Liquid cooling heat dissipation device for semiconductor chilling plate

Abstract

The utility model relates to the technical field of semiconductor chilling plate manufacturing, in particular to a liquid cooling heat dissipation device for a semiconductor chilling plate. The liquid cooling heat dissipation device for the semiconductor chilling plate comprises a box body, a heat conduction plate and heat conduction fins. Wherein a cooling liquid flow channel is arranged in the box body, an inlet and an outlet are formed in the box body, and the inlet and the outlet are both communicated with the cooling liquid flow channel, so that cooling liquid can enter the cooling liquid flow channel along the inlet and flow out of the outlet. The heat conduction plate is connected with the box body, heat conduction fins are arranged on the side, facing the box body, of the heat conduction plate, and the heat conduction fins are contained in the cooling liquid flow channel and make contact with the cooling liquid for heat exchange. A containing groove is formed in the side, away from the heat conduction fins, of the heat conduction plate and is configured to contain the semiconductor chilling plate. The liquid cooling heat dissipation device for the semiconductor chilling plate is simple and compact in structure, saves installation space and is convenient to assemble and arrange; and meanwhile, noise pollution can be reduced, and user experience is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor refrigeration piece manufacturing, especially relates to a liquid cooling heat dissipation device for semiconductor refrigeration piece. BACKGROUND

[0002] Semiconductor refrigeration piece is the peltier effect of semiconductor material, when direct current passes through the couple of series connection of two different semiconductor materials, can absorb heat and emit heat at the two ends of the couple respectively, can realize the purpose of refrigeration. Among them, the two ends of the semiconductor absorbing heat and emitting heat are called the cold end and the hot end of the semiconductor. When the cold end and the hot end reach a certain temperature difference, the two heat transfer amounts are equal, and a balance point is reached, and the forward and reverse heat transfer cancels each other out. At this time, the temperature of the cold end and the hot end will not continue to change. In order to make the cold end reach lower temperature, it is necessary to reduce the temperature of the hot end by taking active heat dissipation and other ways.

[0003] In the prior art, the semiconductor refrigeration piece usually adopts the air cooling mode for cooling, and due to the small heat exchange coefficient of air, the volume of the fan is relatively large, and a large installation space is occupied, which is not conducive to the layout of the device. At the same time, the fan will produce a large noise when working, which will affect the user experience.

[0004] Therefore, it is urgent to design a liquid cooling heat dissipation device for semiconductor refrigeration piece to solve the above technical problems. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a liquid cooling heat dissipation device for semiconductor refrigeration piece, which is simple and compact in structure, saves installation space, is convenient to assemble and layout, can reduce noise pollution and improve user experience.

[0006] In order to achieve this purpose, the utility model adopts the following technical scheme:

[0007] The utility model provides a liquid cooling heat dissipation device for semiconductor refrigeration piece, which comprises:

[0008] The box body is provided with a cooling liquid flow channel, an inlet and an outlet are arranged on the box body, and the inlet and the outlet are communicated with the cooling liquid flow channel, so that the cooling liquid can enter the cooling liquid flow channel through the inlet and flow out through the outlet;

[0009] The heat conduction plate is connected with the box body, heat conduction fins are arranged on one side of the heat conduction plate facing the box body, the heat conduction fins are accommodated in the cooling liquid flow channel and are in contact with the cooling liquid for heat exchange;

[0010] The side of the heat conduction plate away from the heat conduction fins is provided with a containing groove, and the containing groove is configured to place the semiconductor refrigeration piece.

[0011] As an optional technical scheme of the liquid cooling heat dissipation device for semiconductor refrigeration sheet, the box is provided with a flange, and the liquid cooling heat dissipation device for semiconductor refrigeration sheet further comprises a fixing piece, which is arranged between the heat conduction plate and the flange.

[0012] As an optional technical scheme of the liquid cooling heat dissipation device for semiconductor refrigeration sheet, a groove is arranged on the flange, and the liquid cooling heat dissipation device for semiconductor refrigeration sheet further comprises a sealing ring arranged in the groove.

[0013] As an optional technical scheme of the liquid cooling heat dissipation device for semiconductor refrigeration sheet, the heat conduction fins are arranged at equal intervals.

[0014] As an optional technical scheme of the liquid cooling heat dissipation device for semiconductor refrigeration sheet, the accommodation groove is coated with heat-conducting silicone grease, and the semiconductor refrigeration sheet is connected in heat conduction with the heat conduction plate through the heat-conducting silicone grease.

[0015] As an optional technical scheme of the liquid cooling heat dissipation device for semiconductor refrigeration sheet, the inlet and the outlet are located on the side of the box away from the heat conduction plate.

[0016] As an optional technical scheme of the liquid cooling heat dissipation device for semiconductor refrigeration sheet, the inlet and the outlet are located on the side of the box away from the heat conduction plate.

[0017] As an optional technical scheme of the liquid cooling heat dissipation device for semiconductor refrigeration sheet, the box is provided with a first buffer part and a second buffer part, one side of the first buffer part is communicated with the inlet, and the other side of the first buffer part is communicated with the cooling liquid flow channel; one side of the second buffer part is communicated with the outlet, and the other side of the second buffer part is communicated with the cooling liquid flow channel.

[0018] As an optional technical scheme of the liquid cooling heat dissipation device for semiconductor refrigeration sheet, the cooling liquid flow channel is arranged in multiple, and the multiple cooling liquid flow channels are communicated in series.

[0019] As an optional technical scheme of the liquid cooling heat dissipation device for semiconductor refrigeration sheet, the box, the heat conduction plate and the heat conduction fin are metal parts, and the heat conduction plate and the heat conduction fin are welded.

[0020] The beneficial effects of the utility model at least include:

[0021] The utility model provides a liquid cooling heat abstractor for semiconductor refrigeration piece, this liquid cooling heat abstractor for semiconductor refrigeration piece includes box, heat conduction board and heat conduction fin. Among them, the cooling liquid flow channel is arranged in the box, and the inlet and outlet are arranged on the box, and the inlet and outlet are communicated with the cooling liquid flow channel, so that the cooling liquid can enter the cooling liquid flow channel along the inlet and flow out from the outlet. The heat conduction board is connected with the box, and the side of the heat conduction board towards the box is provided with heat conduction fin, and the heat conduction fin is accommodated in the cooling liquid flow channel and contacts with the cooling liquid to exchange heat. The side of the heat conduction board away from the heat conduction fin is provided with the accommodation groove, and the accommodation groove is configured to place the semiconductor refrigeration piece.

[0022] Above, the heat on the semiconductor refrigeration piece can be transmitted to the heat conduction fin through the heat conduction board, the cooling liquid can enter the cooling liquid flow channel and contact with the heat conduction fin to exchange heat through the inlet, and then the cooling liquid after absorbing heat flows out through the outlet. The cooling liquid in the cooling liquid flow channel can not only exchange heat with the heat conduction fin, but also contact with the inner wall of the heat conduction board to exchange heat, thereby improving the heat dissipation and cooling effect on the semiconductor refrigeration piece. Compared with the prior art, the liquid cooling heat abstractor for semiconductor refrigeration piece in the utility model is simple and compact, does not need to set the fan and other components in the traditional technology, saves the installation space, and is convenient for assembly and layout. At the same time, the cooling liquid is used to cool the semiconductor refrigeration piece, there is no noise of the fan in the prior art, noise pollution is reduced, and the user experience is improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the description of the embodiments of the utility model will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to the contents of the embodiments of the utility model and these drawings for those skilled in the art without creating labor.

[0024] Figure 1 It is the structure schematic diagram of the liquid cooling heat abstractor for semiconductor refrigeration piece provided in the embodiment one of the utility model;

[0025] Figure 2 It is the explosion drawing of the liquid cooling heat abstractor for semiconductor refrigeration piece provided in the embodiment one of the utility model;

[0026] Figure 3 It is the explosion drawing of the liquid cooling heat abstractor for semiconductor refrigeration piece provided in the embodiment one of the utility model in another visual angle;

[0027] Figure 4 It is the sectional view of the liquid cooling heat abstractor for semiconductor refrigeration piece provided in the embodiment one of the utility model;

[0028] Figure 5This is a schematic diagram of the staggered tooth structure heat-conducting fins provided in Embodiment 1 of this utility model;

[0029] Figure 6 This is a schematic diagram of the heat-conducting plate and the U-shaped heat-conducting fins provided in Embodiment 1 of this utility model;

[0030] Figure 7 This is a schematic diagram of the structure of the liquid cooling heat dissipation device for semiconductor cooling chips provided in Embodiment 2 of this utility model.

[0031] Figure Labels

[0032] 10. Housing; 11. Coolant flow channel; 12. Inlet; 13. Outlet; 14. Flange; 141. Groove; 15. First buffer section; 16. Second buffer section; 20. Heat-conducting plate; 21. Receiving groove; 22. Thermal grease; 30. Heat-conducting fins; 40. Fixing component; 50. Sealing ring;

[0033] 100. Semiconductor cooling chip. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0038] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0041] Example 1

[0042] This embodiment provides a liquid cooling heat dissipation device for semiconductor cooling chips, which has a simple and compact structure, saves installation space, and is easy to assemble and lay out; at the same time, it can reduce noise pollution and improve user experience.

[0043] like Figures 1-4As shown, the liquid cooling heat dissipation device for the thermoelectric cooler mainly includes a housing 10, a heat-conducting plate 20, and heat-conducting fins 30. The housing 10 contains a coolant channel 11, and has an inlet 12 and an outlet 13, both of which are connected to the coolant channel 11, allowing coolant to enter the channel 11 through the inlet 12 and exit through the outlet 13. The heat-conducting plate 20 is connected to the housing 10, and heat-conducting fins 30 are arranged on the side of the heat-conducting plate 20 facing the housing 10. The heat-conducting fins 30 are housed within the coolant channel 11 and exchange heat with the coolant. A receiving groove 21 is provided on the side of the heat-conducting plate 20 away from the heat-conducting fins 30, and the receiving groove 21 is configured to hold the thermoelectric cooler 100.

[0044] Based on the above design, in this embodiment, the heat on the thermoelectric cooler 100 can be transferred to the heat-conducting fins 30 via the heat-conducting plate 20. The coolant enters the coolant channel 11 through the inlet 12 and exchanges heat with the heat-conducting fins 30. After absorbing heat, the coolant flows out through the outlet 13. The coolant in the coolant channel 11 can exchange heat not only with the heat-conducting fins 30 but also with the inner wall of the heat-conducting plate 20, thereby improving the heat dissipation and cooling effect on the thermoelectric cooler 100. Compared with the prior art, the liquid cooling device for the thermoelectric cooler in this embodiment has a simple and compact structure, eliminating the need for components such as fans found in traditional technologies, saving installation space, and facilitating assembly and layout. Furthermore, by using coolant to cool the thermoelectric cooler 100, there is no noise from the fans found in the prior art, reducing noise pollution and improving the user experience.

[0045] like Figure 2 As shown, in this embodiment, the housing 10 is provided with a flange 14, and the liquid cooling heat dissipation device for the semiconductor refrigeration chip also includes a fixing member 40, which passes between the heat-conducting plate 20 and the flange 14. The flange 14 can improve the stability and convenience of the connection between the heat-conducting plate 20 and the housing 10, and improve assembly efficiency. Optionally, the fixing member 40 can be a bolt or other component, and multiple fixing members 40 can be provided.

[0046] Furthermore, in this embodiment, a groove 141 is provided on the flange 14. The liquid cooling heat dissipation device for semiconductor refrigeration chips also includes a sealing ring 50, which is disposed in the groove 141. After the fixing member 40 assembles and connects the heat-conducting plate 20 and the housing 10, the heat-conducting plate 20 and the groove 141 can squeeze the sealing ring 50, causing the sealing ring 50 to deform, thereby improving the sealing performance of the liquid cooling heat dissipation device for semiconductor refrigeration chips and preventing coolant leakage.

[0047] Optionally, multiple grooves 141 can be provided, and each groove 141 is corresponding to a semiconductor cooling chip 100, so as to simultaneously cool and dissipate heat from multiple semiconductor cooling chips 100.

[0048] like Figures 1-4 As shown, in this embodiment, multiple heat-conducting fins 30 can be configured, and the multiple heat-conducting fins 30 are arranged at equal intervals or adjacent heat-conducting fins 30 are staggered, thereby improving the turbulence effect of the heat-conducting fins 30 on the coolant and improving the heat exchange efficiency between the coolant and the heat-conducting fins 30.

[0049] Optionally, the heat-conducting fins 30 in this embodiment can be configured in various structural forms, for example, configured as follows: Figure 5 The staggered tooth structure or Figure 6 The U-shaped structure is used. Of course, operators can also configure the heat-conducting fins 30 to other structural types.

[0050] Optionally, in this embodiment, the receiving groove 21 is coated with thermally conductive silicone grease 22, and the thermoelectric cooler 100 is thermally connected to the heat-conducting plate 20 through the thermally conductive silicone grease 22. The application of thermally conductive silicone grease 22 can improve the heat transfer efficiency between the thermoelectric cooler 100 and the heat-conducting plate 20, thereby improving the cooling effect of the coolant on the thermoelectric cooler 100.

[0051] like Figures 1-4 As shown, the inlet 12 and outlet 13 on the housing 10 are both located on the side of the housing 10 away from the heat-conducting plate 20. Furthermore, both the inlet 12 and outlet 13 are arranged vertically to avoid interference with the operator's actions of handling the thermoelectric cooler 100. This also saves lateral space in the liquid cooling device for the thermoelectric cooler, facilitating assembly. It is understandable that... Figure 4 The arrows in the diagram indicate the direction of coolant flow.

[0052] Optionally, in this embodiment, the coolant flow channel 11 can be configured as multiple channels, and the multiple coolant flow channels 11 are connected in series to improve the heat exchange efficiency between the coolant and the heat-conducting fins 30. Of course, the coolant flow channel 11 can also be configured as a single channel.

[0053] Optionally, in this embodiment, the housing 10, heat-conducting plate 20, and heat-conducting fins 30 are all metal parts, thereby facilitating heat exchange between the coolant and the semiconductor cooling chip 100. Exemplarily, the housing 10, heat-conducting plate 20, and heat-conducting fins 30 can all be made of materials such as stainless steel or aluminum alloy. The heat-conducting plate 20 and the heat-conducting fins 30 are welded together to improve their stability and prevent the heat-conducting fins 30 from falling off under the influence of the coolant.

[0054] Example 2

[0055] like Figure 7As shown, this embodiment provides a liquid cooling heat dissipation device for semiconductor refrigeration chips. The main difference between this embodiment and Embodiment 1 is that the inlet 12 and outlet 13 are both located on the side of the housing 10. That is, the inlet 12 and outlet 13 are positioned horizontally within the housing 10, allowing the liquid cooling heat dissipation device for semiconductor refrigeration chips to be placed on a horizontal work platform without interfering with the pipe connections of the inlet 12 and outlet 13. This facilitates the installation and layout of the liquid cooling heat dissipation device for semiconductor refrigeration chips.

[0056] like Figure 7 As shown, in this embodiment, the housing 10 is provided with a first buffer section 15 and a second buffer section 16. One side of the first buffer section 15 is connected to the inlet 12, and the other side is connected to the coolant flow channel 11. One side of the second buffer section 16 is connected to the outlet 13, and the other side is connected to the coolant flow channel 11. The arrangement of the first buffer section 15 and the second buffer section 16 can improve the buffering effect on the coolant. The cross-sectional area of ​​the first buffer section 15 is larger than that of the inlet 12, and the cross-sectional area of ​​the second buffer section 16 is larger than that of the outlet 13. This can slow down the flow rate of the coolant, thereby reducing the scouring force of the coolant on the heat-conducting fins 30, extending the service life of the heat-conducting fins 30, and saving costs.

[0057] The remaining structures of the liquid cooling heat dissipation device for the semiconductor refrigeration chip in this embodiment are the same as those in Embodiment 1, and will not be described in detail here.

[0058] Obviously, the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

[0059] Note that in the description of this specification, the references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A liquid-cooled heat dissipation device for semiconductor refrigeration chips, characterized in that, include: A housing (10) is provided with a coolant flow channel (11) inside the housing (10). The housing (10) is provided with an inlet (12) and an outlet (13). The inlet (12) and the outlet (13) are both connected to the coolant flow channel (11) so that the coolant can enter the coolant flow channel (11) along the inlet (12) and flow out from the outlet (13). A heat-conducting plate (20) is connected to the housing (10). A heat-conducting fin (30) is provided on the side of the heat-conducting plate (20) facing the housing (10). The heat-conducting fin (30) is housed in the coolant flow channel (11) and exchanges heat with the coolant. The heat-conducting plate (20) has a receiving groove (21) on the side opposite to the heat-conducting fins (30), and the receiving groove (21) is configured to hold a semiconductor cooling chip (100).

2. The liquid cooling heat dissipation device for semiconductor refrigeration chips according to claim 1, characterized in that, The housing (10) is provided with a flange (14), and the liquid cooling heat dissipation device for the semiconductor cooling chip also includes a fixing member (40), which passes through the heat-conducting plate (20) and the flange (14).

3. The liquid cooling heat dissipation device for semiconductor cooling chips according to claim 2, characterized in that, The flange (14) is provided with a groove (141), and the liquid cooling heat dissipation device for semiconductor cooling chip also includes a sealing ring (50), which is disposed in the groove (141).

4. The liquid cooling heat dissipation device for semiconductor refrigeration chips according to claim 1, characterized in that, The heat-conducting fins (30) are configured in multiple ways, and the multiple heat-conducting fins (30) are arranged at equal intervals.

5. The liquid cooling heat dissipation device for semiconductor refrigeration chips according to claim 1, characterized in that, The receiving groove (21) is coated with thermal grease (22), and the semiconductor cooling chip (100) is thermally connected to the heat-conducting plate (20) through the thermal grease (22).

6. The liquid cooling heat dissipation device for semiconductor refrigeration chips according to claim 1, characterized in that, The inlet (12) and the outlet (13) are both located on the side of the housing (10) away from the heat-conducting plate (20).

7. The liquid cooling heat dissipation device for semiconductor refrigeration chips according to claim 1, characterized in that, The inlet (12) and the outlet (13) are both located on the side of the box (10).

8. The liquid cooling heat dissipation device for semiconductor refrigeration chips according to claim 7, characterized in that, The housing (10) is provided with a first buffer section (15) and a second buffer section (16). One side of the first buffer section (15) is connected to the inlet (12), and the other side of the first buffer section (15) is connected to the coolant flow channel (11). One side of the second buffer section (16) is connected to the outlet (13), and the other side of the second buffer section (16) is connected to the coolant flow channel (11).

9. The liquid-cooled heat dissipation device for a semiconductor refrigeration chip according to any one of claims 1-8, characterized in that, The coolant flow channel (11) is configured as multiple channels, and the multiple coolant flow channels (11) are connected in series sequentially.

10. The liquid-cooled heat dissipation device for a semiconductor refrigeration chip according to any one of claims 1-8, characterized in that, The housing (10), the heat-conducting plate (20), and the heat-conducting fins (30) are all metal parts, and the heat-conducting plate (20) and the heat-conducting fins (30) are welded together.

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