Busbar structure and converter module

Abstract

The utility model discloses a busbar structure and a converter module, and belongs to the technical field of converters, and the busbar structure comprises a plurality of conductive members which are arranged at intervals; the insulating part wraps the plurality of conductive parts, and the insulating part is of an integrally formed structure; and the plurality of connecting assemblies are arranged on the surface of the insulating part, and each connecting assembly is connected with one conductive part. The plurality of conductive parts arranged at intervals are wrapped by the insulating parts, and the plurality of conductive parts are arranged in a centralized manner, so that an integration effect is achieved, and disordered distribution of the conductive wires in the module is avoided. According to the structure, the plurality of conductive parts are orderly arranged in the module, so that the tidiness in the module is ensured.

Description

Technical Field

[0001] This application belongs to the field of converter technology, and specifically relates to a busbar structure and a converter module. Background Technology

[0002] Busbars are used to connect multiple electronic components in a converter module. They typically consist of a long, narrow metal strip or wire with multiple slots or pins for inserting other electronic components. However, the large number of busbars in a converter module leads to a somewhat scattered distribution of busbars within the module. Utility Model Content

[0003] Purpose of this application: This application provides a busbar structure to overcome the technical problem that the large number of busbars in a converter module leads to a scattered distribution of busbars; another purpose of this application is to provide a converter module.

[0004] Technical solution: The busbar structure described in this application includes:

[0005] Multiple conductive elements are arranged at intervals;

[0006] An insulating component, which covers a plurality of conductive components, wherein the insulating component is an integrally formed structure;

[0007] A plurality of connecting components are disposed on the surface of the insulating element, and each connecting component is connected to one of the conductive elements.

[0008] In some embodiments, the conductive element is a rigid structure and / or a flexible structure.

[0009] In some embodiments, the conductive element is a rigid structure, the conductive element includes a main body and a bent portion, the bent portion is connected to one end of the main body, and the extending direction of the main body intersects the extending direction of the bent portion;

[0010] The connecting components are connected to both the main body and the bent portion.

[0011] In some embodiments, both the conductive element and the insulating element are flexible structures, and the insulating element has a plurality of spaced-apart cavities, with a conductive element disposed inside each cavity.

[0012] In some embodiments, the conductive element includes a plurality of interconnected current-passing portions, and the connection assembly is connected to at least one of the current-passing portions.

[0013] In some embodiments, each of the connection components includes a plurality of pins, and each of the conductive elements is connected to a plurality of the pins of the connection component.

[0014] In some embodiments, the insulating element includes a plurality of mounting surfaces, and a plurality of the pin portions of the connecting assembly are disposed on at least one of the mounting surfaces.

[0015] In some embodiments, a plurality of pins connected to the same conductive element are disposed on a mounting surface.

[0016] In some embodiments, a plurality of pins connected to the same conductive element are disposed on two adjacent mounting surfaces.

[0017] In some embodiments, a plurality of pins connected to the same conductive element are disposed on two opposite mounting surfaces.

[0018] A converter module includes the busbar structure described in any one of the above descriptions.

[0019] Beneficial Effects: The busbar structure of this embodiment includes: multiple conductive elements spaced apart; an insulating element covering the multiple conductive elements, the insulating element being an integrally formed structure; and multiple connecting components disposed on the surface of the insulating element, each connecting component being connected to one conductive element. By covering the multiple spaced conductive elements with the insulating element, the multiple conductive elements are centrally arranged, achieving an integrated effect and avoiding a chaotic distribution of conductive wires inside the module. This structure ensures an orderly arrangement of the multiple conductive elements inside the module, maintaining neatness within the module. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A cross-sectional view of the busbar structure provided in an embodiment of this application, wherein the conductive element is a straight line shape;

[0022] Figure 2 A perspective view of the busbar structure provided in an embodiment of this application, wherein the conductive element is in a bent shape;

[0023] Figure 3 This is a cross-sectional view of the busbar structure provided in an embodiment of this application, wherein the conductive element is in a bent shape;

[0024] Figure 4 Schematic diagram of the main body and the bent portion provided in the embodiments of this application;

[0025] Figure 5 This is a partial structural diagram of a conductive component provided in an embodiment of this application, wherein contacts are provided on the conductive component;

[0026] Figure 6 A perspective view of the busbar structure provided in an embodiment of this application, wherein the conductive element is in a straight line shape;

[0027] Figure 7 Provided for the embodiments of this application Figure 6 A cross-sectional view of MM;

[0028] Figure 8 A structural diagram illustrating a connection configuration of multiple flow passages provided in an embodiment of this application;

[0029] Figure 9 Another connection configuration of the multiple flow passages provided in the embodiments of this application is shown in the structural diagram.

[0030] Figure 10 A perspective view of a busbar structure provided in an embodiment of this application, wherein multiple pin portions are located on a mounting surface of an insulating member;

[0031] Figure 11 This is a front view of a busbar structure provided in an embodiment of this application, wherein a plurality of pin portions are located on a mounting surface of an insulating member;

[0032] Figure 12 A front view of a busbar structure provided in an embodiment of this application, wherein multiple pin portions are located on two adjacent mounting surfaces of an insulating member;

[0033] Figure 13 This is a front view of a busbar structure provided in an embodiment of this application, wherein a plurality of pin portions are located on two opposite mounting surfaces of an insulator;

[0034] Reference numerals: 10-conductive component; 11-main body; 12-bending part; 13-current passage part; 14-contact; 20-insulating component; 21-accommodating cavity; 22-mounting surface; 30-connecting assembly; 31-pin part; 40-clearance space. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0036] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, and "at least one" can mean one, two, or more, unless otherwise explicitly specified.

[0037] As an introduction to the embodiments of this application, a busbar structure is introduced. With the increase in power density of converter modules, the internal space of the modules gradually decreases, which places higher demands on the connection of internal components. While meeting installation requirements, it is necessary to effectively improve space utilization. As a crucial component for device connection, the busbar plays a vital role in the demand for high current transmission. Commercially available multilayer busbars and similar structures offer advantages such as high current transmission capacity and low inductance. These busbars utilize a hard copper busbar with an outer insulating film, providing excellent insulation. The shape of the busbar can be adjusted according to the pin positions to meet connection requirements. Busbars are used to connect multiple electronic devices in a converter module. They typically consist of a long, narrow metal strip or wire with multiple slots or pins for inserting other electronic devices. However, converter modules require the connection of numerous devices, necessitating a large number of busbars. This can lead to a scattered distribution of busbars within the module, hindering the improvement of internal space utilization.

[0038] In view of the above, embodiments of this application provide a busbar structure to overcome at least one of the above-mentioned technical problems.

[0039] In this embodiment, the busbar structure includes multiple conductive elements 10, insulating elements 20, and multiple connecting assemblies 30. Please refer to... Figure 1 There are four conductive components 10, but the exact number is not limited. Figure 1 Each conductive element 10 has a connecting component 30 at both ends, but each conductive element 10 may have more than two connecting components 30, and the specific number is not limited. The position of the connecting component 30 on the conductive element 10 is also not limited.

[0040] Multiple conductive elements 10 are spaced apart; an insulating element 20 covers the multiple conductive elements 10, and the insulating element 20 can be integrally molded by injection molding. Multiple connecting components 30 are disposed on the surface of the insulating element 20, and each connecting component 30 is connected to one conductive element 10. It can be understood that by spaced apart, the multiple conductive elements 10 are disposed inside the insulating element 20, which can cover the multiple conductive elements 10, thus insulating the conductive elements 10 from other structures and preventing the current on the conductive elements 10 from affecting the normal use of other structures.

[0041] Meanwhile, by encasing multiple conductive elements 10 with insulating material 20, the multiple conductive elements 10 can be connected into a single unit and arranged at intervals, thus integrating the multiple conductive elements 10 and facilitating their movement and transportation. The spacing between adjacent conductive elements 10 in insulating material 20 can be set as needed, and the arrangement of the multiple conductive elements 10 can also be set as required; they can be arranged side-by-side in the same plane, or in an arc shape, ring shape, etc. The shape of the conductive elements 10 can be elongated, bent, arc-shaped, or any other shape.

[0042] When multiple conductive components 10 are connected to devices inside the converter module, the insulating component 20 restrains the conductive components 10, preventing the module's interior from appearing cluttered and ensuring neatness and aesthetics. Furthermore, the insulating component 20 allows for an orderly arrangement of the conductive components 10 within the module, which can shorten their length and improve space utilization. This busbar structure saves internal space, allowing for a smaller internal layout, more compact internal structure, and a reduced module size.

[0043] Please see Figure 4 and Figure 5 In conjunction with the above embodiments, in some embodiments, the conductive element 10 is a rigid structure, comprising a main body 11 and a bent portion 12. The bent portion 12 is connected to one end of the main body 11, and the extending direction of the main body 11 intersects the extending direction of the bent portion 12. Connecting components 30 are connected to both the main body 11 and the bent portion 12. It is understood that when the conductive element 10 is a rigid structure, in order to adapt to the complex spatial environment inside the module, each conductive element 10 can be bent as needed. The conductive element 10 may include a main body 11 and a bent portion 12. The main body 11 can be connected to one or more devices inside the module, and the bent portion 12 can be connected to another device or more devices, thereby realizing electrical connection between corresponding devices. The main body 11 and the bent portion 12 extend in different directions and are not on a straight line, allowing for the connection of multiple devices in a complex space. Of course, multiple bent structures like the bent portion 12 can be provided on the conductive member 10. This bent structure can be located at the end of the bent portion 12 away from the main body 11, and the bending direction can be set according to the position of the device, without limitation here. Simultaneously, due to the presence of the bent portion 12, the extension direction of a portion of the conductive member 10 changes, allowing for the avoidance of some structures within the module. After multiple conductive members 10 are covered by the insulating member 20, a clearance space 40 can be provided on the insulating member 20 at the location of the bent portion 12 (e.g., ...). Figure 2 and Figure 3Some structures within the module can be set inside the clearance space 40, or pass through the clearance space 40, which is beneficial for the setting and layout of the internal structure of the module.

[0044] The conductive component 10 may include a positive conductive portion and a negative conductive portion, which are respectively connected to the positive and negative terminals of the corresponding devices. It is understood that, to adapt to the complex spatial environment inside the module, facilitate the connection of devices with complex positions, and avoid some internal structures, both the positive and negative conductive portions may have bent sections, forming the bent portions 12 of the conductive component 10, which facilitates the connection between devices and the arrangement of internal structures within the module. Simultaneously, multiple contacts that connect to the connecting assembly 30 can be provided on both the positive and negative conductive portions. These contacts can be positioned at different locations on the positive and negative conductive portions, and different contact positions can be selected to connect to the devices based on the distance between them, thus broadening the applicability of the structure.

[0045] Please see Figure 6 and Figure 7 In conjunction with the above embodiments, in some embodiments, both the conductive element 10 and the insulating element 20 are flexible structures. The insulating element 20 has multiple spaced-apart cavities 21, and each cavity 21 contains a conductive element 10. It is understood that when both the conductive element 10 and the insulating element 20 are flexible structures, the insulating element 20 can have multiple spaced-apart cavities 21 for accommodating the conductive element 10. The flexible conductive element 10 can be bent to a certain extent according to the internal spatial structure of the module, without needing to be processed into a fixed curved shape. The conductive element 10 can be bent as needed, and the direction and degree of bending can also be adjusted to connect corresponding devices, improving the flexibility of the conductive element 10 during use. Simultaneously, the insulating element 20 is also a flexible structure. When the conductive element 10 bends, the insulating element 20 can be compressed, causing it to deform and bend to a certain extent. The insulating element 20 can deform along with the conductive element 10. Both can adapt to the complex spatial environment inside the module structure to a certain extent, facilitating the connection of devices at different locations.

[0046] Please see Figure 6 , Figure 7 , Figure 8 and Figure 9In conjunction with the above embodiments, in some embodiments, the conductive element 10 includes multiple interconnected current-carrying portions 13, and the connecting assembly 30 is connected to at least one current-carrying portion 13. It is understood that the conductive element 10 can be formed by connecting multiple current-carrying portions 13 to meet current-carrying requirements. All multiple current-carrying portions 13 are flexible structures. The multiple current-carrying portions 13 can be stacked to form the conductive element 10, or multiple current-carrying portions 13 can be arranged around one current-carrying portion 13 to form the conductive element 10, or they can be spirally wound together to form the conductive element 10. The arrangement of multiple current-carrying portions 13 to form the conductive element 10 is not limited here. The conductive element 10 is composed of multiple flexible current-carrying portions 13 with small width or thickness dimensions. Compared to a single flexible structure with a large width or thickness dimension, the conductive element 10 is easier to deform overall (for the same flexible structure, the larger the width or thickness dimension, the less likely it is to deform), thus making it easier to adapt to different spatial environments and facilitating the connection of devices with complex positions. When the connecting component 30 is connected to the conductive component 10, it is connected to at least one current-passing part 13 on the conductive component 10. Multiple current-passing parts 13 are interconnected. Even if the connecting component 30 is only connected to one current-passing part 13, it can still achieve electrical connection with the entire conductive component 10. The connection of the connecting component 30 to a small number of current-passing parts 13 can reduce the difficulty of connecting the two in production and processing and improve production efficiency.

[0047] Please see Figure 1 and Figure 6 In conjunction with the above embodiments, in some embodiments, each connecting component 30 includes multiple pin portions 31, and each conductive element 10 is connected to multiple pin portions 31 of the connecting component 30. It is understood that each connecting component 30 can be composed of multiple pin portions 31, all of which are connected to the same conductive element 10. Each pin portion 31 can be connected to different positions on the conductive element 10 and connected to contacts 14 at different positions on the conductive element 10, thus realizing the connection between the pin portion 31 and the conductive element 10. The pin portions 31, positioned at different locations, can connect devices at different distances, improving the flexibility of the busbar structure. The number of pin portions 31 can be set according to the number of devices, thereby facilitating the connection of two or more devices and enabling the coordinated use of multiple devices.

[0048] Please see Figure 10In conjunction with the above embodiments, in some embodiments, the insulating member 20 includes multiple mounting surfaces 22, and multiple pin portions 31 of the connecting assembly 30 are disposed on at least one mounting surface 22. It is understood that the insulating member 20 has multiple mounting surfaces 22, which are multiple sides of the insulating member 20. Multiple pin portions 31 on a connecting assembly 30 can be disposed on one or more mounting surfaces 22 to connect devices at different locations; alternatively, a suitable mounting position of the busbar structure can be selected according to the internal space environment of the module, and then, based on the position of the busbar structure and the device to be connected, pin portions 31 can be disposed on the side of the busbar structure facing the device to facilitate connection with the corresponding device.

[0049] Please see Figure 11 In conjunction with the above embodiments, in some embodiments, multiple pin portions 31 connected to the same conductive element 10 are disposed on a mounting surface 22. It is understood that when multiple devices that need to be connected inside the module are located on the same side of the busbar structure, multiple pin portions 31 for connecting to the devices can be disposed on one side of the insulating element 20, that is, on a mounting surface 22. When multiple devices are located on the same side of the busbar structure, this arrangement of the pin portions 31 facilitates the connection between the busbar structure and multiple devices.

[0050] Please see Figure 12 In conjunction with the above embodiments, in some embodiments, multiple pin portions 31 connected to the same conductive element 10 are disposed on two adjacent mounting surfaces 22. It is understood that when multiple devices that need to be connected inside the module are located on adjacent sides of the busbar structure, a corresponding number of pin portions 31 can be disposed on two adjacent mounting surfaces 22 of the insulating element 20, facilitating the connection of the pin portions 31 on the mounting surfaces facing the devices to the corresponding devices. When multiple devices are located on adjacent sides of the busbar structure, this arrangement of pin portions 31 facilitates the connection between the busbar structure and multiple devices.

[0051] Please see Figure 13 In conjunction with the above embodiments, in some embodiments, multiple pin portions 31 connected to the same conductive element 10 are disposed on two opposite mounting surfaces 22. It is understood that when multiple devices that need to be connected inside the module are located on opposite sides of the busbar structure, a corresponding number of pin portions 31 can be disposed on the two opposite mounting surfaces 22 of the insulating element 20, allowing the pin portions 31 to connect with the corresponding devices. This arrangement of the pin portions 31 facilitates the connection between the busbar structure and multiple devices when multiple devices are located on opposite sides of the busbar structure.

[0052] A converter module includes the busbar structure described above. The converter module also includes multiple devices located at different positions, and the busbar structure is used to connect the corresponding devices.

[0053] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0054] The busbar structure and converter module provided in the embodiments of this application have been described in detail above, and specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A busbar structure, characterized in that, include: Multiple conductive elements (10) are arranged at intervals; An insulating component (20) is provided, which covers a plurality of conductive components (10), and the insulating component (20) is an integrally formed structure. A plurality of connecting components (30) are disposed on the surface of the insulating member (20), and each connecting component (30) is connected to one of the conductive members (10).

2. The busbar structure according to claim 1, characterized in that, The conductive element (10) is a rigid structure and / or a flexible structure.

3. The busbar structure according to claim 2, characterized in that, The conductive element (10) is a rigid structure. The conductive element (10) includes a main body (11) and a bent part (12). The bent part (12) is connected to one end of the main body (11). The extension direction of the main body (11) intersects with the extension direction of the bent part (12). The connecting assembly (30) is connected to both the main body (11) and the bent part (12).

4. The busbar structure according to claim 2, characterized in that, Both the conductive element (10) and the insulating element (20) are flexible structures. The insulating element (20) has a plurality of spaced-apart cavities (21), and each cavity (21) contains a conductive element (10).

5. The busbar structure according to claim 3 or 4, characterized in that, The conductive element (10) includes a plurality of interconnected current-passing parts (13), and the connecting assembly (30) is connected to at least one of the current-passing parts (13).

6. The busbar structure according to claim 1, characterized in that, Each of the connection components (30) includes a plurality of pin portions (31), and each of the conductive elements (10) is connected to a plurality of the pin portions (31) of the connection component (30).

7. The busbar structure according to claim 6, characterized in that, The insulating element (20) includes a plurality of mounting surfaces (22), and a plurality of the pin portions (31) of the connecting assembly (30) are disposed on at least one of the mounting surfaces (22).

8. The busbar structure according to claim 7, characterized in that, A plurality of pin portions (31) connected to the same conductive element (10) are disposed on a mounting surface (22).

9. The busbar structure according to claim 7, characterized in that, Multiple pin portions (31) connected to the same conductive element (10) are disposed on two adjacent mounting surfaces (22).

10. The busbar structure according to claim 7, characterized in that, Multiple pin portions (31) connected to the same conductive element (10) are disposed on two opposite mounting surfaces (22).

11. A converter module, characterized in that, Includes the busbar structure as described in any one of claims 1 to 10.

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