Anti-layering circuit board high-strength multilayer pressing device

By designing a high-strength multilayer lamination device for circuit boards that prevents delamination, and by using a high-pressure mechanism and snap-fit ​​components to achieve automated lamination and positioning, the problems of insufficient lamination force and delamination are solved, thereby improving the quality and manufacturing efficiency of multilayer circuit boards.

CN223829549UActive Publication Date: 2026-01-23HUIZHOU RISHENGTAI CIRCUIT CO LTD
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Patent Information

Application Number
CN202520130123.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-18
Publication Date
2026-01-23
Estimated Expiration
2035-01-18

AI Technical Summary

Technical Problem

Existing lamination equipment suffers from poor results when laminating multilayer circuit boards due to insufficient lamination force, while excessive lamination force may cause delamination. Furthermore, manufacturing efficiency depends on manual operation, resulting in low overall work efficiency.

Method used

A high-strength multilayer lamination device for circuit boards with anti-delamination was designed. It adopts a high-pressure mechanism and a snap-fit ​​assembly. The lamination strength is detected by a sensing block. Combined with the automatic conveying mechanism and snap-fit ​​fixing, automatic lamination and positioning are achieved.

Benefits of technology

It achieves high-quality lamination of multilayer circuit boards, avoids delamination, improves manufacturing efficiency, simplifies operation processes, and reduces manual intervention.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of circuit boards, and discloses an anti-layering circuit board high-strength multilayer pressing device, which comprises a pressing base, the bottom end of the pressing base is fixedly connected with a bearing substrate, the bearing substrate is provided with symmetrical guide grooves, the guide grooves are internally and fixedly connected with a conveying mechanism, and the conveying mechanism comprises a transmission chain belt. A plurality of buckle assemblies are fixedly connected to the surface layer of the transmission chain belt, each buckle assembly comprises a guide plate, a containing box is slidably connected between the guide plates, a loading frame is fixedly connected to the middle of the top face of the bearing base plate, a power mechanism is fixedly connected to one side of the loading frame and comprises a gear plate, and the gear plate is connected with a strong pressing mechanism in an engaged mode; the pressing strength of the circuit board in the pressing process is stabilized, the quality of the multi-layer pressed board is improved, the problem that workers need to place and take out the multi-layer pressed board frequently is solved, the working process is simplified, and meanwhile the position of the circuit board in the pressing process is stabilized.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit board technical field more specifically relates to a prevent delamination's circuit board high strength multilayer compression device. BACKGROUND

[0002] Multilayer circuit board is the product of electronic technology to high speed, multi-functional, large capacity, small size direction development, with the continuous development of electronic technology, especially the wide application of large scale and super large scale integrated circuit, multilayer circuit board is rapidly developing towards high density, high precision, high layer number, microline, small aperture penetration, blind hole buried hole, high board thickness aperture ratio and other technologies to meet the needs of the market, in the production and processing of multilayer circuit board, a plurality of circuit boards and a plurality of insulating layers are fixed on the compression device, and then compression operation is carried out to obtain multilayer circuit board.

[0003] The prior art has the following disadvantages: the existing compression device lacks monitoring of the pressure of the multilayer circuit board during compression, and if the compression force is small, the compression effect of the multilayer circuit board will be poor, and if the compression force is too large, the edges of the circuit board may be raised to cause delamination, thereby reducing the quality of the multilayer circuit board, and the placement and removal of the compression of the circuit board each time need to be manually performed, which limits the manufacturing efficiency of the compression device to artificial, and the overall working efficiency is not high, therefore, we provide a prevent delamination's circuit board high strength multilayer compression device. UTILITY MODEL CONTENTS

[0004] In order to overcome the above-mentioned defects of the prior art, the utility model provides a prevent delamination's circuit board high strength multilayer compression device to solve the problems in the above background art.

[0005] The utility model provides the following technical scheme: a prevent delamination's circuit board high strength multilayer compression device, including compression pedestal, the bottom of compression pedestal is fixedly connected with the bearing base plate, is set up in bearing base plate the symmetrical guide slot of the top, the guide slot is fixedly connected with conveying mechanism, and conveying mechanism includes transmission chain belt, and the surface of transmission chain belt is fixedly connected with a plurality of groups of buckle components, and the buckle component includes the guide plate, and the guide plate is slidably connected with the placing box, and the top surface of bearing base plate is fixedly connected with the loading frame, and the one side of loading frame is fixedly connected with the power mechanism, and the power mechanism includes the gear plate, and the gear plate is engaged with the strong pressure mechanism.

[0006] Preferably, the top surface of the bearing base plate is fixedly connected with the loading frame, and the one side of the loading frame is provided with a positioning hole, and the positioning hole is rotatably connected with the power mechanism.

[0007] Preferably, one end of the power mechanism is fixedly connected with a power motor, one end of the power motor is fixedly connected with a rotating shaft, and one end of the rotating shaft is fixedly connected with the gear plate.

[0008] Preferably, the top of the high-pressure mechanism is fixedly connected to a symmetrical fixed concave plate, the inner side of the fixed concave plate is provided with a sliding groove, a sliding plate is slidably connected in the sliding groove, a connecting plate is fixedly connected to the bottom end of the sliding plate, a side toothed plate is fixedly connected to one side of the connecting plate, a pressure rod is fixedly connected to the bottom surface of the connecting plate, a pressing block is fixedly connected to the bottom end of the pressure rod, a placement groove is provided on the bottom surface of the pressing block, and a sensing block is installed in the placement groove.

[0009] Preferably, the buckle assembly includes a limiting block, a transmission chain is fixedly connected to the bottom surface of the limiting block, a spring plate is installed on the top surface of the transmission chain, and a guide plate is fixedly connected to the transmission chain.

[0010] Preferably, the conveying mechanism includes a guide roller, the roller body of which is rotatably connected to the drive chain belt.

[0011] The technical effects and advantages of this utility model are as follows:

[0012] 1. This utility model features a pressing base with a strong pressing mechanism. Driven by a power mechanism, a sliding plate slides downwards in conjunction with a fixed concave plate, simultaneously causing a connecting plate fixed at the bottom and a pressure rod on its bottom surface to slide down synchronously. Ultimately, the pressing block at the bottom of the pressure rod falls into the placement box, pressing the circuit board inside the box. During the pressing process, a sensing block installed on the bottom surface of the pressing block synchronously detects the pressure intensity. When the maximum pressure intensity is reached, a signal is sent to the power motor, which reverses and retracts the strong pressing mechanism. This effectively stabilizes the pressure intensity applied to the circuit board during the pressing process and improves the quality of the multi-layer pressed board.

[0013] 2. This utility model features a pressing base with a snap-fit ​​assembly and a conveying mechanism. Each rotation of the power motor is accompanied by the activation of the two pressing mechanisms controlled by it. When one side presses the circuit board, the pressing block on the other side slides upward. The movement of the conveying mechanisms on both sides is synchronized with the pressing mechanism on the other side. When one pressing mechanism presses, the transmission chain on that side stops moving, while the pressing mechanism on the other side slides upward. After pressing, the multi-layer circuit board moves towards the outlet under the drive of the transmission chain. The operator only needs to slide the placement box along the space between the guide plates towards the limiting block at the inlet position. During this process, after pressing over the spring plate, it slides completely between the snap-fit ​​assemblies. At this time, the spring plate resets and completes the snap-fit ​​of the placement box, effectively solving the problem of frequent insertion and removal by the operator, simplifying the workflow, and stabilizing the position of the circuit board during the pressing process. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0015] Figure 2 This is a partial top view cross-sectional structural diagram of the present invention.

[0016] Figure 3 For the utility model Figure 2 The enlarged structural schematic view of A in the middle.

[0017] Figure 4 For the utility model is part of the schematic diagram of the bottom view section structure.

[0018] The figure mark is: 1, the compression base; 101, the bearing base plate; 102, the loading frame; 2, power mechanism; 201, power motor; 202, rotating shaft; 203, gear plate; 3, strong pressure mechanism; 301, fixed concave plate; 302, sliding plate; 303, connecting plate; 304, side joint tooth plate; 305, pressure bar; 306, compression block; 307, inductive block; 4, buckle assembly; 401, guide plate; 402, limit block; 403, spring plate; 5, conveying mechanism; 501, guide roller; 502, transmission chain belt; 6, placing box. Specific implementation

[0019] The technical scheme in the utility model will be described clearly and completely in combination with the drawings in the utility model, and in addition, the form of each structure recorded in the following implementation is only an example, the high-strength multilayer compression device for the delamination-resistant circuit board involved in the utility model is not limited to each structure recorded in the following implementation, all other implementations obtained by the ordinary skilled in the art without making creative labor belong to the range of protection of the utility model.

[0020] The utility model provides a kind of high-strength multilayer compression device for the delamination-resistant circuit board, including compression base 1, the bottom end of the compression base 1 is fixedly connected with bearing base plate 101, the bearing base plate 101 is equipped with symmetrical guide slot, the guide slot is fixedly connected with conveying mechanism 5, the conveying mechanism 5 includes transmission chain belt 502, the surface of the transmission chain belt 502 is fixedly connected with several groups of buckle assembly 4, the buckle assembly 4 includes guide plate 401, the guide plate 401 is slidably connected with placing box 6, the top surface of the bearing base plate 101 is fixedly connected with loading frame 102, one side of the loading frame 102 is fixedly connected with power mechanism 2, the power mechanism 2 includes gear plate 203, the gear plate 203 is engagedly connected with strong pressure mechanism 3.

[0021] The staff stacks the circuit board card in advance in the placing box 6 in advance, connects the driving chain belt 502 of the conveying mechanism 5, and is clamped into the buckle assembly 4 through the guide plate 401, fixes the placing box 6, and then starts the power mechanism 2 on the loading rack 102, drives the related parts, and synchronously drives the gear plate 203 through the synchronous belt, drives the strong pressing mechanism 3 connected with the gear plate 203 through the rotation of the gear plate 203, and the strong pressing mechanism 3 presses the circuit board in the placing box 6 under the power, and moves the placing box 6 with the driving chain belt 502 to the other end of the bearing base plate 101 in the pressing base 1 after the pressing is completed.

[0022] Further, the top surface of the bearing base plate 101 is fixedly connected with the loading rack 102, one side of the loading rack 102 is provided with a positioning hole, and the positioning hole is rotationally connected with the power mechanism 2.

[0023] Further, one end of the power mechanism 2 is fixedly connected with a power motor 201, one end of the power motor 201 is fixedly connected with a rotating shaft 202, and one end of the rotating shaft 202 is fixedly connected with a gear plate 203.

[0024] The power motor 201 drives the rotating shaft 202 to rotate, thereby further driving the gear plate 203 at the end of the rotating shaft 202 to rotate.

[0025] Further, the strong pressing mechanism 3 is fixedly connected with symmetrical fixed recessed plates 301 at the top, the inner side of the fixed recessed plate 301 is provided with a sliding groove, the sliding groove is slidably connected with a sliding plate 302, the bottom end of the sliding plate 302 is fixedly connected with a connecting plate 303, one side of the connecting plate 303 is fixedly connected with a side connecting tooth plate 304, the bottom surface of the connecting plate 303 is fixedly connected with a pressing rod 305, the bottom end of the pressing rod 305 is fixedly connected with a pressing block 306, the bottom surface of the pressing block 306 is provided with a mounting groove, and the mounting groove is mounted with a sensing block 307.

[0026] Under the movement of the inner core of the side connecting tooth plate 304, the connecting plate 303 connected therewith synchronously moves up and down, thereby further driving the sliding plate 302 fixedly connected with the connecting plate 303 to slide up and down in cooperation with the sliding groove on the fixed recessed plate 301, synchronously driving the pressing rod 305 fixedly connected with the bottom end of the connecting plate 303 to synchronously ascend and descend, and finally driving the pressing block 306 to press the circuit board.

[0027] Further, the buckle assembly 4 comprises a limiting block 402, the bottom surface of the limiting block 402 is fixedly connected with a driving chain belt 502, the top surface of the driving chain belt 502 is mounted with a spring plate 403, and the guide plate 401 is fixedly connected with the driving chain belt 502.

[0028] Further, the conveying mechanism 5 includes a guide roller 501, the roller body of the guide roller 501 is rotationally connected with a transmission chain 502.

[0029] The working principle of the utility model is:

[0030] The staff stacks the circuit board in the placing box 6 in advance and clamps it on the transmission chain 502 of the conveying mechanism 5, and then clamps into the buckle assembly 4 along the guide plate 401 by pressing the spring plate 403 and abutting against the limiting block 402, completing the fixation of the placing box 6, and then starting the power mechanism 2 on the installed loading frame 102, the power motor 201 drives the rotating shaft 202 to rotate, thereby synchronously driving the gear plate 203 at the end of the rotating shaft 202, the gear plate 203 drives the side toothed plate 304 connected therewith, the side toothed plate 304 drives the connecting plate 303, the connecting plate 303 further drives the sliding plate 302 to slide up and down in cooperation with the fixed concave plate 301, and simultaneously drives the pressing rod 305 to ascend and descend, finally drives the pressing block 306 to press and combine the circuit board in the placing box 6 on the transmission chain 502 below, after the pressing and combining is completed, the transmission chain 502 carries the placing box 6 to the other end of the bearing base plate 101 in the pressing base 1, during the movement, the strong pressing mechanism 3 on the other side starts to press and combine the multilayer circuit board on the side, and the process is repeated in turn, the staff only needs to fix the placing box 6 stacked with the circuit board on the buckle assembly 4.

[0031] Finally, it should be pointed out that: first, in the description of the present application, it should be pointed out that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, which can be mechanical connection or electrical connection, or the communication between two elements, or direct connection, "up", "down", "left", "right" and the like are only used to indicate the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship may change;

[0032] Secondly: the utility model discloses the embodiment of the drawings, only relates to the structure involved in the embodiment of the present disclosure, other structures can refer to the usual design, under the condition of no conflict, the same embodiment and different embodiments of the utility model can be combined with each other;

[0033] Finally: the above only for the preferred embodiment of the utility model, and does not limit the utility model, any modification, equivalent replacement, improvement etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A high-strength multilayer lamination device for anti-delamination circuit boards, comprising a lamination base (1), characterized in that: The bottom end of the pressing base (1) is fixedly connected to a bearing base plate (101). The bearing base plate (101) has symmetrical guide grooves. A conveying mechanism (5) is fixedly connected in the guide grooves. The conveying mechanism (5) includes a transmission chain belt (502). Several sets of buckle assemblies (4) are fixedly connected to the surface of the transmission chain belt (502). The buckle assembly (4) includes a guide plate (401). A placement box (6) is slidably connected between the two guide plates (401). A loading frame (102) is fixedly connected to the middle of the top surface of the bearing base plate (101). A power mechanism (2) is fixedly connected to one side of the loading frame (102). The power mechanism (2) includes a gear plate (203). The gear plate (203) is meshed with a high-pressure mechanism (3).

2. The anti-delamination high-strength multilayer lamination device for circuit boards according to claim 1, characterized in that: The top surface of the support base plate (101) is fixedly connected to the loading frame (102), and a positioning hole is provided on one side of the loading frame (102), which is rotatably connected to the power mechanism (2).

3. The anti-delamination high-strength multilayer lamination device for circuit boards according to claim 1, characterized in that: One end of the power mechanism (2) is fixedly connected to a power motor (201), one end of the power motor (201) is fixedly connected to a rotating shaft (202), and one end of the rotating shaft (202) is fixedly connected to a gear plate (203).

4. The anti-delamination high-strength multilayer lamination device for circuit boards according to claim 1, characterized in that: The top of the high-pressure mechanism (3) is fixedly connected to a symmetrical fixed concave plate (301). A sliding groove is provided on the inner side of the fixed concave plate (301). A sliding plate (302) is slidably connected in the sliding groove. A connecting plate (303) is fixedly connected to the bottom end of the sliding plate (302). A side toothed plate (304) is fixedly connected to one side of the connecting plate (303). A pressure rod (305) is fixedly connected to the bottom surface of the connecting plate (303). A pressing block (306) is fixedly connected to the bottom end of the pressure rod (305). A placement groove is provided on the bottom surface of the pressing block (306). A sensing block (307) is installed in the placement groove.

5. The anti-delamination high-strength multilayer lamination device for circuit boards according to claim 1, characterized in that: The buckle assembly (4) includes a limiting block (402), the bottom surface of which is fixedly connected to a transmission chain belt (502), the top surface of which is equipped with a spring plate (403), and the guide plate (401) is fixedly connected to the transmission chain belt (502).

6. The anti-delamination high-strength multilayer lamination device for circuit boards according to claim 1, characterized in that: The conveying mechanism (5) includes a guide roller (501), the roller body of which is rotatably connected to the transmission chain belt (502).