Variable-pitch turnover device and wafer separation device for semiconductor silicon wafers

Abstract

The utility model provides a variable pitch turnover device and a fragmentation device of a semiconductor silicon wafer, which comprises a turnover assembly and a variable pitch assembly, the turnover assembly comprises a turnover driving device and a turnover support, and the variable pitch assembly comprises a variable pitch driving device, a plurality of variable pitch blocks, a tension spring and a plurality of limiting pieces. Under the tightening action of the tension spring, the variable-pitch blocks are arranged at narrow intervals, at the moment, the variable-pitch blocks are opposite to the adsorption blocks through overturning of the overturning support, then the sliced silicon single chips can be adsorbed, the adsorbed and fixed silicon single chips are overturned again, the silicon single chips with the back faces facing upwards originally are arranged in the mode that the back faces face downwards after being overturned, and the silicon single chips with the back faces facing downwards after being overturned. And then, a plurality of variable-pitch blocks are moved through a variable-pitch driving device, and the variable-pitch blocks are arranged at wide intervals under the limiting action of a limiting sheet, namely, the silicon single sheets are arranged at wide intervals, so that the wide-interval transfer is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to solar semiconductor silicon wafer production technical field especially, relates to a semiconductor silicon wafer's variable distance turnover device and piece device. BACKGROUND

[0002] The piece device is mainly used for the work of separating the silicon wafer that is not completely cut off after being cut by the cutting machine, in the photovoltaic industry at present stage, with the different size of semiconductor silicon wafer size required, it needs to be designed according to the semiconductor silicon wafer specification and the number of cutting, and also needs to improve the efficiency of piece.

[0003] The existing semiconductor silicon wafer cutting is usually carried out on the back, specifically, the cutting technology mainly processes a cutting path through the surface on the back of the cell piece, and then the cell piece is broken along the cutting path by using machinery or manually.

[0004] However, the separated silicon single piece cannot be arranged efficiently, and cannot be intelligently connected to the next welding process step, so it is necessary to automatically separate and arrange the distance of the silicon single piece after piece. UTILITY MODEL CONTENTS

[0005] The first object of the utility model is to provide a high-efficiency and stable variable distance turnover device for semiconductor silicon wafer.

[0006] The second object of the utility model is to provide a piece device with the above-mentioned variable distance turnover device.

[0007] To achieve the first objective of this utility model, it provides a variable-pitch flipping device for semiconductor silicon wafers, comprising a flipping assembly and a variable-pitch assembly. The flipping assembly includes a flipping drive device and a flipping bracket. The flipping drive device is connected to the flipping bracket and drives the flipping bracket to rotate around the X-axis. A slide rail extending along the X-axis is provided on the flipping bracket. The variable-pitch assembly includes a variable-pitch drive device, multiple variable-pitch blocks, a tension spring, and multiple limiting plates. The variable-pitch blocks extend along the X-axis, and the multiple variable-pitch blocks are arranged along the Y-axis. The variable-pitch block located at the end in the X-axis direction is fixedly connected to the flipping bracket, and the other variable-pitch blocks are movably mounted on the slide rail. At least two limiting plates are provided. The device includes at least one connecting hole, which is a sliding hole extending along the X-axis. Two connecting holes are respectively connected between two adjacent pitch blocks. The pitch block connected to the sliding hole can move relative to the limiting plate. A tension spring extends along the X-axis, and its two ends are connected between the pitch blocks at both ends of the X-axis. A pitch driving device is connected to the pitch block located at the other end of the X-axis and drives the pitch block to move outward along the X-axis. A first adsorption plane extending along the X-axis is provided on the pitch block. A first adsorption hole is provided on the first adsorption plane. A first adsorption pipe communicating with the first adsorption hole is provided inside the pitch block. A first interface is provided at the outer end of the first adsorption pipe.

[0008] A further solution is that the limiting piece is provided with at least three connecting holes, at least two of which are arranged as sliding holes extending along the X horizontal direction, and the two sliding holes are located at both ends of the limiting piece based on the X horizontal direction.

[0009] A further proposed solution is to arrange the connecting holes, excluding the two sliding holes, in a circular arrangement. The circular holes are connected to the pitch block located in the middle, while the sliding holes on both sides are connected to the pitch blocks on the opposite sides.

[0010] A further alternative is to place the tension spring on the outer side of the limiting plate in the Y-direction.

[0011] A further proposed solution is to have multiple limiting plates located at both ends of the pitch block in the Y-direction, and two tension springs located at both ends of the pitch block in the Y-direction.

[0012] A further proposed solution is that the pitch-changing flipping device includes two pitch-changing drive devices, which are located at both ends of the pitch block based on the Y-axis horizontal direction.

[0013] A further solution is to provide a fixing hole at the end of the pitch block in the Y horizontal direction, and the fixing hole and the connecting hole are connected by a pin.

[0014] A further proposed solution is to have a rectangular frame for the flip bracket with a perforation in the middle, with the first interface located on the bottom surface of the pitch block and multiple first interfaces facing the perforation.

[0015] A further proposed solution is to have the variable pitch drive unit located inside the cutout and fixedly connected to the flipping bracket.

[0016] To achieve the second objective of this utility model, a segmentation device is provided, comprising a variable-pitch flipping device and a segmentation assembly as described above. The segmentation assembly includes a bending module, a lifting module, and a fixing bracket. The bending module includes multiple adsorption blocks extending along the Y-axis and arranged along the X-axis. Each adsorption block has a second adsorption plane extending along the Y-axis, and a second adsorption hole is provided on the second adsorption plane. A second adsorption pipe communicating with the second adsorption hole is provided inside the adsorption block, and a second interface is provided at the outer end of the second adsorption pipe. Each adsorption block has a hinge portion at the edge of the second adsorption plane along the X-axis, extending along the Y-axis. Two adjacent hinge portions of two adsorption blocks are hinged together. The fixing bracket is fixedly connected to one of the adsorption blocks, and the other adsorption blocks are arranged around the Y-axis. The lifting module includes a lifting drive device and a support frame. The support frame extends along the X-axis and is located below multiple adsorption blocks. The lifting drive device is connected to the support frame and drives the support frame to move vertically along the Z-axis. In the bending and segmenting state, the support frame moves downward, and the adsorption blocks other than the fixedly connected ones rotate downward under gravity. The multiple second adsorption planes are not coplanar. In the flat and flipping state, the support frame moves upward to support the multiple adsorption blocks. The multiple second adsorption planes are horizontally coplanar. The flipping drive device drives the flipping bracket and multiple pitch blocks to rotate around the X-axis. The multiple pitch blocks are located above and opposite the multiple adsorption blocks. In the pitch-changing state, the pitch-changing drive device drives the pitch blocks to move outward along the X-axis, increasing the distance between two adjacent pitch blocks.

[0017] The beneficial effects of this utility model are as follows: After the semiconductor silicon wafer is sliced ​​by the slicing assembly, and under the tightening action of the tension spring, the variable pitch blocks are arranged in a narrow spacing. At this time, the variable pitch blocks are made to face the adsorption blocks by the flipping bracket, and then the sliced ​​silicon wafers can be adsorbed. The adsorbed and fixed silicon wafers are flipped again, so that the silicon wafers that were originally facing up are now facing down, which facilitates the welding of the back metal layer. Subsequently, the variable pitch drive device moves multiple variable pitch blocks, and under the limiting action of the limiting plate, the variable pitch blocks are arranged in a wide spacing, which also makes the silicon wafers wide spacing, thus facilitating the transfer of wide spacing. Furthermore, the arrangement of the round holes and sliding holes of the limiting plate, as well as the limiting plates and tension springs arranged on both sides, maintains the stable change of the spacing. Moreover, the arrangement of the perforations makes the connection of the first interface more convenient and reduces the interference of the pipeline during flipping. Attached Figure Description

[0018] Figure 1 This is a structural diagram of the semiconductor silicon wafer slicing and splitting equipment of this utility model.

[0019] Figure 2 This is a structural diagram of an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0020] Figure 3 This is a structural diagram of an embodiment of the semiconductor silicon wafer slicing device of this utility model from another perspective.

[0021] Figure 4 This is a structural diagram of an embodiment of the variable pitch flipping device of this utility model.

[0022] Figure 5 This is a structural diagram of an embodiment of the variable pitch flipping device of this utility model from another perspective.

[0023] Figure 6 This is a structural diagram of an embodiment of the variable pitch flipping device of this utility model in the variable pitch state.

[0024] Figure 7 This is a structural diagram of an embodiment of the variable pitch flipping device of this utility model in a flat unfolded state.

[0025] Figure 8 This is a structural diagram of the slicing assembly in a bent slicing state in an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0026] Figure 9 This is a structural diagram of the slicing component in a flat state in an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0027] Figure 10 This is a structural diagram of an embodiment of the variable pitch flipping device of this utility model in a flat flipping state.

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments. Detailed Implementation

[0029] Reference Figures 1 to 10 The semiconductor silicon wafer slicing and dicing equipment includes a dicing device, a robotic arm device 12, a semiconductor silicon wafer dicing device 10, and a feeding device 13. The dicing device is used to perform dicing treatment on the semiconductor silicon wafer 101 along the X horizontal direction and the Y horizontal direction, thereby forming X-direction dicing and Y-direction dicing, and thus dicing multiple silicon wafers.

[0030] The semiconductor silicon wafer slitting device 10 includes a slitting assembly 2, a slitting assembly 4, and a flipping device 3. The device has a first slitting station and a second slitting station. The slitting assembly 2, which rotates in the X-direction, is located at the first slitting station, and the slitting assembly 4, which rotates in the Y-direction, is located at the second slitting station. The slitting structures and principles of the slitting assemblies 2 and 4 are similar, differing only in the rotation direction and the arrangement of the adsorption blocks. Therefore, the description will primarily focus on the slitting assembly 4.

[0031] The segmented assembly 4 includes a bending module 41, a lifting module 42, and a fixing bracket 43. The bending module 41 includes multiple adsorption blocks 411, which extend along the Y-direction and are arranged along the X-direction. Each adsorption block 411 has a second adsorption plane extending along the Y-direction, and a second adsorption hole is provided on the second adsorption plane. A second adsorption pipe communicating with the second adsorption hole is provided inside the adsorption block 411, and a second interface is provided at the outer end of the second adsorption pipe. The adsorption blocks 411 are positioned along the edge of the second adsorption plane in the X-direction. The device has a hinge 412 that extends along the Y-axis. Two hinges 412 that are close to each other in two adjacent adsorption blocks 411 are hinged together. A fixed bracket 43 is fixedly connected to one of the adsorption blocks 411. The other adsorption blocks 411 rotate around the Y-axis. The lifting module 42 includes a lifting drive device 421 and a support frame 422. The support frame 422 extends along the X-axis and is located below the multiple adsorption blocks 411. The lifting drive device 421 is connected to the support frame 422 and drives the support frame 422 to move vertically along the Z-axis.

[0032] With a basically the same structure and principle, the semiconductor silicon wafer slicing device 10 can be placed in the slicing assembly 2 and rotated in the Y horizontal direction for slicing. Then, the semiconductor silicon wafer 101 is transported to the slicing assembly 4 by the robotic arm device 12, and then the semiconductor silicon wafer slicing device 10 can be rotated in the X horizontal direction by the slicing assembly 4 for slicing.

[0033] The variable pitch tilting device 3 includes a tilting component 31 and a variable pitch component 32. The tilting component 31 includes a tilting drive device 311 and a tilting bracket 312. The tilting drive device 311 can be driven by a motor. The tilting drive device 311 is connected to the tilting bracket 312 and drives the tilting bracket 312 to rotate around the X horizontal direction. The tilting bracket 312 is provided with a slide rail 314 extending along the X horizontal direction. The tilting bracket 312 is a rectangular frame with a hole 313 in the middle. The two slide rails 314 are respectively provided on both sides of the Y horizontal direction.

[0034] The pitch control assembly 32 includes two pitch control drive devices 35, multiple pitch control blocks 321, two tension springs 34 and multiple limiting plates 33. The pitch control blocks 321 extend along the X horizontal direction, and the multiple pitch control blocks 321 are arranged along the Y horizontal direction. The pitch control block 321 located at the right end in the X horizontal direction is fixedly connected to the flip bracket 312, and the other pitch control blocks 321 are movably mounted on the slide rail 314.

[0035] The variable pitch block 321 is provided with a first adsorption plane 320 extending in the horizontal direction X, the first adsorption plane 320 is provided with a first adsorption hole 322, the variable pitch block 321 is provided with a first adsorption pipe communicating with the first adsorption hole 322, and the outer end of the first adsorption pipe is provided with a first interface 323.

[0036] The limiting piece 33 is provided with four connecting holes, which are arranged along the Y-direction. The two connecting holes in the middle are arranged as circular holes 332, and the connecting holes on both sides are arranged as sliding holes 331 extending along the X-direction. Two of the connecting holes are connected between two adjacent pitch blocks 321. Specifically, the limiting piece 33 is connected in groups of three pitch blocks 321. The pitch blocks 321 are provided with fixing holes at their ends in the Y-direction. The fixing hole of the left pitch block 321 is connected to the left sliding hole 331 by a pin. The fixing hole of the middle pitch block 321 is connected to the circular hole 332 by a pin. Then the middle pitch block 321 is fixedly connected to the limiting piece 33. The fixing hole of the right pitch block 321 is connected to the right sliding hole 331 by a pin. Then the left and right pitch blocks 321 slide relative to the limiting piece 33.

[0037] A tension spring 34 extends along the X-axis horizontal direction, with its two ends connected between the pitch blocks 321 at both ends of the X-axis horizontal direction. The tension spring 34 is located on the outer side of the limiting plate 33 based on the Y-axis horizontal direction. Multiple limiting plates 33 are located at both ends of the pitch block 321 based on the Y-axis horizontal direction, and two tension springs 34 are located at both ends of the pitch block 321 based on the Y-axis horizontal direction. A pitch drive device 35 is connected to the pitch block 321 located at the other end of the X-axis horizontal direction and drives the pitch block 321 to move outward along the X-axis horizontal direction. Two pitch drive devices 35 are located at both ends of the pitch block 321 based on the Y-axis horizontal direction. A first interface 323 is located on the bottom surface of the pitch block 321, and multiple first interfaces 323 face the cutout 313, thereby facilitating the connection of the first interface 323 to external pipelines. The pitch drive device 35 is located inside the cutout 313 and is fixedly connected to the flip bracket 312.

[0038] Reference Figure 8 When the wafer is in the bending and slicing state, the support frame 422 moves downward, and the adsorption blocks 411 other than the fixedly connected adsorption block 411 rotate downward under the action of gravity. The multiple second adsorption planes are not coplanar, thereby realizing the slicing of the semiconductor silicon wafer 101.

[0039] Reference Figure 9 Then, the support frame 422 moves upward, supporting multiple adsorption blocks 411. Multiple second adsorption planes are horizontally coplanar, and at this point, they are in a flat, flipped state. (Refer to...) Figure 10 The flipping drive device 311 drives the flipping bracket 312 and multiple variable pitch blocks 321 to rotate around the X horizontal direction. The multiple variable pitch blocks 321 are located above and opposite to the multiple adsorption blocks 411. Then, the adsorption holes 322 on the variable pitch blocks 321 can generate adsorption force, thereby adsorbing and fixing the silicon monolith of the semiconductor silicon wafer 101 of the adsorption block 411. Then, the flipping bracket 312 is driven again to flip to the horizontal state.

[0040] Reference Figure 6 In the variable pitch state, the variable pitch drive device 35 drives the variable pitch block 321 to move outward in the X horizontal direction, increasing the distance between two adjacent variable pitch blocks 321, which in turn increases the gap between each silicon wafer. Then, the flipped and variable pitch silicon wafer can be transferred to the material tray of the unloading device 13 by the suction cup on the robotic arm device 12.

[0041] As can be seen from the above, after the slicing assembly slices the semiconductor silicon wafer, and under the tightening action of the tension spring, the variable pitch blocks are arranged in a narrow spacing. At this time, the variable pitch blocks are made to face the adsorption blocks by the flipping bracket, and then the sliced ​​silicon wafers can be adsorbed. The adsorbed and fixed silicon wafers are flipped again, so that the silicon wafers that were originally facing up are now facing down, which facilitates the welding of the back metal layer. Subsequently, the variable pitch drive device moves multiple variable pitch blocks, and under the limiting action of the limiting plate, the variable pitch blocks are arranged in a wide spacing, which also makes the silicon wafers have a wide spacing, thus facilitating the transfer of wide spacing.

Claims

1. A variable-pitch flipping device for semiconductor silicon wafers, characterized in that, Including flip-up components and variable pitch components; The flipping assembly includes a flipping drive device and a flipping bracket. The flipping drive device is connected to the flipping bracket and drives the flipping bracket to rotate around the X horizontal direction. The flipping bracket is provided with a slide rail extending along the X horizontal direction. The pitch-changing assembly includes a pitch-changing drive device, multiple pitch-changing blocks, a tension spring, and multiple limiting plates. The pitch-changing blocks extend along the X horizontal direction, and the multiple pitch-changing blocks are arranged along the Y horizontal direction. The pitch-changing block located at the end of the X horizontal direction is fixedly connected to the flipping bracket, and the other pitch-changing blocks are movably disposed on the slide rail. The limiting plate is provided with at least two connecting holes, at least one of the connecting holes is a sliding hole extending along the X horizontal direction, and the two connecting holes are respectively connected between two adjacent pitch-changing blocks. The pitch-changing block connected to the sliding hole can move relative to the limiting plate. The tension spring extends along the X horizontal direction, and the two ends of the tension spring are connected between the pitch-changing blocks at both ends of the X horizontal direction. The variable pitch drive device is connected to the variable pitch block located at the other end in the X horizontal direction and drives the variable pitch block to move outward along the X horizontal direction; The variable pitch block is provided with a first adsorption plane extending along the X horizontal direction, the first adsorption plane is provided with a first adsorption hole, the variable pitch block is provided with a first adsorption pipe communicating with the first adsorption hole, and the outer end of the first adsorption pipe is provided with a first interface.

2. The variable pitch flipping device according to claim 1, characterized in that: The limiting piece is provided with at least three connecting holes, at least two of the connecting holes are arranged as sliding holes extending along the X horizontal direction, and the two sliding holes are respectively located at both ends of the limiting piece based on the X horizontal direction.

3. The variable pitch flipping device according to claim 2, characterized in that: Apart from the two sliding holes, the connecting holes are arranged in a circular pattern. The circular holes are connected to the pitch block located in the middle, and the sliding holes on both sides are connected to the pitch blocks on the opposite sides.

4. The variable pitch flipping device according to claim 1, characterized in that: The tension spring is located on the outside of the limiting piece based on the Y-direction.

5. The variable pitch flipping device according to claim 4, characterized in that: The plurality of limiting plates are respectively located at both ends of the pitch block based on the Y horizontal direction, and the two tension springs are respectively located at both ends of the pitch block based on the Y horizontal direction.

6. The variable pitch flipping device according to claim 5, characterized in that: The pitch-changing flipping device includes two pitch-changing drive devices, which are respectively located at both ends of the pitch-changing block based on the Y horizontal direction.

7. The variable pitch flipping device according to claim 1, characterized in that: The pitch block has a fixing hole at its end in the Y horizontal direction, and the fixing hole is connected to the connecting hole by a pin.

8. The variable-pitch flipping device according to any one of claims 1 to 7, characterized in that: The flip bracket is arranged in the shape of a rectangular frame with a cutout in the middle. The first interface is located on the bottom surface of the variable pitch block, and multiple first interfaces face the cutout.

9. The variable pitch flipping device according to claim 8, characterized in that: The variable pitch drive device is located inside the cutout and is fixedly connected to the flip bracket.

10. A slicing device, characterized in that, Includes the variable pitch flipping device and the segmented assembly as described in any one of claims 1 to 9, wherein the segmented assembly includes a bending module, a lifting module and a fixing bracket; The bending module includes multiple adsorption blocks that extend along the Y-axis and are arranged along the X-axis. Each adsorption block has a second adsorption plane extending along the Y-axis and a second adsorption hole. A second adsorption pipe communicating with the second adsorption hole is provided inside the adsorption block, and a second interface is provided at the outer end of the second adsorption pipe. Each adsorption block has a hinge portion at the edge of the second adsorption plane along the X-axis, and the hinge portion extends along the Y-axis. Two hinge portions of two adjacent adsorption blocks that are close to each other are hinged together. The fixed bracket is fixedly connected to one of the adsorption blocks, while the other adsorption blocks rotate around the Y horizontal direction; The lifting module includes a lifting drive device and a support frame. The support frame extends along the X horizontal direction and is located below the plurality of adsorption blocks. The lifting drive device is connected to the support frame and drives the support frame to move along the Z vertical direction. In the bent, segmented state, the support frame moves downwards, and the adsorption blocks other than the fixedly connected adsorption blocks rotate downwards under the action of gravity, and the multiple second adsorption planes are not coplanar; In the flat flipping state, the support frame moves upward to support the plurality of adsorption blocks, the plurality of second adsorption planes are horizontal and coplanar, the flipping drive device drives the flipping bracket and the plurality of variable pitch blocks to rotate around the X horizontal direction, and the plurality of variable pitch blocks are located above the plurality of adsorption blocks and opposite to the plurality of adsorption blocks; In the variable pitch state, the variable pitch driving device drives the variable pitch block to move outward along the X horizontal direction, thereby increasing the distance between two adjacent variable pitch blocks.

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