CPU (Central Processing Unit) heat dissipation device

Abstract

The utility model discloses a CPU heat dissipation device which comprises a shell and a heat dissipation base, the shell is provided with a heat dissipation cavity, a source inlet channel and a source outlet channel, and the source inlet channel, the heat dissipation cavity and the source outlet channel are sequentially communicated. At least one of the source outlet channel and the source inlet channel is used for being connected with external source equipment; the heat dissipation base comprises a heat dissipation base, the heat dissipation base is connected to the opening of the heat dissipation cavity in a sealed mode, and the side, away from the shell, of the heat dissipation base is used for being attached to the CPU The shell further comprises a heat dissipation blocking piece, the heat dissipation blocking piece is arranged in the heat dissipation cavity, a flowing gap is formed between the periphery of the heat dissipation blocking piece and the inner wall of the shell, an outlet of the source inlet channel is formed in the inner wall of the shell and located on the side, away from the heat dissipation base, of the heat dissipation blocking piece, and an inlet of the source outlet channel is formed in the heat dissipation blocking piece and located on the side, facing the heat dissipation base, of the heat dissipation blocking piece. The staying time of the refrigeration source in the heat dissipation cavity is effectively prolonged, so that the refrigeration source fully absorbs heat, and the heat dissipation effect is effectively improved under the condition that the size of the CPU heat dissipation device is not changed.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit test technical field, especially CPU heat abstractor. BACKGROUND

[0002] In the ITC test of electronic circuit, the CPU on the circuit usually emits a large amount of heat, and the excessive heat can cause the performance of CPU to decline, the system to be unstable, and even lead to hardware damage. Therefore, in the ICT test process, in order to ensure that CPU can be stably operated for a long time without being damaged due to overheating, cooling is necessary.

[0003] In the related art, a copper heat sink is usually connected to the surface of CPU in contact, and when the heat dissipation effect of the copper heat sink is poor, a ventilation device is additionally installed outside the copper heat sink, which has problems such as large energy consumption, large size, and poor heat dissipation effect. SUMMARY

[0004] The utility model aims at at least one of the technical problems existing in the prior art. To this end, the utility model provides a CPU heat abstractor, which can concentrate the refrigeration source in the heat dissipation cavity, so that the refrigeration source fully absorbs the heat of the heat dissipation seat. In addition, the heat dissipation baffle is arranged to prolong the flow path of the refrigeration source inside the heat dissipation cavity, so that the refrigeration source fully absorbs the heat. Without changing the size of the CPU heat abstractor, the heat dissipation effect is effectively improved.

[0005] The utility model embodiment provides a CPU heat abstractor for CPU heat dissipation, comprising:

[0006] A shell is provided with a heat dissipation cavity, an inlet channel and an outlet channel, the inlet channel, the heat dissipation cavity and the outlet channel are sequentially communicated, and at least one of the outlet channel and the inlet channel is used for connecting an external source device;

[0007] A heat dissipation seat comprises a heat dissipation base, the heat dissipation base is sealingly connected to the opening of the heat dissipation cavity, and the side of the heat dissipation base away from the shell is used for abutting the CPU;

[0008] The shell further comprises a heat dissipation baffle, the heat dissipation baffle is arranged in the heat dissipation cavity, a flow gap is arranged between the outer periphery of the heat dissipation baffle and the inner wall of the shell, the outlet of the inlet channel is arranged on the inner wall of the shell and located on the side of the heat dissipation baffle away from the heat dissipation seat, the inlet of the outlet channel is arranged on the heat dissipation baffle and located on the side of the heat dissipation baffle towards the heat dissipation seat, and the flow path formed between the outlet of the inlet channel, the flow gap and the inlet of the outlet channel at least partially flows through the surface of the heat dissipation baffle (140).

[0009] The embodiment of the utility model at least has following beneficial effect: through the heat dissipation cavity concentrates the refrigeration source, makes the refrigeration source fully absorbs the heat in the heat dissipation cavity and does not waste the refrigeration source, realizes the same refrigeration working condition under the effective reduction of the energy consumption of the external source equipment, and through the control of the distance between the flow gap and the outlet of the source inlet channel or the inlet of the source outlet channel, guarantees that the refrigeration source at least flows through the surface of part of the heat dissipation baffle, effectively prolongs the flow path of the refrigeration source to prolong the residence time of the refrigeration source in the heat dissipation cavity, so that the refrigeration source fully absorbs heat, effectively improves the heat dissipation effect without changing the volume of the CPU heat dissipation device.

[0010] According to some embodiments of the utility model, the direction in which the heat dissipation seat points to the shell is a set direction, the source outlet channel and the source inlet channel extend along the set direction, the outlet of the source outlet channel and the inlet of the source inlet channel are located at a first side of the shell, the opening of the heat dissipation cavity is located at a second side of the shell, and the first side and the second side are oppositely arranged along the set direction.

[0011] According to some embodiments of the utility model, the source inlet channel comprises at least two source inlet sub-channels.

[0012] The source inlet sub-channels are arranged around the source outlet channel, and / or the cross-sectional area of the source inlet sub-channels is smaller than that of the source outlet channel.

[0013] According to some embodiments of the utility model, the heat dissipation baffle piece comprises a baffle piece part and a connecting part arranged concentrically, a first end of the connecting part is connected to the inner wall of the shell, and a second end of the connecting part is connected to the baffle piece part.

[0014] The inlet of the source outlet channel is arranged at the center of the baffle piece part, and the outlet of the source inlet sub-channel is arranged around the connecting part.

[0015] According to some embodiments of the utility model, the cross-sectional area of the opening of the heat dissipation cavity is larger than that of the heat dissipation baffle piece, and the first end of the connecting part is detachably connected to the inner wall of the shell.

[0016] According to some embodiments of the utility model, the shell further comprises a middle shell, the middle shell comprises a first shell part and a second shell part arranged in steps, the cross-sectional outer periphery of the first shell part is larger than that of the second shell part, the first shell part is provided with the heat dissipation cavity, and the second shell part is provided with part of the source inlet channel and part of the source outlet channel.

[0017] According to some embodiments of the utility model, the shell further comprises a cover body, the cover body and the first shell part are respectively connected to two ends of the second shell part, and the cover body, the second shell part and the first shell part are clamped to form a ring groove.

[0018] According to some embodiments of the present application, the CPU heat dissipation device further comprises a quick release joint, a first end of the quick release joint is connected to an outlet of the source outlet channel, and a second end of the quick release joint is used for connecting the external source device.

[0019] According to some embodiments of the present application, the heat dissipation seat further comprises a plurality of fins, and the plurality of fins are connected to the heat dissipation base and located in the heat dissipation cavity.

[0020] According to some embodiments of the present application, the heat dissipation seat is a copper heat dissipation seat, and the shell is an aluminum shell.

[0021] The additional aspects and advantages of the present application will be partially given in the following description, some will become apparent from the following description, or will be understood by those skilled in the art through the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0023] Figure 1 It is an exploded view of the CPU heat dissipation device of the present application embodiment;

[0024] Figure 2 It is a top view of the CPU heat dissipation device of the present application embodiment;

[0025] Figure 3 It is Figure 2 It is a sectional view along the section line A-A.

[0026] REFERENCE NUMERALS:

[0027] 100, shell; 110, heat dissipation cavity; 120, source inlet channel; 121, source inlet sub-channel; 130, source outlet channel; 140, heat dissipation baffle; 141, baffle part; 142, connecting part; 150, flow gap; 160, middle section shell; 161, first shell part; 162, second shell part; 170, cover; 180, ring groove;

[0028] 200, heat dissipation seat; 210, heat dissipation base; 220, fin;

[0029] 300, quick release joint. DETAILED DESCRIPTION

[0030] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0031] In the description of the utility model, it needs to be understood that, the orientation description, such as the orientation or positional relationship of the indication of upper, lower, front, rear, left, right etc. based on the orientation or positional relationship shown in the drawing, is only for the convenience of describing the utility model and simplifying the description, and is not to indicate or imply that the device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore can not be understood as a limitation on the utility model.

[0032] In the description of the utility model, the meaning of "several" is one or more, the meaning of "multiple" is two or more, greater than, less than, more than, etc. are understood as not including the number, "above", "below", "within" etc. are understood as including the number. If it is described as "first", "second" etc., it is only used for distinguishing technical features for the purpose, and can not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0033] In the description of the utility model, unless otherwise explicitly limited, the words "set", "install", "connect" etc. should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the utility model according to the specific content of the technical scheme.

[0034] Please refer to Figures 1 to 3 The utility model discloses a CPU heat abstractor for CPU heat abstractor, CPU heat abstractor includes shell 100 and heat abstractor 200, shell 100 is equipped with heat dissipation cavity 110, inlet source channel 120 and outlet source channel 130, inlet source channel 120, heat dissipation cavity 110 and outlet source channel 130 are communicated in proper order;At least one of outlet source channel 130 and inlet source channel 120 is used for connecting external source equipment;Heat abstractor 200 includes heat dissipation base 210, and heat dissipation base 210 is sealedly connected to the opening of heat dissipation cavity 110, and the side of heat dissipation base 210 away from shell 100 is used for adhering CPU;Shell 100 further includes heat dissipation baffle 140, and heat dissipation baffle 140 is arranged in heat dissipation cavity 110, and flow gap 150 is arranged between the outer periphery of heat dissipation baffle 140 and the inner wall of shell 100, the outlet of inlet source channel 120 is arranged on the inner wall of shell 100 and is located on the side of heat dissipation baffle 140 away from heat abstractor 200, and the inlet of outlet source channel 130 is arranged on heat dissipation baffle 140 and is located on the side of heat dissipation baffle 140 towards heat abstractor 200;The flow path formed between the outlet of inlet source channel 120, flow gap 150 and the inlet of outlet source channel 130 at least partially flows through the surface of heat dissipation baffle 140.

[0035] According to the CPU heat dissipation device of this utility model embodiment, for ease of description, an external source device connected to the source channel 130 is an exhaust fan, and the source channel 120 is connected to external air is used as an example for explanation:

[0036] The staff attaches the heat sink 200 to the CPU surface, and the heat from the CPU surface is transferred to the heat sink 200. At this time, the external source device is started (such as the exhaust fan). Under the traction of the external source device, the external cooling source (such as low temperature air) enters the heat dissipation cavity 110 through the inlet channel 120 and comes into contact with the heat sink 200. The cooling source flows through the outlet of the inlet channel 120, the flow gap 150 and the inlet of the outlet channel 130 in sequence, and absorbs the heat from the heat sink 200 in the process, converting it into high temperature air. The high temperature air continues to flow out of the casing 100 along the outlet channel 130, realizing rapid heat dissipation of the CPU.

[0037] The CPU cooling device of this embodiment concentrates the cooling source through the cooling cavity 110, allowing the cooling source to fully absorb the heat in the cooling cavity 110 without wasting the cooling source, effectively reducing the energy consumption of external devices under the same cooling conditions; and by controlling the distance between the flow gap 150 and the outlet of the inlet channel 120, or between the flow gap 150 and the inlet of the outlet channel 130, it ensures that the cooling source flows through at least part of the surface of the heat dissipation baffle 140, effectively extending the flow path of the cooling source and extending the residence time of the cooling source in the cooling cavity 110, so that the cooling source can fully absorb heat, effectively improving the heat dissipation effect without changing the volume of the CPU cooling device.

[0038] In this embodiment, air is used as the cooling source to reduce the cost of using the CPU heat dissipation device. In other embodiments, both the inlet channel 120 and the outlet channel 130 can be connected to an external source device. In this case, a sealed environment is formed between the external source device and the CPU heat dissipation device. Liquid substances such as water and oil can be used as the cooling source to further improve the heat dissipation effect.

[0039] According to some embodiments of this utility model, combined with Figures 1 to 3 As shown, the direction in which the heat sink 200 points towards the outer casing 100 is the set direction ( Figure 1 (From bottom to top) The source channel 130 and the source channel 120 extend along a set direction. The outlet of the source channel 130 and the inlet of the source channel 120 are located on the first side of the housing 100, and the opening of the heat dissipation cavity 110 is located on the second side of the housing 100. The first side and the second side are arranged opposite to each other along a set direction.

[0040] It should be noted that the CPU is usually mounted on a circuit board, and other electronic components are generally arranged around it. In this embodiment, by arranging the CPU, heat dissipation cavity 110, and channels (including source outlet channel 130 and source inlet channel 120) along a set direction, interference caused by occupying the space around the CPU is effectively prevented, while also facilitating the connection of external source devices to the outlet of source outlet channel 130 and the inlet of source inlet channel 120.

[0041] Of course, in other embodiments, the positional relationship between the source channel 120 and the source channel 130, the heat dissipation cavity 110 and the CPU can be adjusted to accommodate the arrangement of the CPU and other electronic components on the circuit board, ensuring that other electronic components are avoided.

[0042] According to some embodiments of this utility model, combined with Figures 1 to 3 As shown, the source channel 120 includes at least two source sub-channels 121.

[0043] In one embodiment, the inlet sub-channel 121 is arranged around the outlet channel 130, so that the cooling source in the outlet channel 130 and the cooling source in the inlet sub-channel 121 exchange heat when they flow in opposite directions, thereby improving the overall heat dissipation efficiency of the CPU cooling device.

[0044] In this embodiment, twelve source input sub-channels 121 are provided, and three are evenly distributed around the source output channel 130 in groups; of course, the number of source input sub-channels 121 can be adjusted according to actual needs.

[0045] In this embodiment, the source outlet channel 130 and the source inlet sub-channel 121 are straight channels; of course, the source outlet channel 130 or the source inlet sub-channel 121 can also be set as a spiral channel, a wave-shaped channel, etc., to increase the heat exchange area.

[0046] In one embodiment, the cross-sectional area of ​​the inlet sub-channel 121 is smaller than the cross-sectional area of ​​the outlet channel 130. It is understood that when the cooling source is air, reducing the cross-sectional area of ​​the inlet sub-channel 121 can effectively prevent external debris from entering the inlet sub-channel 121 and causing blockage.

[0047] In one embodiment, multiple source inlet sub-channels 121 can be arranged around the source outlet channel 130, and the cross-sectional area of ​​the source inlet sub-channels 121 is smaller than that of the source outlet channel 130. By increasing the number of source inlet sub-channels 121, the defect of small cross-sectional area of ​​source inlet sub-channels 121 can be compensated, so that the overall cross-sectional area of ​​source inlet sub-channels 121 is close to that of source outlet channel 130, thus ensuring the flow stability of the cooling source flowing into and out of the housing 100.

[0048] According to some embodiments of this utility model, combined with Figures 1 to 3As shown, the heat dissipation baffle 140 includes a baffle portion 141 and a connecting portion 142 arranged concentrically. The first end of the connecting portion 142 is connected to the inner wall of the housing 100, and the second end of the connecting portion 142 is connected to the baffle portion 141. The inlet of the source channel 130 is located at the center of the baffle portion 141, and the outlet of the source sub-channel 121 is arranged around the connecting portion 142.

[0049] The refrigeration source enters the heat dissipation cavity 110 through the outlet of the inlet channel 120 and moves along the upper surface of the baffle portion 141 to the flow gap 150. After passing through the flow gap 150, it flows from the edge of the baffle portion 141 to the inlet of the outlet channel 130 at the center. By setting the inlet of the outlet channel 130 and the outlet of the inlet channel 120 as close as possible to the center of the heat dissipation baffle 140, the distance from the inlet of the outlet channel 130 or the outlet of the inlet channel 120 to the flow gap 150 is extended, effectively prolonging the flow time of the refrigeration source in the heat dissipation cavity 110 and ensuring sufficient heat exchange between the refrigeration source and the heat sink 200.

[0050] In this embodiment, the flow gap 150 is arranged around the outer periphery of the baffle portion 141, so that the cooling source can flow evenly from the peripheral wall of the heat dissipation cavity 110 to the inlet of the source channel 130, ensuring uniform heat dissipation effect and avoiding excessive local temperature of the CPU.

[0051] According to some embodiments of this utility model, combined with Figures 1 to 3 As shown, the cross-sectional area of ​​the opening of the heat dissipation cavity 110 is larger than the cross-sectional area of ​​the heat dissipation baffle 140, and the first end of the connecting part 142 is detachably connected to the inner wall of the outer casing 100. The operator can remove the heat dissipation baffle from the opening and quickly complete the assembly of the heat dissipation baffle 140, so as to form a complex internal structure of the heat dissipation cavity 110 by assembling and disassembling.

[0052] According to some embodiments of this utility model, combined with Figure 1 As shown, the outer shell 100 also includes a middle shell 160, which includes a first shell portion 161 and a second shell portion 162 arranged in a stepped manner. The outer perimeter of the cross-section of the first shell portion 161 is larger than the outer perimeter of the cross-section of the second shell portion 162. The first shell portion 161 is provided with a heat dissipation cavity 110, and the second shell portion 162 is provided with a partial source inlet channel 120 and a partial source outlet channel 130.

[0053] The wall thickness of the first shell 161 and the second shell 162 are similar when the steps are set, which facilitates manufacturing (die casting, injection molding or machining) and prevents shrinkage cavities in the first shell 161 or the second shell 162 or excessive machining residue that would affect production efficiency.

[0054] According to some embodiments of this utility model, combined with Figures 1 to 3As shown, the outer casing 100 also includes a cover 170, which and the first shell portion 161 are respectively connected to the two ends of the second shell portion 162; the cover 170, the second shell portion 162, and the first shell portion 161 are clamped to form an annular groove 180. The annular groove 180 can increase the contact area between the outer casing 100 and the outside, effectively improving the heat dissipation effect; and when the CPU heat sink is moved, the operator can grip the cover 170 by inserting it into the annular groove 180, realizing the rapid moving and installation of the CPU heat sink.

[0055] In other embodiments, a separate handle may be provided for carrying the CPU cooling device.

[0056] According to some embodiments of this utility model, combined with Figure 1 As shown, the CPU cooling device also includes a quick-release connector 300. The first end of the quick-release connector 300 connects to the outlet of the power supply channel 130, and the second end of the quick-release connector 300 is used to connect to an external power source device. The quick-release connector 300 enables quick connection between the CPU cooling device and the external power source device, effectively improving installation efficiency.

[0057] In this embodiment, the quick-release connector 300 adopts a PH1002 connector. In other embodiments, the quick-release connector 300 can be replaced as needed.

[0058] According to some embodiments of this utility model, combined with Figure 1 As shown, the heat sink 200 also includes several fins 220, which are connected to the heat sink base 210 and located in the heat sink cavity 110. The fins 220 help increase the heat dissipation area of ​​the heat sink 200 and enhance the heat exchange effect between the cooling source and the heat sink 200.

[0059] According to some embodiments of this utility model, the heat sink 200 is a copper heat sink, and the outer shell 100 is an aluminum shell. The copper heat sink 200 has good thermal conductivity and can quickly transfer heat from the CPU, while the aluminum shell 100 is low in cost, lightweight, and easy to transport, effectively reducing the manufacturing and installation costs of the CPU cooling device.

[0060] Of course, in other embodiments, the heat sink 200 can also be made of other materials that can achieve heat transfer, such as iron; or the outer shell 100 can be made of other lightweight materials, such as plastic.

[0061] In this application, the connection between components such as the heat sink 200, heat sink baffle 140, middle shell 160, and cover 170 can be achieved by bolt connection.

[0062] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A CPU cooling device for cooling a CPU, characterized in that, include: The housing (100) is provided with a heat dissipation cavity (110), a power inlet channel (120) and a power outlet channel (130), wherein the power inlet channel (120), the heat dissipation cavity (110) and the power outlet channel (130) are connected in sequence; at least one of the power outlet channel (130) and the power inlet channel (120) is used to connect an external power source device. The heat sink (200) includes a heat sink base (210), which is sealed to the opening of the heat sink cavity (110), and the side of the heat sink base (210) facing away from the outer casing (100) is used to fit the CPU. The outer casing (100) further includes a heat dissipation baffle (140), which is disposed in the heat dissipation cavity (110). A flow gap (150) is provided between the outer periphery of the heat dissipation baffle (140) and the inner wall of the outer casing (100). The outlet of the inlet channel (120) is located on the inner wall of the outer casing (100) and on the side of the heat dissipation baffle (140) away from the heat sink (200). The inlet of the outlet channel (130) is located on the side of the heat dissipation baffle (140) facing the heat sink (200). The flow path formed between the outlet of the inlet channel (120), the flow gap (150), and the inlet of the outlet channel (130) flows through the surface of the heat dissipation baffle (140) at least partially.

2. The CPU heat dissipation device according to claim 1, characterized in that, The direction in which the heat sink (200) points toward the housing (100) is a set direction. The source outlet channel (130) and the source inlet channel (120) extend along the set direction. The outlet of the source outlet channel (130) and the inlet of the source inlet channel (120) are located on the first side of the housing (100). The opening of the heat dissipation cavity (110) is located on the second side of the housing (100). The first side and the second side are arranged opposite to each other along the set direction.

3. The CPU heat dissipation device according to claim 2, characterized in that, The source channel (120) includes at least two source sub-channels (121). The source input sub-channel (121) is arranged around the source output channel (130), and / or the cross-sectional area of ​​the source input sub-channel (121) is smaller than the cross-sectional area of ​​the source output channel (130).

4. The CPU heat dissipation device according to claim 3, characterized in that, The heat dissipation baffle (140) includes a baffle portion (141) and a connecting portion (142) arranged concentrically. The first end of the connecting portion (142) is connected to the inner wall of the outer shell (100), and the second end of the connecting portion (142) is connected to the baffle portion (141). The inlet of the source channel (130) is located at the center of the baffle portion (141), and the outlet of the source sub-channel (121) is arranged around the connecting portion (142).

5. The CPU heat dissipation device according to claim 4, characterized in that, The opening cross-sectional area of ​​the heat dissipation cavity (110) is larger than the cross-sectional area of ​​the heat dissipation baffle (140), and the first end of the connecting part (142) is detachably connected to the inner wall of the outer shell (100).

6. The CPU cooling device according to any one of claims 1 to 5, characterized in that, The outer shell (100) further includes a middle shell (160), which includes a stepped first shell portion (161) and a second shell portion (162). The outer perimeter of the cross-section of the first shell portion (161) is larger than the outer perimeter of the cross-section of the second shell portion (162). The first shell portion (161) is provided with the heat dissipation cavity (110), and the second shell portion (162) is provided with a portion of the source inlet channel (120) and a portion of the source outlet channel (130).

7. The CPU heat dissipation device according to claim 6, characterized in that, The outer shell (100) further includes a cover (170), the cover (170) and the first shell portion (161) are respectively connected to the two ends of the second shell portion (162); the cover (170), the second shell portion (162) and the first shell portion (161) are sandwiched to form an annular groove (180).

8. The CPU cooling device according to any one of claims 1 to 5, characterized in that, The CPU cooling device also includes a quick-release connector (300), the first end of which is connected to the outlet of the power supply channel (130), and the second end of which is used to connect to the external power supply device.

9. The CPU cooling device according to any one of claims 1 to 5, characterized in that, The heat sink (200) also includes a plurality of fins (220), which are connected to the heat sink base (210) and located in the heat sink cavity (110).

10. The CPU cooling device according to any one of claims 1 to 5, characterized in that, The heat sink (200) is a copper heat sink, and the outer shell (100) is an aluminum outer shell.

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