Double-sided metalized miniature aluminum nitride refrigeration sheet and refrigeration module

Abstract

The utility model provides a double-sided metalized miniature aluminum nitride refrigeration sheet and refrigeration module, the refrigeration sheet comprises a cold-side ceramic sheet, a hot-side ceramic sheet and a semiconductor refrigeration NP element, the cold-side ceramic sheet and the hot-side ceramic sheet are made of aluminum nitride ceramic, the cold-side ceramic sheet, the hot-side ceramic sheet and the semiconductor refrigeration NP element are integrally formed by welding, and the cold-side ceramic sheet, the hot-side ceramic sheet and the semiconductor refrigeration NP element are made of aluminum nitride ceramic. A first metal layer is arranged on the upper surface of the cold-surface ceramic wafer, a second metal layer is arranged on the lower surface of the hot-surface ceramic wafer, the corresponding area proportion of the first metal layer and the upper surface of the cold-surface ceramic wafer and the corresponding area proportion of the second metal layer and the lower surface of the hot-surface ceramic wafer both exceed a preset proportion, and the value range of the preset proportion is larger than 50%. The aluminum nitride ceramic is adopted, the overall hardness and strength of the refrigeration sheet can be effectively improved, cracking and deformation are not prone to occurring, and the metal layers are arranged on the upper surface and the lower surface, so that the overall occupied area of the refrigeration sheet is reduced as much as possible while the heat conduction effect is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to photoelectric display technical field, concretely relates to a kind of double-sided metallized miniature aluminum nitride cooling sheet and refrigeration module. BACKGROUND

[0002] Miniature cooling sheet is specially designed for small size and high voltage input application, assembled with high-strength bismuth telluride thermoelectric material and high-thermal-conductivity high-insulation ceramic substrate, suitable for high-voltage, low-current, small-size application occasions. At present, the technology of miniature semiconductor cooling sheet is developing continuously, and its application prospect is also very broad. However, the current miniature semiconductor cooling sheet has the problems of inconvenient packaging and easy deformation. SUMMARY

[0003] In view of the above problems, the present application provides a double-sided metallized miniature aluminum nitride cooling sheet and refrigeration module, to solve the problems of the existing cooling sheet packaging inconvenience and easy deformation.

[0004] To achieve the above purpose, in the first aspect, the utility model provides a double-sided metallized miniature aluminum nitride cooling sheet, comprising a cold face ceramic sheet, a hot face ceramic sheet and a semiconductor cooling NP element, the semiconductor cooling NP element is arranged between the cold face ceramic sheet and the hot face ceramic sheet, the material of the cold face ceramic sheet and the hot face ceramic sheet is aluminum nitride ceramic, the cold face ceramic sheet, the hot face ceramic sheet and the semiconductor cooling NP element are integrally formed by welding, the upper surface of the cold face ceramic sheet is provided with a first metal layer, the lower surface of the hot face ceramic sheet is provided with a second metal layer, the area ratio of the first metal layer corresponding to the upper surface of the cold face ceramic sheet and the area ratio of the second metal layer corresponding to the lower surface of the hot face ceramic sheet both exceed a preset proportion, and the value range of the preset proportion is greater than 50%.

[0005] Optionally, the upper surface of the cold face ceramic sheet and / or the lower surface of the hot face ceramic sheet is further provided with a moisture-proof sealing layer.

[0006] Optionally, the moisture-proof sealing layer is made of RTV silicone.

[0007] Optionally, the area ratio of the first metal layer corresponding to the upper surface of the cold face ceramic sheet exceeding the preset proportion comprises that the shape of the upper surface of the cold face ceramic sheet is a first rectangle, the coverage area of the first metal layer is a first octagon obtained by removing the four corners of the first rectangle, and the area ratio of the first octagon to the first rectangle is greater than the preset proportion.

[0008] Optionally, the area ratio of the second metal layer to the lower surface of the hot surface ceramic sheet exceeds the preset ratio, including that the lower surface of the hot surface ceramic sheet is a second rectangle, the covering area of the second metal layer is a second octagon obtained by removing four corners of the second rectangle, and the area ratio of the second octagon to the second rectangle is greater than the preset ratio.

[0009] Optionally, the preset ratio is in a range of 70% to 95%.

[0010] Optionally, the welding mode between the cold surface ceramic sheet, the hot surface ceramic sheet and the semiconductor refrigeration NP element is tin welding.

[0011] Optionally, the material of the first metal layer and the second metal layer is copper.

[0012] In a second aspect, the utility model also provides a refrigeration module, including:

[0013] A pipe seat;

[0014] A refrigeration sheet, which is a double-sided metallized micro aluminum nitride refrigeration sheet as described in the first aspect of the utility model, and the refrigeration sheet is tin welded with the pipe seat.

[0015] Optionally, the pipe seat is provided with a containing groove, the size of the containing groove is matched with the size of the refrigeration sheet, and the refrigeration sheet is arranged in the containing groove.

[0016] Different from the prior art, the above technical solution provides a double-sided metallized micro aluminum nitride refrigeration sheet and a refrigeration module, the refrigeration sheet includes a cold surface ceramic sheet, a hot surface ceramic sheet and a semiconductor refrigeration NP element, the material of the cold surface ceramic sheet and the hot surface ceramic sheet is aluminum nitride ceramic, the cold surface ceramic sheet, the hot surface ceramic sheet and the semiconductor refrigeration NP element are integrally formed by welding, the upper surface of the cold surface ceramic sheet is provided with a first metal layer, the lower surface of the hot surface ceramic sheet is provided with a second metal layer, the area ratio of the first metal layer to the upper surface of the cold surface ceramic sheet and the area ratio of the second metal layer to the lower surface of the hot surface ceramic sheet both exceed a preset ratio, and the preset ratio is greater than 50%. The use of aluminum nitride ceramic can effectively increase the hardness and strength of the refrigeration sheet as a whole, and the refrigeration sheet is not prone to cracking and deformation, the metal layer arranged on the upper and lower surfaces can play a heat conduction role and reduce the occupied area of the refrigeration sheet as much as possible.

[0017] The above utility model content related record is only the summary of the technical scheme of the application, in order to let the ordinary skilled person in the art can more clearly understand the technical scheme of the application, then can be implemented according to the content of the description and the drawings, and in order to let the above-mentioned purpose of the application and other purposes, characteristics and advantages can be more easily understood, the following combining the specific embodiment of the application and the drawings are described. Attached Figure Description

[0018] The accompanying drawings are only used to illustrate the principles, implementation methods, applications, features, and effects of specific embodiments of this application and other related content, and should not be considered as limitations on this application.

[0019] In the accompanying drawings of the instruction manual:

[0020] Figure 1 This is a schematic diagram of the structure of a double-sided metallized micro aluminum nitride refrigeration chip according to an exemplary embodiment of this application;

[0021] Figure 2 This is a schematic diagram of the structure of the lower surface of the hot-faced ceramic sheet according to an exemplary embodiment of this application;

[0022] Figure 3 This is a schematic diagram of the structure of a refrigeration module according to an exemplary embodiment of this application;

[0023] Figure 4 This is a cross-sectional view of a cooling module according to an exemplary embodiment of this application;

[0024] Explanation of reference numerals in the attached figures:

[0025] 10. Cooling element;

[0026] 101. Cold-drying ceramic sheet;

[0027] 102. Hot-surface ceramic sheet;

[0028] 103. Semiconductor cooling NP element;

[0029] 104. First metal layer;

[0030] 105. Second metal layer;

[0031] 20. Tube seat. Detailed Implementation

[0032] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0033] The term "embodiment" is mentioned herein means that the specific features, structures, or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The term "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit the independence or association between other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, each technical feature mentioned in each embodiment can be combined in any way to form a corresponding implementable technical solution.

[0034] Unless otherwise defined, the meaning of technical terms used herein is the same as commonly understood by one of ordinary skill in the art to which this application belongs; the use of related terms in the present application is only for the purpose of describing specific embodiments, and is not intended to limit the present application.

[0035] In the description of the present application, the phrase "and / or" is a description of the logical relationship between the objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally represents that the associated objects before and after are a "or" logical relationship.

[0036] In the present application, such as "first" and "second", the terms are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual quantity, primary and secondary or order relationship between the entities or operations.

[0037] In the present application, without more limitation, the "include", "contain", "have" or other similar expressions used in the sentence are intended to cover non-exclusive inclusion, and these expressions do not exclude the presence of other elements in the process, method or product including the described elements, so that the process, method or product including a series of elements can not only include those limited elements, but also include other elements not explicitly listed, or also include the elements inherent in such process, method or product.

[0038] In the present application, "greater than", "less than", "exceed" and other expressions are understood as not including the number; "above", "below", "within" and other expressions are understood as including the number. In addition, in the description of the embodiments of the present application, the meaning of "multiple" is more than two (including two), and similar expressions related to "multiple" are also understood in this way, for example, "multiple groups", "multiple times" and the like, unless otherwise explicitly limited.

[0039] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0040] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0041] In the first aspect, such as Figures 1-2 As shown, this utility model provides a double-sided metallized micro aluminum nitride refrigeration chip 10, including a cold-side ceramic chip 101, a hot-side ceramic chip 102, and a semiconductor refrigeration NP element 103. The semiconductor refrigeration NP element 103 is disposed between the cold-side ceramic chip 101 and the hot-side ceramic chip 102. The cold-side ceramic chip 101 and the hot-side ceramic chip 102 are made of aluminum nitride ceramic. The cold-side ceramic chip 101, the hot-side ceramic chip 102, and the semiconductor refrigeration NP element 103 are integrally formed by welding. A first metal layer 104 is disposed on the upper surface of the cold-side ceramic chip 101, and a second metal layer 105 is disposed on the lower surface of the hot-side ceramic chip 102. The area ratio of the first metal layer 104 to the upper surface of the cold-side ceramic chip 101 and the area ratio of the second metal layer 105 to the lower surface of the hot-side ceramic chip 102 both exceed a preset ratio, and the value range of the preset ratio is greater than 50%.

[0042] In this application, the cold-side ceramic sheet 101 and the hot-side ceramic sheet 102 are made of aluminum nitride ceramic, which can meet the requirements of refrigeration performance, reliability, mechanical strength, corrosion resistance, and other aspects. Aluminum nitride ceramic has the following advantages:

[0043] (1) High thermal conductivity: Aluminum nitride ceramics have high thermal conductivity, which can dissipate heat more effectively, thereby improving the cooling efficiency of micro-cooling chips.

[0044] (2) Low coefficient of thermal expansion: The coefficient of thermal expansion of aluminum nitride ceramics is lower than that of aluminum oxide, so it is more suitable to be used with refrigeration chips, which can effectively reduce the problems of thermal stress and thermal cracking caused by the mismatch of thermal expansion coefficients.

[0045] (3) Good chemical stability: Aluminum nitride ceramics have good chemical stability and can withstand corrosion from various chemical media such as acids, alkalis and organic solvents, thereby extending the service life of the micro-cooling chip.

[0046] (4) High mechanical strength: Aluminum nitride ceramics have high mechanical strength and hardness, and are not prone to cracking and deformation, which can ensure the stability and reliability of micro-cooling chips.

[0047] In this application, the fabrication of the micro-cooling chip can employ micro-nano fabrication techniques, such as photolithography, thin film deposition, and ion implantation. Simultaneously, it is necessary to ensure the precision and consistency of the fabrication process, as well as to reduce defects and contamination generated during the process. Therefore, in the production of aluminum nitride ceramics, this application employs advanced photoresist films in the production process, using a high-precision exposure machine for alignment and development, achieving line alignment accuracy control within ±10µm and line width and spacing tolerance control within 10%.

[0048] The above solution uses aluminum nitride ceramic, which can effectively increase the overall hardness and strength of the cooling chip, making it less prone to cracking and deformation. By setting metal layers on the upper and lower surfaces, the overall area occupied by the cooling chip is minimized while providing heat conduction.

[0049] In some embodiments, the upper surface of the cold-side ceramic sheet 101 and / or the lower surface of the hot-side ceramic sheet 102 are further provided with a moisture-proof sealing layer. Preferably, the moisture-proof sealing layer is made of RTV silicone.

[0050] The encapsulation of micro-cooling chips needs to ensure stability and reliability, while also considering heat dissipation. To avoid reduced cooling performance and potential electrochemical corrosion of the cooling materials, thermoelectric coolers need to be moisture-proof. When the temperature drops below the dew point, to prevent moisture from penetrating the cooler, a moisture-proof sealing layer can be provided on the upper surface of the cold-side ceramic plate 101 and / or the lower surface of the hot-side ceramic plate 102. This moisture-proof protective layer should surround the thermoelectric cooler and be installed between the heat sink and the object being cooled. Electronic-grade RTV silicone is used as the moisture-proof protective layer for the thermoelectric cooler. Deformable closed-cell foam insulating tape or sheet material, appropriately combined with RTV to fill the gaps, can be used to form a protective layer between the object being cooled and the heat sink.

[0051] In some embodiments, the area ratio of the first metal layer 104 to the upper surface of the cold ceramic sheet 101 exceeding a preset ratio includes: the upper surface of the cold ceramic sheet 101 is a first rectangle, the coverage area of ​​the first metal layer 104 is a first octagon obtained by removing the four corners of the first rectangle, and the area ratio of the first octagon to the first rectangle is greater than the preset ratio.

[0052] In other embodiments, the area ratio of the second metal layer 105 to the lower surface of the hot-surface ceramic sheet 102 exceeds a preset ratio, including: the lower surface of the hot-surface ceramic sheet 102 is a second rectangle, the coverage area of ​​the second metal layer 105 is a second octagon obtained by removing the four corners of the second rectangle, and the area ratio of the second octagon to the second rectangle is greater than the preset ratio.

[0053] Preferably, the preset ratio ranges from 70% to 95%.

[0054] In short, the miniature aluminum nitride refrigeration chip involved in this utility model is a finished product assembled by welding a double-sided metallized aluminum nitride substrate and semiconductor PN particles at high temperature. The hot and cold sides of the finished product contain metal layers, and the area of ​​the metal layers exceeds a certain proportion. This can solve the problem of inconvenient packaging of refrigeration chips due to space limitations while ensuring heat conduction.

[0055] In some embodiments, the welding method between the cold-side ceramic sheet 101, the hot-side ceramic sheet 102, and the semiconductor cooling NP element 103 is tin soldering. Tin soldering is a method of joining metal materials, mainly using tin (Sn) or tin alloy as filler material. After being heated and melted, it is filled between the metals being welded, and after cooling and solidification, a strong connection is formed.

[0056] In some embodiments, the first metal layer 104 and the second metal layer 105 are made of copper.

[0057] In the second aspect, such as Figures 3-4 As shown, this application also provides a cooling module, including:

[0058] tube seat 20;

[0059] The cooling chip is a double-sided metallized micro aluminum nitride cooling chip 10 as described in the first aspect of this application, and the cooling chip is soldered to the tube seat 20 by tin.

[0060] In some embodiments, the tube socket 20 is provided with a receiving groove, the size of which is adapted to the size of the cooling chip, and the cooling chip is disposed within the receiving groove. By providing a receiving groove on the tube socket, the spatial area of ​​the cooling module can be further reduced, making the cooling module more miniaturized.

[0061] This application has the following advantages:

[0062] (1) Aluminum nitride is used as the core cooling chip material, which has high thermal conductivity. The thermal conductivity of the new aluminum nitride ceramic substrate can be above 170W, while the thermal conductivity of the alumina ceramic substrate is about 15-35W / (m·K). Compared with traditional alumina ceramic materials, the thermal conductivity of the new aluminum nitride is 5 times higher. The aluminum nitride ceramic substrate has good high temperature resistance, can adapt to more complex working environments, and ensures stable cooling efficiency.

[0063] (2) The cooling chip of this application adopts a unique double-sided metallization process. One side of the metal layer can achieve efficient heat conduction, while the other side is conducive to stable circuit connection. Compared with similar products with traditional single-sided metallization or no metallization, it can accelerate the heat transfer speed by 5-10 times. Aluminum nitride (AIN) ceramic has high thermal conductivity (theoretical thermal conductivity is 320 W·m-1·K-1, which is about 10 times that of alumina ceramic), and aluminum nitride has relatively low dielectric constant and dielectric loss. It has a series of excellent properties such as thermal expansion coefficient that matches that of chip materials such as silicon and gallium arsenide, non-toxicity, and insulation, which can greatly improve the overall cooling efficiency.

[0064] (3) This application innovatively designs the cooling chip to be miniature in size. By optimizing the internal microstructure layout, the volume is reduced while maintaining the required cooling capacity. It also reduces the overall space occupancy of the module and makes it easier to integrate into various small devices with strict space requirements.

[0065] Furthermore, thanks to its unique material combination and structure, this application enables the cooling element to achieve a minimum cooling temperature of -70 to -90°C under given voltage and current conditions. In comparison, the minimum cooling temperature of alumina cooling elements is approximately -50 to -70°C. The aluminum nitride cooling element lowers the temperature by about 20 to 30°C compared to traditional alumina cooling elements, thus meeting the stringent requirements of low-temperature applications. Simultaneously, this application utilizes advanced processes to ensure the uniformity of the double-sided metallization layer, resulting in a more uniform surface temperature distribution for the cooling element. The temperature difference can be controlled within ±0.025°C, effectively avoiding problems such as unstable device performance caused by localized temperature differences.

[0066] The cooling module of this application also features a standardized interface and a compact miniature structure, facilitating flexible integration with various systems. Whether embedded in smart wearable devices or miniaturized industrial testing equipment, it can quickly achieve cooling function integration, significantly saving R&D and adaptation time. Due to its miniature and efficient characteristics, this cooling module can be widely used in various fields such as heat dissipation of microelectronic devices, constant temperature control of high-precision optical instruments, and local cooling for biomedical sample preservation, broadening the relatively limited application scope of traditional cooling chips and modules.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A double-sided metallized micro aluminum nitride refrigeration chip, characterized in that, The device includes a cold-side ceramic sheet, a hot-side ceramic sheet, and a semiconductor cooling NP element. The semiconductor cooling NP element is disposed between the cold-side and hot-side ceramic sheets. The cold-side and hot-side ceramic sheets are made of aluminum nitride ceramic. The cold-side, hot-side, and semiconductor cooling NP elements are integrally formed by welding. A first metal layer is disposed on the upper surface of the cold-side ceramic sheet, and a second metal layer is disposed on the lower surface of the hot-side ceramic sheet. The area ratio of the first metal layer to the upper surface of the cold-side ceramic sheet and the area ratio of the second metal layer to the lower surface of the hot-side ceramic sheet both exceed a preset ratio, and the preset ratio is greater than 50%.

2. The double-sided metallized micro aluminum nitride refrigeration chip as described in claim 1, characterized in that, The upper surface of the cold-side ceramic sheet and / or the lower surface of the hot-side ceramic sheet are further provided with a moisture-proof sealing layer.

3. The double-sided metallized micro aluminum nitride refrigeration chip as described in claim 2, characterized in that, The moisture-proof sealing layer is made of RTV silicone.

4. The double-sided metallized micro aluminum nitride refrigeration chip as described in claim 1, characterized in that, The area ratio of the first metal layer to the upper surface of the cold ceramic sheet exceeds the preset ratio as follows: the upper surface of the cold ceramic sheet is a first rectangle, the coverage area of ​​the first metal layer is a first octagon obtained by removing the four corners of the first rectangle, and the area ratio of the first octagon to the first rectangle is greater than the preset ratio.

5. The double-sided metallized micro aluminum nitride refrigeration chip as described in claim 1, characterized in that, The area ratio of the second metal layer to the lower surface of the hot-surface ceramic sheet exceeds the preset ratio as follows: the shape of the lower surface of the hot-surface ceramic sheet is a second rectangle, the coverage area of ​​the second metal layer is a second octagon obtained after removing the four corners of the second rectangle, and the area ratio of the second octagon to the second rectangle is greater than the preset ratio.

6. The double-sided metallized micro aluminum nitride refrigeration chip as described in claim 4 or 5, characterized in that, The preset ratio ranges from 70% to 95%.

7. The double-sided metallized micro aluminum nitride refrigeration chip as described in claim 1, characterized in that, The welding method between the cold-side ceramic sheet, the hot-side ceramic sheet, and the semiconductor refrigeration NP element is tin soldering.

8. The double-sided metallized micro aluminum nitride refrigeration chip as described in claim 1, characterized in that, The first and second metal layers are made of copper.

9. A refrigeration module, characterized in that, include: tube seat; The cooling chip is a double-sided metallized micro aluminum nitride cooling chip as described in any one of claims 1-8, wherein the cooling chip is soldered to the tube socket by tin.

10. The refrigeration module as described in claim 9, characterized in that, The tube seat is provided with a receiving groove, the size of which is adapted to the size of the cooling chip, and the cooling chip is disposed in the receiving groove.

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