Vehicle-mounted gateway and vehicle

Abstract

The embodiment of the utility model discloses a vehicle-mounted gateway and a vehicle, a heat conduction assembly is arranged in a shell, a heat conduction effect on a circuit board group in the shell is achieved, and the surface of the heat conduction assembly is attached to the surface of the circuit board group and the inner wall of the shell, so that the heat conduction effect of the heat conduction assembly can directly act on the circuit board group, and heat is conducted out of the shell. Compared with natural heat conduction only depending on air in the shell, the heat conduction efficiency of the heat conduction assembly is higher, and therefore the heat dissipation efficiency and the heat dissipation effect of the vehicle-mounted gateway are improved.

Description

Technical Field

[0001] This application relates to the field of vehicle gateway technology, specifically to vehicle gateways and vehicles. Background Technology

[0002] The vehicle gateway is the core control device of an automotive network system, primarily responsible for coordinating data exchange and fault diagnosis between data networks with different structures and characteristics. In existing technologies, due to the increasing intelligence of vehicles, the number of electronic components on the circuit boards inside the vehicle gateway has increased significantly. Furthermore, the limited space on the circuit boards for mounting these components leads to their close proximity, causing heat exchange within the vehicle gateway to occur and resulting in low heat dissipation efficiency. Utility Model Content

[0003] This application provides an in-vehicle gateway and a vehicle to improve the problem of low heat dissipation efficiency of in-vehicle gateways.

[0004] In a first aspect, embodiments of this application provide an in-vehicle gateway, comprising:

[0005] case;

[0006] The circuit board assembly is located inside the housing;

[0007] A heat-conducting component is disposed within the housing, filling the remaining space within the housing except for the circuit board assembly, and the surface of the heat-conducting component is attached to the surface of the circuit board assembly and the inner wall of the housing.

[0008] In some embodiments of this application, the circuit board assembly includes a first circuit board and a second circuit board, both of which are disposed within the housing. The first circuit board and the second circuit board are disposed opposite to each other and are spaced apart from the inner wall of the housing.

[0009] In some embodiments of this application, the inner sidewall of the housing is provided with a plurality of first support plates and a plurality of second support plates, the first support plates and the second support plates are disposed opposite to each other, a plurality of corners of the first circuit board are respectively disposed on the plurality of first support plates, and a plurality of corners of the second circuit board are respectively disposed on the plurality of second support plates.

[0010] In some embodiments of this application, the thermally conductive component includes a plurality of thermally conductive silicone blocks. The first circuit board and the second circuit board are arranged opposite to each other so that the housing is divided into a first space, a second space and a third space from bottom to top. The thermally conductive silicone blocks are provided in the first space, the second space and the third space. The surface of the thermally conductive silicone block in the first space is attached to the lower surface of the first circuit board and the inner wall of the first space. The surface of the thermally conductive silicone block in the second space is attached to the upper surface of the first circuit board, the lower surface of the second circuit board and the inner wall of the second space. The surface of the thermally conductive silicone block in the third space is attached to the upper surface of the second circuit board and the inner wall of the third space.

[0011] In some embodiments of this application, the heat-conducting component further includes a heat-conducting pipe disposed within the heat-conducting silicone block and extending to the outside of the housing, wherein coolant is circulated within the heat-conducting pipe.

[0012] In some embodiments of this application, each of the thermally conductive silicone blocks is provided with two thermally conductive tubes, which are arranged opposite to each other along the thickness direction of the thermally conductive silicone block.

[0013] In some embodiments of this application, one heat-conducting pipe in the thermally conductive silicone block located in the first space is disposed near the inner bottom wall of the housing, and the other heat-conducting pipe is disposed near the bottom surface of the first circuit board; one heat-conducting pipe in the thermally conductive silicone block located in the second space is disposed near the top surface of the first circuit board, and the other heat-conducting pipe is disposed near the bottom surface of the second circuit board; one heat-conducting pipe in the thermally conductive silicone block located in the third space is disposed near the inner top wall of the housing, and the other heat-conducting pipe is disposed near the top surface of the second circuit board.

[0014] In some embodiments of this application, the heat pipe includes multiple U-shaped segments connected sequentially along the length of the thermally conductive silicone block, and the opening directions of adjacent U-shaped segments are opposite, so that the heat pipe has a serpentine shape.

[0015] In some embodiments of this application, the vehicle gateway further includes heat dissipation fins disposed on at least one side surface of the housing.

[0016] Secondly, embodiments of this application provide a vehicle including the vehicle gateway as described in the first aspect.

[0017] Therefore, the vehicle gateway disclosed in the embodiments of this application provides a heat-conducting component inside the housing to conduct heat to the circuit board assembly inside the housing. The surface of the heat-conducting component is attached to the surface of the circuit board assembly and the inner wall of the housing, so that the heat conduction effect of the heat-conducting component can directly act on the circuit board assembly and conduct heat out of the housing. Compared with relying solely on the natural heat conduction of the air inside the housing, the heat conduction efficiency of the heat-conducting component is higher, thereby improving the heat dissipation efficiency and heat dissipation effect of the vehicle gateway. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a vehicle gateway provided in an embodiment of this application;

[0020] Figure 2 This is a cross-sectional schematic diagram of a thermally conductive silicone block in an in-vehicle gateway, provided as an embodiment of this application.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1. Housing; 11. First support plate; 12. Second support plate; 13. First space; 14. Second space; 15. Third space; 2. Circuit board assembly; 21. First circuit board; 22. Second circuit board; 3. Thermal conductive component; 31. Thermal conductive silicone block; 32. Heat conduction pipe; 33. Heat dissipation fins. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0025] Please see Figure 1This application provides an in-vehicle gateway, including a housing 1, a circuit board assembly 2, and a heat-conducting component 3. Both the circuit board assembly 2 and the heat-conducting component 3 are disposed within the housing 1. The heat-conducting component 3 fills the remaining space within the housing 1 except for the space occupied by the circuit board assembly 2, and the surface of the heat-conducting component 3 is attached to the surface of the circuit board assembly 2 and the inner wall of the housing 1.

[0026] The technical solution provided in this application provides a heat-conducting component 3 inside the housing 1, which conducts heat to the circuit board assembly 2 inside the housing 1. The surface of the heat-conducting component 3 is attached to the surface of the circuit board assembly 2 and the inner wall of the housing 1, so that the heat conduction of the heat-conducting component 3 can directly act on the circuit board assembly 2 and conduct heat out of the housing 1. Compared with relying solely on the natural heat conduction of the air inside the housing 1, the heat conduction efficiency of the heat-conducting component 3 is higher, thereby improving the heat dissipation efficiency and heat dissipation effect of the vehicle gateway.

[0027] In some embodiments, the circuit board assembly 2 includes a first circuit board 21 and a second circuit board 22. Both the first circuit board 21 and the second circuit board 22 are disposed within the housing 1, with the first circuit board 21 and the second circuit board 22 positioned opposite each other and spaced apart from the inner wall of the housing 1. Disposing both circuit boards within the housing 1 improves the integration of the vehicle gateway, and the opposite arrangement of the two circuit boards, with a certain distance between them, facilitates heat dissipation between the circuit boards. Furthermore, the spaced-apart arrangement between the circuit boards and the inner wall of the housing 1 prevents the housing 1 from partially obstructing the circuit boards and affecting their heat dissipation.

[0028] Furthermore, the inner wall of the housing 1 is provided with multiple first support plates 11 and multiple second support plates 12. The first support plates 11 and the second support plates 12 are arranged opposite to each other. Multiple corners of the first circuit board 21 are respectively disposed on the multiple first support plates 11, and multiple corners of the second circuit board 22 are respectively disposed on the multiple second support plates 12. By using multiple support plates to support the circuit board, and the support plates only contacting the corners of the circuit board, the sides of the circuit board can be spaced apart from the inner wall of the housing 1, while minimizing the contact area between the support plates and the circuit board, thus reducing the impact of the support plates on the heat dissipation of the circuit board.

[0029] In some embodiments, the thermally conductive component 3 includes a plurality of thermally conductive silicone blocks 31. The first circuit board 21 and the second circuit board 22 are arranged opposite to each other so that the housing 1 is divided into a first space 13, a second space 14 and a third space 15 from bottom to top. Each of the first space 13, the second space 14 and the third space 15 is provided with a thermally conductive silicone block 31. The surface of the thermally conductive silicone block 31 in the first space 13 is attached to the lower surface of the first circuit board 21 and the inner wall of the first space 13. The surface of the thermally conductive silicone block 31 in the second space 14 is attached to the upper surface of the first circuit board 21, the lower surface of the second circuit board 22 and the inner wall of the second space 14. The surface of the thermally conductive silicone block 31 in the third space 15 is attached to the upper surface of the second circuit board 22 and the inner wall of the third space 15. By using two circuit boards to divide the housing 1 into three spaces, and placing thermally conductive silicone blocks 31 in each of the three spaces, the thermally conductive silicone blocks 31 can dissipate heat for both circuit boards. Furthermore, the surface of the thermally conductive silicone blocks 31 can adhere to both the surface of the circuit boards and the inner wall of the space, allowing the heat emitted by the circuit boards to be directly conducted to the outside of the housing 1 through the thermally conductive silicone blocks 31.

[0030] Further, please see Figure 1 and Figure 2 The heat-conducting component 3 also includes a heat-conducting pipe 32, which is disposed within the heat-conducting silicone block 31 and extends to the outside of the housing 1. Coolant flows through the heat-conducting pipe 32. By connecting the portions of the heat-conducting pipe 32 extending outside the housing 1 to a device for pumping out coolant, coolant can flow into a guide pipe and then out of the heat-conducting pipe 32. The temperature of the coolant further removes heat from the housing 1, improving heat dissipation effect and efficiency. Furthermore, in some embodiments, the coolant device connected to the heat-conducting pipe 32 can be shared with other components in the vehicle to save cooling costs and reduce the space occupied by cooling equipment in the vehicle.

[0031] In some embodiments, each thermally conductive silicone block 31 is provided with two heat-conducting pipes 32, which are arranged opposite to each other along the thickness direction of the thermally conductive silicone block 31. This allows the heat conduction effect of the heat-conducting pipes 32 in the thermally conductive silicone block 31 to be distributed as evenly as possible across multiple parts of the thermally conductive silicone block 31, thereby improving the uniform conduction of heat absorbed by the thermally conductive silicone block 31.

[0032] Furthermore, in the first space 13, one heat pipe 32 of the thermally conductive silicone block 31 is positioned near the inner bottom wall of the housing 1, and the other heat pipe 32 is positioned near the bottom surface of the first circuit board 21; in the second space 14, one heat pipe 32 of the thermally conductive silicone block 31 is positioned near the top surface of the first circuit board 21, and the other heat pipe 32 is positioned near the bottom surface of the second circuit board 22; in the third space 15, one heat pipe 32 of the thermally conductive silicone block 31 is positioned near the inner top wall of the housing 1, and the other heat pipe 32 is positioned near the top surface of the second circuit board 22. By placing some heat pipes 32 as close as possible to the circuit board and others as close as possible to the inner wall of the housing 1, and then placing the heat pipes 32 directly inside the thermally conductive silicone block 31, heat conduction can be seamlessly transferred from the circuit board to the thermally conductive silicone block 31. Then, some of the heat transferred to the thermally conductive silicone block 31 is directly transferred to the outside of the housing 1 through the housing 1, and some of the heat is conducted to the outside of the housing 1 through the heat pipes 32, thereby improving the heat conduction efficiency.

[0033] In some embodiments, see Figure 2 The heat pipe 32 comprises multiple U-shaped segments connected sequentially along the length of the thermally conductive silicone block 31. Exemplarily, the multiple U-shaped segments are integrally formed, improving the sealing effect and strength of the heat pipe 32. Furthermore, the opening directions of adjacent U-shaped segments are opposite, giving the heat pipe 32 a serpentine, meandering shape. This allows the heat pipe 32 to maximize its length within the limited area of ​​the thermally conductive silicone block 31, enabling it to cover a larger area of ​​the block and thus improving heat dissipation.

[0034] In some embodiments, the vehicle gateway further includes heat dissipation fins 33, which are disposed on at least one side surface of the housing 1 to further improve the heat dissipation effect and efficiency of the vehicle gateway. Exemplarily, the heat dissipation fins 33 are disposed on the side and top surfaces of the housing 1 so that the heat dissipation fins 33 cover as much of the surface area of ​​the housing 1 as possible, improving the heat dissipation effect. Furthermore, it also allows for reserved bottom surface area for the vehicle gateway to be installed inside the vehicle, preventing the heat dissipation fins 33 from affecting the installation of the vehicle gateway.

[0035] Embodiments of this application also provide a vehicle including the vehicle gateway of any of the foregoing embodiments. Since the vehicle includes the vehicle gateway, the vehicle has the same beneficial effects as the vehicle gateway, which will not be elaborated further here.

[0036] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0037] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0038] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0039] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that patent application are incorporated herein by reference, except for historical application documents that are inconsistent with or conflict with the content of this application, and documents that limit the broadest scope of the claims of this application (currently or subsequently appended to this application). It should be noted that if there are any inconsistencies or conflicts between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

[0040] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A vehicle-mounted gateway, characterized in that, include: case; The circuit board assembly is located inside the housing; A heat-conducting component is disposed within the housing, filling the remaining space within the housing except for the circuit board assembly, and the surface of the heat-conducting component is attached to the surface of the circuit board assembly and the inner wall of the housing.

2. The vehicle gateway according to claim 1, characterized in that, The circuit board assembly includes a first circuit board and a second circuit board, both of which are disposed within the housing. The first circuit board and the second circuit board are arranged opposite to each other and are spaced apart from the inner wall of the housing.

3. The vehicle gateway according to claim 2, characterized in that, The inner wall of the housing is provided with a plurality of first support plates and a plurality of second support plates. The first support plates and the second support plates are arranged opposite to each other. A plurality of corners of the first circuit board are respectively provided on the plurality of first support plates, and a plurality of corners of the second circuit board are respectively provided on the plurality of second support plates.

4. The vehicle gateway according to claim 2, characterized in that, The thermally conductive component includes multiple thermally conductive silicone blocks. The first circuit board and the second circuit board are arranged opposite each other to divide the housing into a first space, a second space, and a third space from bottom to top. The thermally conductive silicone blocks are provided in the first space, the second space, and the third space. The surface of the thermally conductive silicone block in the first space is attached to the lower surface of the first circuit board and the inner wall of the first space. The surface of the thermally conductive silicone block in the second space is attached to the upper surface of the first circuit board, the lower surface of the second circuit board, and the inner wall of the second space. The surface of the thermally conductive silicone block in the third space is attached to the upper surface of the second circuit board and the inner wall of the third space.

5. The vehicle-mounted gateway according to claim 4, characterized in that, The heat-conducting component also includes a heat-conducting pipe, which is disposed inside the heat-conducting silicone block and extends to the outside of the housing, and is used for the flow of coolant.

6. The vehicle-mounted gateway according to claim 5, characterized in that, Each of the thermally conductive silicone blocks contains two thermally conductive tubes, which are arranged opposite each other along the thickness direction of the thermally conductive silicone block.

7. The vehicle gateway according to claim 6, characterized in that, One heat pipe in the thermally conductive silicone block located in the first space is positioned near the inner bottom wall of the housing, and the other heat pipe is positioned near the bottom surface of the first circuit board; one heat pipe in the thermally conductive silicone block located in the second space is positioned near the top surface of the first circuit board, and the other heat pipe is positioned near the bottom surface of the second circuit board; one heat pipe in the thermally conductive silicone block located in the third space is positioned near the inner top wall of the housing, and the other heat pipe is positioned near the top surface of the second circuit board.

8. The vehicle gateway according to any one of claims 5 to 7, characterized in that, The heat pipe includes multiple U-shaped segments, which are connected sequentially along the length of the thermally conductive silicone block, and the opening directions of adjacent U-shaped segments are opposite, so that the heat pipe has a serpentine shape.

9. The vehicle gateway according to claim 1, characterized in that, The vehicle gateway also includes heat dissipation fins, which are disposed on at least one side surface of the housing.

10. A vehicle, characterized in that, Including the vehicle gateway as described in any one of claims 1 to 9.

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