Circuit board soldering paste brushing device

Abstract

The utility model belongs to the technical field of circuit board processing, and particularly relates to a soldering paste brushing device for a circuit board. The paste brushing machine comprises a paste brushing machine body, a control panel is installed at the front end of the paste brushing machine body, a supporting seat is fixedly installed on the paste brushing machine body, a supporting plate is fixedly installed on the end face of the top end of the supporting seat, a plurality of buffering assemblies are connected to the supporting plate in a screwed mode, and a driving box is fixedly connected to the top end of the paste brushing machine body. The driving box is in transmission connection with a moving plate, and a lifting mechanism is fixedly installed on the moving plate. According to the utility model, the supporting seat is fixedly arranged on the paste brushing machine, the supporting plate is fixedly arranged on the supporting seat, and the buffering assembly is arranged on the supporting plate, so that the safety during circuit board processing can be further improved, and meanwhile, the V-shaped folding plates are arranged on the two sides of the scraping plate, so that the tin soldering paste smearing quality can be better maintained; the production efficiency of the circuit board is improved, human errors are reduced, and the consistency and reliability of product quality are ensured.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board processing technology and relates to a device for brushing solder paste onto circuit boards. Background Technology

[0002] A circuit board, or printed circuit board, is an indispensable component in modern electronic devices. It primarily supports and connects various electronic components, enabling them to work together to achieve specific functions. With the continuous advancement of electronic product manufacturing technology, applying solder paste to circuit boards has become a crucial step. To improve production efficiency and product quality, various devices and technologies for applying solder paste to circuit boards have emerged in recent years. The core component of a circuit board solder paste application device is its application mechanism. This mechanism typically includes a steel template with stencil grooves and a structure parallel to the circuit board. A scraper sliding above the steel template applies solder paste from the stencil grooves to the corresponding positions on the circuit board.

[0003] Current solder paste application devices require screwing threaded support rods onto a bracket and placing the circuit board on the support rods. Simultaneously, a drive template is attached to the top of the circuit board for the next application step. However, this process cannot effectively protect the circuit board, potentially causing damage during processing. Furthermore, existing solder paste application devices can only perform simple, repeated application, causing solder paste to be squeezed to the sides of the template during application. Therefore, manual pushing is required to the center of the template, making them impractical. Utility Model Content

[0004] The purpose of this invention is to address the above-mentioned problems by providing a device for brushing solder paste onto circuit boards.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A circuit board solder paste application device includes a paste application machine. A control panel is installed at the front end of the paste application machine. A support base is fixedly installed on the paste application machine. A tray is fixedly installed on the top end face of the support base. Several buffer components are screwed onto the tray. A drive box is fixedly connected to the top of the paste application machine. A moving plate is drivenly connected to the drive box. A lifting mechanism is fixedly installed on the moving plate. A scraper is fixedly connected to the bottom of the lifting mechanism. A gathering plate is fixedly connected to the inner walls on both sides of the scraper by screws. Two brackets are fixedly connected to the bottom of the scraper and to the outer wall of the paste application machine. A template is pressed between the two brackets by a clamping screw.

[0007] In the above-mentioned circuit board solder paste brushing device, the tray is a flat metal plate, and a plurality of mounting holes are evenly provided on the tray.

[0008] In the above-mentioned circuit board solder paste brushing device, the buffer assembly consists of a positioning block, a support rod, a sleeve, a buffer spring, and a ball bearing. The positioning block is an L-shaped metal block with a protrusion at one end.

[0009] In the above-mentioned circuit board solder paste brushing device, the other end of the positioning block is provided with an adjustment groove. The positioning block passes through the adjustment groove by fixing bolts and is pressed and connected to the support plate.

[0010] In the aforementioned circuit board solder paste brushing device, the bottom outer wall of the support rod is provided with an external thread, and is connected to the mounting hole by screwing the thread. The other end of the support rod is embedded in the sleeve and is slidably connected.

[0011] In the above-mentioned circuit board solder paste brushing device, a buffer spring is fitted inside the sleeve, and a ball is fitted to the other end of the buffer spring, with the top end face of the ball extending out of the other end of the sleeve.

[0012] In the above-mentioned circuit board solder paste brushing device, the lifting mechanism consists of an air pump, a pump rod, a support spring, an adjusting nut, and a mounting bracket. The air pump is fixedly installed on the top end face of the moving plate, and the pump rod is internally connected to the air pump.

[0013] In the aforementioned circuit board solder paste brushing device, the outer wall of the other end of the pump rod is provided with an external thread, and the other end of the pump rod passes through the movable plate and is embedded in the mounting bracket. Two adjusting nuts are screwed onto the pump rod, and a support spring is sleeved on the pump rod between the adjusting nuts and the top of the mounting bracket.

[0014] In the above-mentioned circuit board solder paste brushing device, the top of the scraper is tightened to the bottom of the mounting frame by screws, and the bottom of the scraper is attached to the template.

[0015] In the above-mentioned circuit board solder paste brushing device, a gathering plate is fixedly connected to the inner walls on both sides of the scraper by screws. The gathering plate is an inclined metal sheet and is installed in a V-shape. The other end of the gathering plate is attached to the inner wall of the template.

[0016] Compared with existing technologies, the advantages of this utility model are:

[0017] 1. This utility model features a support base fixedly installed on a plaster application machine, with a tray fixedly connected to the top of the support base. Several mounting holes are evenly distributed on the tray, through which positioning blocks are fixedly connected with bolts, thus limiting and fixing the placement position of the circuit board. Several support rods are threadedly connected to the center of the positioning blocks, and sleeves are slidably fitted onto the top of the support rods. A buffer spring is fitted inside the sleeve, and a ball bearing is fitted to the other end of the buffer spring, with the top of the ball bearing protruding outside the sleeve. This not only provides stable support for the circuit board but also allows the circuit board to slowly adhere to the bottom of the template when it moves downwards, providing some protection against damage.

[0018] 2. This utility model features a drive box fixedly installed at the top of the solder paste application machine, with a moving plate connected to the drive box for transmission. This allows the moving plate to move left and right. Two air pumps are fixedly installed at the top of the moving plate, with the other end of the pump rod passing through the moving plate and screwed onto a mounting bracket. A support spring is fitted between the mounting bracket and the adjusting nut screwed onto the pump rod, ensuring the scraper adheres more stably to the template. Simultaneously, gathering plates are fixedly connected to the inner walls of both sides of the scraper, with the other end of the gathering plates adhering to the inner wall of the template. The gathering plates are designed with a V-shaped structure to gather and collect the solder paste on both sides. Through automated application and removal processes, these devices significantly improve circuit board production efficiency, reduce human error, and ensure consistent and reliable product quality.

[0019] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0021] Figure 2 This is a top view of the pallet of this utility model.

[0022] Figure 3 This is a schematic diagram of the connection between the pump rod and the mounting bracket of this utility model.

[0023] Figure 4 This is a cross-sectional view of the connection between the support rod and the sleeve of this utility model.

[0024] Figure 5 This is a schematic diagram showing the connection between the scraper and the gathering plate of this utility model.

[0025] Figure 6 This is a utility model Figure 1Enlarged diagram of point A in the middle.

[0026] In the diagram: 1. Paste brushing machine; 2. Control panel; 3. Support base; 4. Tray; 41. Mounting hole; 5. Buffer assembly; 51. Positioning block; 501. Protrusion; 502. Adjustment groove; 52. Support rod; 53. Sleeve; 54. Buffer spring; 55. Ball bearing; 6. Drive box; 61. Moving plate; 7. Lifting mechanism; 71. Air pump; 72. Pump rod; 73. Support spring; 74. Adjusting nut; 75. Mounting bracket; 8. Scraper; 81. Gathering plate; 9. Bracket; 91. Clamping screw; 92. Template. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings.

[0028] like Figure 1-6 As shown, a circuit board solder paste application device includes a paste application machine 1. A control panel 2 is installed at the front end of the paste application machine 1. A support base 3 is fixedly installed on the paste application machine 1. A tray 4 is fixedly installed on the top end face of the support base 3. Several buffer components 5 are screwed onto the tray 4. A drive box 6 is fixedly connected to the top of the paste application machine 1. A moving plate 61 is drivenly connected to the drive box 6. A lifting mechanism 7 is fixedly installed on the moving plate 61. A scraper 8 is fixedly connected to the bottom of the lifting mechanism 7. A gathering plate 81 is fixedly connected to the inner walls on both sides of the scraper 8 by screws. Two brackets 9 are fixedly connected to the bottom of the scraper 8 and located on the outer wall of the paste application machine 1. A template 92 is pressed between the two brackets 9 by a clamping screw 91.

[0029] In this embodiment, a control panel 2 is provided at the front end of the paste application machine 1, which allows for the control and driving of the entire device. A support base 3 is fixedly installed on the paste application machine 1, and a tray 4 is fixedly installed on the support base 3, which provides stable support for the tray 4 and facilitates replacement. A buffer component 5 is screwed onto the tray 4, which provides stable support for the circuit board and also protects the circuit board to a certain extent. A drive box 6 is fixedly installed at the top of the paste application machine 1, and a moving plate 61 is driven to the drive box 6, which can drive the moving plate 61 to move left and right. A lifting mechanism 7 is fixedly installed on the moving plate 61, which can further drive the lifting mechanism 7 to move left and right. A scraper 8 is fixedly connected to the bottom of the lifting mechanism 7, which facilitates the scraping and application of solder paste on the template 92.

[0030] Combination Figure 1 , Figure 2 As shown, the tray 4 is a flat metal plate, and a plurality of mounting holes 41 are evenly provided on the tray 4.

[0031] In this embodiment, by setting the tray 4 as a flat metal plate structure, it is easy to place the circuit board stably. A number of mounting holes 41 are evenly opened on the tray 4, so that the buffer component 5 can be installed and removed.

[0032] Combination Figure 2 , Figure 6 As shown, the buffer assembly 5 consists of a positioning block 51, a support rod 52, a sleeve 53, a buffer spring 54, and a ball bearing 55. The positioning block 51 is an L-shaped metal block, and a protrusion 501 is provided at one end of the positioning block 51.

[0033] In this embodiment, by setting the positioning block 51 as an L-shaped metal block structure and providing a protrusion 501 on the top end face of one end of the positioning block 51, the processing position of the circuit board can be limited and fixed.

[0034] Combination Figure 2 , Figure 6 As shown, the other end of the positioning block 51 is provided with an adjustment groove 502. The positioning block 51 passes through the adjustment groove 502 by fixing bolts and is pressed and connected to the support plate 4.

[0035] In this embodiment, by providing an adjustment groove 502 at the other end of the positioning block 51 and screwing it into the mounting hole 41 through the adjustment groove 502 with a bolt, the positioning block 51 can be stably installed on the support plate 4, and the position and angle of the positioning block 51 can be adjusted.

[0036] Combination Figure 2 , Figure 4 and Figure 6 As shown, the support rod 52 has an external thread on its bottom outer wall and is screwed into the mounting hole 41. The other end of the support rod 52 is embedded in the sleeve 53 and slidably connected.

[0037] In this embodiment, by providing an external thread on the bottom outer wall of the support rod 52 and screwing it into the mounting hole 41, the support rod 52 can be stably supported on the support plate 4. The sleeve 53 is slidably connected to the other end of the support rod 52, which can better stably support the sleeve 53.

[0038] Combination Figure 4 As shown, a buffer spring 54 is fitted inside the sleeve 53, and a ball bearing 55 is fitted to the other end of the buffer spring 54, with the top end face of the ball bearing 55 extending out to the outside of the other end of the sleeve 53.

[0039] In this embodiment, a buffer spring 54 is placed inside the sleeve 53 to provide stable support for the buffer spring 54. At the same time, a ball bearing 55 is placed at the other end of the buffer spring 54 to not only provide stable support for the ball bearing 55, but also to give the ball bearing 55 a certain elastic extension force.

[0040] Combination Figure 1 , Figure 3 As shown, the lifting mechanism 7 consists of an air pump 71, a pump rod 72, a support spring 73, an adjusting nut 74, and a mounting bracket 75. The air pump 71 is fixedly installed on the top end face of the moving plate 61, and the pump rod 72 is internally connected to the air pump 71.

[0041] In this embodiment, by fixing the air pump 71 on the movable plate 61, it is easy to provide stable support for the air pump 71, and the movable plate 61 can be used to drive the air pump 71 to move. The pump rod 72 is connected to the internal transmission of the air pump 71, which can better drive the pump rod 72 to perform telescopic movement.

[0042] Combination Figure 1 , Figure 3 As shown, the pump rod 72 has an external thread on the outer wall of the other end, and the other end of the pump rod 72 passes through the movable plate 61 and is embedded in the mounting bracket 75. Two adjusting nuts 74 are screwed onto the pump rod 72, and a support spring 73 is sleeved on the pump rod 72 between the adjusting nut 74 and the top of the mounting bracket 75.

[0043] In this embodiment, by embedding the other end of the pump rod 72 into the mounting bracket 75 and screwing two adjusting nuts 74 onto the pump rod 72, the mounting bracket 75 can be stably installed on the pump rod 72. At the same time, by fitting a support spring 73 onto the pump rod 72, the mounting bracket 75 can be stably attached to the template 92.

[0044] Combination Figure 1 , Figure 3 As shown, the top of the scraper 8 is tightened to the bottom of the mounting bracket 75 by screws, and the bottom of the scraper 8 is attached to the template 92.

[0045] In this embodiment, by fixing the scraper 8 to the bottom of the mounting bracket 75, it is easy to keep the scraper 8 stable. At the same time, by attaching the bottom of the scraper 8 to the template 92, it is easy to perform scraping operations on the template 92.

[0046] Combination Figure 1 , Figure 6As shown, a gathering plate 81 is fixedly connected to both inner walls of the scraper 8 by screws. The gathering plate 81 is an inclined metal sheet and is installed in a V-shape. The other end of the gathering plate 81 is attached to the inner wall of the template 92.

[0047] In this embodiment, a gathering plate 81 is fixedly connected to the inner wall of the scraper 8, which facilitates a stable connection of the gathering plate 81. At the same time, the gathering plate 81 is installed in a V-shape and attached to the bottom of the template 92, so that the solder paste can be collected and guided for use.

[0048] The working principle of this utility model is as follows:

[0049] In use, this invention involves transporting the entire plaster applicator 1 to a suitable position. A tray 4 of appropriate size is then fixedly connected to the support base 3. Positioning blocks 51 and support rods 52 are screwed onto the tray 4 according to the size of the circuit board, and these can be adjusted at certain angles. The circuit board to be processed is then placed on the ball bearings 55 in the sleeve 53 for stable support. The positioning blocks 51 also limit and fix the circuit board. The corresponding template 92 is then placed on the bracket 9 and tightened by the clamping screw 91. When the plastering process begins, the drive box 6 drives the template 92 to adhere to the top of the circuit board, while the bottom of the circuit board is placed... The circuit board is further protected by an elastic sleeve 53 and a ball bearing 55 to prevent it from being crushed by the template 92. Two air pumps 71 are fixedly installed on the moving plate 61, and a mounting bracket 75 is screwed to the other end of the pump rod 72 of the air pump 71. A scraper 8 is fixedly connected to the mounting bracket 75, so that the solder paste on the template 92 can be applied from side to side using the scraper 8. At the same time, a gathering plate 81 is fixedly connected to the inner wall of both sides of the scraper 8. The gathering plate 81 is set with a V-shaped structure, with one end attached to the inner wall of both sides of the template 92. In this way, when the circuit board is finished being coated, the gathering plate 81 can be used to collect the solder paste overflowing from both sides, further improving the production efficiency of the circuit board.

[0050] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, without departing from the spirit of this utility model.

[0051] Although this document frequently uses terms such as 1. plaster applicator; 2. control panel; 3. support base; 4. tray; 41. mounting hole; 5. buffer assembly; 51. positioning block; 501. protrusion; 502. adjusting groove; 52. support rod; 53. sleeve; 54. buffer spring; 55. ball bearing; 6. drive box; 61. moving plate; 7. lifting mechanism; 71. air pump; 72. pump rod; 73. support spring; 74. adjusting nut; 75. mounting bracket; 8. scraper; 81. gathering plate; 9. bracket; 91. clamping screw; 92. template, etc., the possibility of using other terms is not excluded. The use of these terms is merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

Claims

1. A circuit board solder paste application device, comprising a paste application machine (1), characterized in that, The front end of the paste brushing machine (1) is equipped with a control panel (2). A support base (3) is fixedly installed on the paste brushing machine (1). A tray (4) is fixedly installed on the top end face of the support base (3). Several buffer components (5) are screwed onto the tray (4). A drive box (6) is fixedly connected to the top of the paste brushing machine (1). A moving plate (61) is driven onto the drive box (6). A lifting mechanism (7) is fixedly installed on the moving plate (61). A scraper (8) is fixedly connected to the bottom of the lifting mechanism (7). A gathering plate (81) is fixedly connected to the inner walls on both sides of the scraper (8) by screws. Two brackets (9) are fixedly connected to the bottom of the scraper (8) and on the outer wall of the paste brushing machine (1). A template (92) is pressed between the two brackets (9) by a clamping screw (91).

2. The circuit board solder paste brushing device according to claim 1, characterized in that, The tray (4) is a flat metal plate, and a plurality of mounting holes (41) are evenly provided on the tray (4).

3. The circuit board solder paste brushing device according to claim 2, characterized in that, The buffer assembly (5) consists of a positioning block (51), a support rod (52), a sleeve (53), a buffer spring (54), and a ball bearing (55). The positioning block (51) is an L-shaped metal block, and a protrusion (501) is provided at one end of the positioning block (51).

4. The circuit board solder paste brushing device according to claim 3, characterized in that, The positioning block (51) has an adjustment groove (502) through it at the other end. The positioning block (51) passes through the adjustment groove (502) by fixing bolts and is pressed and connected to the support plate (4).

5. The circuit board solder paste brushing device according to claim 4, characterized in that, The support rod (52) has an external thread on its bottom outer wall and is screwed into the mounting hole (41). The other end of the support rod (52) is embedded in the sleeve (53) and slidably connected.

6. The circuit board solder paste brushing device according to claim 5, characterized in that, A buffer spring (54) is fitted inside the sleeve (53), and a ball bearing (55) is fitted to the other end of the buffer spring (54), with the top end face of the ball bearing (55) extending out to the outside of the other end of the sleeve (53).

7. The circuit board solder paste brushing device according to claim 6, characterized in that, The lifting mechanism (7) consists of an air pump (71), a pump rod (72), a support spring (73), an adjusting nut (74), and a mounting bracket (75). The air pump (71) is fixedly installed on the top end face of the movable plate (61), and the pump rod (72) is internally connected to the air pump (71).

8. The circuit board solder paste brushing device according to claim 7, characterized in that, The pump rod (72) has an external thread on the outer wall of the other end, and the other end of the pump rod (72) passes through the movable plate (61) and is embedded in the mounting bracket (75). Two adjusting nuts (74) are screwed onto the pump rod (72), and a support spring (73) is sleeved on the pump rod (72) between the adjusting nut (74) and the top of the mounting bracket (75).

9. The circuit board solder paste brushing device according to claim 8, characterized in that, The top of the scraper (8) is tightened to the bottom of the mounting bracket (75) by screws, and the bottom of the scraper (8) is attached to the template (92).

10. The circuit board solder paste brushing device according to claim 9, characterized in that, The scraper (8) has a gathering plate (81) fixedly connected to both sides of the inner wall by screws. The gathering plate (81) is an inclined metal sheet and is installed in a V-shape. The other end of the gathering plate (81) is attached to the inner wall of the template (92).

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