Electrical box assembly and air conditioner

Abstract

The utility model relates to the technical field of air conditioning equipment, in particular to an electric appliance box assembly and an air conditioner. The electric appliance box assembly comprises a shell, a mainboard and a heat dissipation piece. An accommodating space is arranged in the shell, a first through hole area is arranged on the side wall of the shell, and a second through hole area is arranged on the bottom wall of the shell; the mainboard and the heat dissipation piece are accommodated in the accommodating space; when the electric appliance box assembly is arranged on the circulating cooling path, airflow in the circulating cooling path enters the shell from the first through hole area so as to carry heat dissipated by the mainboard through the circulating cooling path and flow out from the second through hole area. According to the air conditioner, the heat dissipation piece located in the shell and the first through hole area and the second through hole area which are arranged on the shell are used for being matched with a circulating cooling path in the air conditioner to effectively cool the electric appliance box assembly, so that more installation space is released in the air conditioner to meet the design requirement of a miniaturized structure of the air conditioner; the internal structure of the air conditioner is simplified, and the effects of reducing cost and improving efficiency are achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to air conditioning equipment technical field especially is related to a kind of electric appliance box assembly and air conditioner. BACKGROUND

[0002] At present, the heat dissipation method of frequency conversion mainboard of air conditioner on the market is mainly through air flow to heat dissipation radiator of electric appliance box, and in order to avoid the temperature of mainboard and other components being too high, the radiator is usually placed outside the electric appliance box.

[0003] But the heat dissipation method of this type of electric appliance box is relatively single, mainly depends on radiator. The size of radiator will greatly affect the heat dissipation efficiency of frequency conversion electric appliance box. In addition, the outward installation of radiator will increase the volume of inductor box components, and cannot meet the design requirements of product miniaturization and convenience. Further, the increase of component volume will also hinder the assembly of other parts inside the air conditioner, affecting the installation efficiency. SUMMARY

[0004] Therefore, the utility model provides an electric appliance box assembly and air conditioner, solve the problem that the radiator for heat dissipation of electric appliance box in existing air conditioner is located on the outside of electric appliance box, which leads to larger installation space and lower installation efficiency of electric appliance box.

[0005] The first aspect of the utility model embodiment provides an electric appliance box assembly applied in air conditioner, and the air conditioner forms a circulating cooling path, and the electric appliance box assembly comprises a shell, a mainboard and a heat dissipation piece.

[0006] The shell has a containing space inside, a first through-hole area is arranged on the side wall of the shell, and a second through-hole area is arranged on the bottom wall of the shell.

[0007] The mainboard and the heat dissipation piece are contained in the containing space.

[0008] When the electric appliance box assembly is arranged on the circulating cooling path, the airflow in the circulating cooling path enters the shell from the first through-hole area to carry the heat dissipated by the mainboard through the circulating cooling path and flows out from the second through-hole area.

[0009] In some embodiments, the heat dissipation piece is arranged close to the first through-hole area, and the first through-hole area comprises a plurality of spaced grid bars.

[0010] In some embodiments, the second through-hole area comprises a plurality of second through-holes.

[0011] The plurality of second through-holes are arranged in a rectangular array or a circumferential array.

[0012] In some embodiments, the first through-hole area and the second through-hole area are located on both sides of the heat sink.

[0013] In some implementations, the heat sink is located upwind of the motherboard.

[0014] In some embodiments, a partition is provided on the top cover of the housing, and the bottom of the partition is not connected to the bottom wall of the housing.

[0015] In some embodiments, a first baffle plate is provided on the outer side of the second through-hole area;

[0016] And / or,

[0017] A second wind deflector is provided on the outer side of the first through-hole area.

[0018] In some embodiments, the electrical box assembly further includes a control unit;

[0019] The control unit is used to selectively control the opening or closing of the first baffle and / or the second baffle according to the temperature change inside the housing;

[0020] When the temperature inside the housing is higher than a set temperature, the first baffle and / or the second baffle are controlled to open.

[0021] A second aspect of this utility model provides an air conditioner, including a housing and an electrical box assembly as described in the first aspect;

[0022] The interior of the housing forms an installation space. An air inlet is provided on the rear side of the installation space, and an air outlet is provided on the front side of the top of the installation space. A circulating cooling path is formed in the installation space along a clockwise direction parallel to the air inlet. A two-component assembly, a compressor, a water tank, and an air duct component are sequentially arranged in the installation space along the circulating cooling path.

[0023] The electrical box assembly is located above the two-device assembly.

[0024] In some embodiments, the fan in the air duct component is in operation, creating a negative pressure zone at the location of the two-element assembly;

[0025] The guide ring in the air duct component is located on the two-element assembly and is positioned opposite to the negative pressure zone. The guide ring is provided with a third through hole area.

[0026] The electrical box assembly is located above the flow guide ring, and the second through hole area in the electrical box assembly is arranged opposite to the third through hole area.

[0027] Compared with the prior art, the main advantages of this utility model are:

[0028] In this utility model, the electrical box assembly and air conditioner are used inside the air conditioner, which forms a circulating cooling path. The electrical box assembly includes a housing, a main board, and a heat sink. The housing has an internal accommodating space, a first through-hole area on the side wall, and a second through-hole area on the bottom wall. The main board and the heat sink are both housed within the accommodating space. When the electrical box assembly is placed on the circulating cooling path, the airflow in the circulating cooling path enters the housing through the first through-hole area, carrying the heat dissipated by the main board through the circulating cooling path and flowing out through the second through-hole area. In this utility model, the heat sink located inside the housing, along with the first and second through-hole areas on the housing, in conjunction with the circulating cooling path inside the air conditioner, effectively cools the electrical box assembly, thereby freeing up more installation space inside the air conditioner to meet the requirements of miniaturized air conditioner design, simplifying the internal structure of the air conditioner, and achieving cost reduction and efficiency improvement. Attached Figure Description

[0029] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0030] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0031] Figure 1 This is a schematic diagram of the structure of an air conditioner according to one embodiment of the present utility model;

[0032] Figure 2 yes Figure 1 A cross-sectional view at position AA in the middle;

[0033] Figure 3 This is a schematic diagram of the internal structure of an electrical box assembly according to an embodiment of the present utility model;

[0034] Figure 4 This is a schematic diagram showing the arrangement of the heat sink and the motherboard in an electrical box assembly according to an embodiment of the present invention;

[0035] Figure 5 This is a schematic diagram of the bottom structure of an electrical box assembly according to an embodiment of the present invention;

[0036] Figure 6 This is a structural schematic diagram showing the relative positions of an electrical box assembly and a flow guide ring according to an embodiment of the present invention;

[0037] Figure 7 This is a schematic diagram of the gas flow direction of an air conditioner according to an embodiment of the present invention;

[0038] Figure 8 yes Figure 7 The sectional view of the right view;

[0039] Figure 9 yes Figure 7 A sectional view of the front view;

[0040] Figure 10 yes Figure 9 An enlarged view of position A in the middle.

[0041] Figure label:

[0042] 10. Air conditioner; 11. Air inlet; 12. End cover; 121. Air outlet; 122. Display panel; 13. Filter assembly; 14. Housing; 20. Heat exchanger assembly; 30. Compressor; 40. Water tank; 50. Air duct assembly; 51. Air guide ring; 511. Third through-hole area; 52. Fan; 60. Chassis assembly; 70. Water tray assembly; 80. Rear panel;

[0043] 100. Electrical box assembly; 110. Housing; 111. Top cover; 112. Bottom wall; 113. First side wall; 114. Second side wall; 115. Third side wall; 116. Fourth side wall; 117. First through-hole area; 118. Second through-hole area; 1181. Second through-hole; 120. Main board; 130. Heat sink. Detailed Implementation

[0044] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0045] The terminology used in the embodiments of this utility model is for the purpose of describing particular embodiments only and is not intended to limit the utility model. The singular forms “a,” “said,” and “the” used in the embodiments of this utility model and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise; “multiple” generally includes at least two, but does not exclude the inclusion of at least one.

[0046] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0047] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes said element.

[0048] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0049] like Figures 1 to 10 As shown, an exemplary embodiment of the present invention provides an electrical box assembly 100, which can be applied to an air conditioner 10 to perform logical control on various operating programs and corresponding actions of various functional devices of the air conditioner 10.

[0050] Air conditioner 10 may include, but is not limited to, cooling-only air conditioners, cooling and heating air conditioners, electric heating air conditioners, and electric auxiliary heat pump air conditioners. Alternatively, air conditioner 10 may also be a modular air conditioner, a split wall-mounted air conditioner, a split cabinet air conditioner, or a split ceiling-mounted air conditioner.

[0051] Among them, such as Figure 2 As shown, the various functional components in the air conditioner 10 may include, but are not limited to, the two-phase assembly 20, the compressor 30, the water tank 40, and the air duct component 50, etc. The air duct component 50 may also include structures such as the guide ring 51.

[0052] An air inlet 11 is provided on the rear side of the air conditioner 10, a filter screen component 13 is provided at the air inlet 11, an end cover 12 is provided on the top of the air conditioner 10, an air outlet 121 is provided on the front side of the end cover 12, and a display panel 122 is provided on the rear side of the end cover 12.

[0053] like Figure 9 and Figure 10 As shown by the middle arrow, a circulating cooling path is provided inside the air conditioner 10 in a clockwise direction parallel to the air inlet 11, and the air flow direction in the circulating cooling path is shown by the arrow in the figure.

[0054] The two-phase assembly 20, compressor 30, water tank 40 and air duct component 50 in the air conditioner 10 are all located on the circulating cooling path.

[0055] Reference Figures 1 to 10 As shown, the electrical box assembly 100 includes a housing 110, a main board 120, and a heat sink 130.

[0056] The housing 110 serves as the external protective structure for the entire electrical box assembly 100, and its interior is hollow to form an accommodating space. That is, the housing 110 can be an outer shell structure formed by sheet metal components. For example, the housing 110 includes a top cover 111, a bottom wall 112, and four side walls, wherein the four side walls are a first side wall 113, a second side wall 114, a third side wall 115, and a fourth side wall 116 connected sequentially. Other important components can be accommodated within the accommodating space; for example, the main board 120 and the heat sink 130 can be housed within the accommodating space.

[0057] A first through-hole area 117 is provided on one of the four side walls of the housing 110. The first through-hole area 117 may be located on the first side wall 113 or on the third side wall 115 which is opposite to the first side wall. A second through-hole area 118 is provided on the bottom wall 112.

[0058] The first through-hole area 117 is located on the side wall away from the second through-hole area 118. For example, when the first through-hole area 117 is located on the first side wall 113, the second through-hole area 118 is located near the third side wall 115. Alternatively, when the first through-hole area 117 is located on the third side wall 115, the second through-hole area 118 is located near the first side wall 113.

[0059] The presence of the first through-hole area 117 provides an inlet channel for external airflow to enter the housing 110, while the second through-hole area 118 serves as an outlet channel for airflow to exit the housing 110. This design, with through-hole areas on different wall surfaces, helps to construct a reasonable airflow circulation path, allowing air to flow effectively within the housing 110. For example, cold air in the circulating cooling path within the air conditioner 10 can flow into the housing 110 from the first through-hole area 117, and after completing the cooling process for the motherboard 120 and the heat sink 130, it flows out from the second through-hole area 118.

[0060] The mainboard 120 is one of the core components of the electrical box assembly 100. It is housed within the enclosure 110. During the operation of the air conditioner 10, the mainboard 120 generates heat. This is because the mainboard 120 integrates numerous electronic components, such as chips, capacitors, and resistors. These components generate heat during operation due to the conversion of electrical energy. If the heat cannot be dissipated in time, the mainboard 120 will overheat, affecting its performance and potentially damaging the electronic components, thus impacting the normal operation of the entire air conditioner 10.

[0061] The motherboard 120 can receive signals from the remote control or buttons and control the operation of the functional components in the air conditioner 10 according to the set temperature or command. For example, by controlling the operation of the inverter or fan in the air conditioner 10, the air temperature and / or air humidity within the set space range can be flexibly controlled.

[0062] The motherboard 120 can adopt the structure of existing technology. For example, the motherboard 120 can be equipped with multiple unit circuits, including power supply circuit, CPU three-element circuit, input circuit and output circuit, etc.

[0063] The heat sink 130 is also located within the housing space and assists the motherboard 120 in heat dissipation. When the air conditioner 10 is operating, the heat sink 130 works in conjunction with the motherboard 120 to transfer the heat generated by the motherboard 120 away. The heat sink 130 typically has a large heat dissipation area or a special heat dissipation structure, effectively dissipating the heat generated by the motherboard 120 into the surrounding environment. The heat sink 130 can be made of metal, utilizing the metal's excellent thermal conductivity to quickly conduct heat from the motherboard 120 to the heat sink 130, where it is then dissipated through heat exchange with the surrounding air.

[0064] The heat sink 130 can be a heat sink in the prior art, and the specific structure of the heat sink is not specifically limited here.

[0065] In the gas flow direction along the circulating cooling path, the first through-hole area 117 is located at the upstream of the airflow direction, and the heat sink 130, the main board 120 and the second through-hole area 118 are arranged in sequence.

[0066] In this example, when the electrical box assembly 100 is positioned on the circulating cooling path, the airflow in the circulating cooling path first enters the housing 180 through the first through-hole area 117. This process is the initial step in heat dissipation. The smooth entry of airflow into the housing 110 is due to the reasonable design of the first through-hole area 117. The specific structural design of the first through-hole area 117 ensures sufficient airflow while also preventing a large amount of external dust, debris, etc., from entering the housing 120 and causing adverse effects on internal components.

[0067] The airflow entering the housing 110 first passes through the heat sink 130 and then cools the heat sink 130, so that the heat sink 130 can better reduce part of the temperature of the motherboard 120.

[0068] As the airflow passes over the motherboard 120, it carries away the heat dissipated by the motherboard 120. This is because there is a temperature difference between the airflow and the motherboard 120; according to the principle of heat conduction, heat is transferred from the hotter motherboard 120 to the cooler airflow. The more heat the motherboard 120 dissipates, the more heat the airflow carries away.

[0069] The airflow carrying heat then flows out of the housing 110 through the second through-hole area 118. The second through-hole area 118 complements the first through-hole area 117, providing a channel for the airflow to exit. In this way, the entire circulating cooling path is fully constructed. Through the continuous circulation of airflow, the heat generated by the main board 120 is continuously carried out of the housing 110, thereby ensuring that the temperature inside the electrical box assembly 100 is within a reasonable range and ensuring the stable operation of the entire air conditioner 10.

[0070] On the other hand, unlike the existing technology where the radiator is located outside the electrical box, in this example, the heat sink 130 is located inside the housing 110. Therefore, more installation space can be freed up inside the air conditioner 10 to meet the miniaturized structural design requirements of the air conditioner 10, simplify the internal structure of the air conditioner 10, and achieve the effect of cost reduction and efficiency improvement.

[0071] like Figures 1 to 10 As shown, in some embodiments, the first through-hole area 117 includes a plurality of spaced grid strips. For example, the first through-hole area 117 is disposed on the first sidewall 113, and the second through-hole area 118 is positioned close to the third through-hole area 118. The grid strips are the basic building blocks of the first through-hole area 117, and the plurality of grid strips can form a regular structure on the first sidewall 113 of the housing 110.

[0072] The shape of the grille strip can vary. For example, the grille strip can be a long, thin rectangular strip. This shape helps to maximize the through-hole area of ​​the first through-hole region 117 while ensuring a certain structural strength, so as to ensure sufficient airflow. Alternatively, the grille strip can also be other shapes. For example, depending on the overall design requirements of the housing 110 and the convenience of the manufacturing process, the grille strip can also be a strip with a certain curvature.

[0073] A predetermined distance is set between two adjacent grid strips. In a specific example, the predetermined distance can be between 30% and 100% of the width of the grid strip.

[0074] If the spacing is too large, although it may reduce the structural strength requirements of a single grille bar, it will result in an excessively large through-hole area in the first through-hole area 117, which may allow more dust, debris, etc., to easily enter the housing 110 with the airflow. Moreover, an excessively large spacing may affect the airflow speed and direction, resulting in uneven airflow distribution inside the housing 110, which is not conducive to effective heat dissipation of the motherboard 120.

[0075] If the spacing is too small, although it can block dust and other foreign objects from entering to some extent, it will reduce the total area of ​​the through holes in the first through hole area 117, thereby limiting the gas flow. Insufficient gas flow will make it difficult for the airflow entering the housing 110 to effectively remove the heat dissipated by the motherboard 120, affecting the heat dissipation effect.

[0076] In this example, multiple grille strips are arranged at predetermined intervals, guiding the airflow entering the housing 110. These grille strips act like small deflectors, allowing airflow to enter the housing 110 in a specific direction and angle. This guiding effect helps to distribute the airflow more evenly around the motherboard 120, improving heat dissipation efficiency.

[0077] Because the grille bars are spaced at predetermined intervals, they allow a certain amount of airflow while also blocking dust and debris. This helps protect components such as the motherboard 120 and heat sink 130 inside the housing 110, reducing the risk of malfunctions caused by dust accumulation and extending the service life of the electrical box assembly 100.

[0078] like Figures 1 to 10 As shown, in some embodiments, the second through-hole region 118 includes a plurality of second through-holes 1181. The plurality of second through-holes 1181 are arranged in a rectangular array or in a circular array.

[0079] The second through-hole 1181 serves as a channel for airflow out of the housing 110. The size and shape of the second through-hole 1181 directly affect the efficiency and smoothness of airflow. For example, the diameter (if it is a circular through-hole) or side length (if it is a square through-hole) of the second through-hole 1181 needs to be determined based on factors such as the expected airflow, the pressure difference inside and outside the housing 110, and the protection requirements for the motherboard 120 and the heat sink 130. If the through-hole is too small, it may obstruct airflow, increase the air pressure inside the housing 110, and affect the normal operation of the entire cooling cycle. If the second through-hole 1181 is too large, it may reduce the structural strength of the area where the second through-hole 118 is located in the bottom wall 112 of the housing 110, and may make the motherboard 120 and the heat sink 130 more susceptible to damage from external dust, moisture, etc.

[0080] When multiple second through holes 1181 are arranged in a rectangular array, this arrangement presents a regular row and column structure. For example, suppose that several second through holes 1181 are evenly distributed in the horizontal direction to form a row, and several second through holes 1181 are also evenly distributed in the vertical direction to form a column. This layout can provide a relatively uniform distribution pattern on the plane, so that the airflow can be dispersed from different second through holes 1181 in a relatively uniform direction and speed when it flows out.

[0081] The rectangular array arrangement helps to create a relatively stable air pressure gradient within the housing 110. In areas near the motherboard 120 where heat dissipation is more concentrated, airflow can flow more orderly toward the nearest second through-hole 1181, and then flow out through these second through-holes 1181 distributed along the rectangular array. This avoids excessive local airflow concentration or dead airflow zones, and facilitates the efficient discharge of heat-carrying airflow outside the housing 110.

[0082] When multiple second through holes 1181 are arranged in a circumferential array, these second through holes 1181 can be distributed in a circular shape around a central point. This arrangement concentrates the second through holes 1181 on a circumference or around a central region. For example, in some circular or near-circular housing 110 structures, the circumferentially arranged second through holes 1181 can better adapt to the shape and internal spatial layout of the housing 110.

[0083] The second through holes 1181 arranged in a circular array can guide airflow to form a rotational flow pattern within the housing 110. This circular array of second through holes 1181 can effectively match the heat distribution pattern of the motherboard 120 and the heat sink 130 in the housing 110, allowing the heat-carrying airflow to converge towards the second through holes 1181 and flow out along the circumferential direction, making heat dissipation more efficient.

[0084] like Figures 1 to 10As shown, in some embodiments, the first through-hole area 117 and the second through-hole area 118 are located on both sides of the heat sink 130.

[0085] The first through-hole area 117 is located upstream of the heat sink 130. The first through-hole area 117 allows cold air to enter the housing 110 and flow through the heat sink 130, contacting the heat exchange surface inside the heat sink 130, thereby carrying away the heat from the surface of the heat sink 130.

[0086] The second through-hole area 118 is located downstream of the heat sink 130. The second through-hole area 118 allows air heated by the heat from the motherboard 120 and the heat sink 130 to flow out from the housing 110, completing the heat exchange process of the electrical box assembly 100.

[0087] By placing the first through-hole area 117 and the second through-hole area 118 on both sides of the heat sink 130, natural air convection can be effectively utilized, allowing cool air to enter from one side and hot air to exit from the other side, thereby improving heat dissipation efficiency. In addition, this design can reduce airflow resistance, allowing air to pass through the heat sink 130 more smoothly, achieving rapid cooling of the internal structure of the electrical box assembly 100.

[0088] like Figures 1 to 10 As shown, in some embodiments, the heat sink 130 is located upwind of the motherboard 120 along the airflow direction within the housing 110.

[0089] As an upwind component, heat sink 130 first exchanges heat with the cool air entering the housing 110. Heat sink 130 typically has a large heat dissipation area or a special heat dissipation structure, such as heat sink fins. When cool air flows through heat sink 130, it transfers the heat absorbed from the motherboard 120 to the cool air. Because heat sink 130 contacts the cool air before the motherboard 120, this creates favorable initial conditions for heat dissipation.

[0090] The heatsink 130 is located upwind of the motherboard 120, preheating the cool air that is about to flow over it. As the cool air passes over the heatsink 130, it absorbs some of the heat, causing its own temperature to rise. While this may seem like simply raising the air temperature, it is actually an optimized cooling strategy.

[0091] Because even after preheating, the temperature difference between the preheated air and the motherboard 120 is still relatively large when the air reaches the motherboard. According to the principle of heat conduction, the greater the temperature difference, the faster the heat transfer rate. Therefore, this preheated air can more efficiently remove heat from the motherboard 120, thereby improving the motherboard's heat dissipation efficiency.

[0092] An orderly heat dissipation path improves the overall heat dissipation efficiency of the electrical box assembly 100, ensuring that the air conditioner 10 operates within its normal temperature range, extending its service life and improving its performance stability. The heat sink 130 provides better conditions for heat dissipation of the main board 120, and the heat generated by the main board 120, in turn, prompts the heat sink 130 to continuously transfer heat to the air. Together, they play an indispensable role in the heat dissipation system of the electrical box assembly 100, ensuring the reliable operation of the air conditioner 10.

[0093] like Figures 1 to 10 As shown, in some embodiments, a partition (not shown) is provided on the top cover 111 of the housing 110. The bottom of the partition is not connected to the bottom wall 112 of the housing 110, meaning that the partition can change the direction of airflow within the housing 110. When airflow enters the housing 110 from the first through-hole area 117, the partition can guide the airflow to flow in different areas, allowing the airflow to more fully contact different parts of the main board 120 or the heat sink 130, improving heat dissipation efficiency, reducing the risk of failure due to overheating, electromagnetic interference, and other problems, thereby improving the reliability and performance stability of the entire electrical box assembly 100.

[0094] like Figures 1 to 10 As shown, in some embodiments, a first baffle plate (not shown in the figure) is provided on the outside of the second through-hole area 118.

[0095] The first baffle plate can regulate the direction of airflow exiting from the second through-hole area 118. Without the first baffle plate, the airflow might diffuse randomly, while the first baffle plate can guide the airflow in a specific direction. Furthermore, the airflow speed can also be controlled. By changing factors such as the contact area between the first baffle plate and the airflow, and the size and distribution of the ventilation holes (if any) on the first baffle plate, the airflow resistance can be increased or decreased, thereby controlling the speed of the airflow exiting from the second through-hole area 118.

[0096] The first baffle plate, located outside the second through-hole area 118, also serves to protect the external environment. For example, in harsh working environments where dust, moisture, or other impurities may be present, the first baffle plate can prevent some external substances from entering the equipment through the second through-hole area 118. Simultaneously, it also prevents internal substances (such as small fragments of parts) from leaking into the external environment through the second through-hole area 118.

[0097] A second wind deflector (not shown in the figure) is provided on the outer side of the first through-hole area 117.

[0098] The second baffle plate filters and purifies the airflow entering the first through-hole area 117. In the external environment, air may carry impurities such as dust and hair. If these impurities enter the housing 110, they may affect the normal operation of the electrical box assembly 100, such as blocking heat dissipation channels or causing short circuits in electronic components. The second baffle plate can be in the form of a filter screen to block larger particles of impurities, thus providing preliminary purification of the incoming air.

[0099] The second baffle can also pre-distribute the airflow entering the housing 110. According to the heat dissipation requirements or airflow distribution requirements inside the electrical box assembly 100, it can be set into a corresponding structure (such as vents or guide plates of different shapes) to guide the airflow to the first through hole area 117 corresponding to the area that needs more heat dissipation, thereby improving the targeting and effectiveness of air intake.

[0100] The placement of the first and second air deflectors helps improve the overall performance of the electrical box assembly 100. Effective regulation of the intake and exhaust airflow optimizes the heat dissipation of the electrical box assembly 100, protecting its interior from external impurities and also protecting the external environment from the influence of substances inside the assembly. This allows the air conditioner 10 to operate more stably and efficiently, extending its service life.

[0101] like Figures 1 to 10 As shown, in some embodiments, the electrical box assembly 100 also includes a control unit (not shown). The control unit may be integrated into the display panel 122 of the air conditioner 10 to selectively control the opening or closing of the first and second air deflectors, thereby refining the adjustment capability of the heat dissipation system of the electrical box assembly 100.

[0102] For example, in some cases, only the first baffle may need to be adjusted, while in others, such as when hot air is not venting properly, only the first baffle needs to be adjusted.

[0103] In other cases, such as when both intake and exhaust need to be optimized to adapt to temperature changes, it may be necessary to adjust both the first and second baffles simultaneously. This depends on the specific temperature distribution within the housing, the airflow conditions, and the overall operating status of the electrical box assembly 100.

[0104] When the temperature inside the housing 110 rises and heat dissipation is required, the first and / or second baffles are opened in a timely manner by controlling the control unit. This enables heat dissipation in the most efficient way, improves the heat dissipation efficiency of the entire electrical box assembly, and helps to save energy while ensuring the normal operation of the air conditioner 10.

[0105] Specifically, the opening and closing of the first and / or second baffles can be adjusted according to temperature changes within the housing 110. When the internal temperature of the housing 110 reaches a preset value, the first and / or second baffles close. When the temperature inside the housing 110 is high, the first and / or second baffles open to help cool the interior of the housing 110. Through the aforementioned baffle control logic, the airflow through the electrical box assembly 100 can be intelligently adjusted, thereby increasing the gas flow to the evaporator and condenser in the air conditioner 10 and improving the dehumidification effect.

[0106] like ​ As shown, an exemplary embodiment of the present invention provides an air conditioner 10, which includes a housing 14 and an electrical box assembly 100 of any of the above embodiments.

[0107] The interior of the outer casing 14 is configured as an installation space. An air inlet 11 is provided on the rear side of the installation space, and an air outlet 122 is provided on the front side of the top of the installation space. The air outlet 122 is located on the front side of the end cover 12.

[0108] A circulating cooling path is formed in the installation space along a clockwise direction parallel to the air inlet 11. The two-phase assembly 20, compressor 30, water tank 40 and air duct component 50 in the air conditioner 10 are all located on the circulating cooling path.

[0109] The electrical box assembly 100 is located above the two-device assembly 20.

[0110] A water receiving tray assembly 70 is provided below the two-component assembly 20, and a rear plate 80 is provided between the water receiving tray assembly 70 and the filter screen component 13.

[0111] All the structural components of the air conditioner 10 mentioned above are mounted on the chassis component 60.

[0112] Specifically, when the fan 52 in the air duct component 50 is in operation, a negative pressure zone is formed at the location of the two-electrode assembly 20 to facilitate the flow of gas inside the housing 110 in the electrical box assembly 100. The presence of the negative pressure zone accelerates the airflow along the circulating cooling path, ensuring that the airflow can efficiently remove heat from inside the housing 110, thereby achieving the purpose of heat dissipation.

[0113] In addition, by creating an airflow path through the openings in the housing 110 and the guide ring 51, the negative pressure generated by the rotation of the fan blades can drive the airflow in the electrical box, carrying away the heat from the housing 110 and achieving the purpose of heat dissipation.

[0114] The air duct component 50 has a flow guide ring 51 located on the two-electrode assembly 20 and is positioned opposite to the negative pressure zone. A third through hole area 511 is provided on the flow guide ring 51. The electrical box assembly 100 is located above the flow guide ring 51, and the second through hole area 118 in the electrical box assembly 100 is positioned opposite to the third through hole area 511.

[0115] In this example, without affecting the heat dissipation efficiency of the electrical box assembly 100, a smaller heat sink 130 can be used, thereby effectively reducing the size of the heat sink 130, freeing up more installation space, and making the air conditioner 10 more compact and convenient.

[0116] In addition, by changing the installation position of the heat sink 130, interference with other components inside the air conditioner 10 is reduced, the assembly process is simplified, and production costs are reduced.

[0117] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0118] It should be understood that this invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this invention is limited only by the appended claims.

Claims

1. An electrical box assembly, used inside an air conditioner, wherein a circulating cooling path is formed inside the air conditioner, characterized in that, The electrical box assembly includes: a housing, a main board, and a heat sink; The housing has an accommodating space inside, a first through-hole area is provided on the side wall of the housing, and a second through-hole area is provided on the bottom wall of the housing. Both the motherboard and the heat sink are housed within the accommodating space; When the electrical box assembly is disposed on the circulating cooling path, the airflow in the circulating cooling path enters the housing through the first through-hole area, so as to carry the heat dissipated by the motherboard through the circulating cooling path and flow out from the second through-hole area.

2. The electrical box assembly according to claim 1, characterized in that, The heat sink is positioned close to the first through-hole area, which includes a plurality of spaced-apart grille bars.

3. The electrical box assembly according to claim 1, characterized in that, The second through-hole region includes a plurality of second through-holes; The second through holes are arranged in a rectangular array or in a circular array.

4. The electrical box assembly according to claim 1, characterized in that, The first through-hole area and the second through-hole area are located on both sides of the heat sink.

5. The electrical box assembly according to claim 1, characterized in that, The heat sink is located upwind of the motherboard.

6. The electrical box assembly according to claim 1, characterized in that, A partition is provided on the top cover of the housing, and the bottom of the partition is not connected to the bottom wall of the housing.

7. The electrical box assembly according to any one of claims 1 to 6, characterized in that, A first baffle plate is provided on the outer side of the second through-hole area; And / or, A second wind deflector is provided on the outer side of the first through-hole area.

8. The electrical box assembly according to claim 7, characterized in that, The electrical box assembly also includes a control unit; The control unit is used to selectively control the opening or closing of the first baffle and / or the second baffle according to the temperature change inside the housing; When the temperature inside the housing is higher than a set temperature, the first baffle and / or the second baffle are controlled to open.

9. An air conditioner, characterized in that, Includes a housing and an electrical box assembly as described in any one of claims 1 to 8; The interior of the housing forms an installation space. An air inlet is provided on the rear side of the installation space, and an air outlet is provided on the front side of the top of the installation space. A circulating cooling path is formed in the installation space along a clockwise direction parallel to the air inlet. A two-component assembly, a compressor, a water tank, and an air duct component are sequentially arranged in the installation space along the circulating cooling path. The electrical box assembly is located above the two-device assembly.

10. The air conditioner according to claim 9, characterized in that, When the fan in the air duct component is in operation, a negative pressure zone is formed at the location of the two components; The guide ring in the air duct component is located on the two-element assembly and is positioned opposite to the negative pressure zone. The guide ring is provided with a third through hole area. The electrical box assembly is located above the flow guide ring, and the second through hole area in the electrical box assembly is arranged opposite to the third through hole area.

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