second part (22) and the fourth part (72).

4. The cable assembly according to claim 3, characterized in that, The first portion (21) bends toward the first side (S1) of the cable assembly relative to the second portion (22), and the third portion (71) bends toward the second side (S2) of the cable assembly relative to the fourth portion (72). The first side (S1) and the second side (S2) are opposite to the second reference plane, which is perpendicular to the first reference plane.

5. The cable assembly according to claim 2, characterized in that, The first part (21) bends toward the first side (S1) of the cable assembly relative to the second part (22), and the third part (71) also bends toward the first side (S1) relative to the fourth part (72); The first part (21) and the third part (71) are arranged to overlap each other to allow the first connector (30) and the third connector (80) to overlap each other.

6. The cable assembly according to any one of claims 2-5, characterized in that, The area of ​​the overlapping portion of the second part (22) and the fourth part (72) is greater than 80% of the area of ​​the second part (22) and / or greater than 80% of the area of ​​the fourth part (72).

7. The cable assembly according to any one of claims 2-5, characterized in that, The first connector (30) and the third connector (80) are fixed to the optical cage (240) by the first positioning element (41); and / or The second connector (50) and the fourth connector (90) are fixed relative to each other by a second positioning element (42); and / or The first flexible circuit board (20) and the second flexible circuit board (70) are fixed relative to each other by a third positioning member.

8. The cable assembly according to claim 7, characterized in that, The second connector (50) and the fourth connector (90) are fixed relative to each other by the second positioning member (42), and the second connector (50) and the fourth connector (90) have a gap along the thickness direction of the second part (22) and the fourth part (72); The second part (22) and the fourth part (72) are constructed as long strips, and the second part (22) and the fourth part (72) have different lengths.

9. The cable assembly according to claim 8, characterized in that, The insertion directions of the second connector (50) and the fourth connector (90) relative to the chip connector (230) are along the extension direction of the first flexible circuit board (20) in its straight state; or The insertion directions of the second connector (50) and the fourth connector (90) relative to the chip connector (230) are perpendicular to the extension direction of the first flexible circuit board (20) in its straight state.

10. A circuit board assembly (200), characterized in that, include: A first circuit board (210), a second circuit board (220), an optical cage (240), and one or more cable assemblies (100) as described in any one of claims 1-9 are arranged at intervals from each other along a predetermined direction. The first connector (30) of the first connection unit (10) and the third connector (80) of the second connection unit (60) are disposed on the optical cage (240), and the optical cage (240) is disposed on the first circuit board (210). The second circuit board (220) is provided with a chip connector (230), and the second connector (50) and the fourth connector (90) are connected to the chip connector (230).

11. The circuit board assembly (200) according to claim 10, characterized in that, The number of the one or more cable assemblies (100) is two, and the two cable assemblies (100) are stacked on top of each other along the thickness direction of the first circuit board (210); The second connector (50) and fourth connector (90) of one cable assembly, and the second connector (50) and fourth connector (90) of another cable assembly are fixed relative to each other by a second positioning member (42).

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