Novel wafer purging disc and device

Abstract

The utility model discloses a novel wafer purging disc and device, and relates to the technical field of semiconductor manufacturing, and the novel wafer purging disc comprises a purging disc body; an air inlet cavity channel, a central purging cavity and a plurality of annular cavity channels are formed in the purging disc body; the central purging cavity is formed in the central position in the purging disc body; one end of the air inlet channel is communicated with the central purging cavity, and the other end of the air inlet channel extends out of the purging disc body; the plurality of annular cavity channels are arranged around the central purging cavity and are sequentially distributed at intervals from the center of the purging disc body to the outside; the central purging cavity is communicated with the innermost annular cavity channel; the adjacent annular cavities are connected and communicated; and air outlet holes which are respectively communicated with the central purging cavity and the annular cavity channel are correspondingly formed in positions, corresponding to the central purging cavity and the annular cavity channel, on one side surface of the purging disc body. The design effectively solves the problem that dust particles on the surface of the wafer, especially at the center position, are difficult to be completely swept.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a novel wafer blow-out disk and apparatus. Background Technology

[0002] Wafer purging is a crucial process in semiconductor manufacturing. Before entering the vacuum coating chamber, wafers may be exposed to air for a period of time, accumulating dust particles and moisture on their surface. Wafer purging effectively reduces the impact of these impurities on coating quality. It involves cleaning and pre-treating the wafer surface using specific gases (such as high-purity nitrogen or argon).

[0003] Existing wafer purging mechanisms such as Figure 6 As shown, the adapter flange welding pipe (20) extends into the cavity through a pre-drilled hole and is connected to the main purging air pipe (40) via a compression fitting. The adapter flange welding pipe (20) and the outer surface of the cavity are sealed by a central support (10) with an O-ring and a hook screw (30). When the wafer passes through the cavity, the purging gas enters the main purging air pipe (40) through the adapter flange welding pipe (20). The main purging air pipe (40) has multiple ventilation holes, allowing the purging gas to be released into the cavity to purify the wafer. However, research has revealed that the purging performance of this wafer purging mechanism is insufficient. Dust particles on the wafer surface, especially in the center, are difficult to completely remove, and the particles remain suspended in the cavity, affecting the cleanliness of the cavity environment. Therefore, a new solution is urgently needed to address these issues. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a novel wafer blowing disk and device to solve the technical problems that the existing wafer blowing mechanism has insufficient blowing performance, and that it is difficult to completely blow away dust particles on the wafer surface, especially in the center, and that the particles will be suspended in the cavity, affecting the cleanliness of the cavity environment.

[0005] To achieve the above technical objectives, this application provides a novel wafer blow pad, including a blow pad body;

[0006] The purge disc body is provided with an air inlet channel, a central purge chamber, and multiple annular channels;

[0007] The central purging chamber is located at the center of the purging disk body;

[0008] One end of the air intake channel is connected to the central purge chamber, and the other end extends out of the purge disk body;

[0009] Multiple annular channels are arranged around the central purge chamber and are distributed sequentially at intervals outward from the center of the purge disk body;

[0010] The center purge cavity is communicated with the innermost annular cavity;

[0011] The adjacent annular cavities are connected and communicated;

[0012] Corresponding to the position of the center purge cavity and the annular cavity on one side of the purge disc body, a gas outlet hole is arranged for respectively communicating the center purge cavity and the annular cavity.

[0013] Further, the purge disc body comprises a purge support and a cover plate;

[0014] The gas inlet cavity, the center purge cavity and the plurality of annular cavities are arranged on one side of the purge support;

[0015] The cover plate is detachably covered on one side of the purge support to close the gas inlet cavity, the center purge cavity and the plurality of annular cavities;

[0016] The gas outlet hole is arranged on the cover plate.

[0017] Further, a first connecting structure is arranged on one side of the purge support;

[0018] The cover plate is provided with a second connecting structure corresponding to the first connecting structure;

[0019] The first connecting structure and the second connecting structure are detachably connected, or are detachably connected through a fastener.

[0020] Further, the first connecting structure is a threaded hole;

[0021] The second connecting structure is a through hole;

[0022] The fastener passes through the through hole and is connected with the threaded hole, for fastening the cover plate and the purge support together.

[0023] Further, a gap is formed between the first end and the second end of each annular cavity, for avoiding the gas inlet cavity;

[0024] The center purge cavity is communicated with the first end of the innermost annular cavity;

[0025] The adjacent annular cavities are connected and communicated.

[0026] Further, a fixing lug is arranged on the outer periphery of the purge disc body;

[0027] The fixing lug is provided with a fixing hole.

[0028] Further, the fixing lug is a plurality of, and is uniformly distributed around the circumference of the outer periphery of the purge disc body.

[0029] The application also discloses a novel wafer blowing device, which comprises a device body, an air inlet pipe assembly and the novel wafer blowing disc.

[0030] The device body is internally provided with a chamber.

[0031] The chamber is internally provided with a fixing table for fixing wafer pieces.

[0032] The novel wafer blowing disc is arranged in the chamber and located at one side of the fixing table, and is used for blowing the wafer pieces on the fixing table.

[0033] One end of the air inlet pipe assembly extends into the chamber and is in communication with an air inlet channel on a blowing disc body of the novel wafer blowing disc.

[0034] Further, the device body is provided with a pipe hole through which the air inlet pipe assembly passes.

[0035] The pipe hole is provided with a sealing ring, which is used for sealingly connecting the air inlet pipe assembly and the inner wall of the pipe hole or sealingly connecting the air inlet pipe assembly and the end face of the pipe hole.

[0036] Further, the sectional area of the air inlet pipe of the air inlet pipe assembly is greater than the total sectional area of the air outlet holes on the novel wafer blowing disc.

[0037] As can be seen from the above technical solution, the novel wafer blowing disc designed by the application has an internal air path design of a central blowing cavity and a plurality of annular cavities arranged around the central blowing cavity and spaced apart along the center of the blowing disc body, blowing gas first enters the central blowing cavity through the air inlet channel, and then sequentially enters the annular cavities from the central blowing cavity, so that the wafer pieces are blown from the center to the outside, the design has good blowing performance, and the blowing cleanliness meets the requirements; the technical problem that dust particles on the surface of the wafer piece, especially at the central position, are difficult to be completely blown clean, and the particles are suspended in the cavity, affecting the cleanliness of the cavity environment, is effectively solved. BRIEF DESCRIPTION OF DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0039] Figure 1 It is a front view of a novel wafer blowing disc provided in the application.

[0040] Figure 2 It isFigure 1 A-A direction cross-sectional view;

[0041] Figure 3 A new wafer purge device provided in the present application is a front view of a purge support;

[0042] Figure 4 A new wafer purge device provided in the present application is a front view;

[0043] Figure 5 A new wafer purge device provided in the present application is a front view; Figure 4 B-B direction cross-sectional view;

[0044] Figure 6 A new wafer purge device provided in the present application is a front view of a purge support;

[0045] Figures 1-5 In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. DETAILED DESCRIPTION

[0046] The technical solutions of the embodiments of the present application will be described below in conjunction with the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0047] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0048] In the description of the embodiments of the present application, it should be noted that unless specifically defined and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be replaceably connected, or it can be integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0049] The embodiments of the present application disclose a new wafer purge disc and device.

[0050] Please refer to Figure 1 , Figure 2 and Figure 5 An embodiment of a new wafer purge disc provided in the embodiments of the present application comprises:

[0051] The purge disc body 100.

[0052] The purge disc body 100 is provided with an air inlet channel 11, a central purge cavity 12 and a plurality of annular channels 13.

[0053] The central purge cavity 12 is arranged at the central position inside the purge disc body 100; one end of the air inlet channel 11 is in communication with the central purge cavity 12, and the other end extends out of the purge disc body 100 for external air source.

[0054] The plurality of annular channels 13 are arranged around the central purge cavity 12 and are sequentially and spacedly distributed outward along the center of the purge disc body 100.

[0055] The central purge cavity 12 is in communication with the innermost annular channel 13, and the adjacent annular channels 13 are connected in communication.

[0056] On one side of the purge disc body 100, corresponding to the positions of the central purge cavity 12 and the annular channels 13, air outlet holes 21 in communication with the central purge cavity 12 and the annular channels 13 are respectively arranged. The air outlet holes 21 corresponding to the annular channels 13 can be arrayed along the annular channels 13, and finally arranged in a ring array. Based on this, the air outlet holes 21 corresponding to the central purge cavity 12 can also be designed to be arranged in a ring array, which is not limited in particular.

[0057] The new wafer purge disc designed in the present application has an internal air path design of the central purge cavity 12 and the plurality of annular channels 13 arranged around the central purge cavity 12 and sequentially and spacedly distributed outward along the center of the purge disc body 100. The purge gas first enters the central purge cavity 12 through the air inlet channel 11, and then sequentially enters the annular channels 13 from the central purge cavity 12, so as to realize the purge of the wafer piece 500 from the center outward.

[0058] Since the central purge cavity 12 corresponds to the gas outlet hole 21 more concentrated than the annular cavity 13 corresponding to the gas outlet hole 21, the gas pressure at the gas outlet hole 21 corresponding to the central purge cavity 12 is also higher, and the gas is blown from the middle to the wafer piece 500 below, and the gas gradually flows into the annular cavity 13 during the process, which makes the gas on the surface of the wafer piece 500 flow outward one by one, thereby blowing the particles on the surface of the wafer piece 500 from the middle position to the outside.

[0059] The design has good purging performance, ensures that the purifying cleanliness meets the requirements, effectively solves the technical problem that the dust particles on the surface of the wafer piece 500, especially the central position, are difficult to be completely blown clean, and the particles are suspended in the cavity, affecting the cleanliness of the cavity environment.

[0060] The above is an embodiment one of a new wafer purge disc provided by the embodiment of the application, and the following is an embodiment two of a new wafer purge disc provided by the embodiment of the application, please refer to Figures 1 to 3 .

[0061] Based on the scheme of the above embodiment one:

[0062] Further, as shown in Figure 2 and Figure 3 , for the structure design of the purge disc body 100, it includes a purge support 1 and a cover plate 2.

[0063] The gas inlet cavity 11, the central purge cavity 12 and the plurality of annular cavities 13 are arranged on one side of the purge support 1; the cover plate 2 is detachably covered on one side of the purge support 1 to close the gas inlet cavity 11, the central purge cavity 12 and the plurality of annular cavities 13; and the gas outlet hole 21 is arranged on the cover plate 2.

[0064] The purge disc body 100 adopts a modular design, which is convenient for processing and manufacturing, and the cover plate 2 is designed to be detachably covered on the purge support 1, which is convenient for installation and disassembly and also convenient for subsequent maintenance.

[0065] Further, for the detachable connection design, a first connection structure can be arranged on one side of the purge support 1, and a second connection structure corresponding to the first connection structure is arranged on the cover plate 2.

[0066] The first connection structure and the second connection structure can be directly detachably connected, or detachably connected through a fastener 3.

[0067] Taking the direct detachable connection design as an example, such as a buckle connection, the first connection structure can be a male buckle, and the second connection structure is a female buckle matched with the male buckle, which is not limited in detail.

[0068] In terms of the detachable connection design by the fastener 3, the first connection structure is the threaded hole 16; the second connection structure is a through hole (not shown in the figure); the fastener 3 passes through the through hole and is connected with the threaded hole 16, for fastening the cover plate 2 and the purge support 1 together.

[0069] The connection mode of the threaded hole 16 and the through hole matched with the fastener 3 makes the assembly and disassembly process of the cover plate 2 and the purge support 1 become simple and fast. The threaded connection itself has certain self-locking characteristics, when the fastener 3 (such as a bolt) is tightened in the threaded hole 16, it can maintain the close connection between the cover plate 2 and the purge support 1 under complex working conditions such as vibration and impact, effectively preventing displacement or loosening between the two. This simple and effective connection design has obvious advantages in terms of material and processing cost. The processing technology of the threaded hole 16 and the through hole is relatively mature and simple, without the need for complex molds or special processing equipment, reducing the manufacturing cost. Moreover, the common fastener 3 (such as a bolt, nut, etc.) has sufficient market supply, low price and easy access, further reducing the cost of the entire connection system.

[0070] Further, the first and last ends of each annular cavity 13 form a gap for avoiding the air inlet cavity 11; the central purge cavity 12 is in communication with the first end of the innermost annular cavity 13; the adjacent annular cavities 13 are connected in series. The first and last ends of each annular cavity 13 form a gap for avoiding the air inlet cavity 11, which ingeniously solves the conflict between the air inlet cavity 11 and the annular cavity 13 in terms of spatial layout. By reasonably utilizing the space, the entire purge disc body 100 is more compact, realizing the integration of multiple cavities in a limited space.

[0071] Further, the outer circumferential surface of the purge disc body 100 is provided with a fixing lug 14; the fixing lug 14 is provided with a fixing hole 15 (a through hole for passing through a bolt screw to realize fastening). The fixing lug 14 and the fixing hole 15 thereon provide a clear and convenient mounting point for the purge disc. During assembly, the operator can quickly and accurately position the purge disc body 100 and fix it to the corresponding support or base through the bolt and other connecting members.

[0072] Further, the fixing lug 14 is a plurality of and is evenly distributed around the outer circumferential surface of the purge disc body 100. The plurality of evenly distributed fixing lugs 14 ensure that the force acting on the purge disc body 100 after installation can be evenly distributed to the entire outer circumferential surface.

[0073] As shown in Figure 4 and Figure 5 , the application also discloses a novel wafer purge device, which comprises a device body 200, an air inlet pipe assembly 300 and a novel wafer purge disc.

[0074] The device body 200 is provided with a chamber, and the chamber is provided with a fixing table 400 for fixing a wafer piece 500;

[0075] The blowing disc body 100 of the novel wafer blowing disc is arranged in the chamber and located at one side of the fixing table 400 (the fixing table 400 and the blowing disc body 100 can be arranged in a lower-upper manner), and is used for blowing the wafer piece 500 on the fixing table 400.

[0076] One end of the air inlet pipe assembly 300 extends into the chamber and communicates with the air inlet channel 11 on the blowing disc body 100 of the novel wafer blowing disc, and the other end is connected with an external air inlet source. The external air inlet source can be a cold air blower or a hot air blower. When the wafer piece 500 needs to be heated, the hot air blower can be connected to heat the wafer piece 500.

[0077] Further, the device body 200 is provided with a pipe hole (not shown in the figure) through which the air inlet pipe assembly 300 passes, and a sealing ring 600 (which can be an O-ring) is arranged on the pipe hole, which is used for sealingly connecting the air inlet pipe assembly 300 and the inner wall of the pipe hole, or sealingly connecting the air inlet pipe assembly 300 and the end face of the pipe hole. The sealing ring 600 (such as an O-ring) arranged on the pipe hole provides reliable sealing connection between the air inlet pipe assembly 300 and the device body 200. In the processes such as vacuum coating and semiconductor manufacturing, which have high requirements on the gas environment, good airtightness is very important. For example, in the wafer blowing process in a vacuum environment, if there is gas leakage between the air inlet pipe assembly 300 and the pipe hole, the vacuum degree in the chamber will decrease, which will affect the blowing effect and the subsequent coating quality.

[0078] Further, the cross-sectional area of the air inlet pipe of the air inlet pipe assembly 300 is greater than the total area of the air outlet holes 21 on the novel wafer blowing disc, which can ensure that the blowing air pressure is strong enough to meet the blowing requirements.

[0079] The novel wafer blowing disc and device provided in the present application are described in detail above. For those skilled in the art, according to the idea of the embodiments of the present application, the specific implementation and application range will be changed. In view of the above, the content of the present description should not be understood as a limitation of the present application.

Claims

1. A novel wafer blow-off disk, characterized in that, Including the purge disc body (100); The purge disc body (100) is provided with an air inlet channel (11), a central purge chamber (12) and multiple annular channels (13). The central purging chamber (12) is located at the center of the purging disk body (100); One end of the air intake cavity (11) is connected to the central purge cavity (12), and the other end extends out of the purge disk body (100); Multiple annular cavities (13) are arranged around the central purge cavity (12) and are distributed sequentially at intervals outward from the center of the purge disk body (100); The central purge chamber (12) is connected to the innermost annular cavity (13); The adjacent annular cavities (13) are connected and conductive; On one side of the purge disc body (100), corresponding to the position of the central purge chamber (12) and the annular cavity (13), there are air outlets (21) that connect the central purge chamber (12) and the annular cavity (13) respectively.

2. The novel wafer blow-off disk according to claim 1, characterized in that, The purge disc body (100) includes a purge support (1) and a cover plate (2); The air intake channel (11), the central purge chamber (12), and the plurality of annular channels (13) are disposed on one side of the purge support (1); The cover plate (2) is detachably mounted on one side of the purge support (1) to seal the air intake channel (11), the central purge chamber (12) and the multiple annular channels (13). The vent (21) is located on the cover plate (2).

3. The novel wafer blow-off disk according to claim 2, characterized in that, The purging support (1) has a first connecting structure on one side; The cover plate (2) is provided with a second connection structure corresponding to the first connection structure; The first connection structure and the second connection structure are detachably connected, or are detachably connected by fasteners (3).

4. The novel wafer blow-off disk according to claim 3, characterized in that, The first connection structure is a threaded hole (16); The second connection structure is a through hole; The fastener (3) passes through the through hole and is connected to the threaded hole (16) for fastening the cover plate (2) together with the purge support (1).

5. The novel wafer blow-off disk according to claim 1, characterized in that, A gap is formed between the beginning and end of each of the annular cavities (13) to avoid the air intake cavity (11). The central purge chamber (12) is connected to the first end of the innermost annular cavity (13); The adjacent annular cavities (13) are connected end to end.

6. The novel wafer blow-off disk according to claim 1, characterized in that, The outer peripheral surface of the purging disc body (100) is provided with a fixing lug (14); The fixing lug (14) is provided with a fixing hole (15).

7. The novel wafer blow-off disk according to claim 6, characterized in that, The fixed lugs (14) are multiple and are evenly distributed around the outer circumference of the blow-off disk body (100).

8. A novel wafer cleaning device, characterized in that, It includes a device body (200), an air inlet pipe assembly (300), and a novel wafer blow-off disk as described in any one of claims 1 to 7; The device body (200) has a chamber inside; The cavity is provided with a fixing stage (400) for fixing the wafer (500). The novel wafer swab disk is disposed in the chamber and located on one side of the fixed stage (400) for swabring the wafers (500) on the fixed stage (400); One end of the air intake pipe assembly (300) extends into the cavity and communicates with the air intake channel (11) on the blow disk body (100) of the novel wafer blow disk.

9. The novel wafer cleaning apparatus according to claim 8, characterized in that, The device body (200) is provided with a pipe hole for the intake pipe assembly (300) to pass through; A sealing ring (600) is provided on the pipe hole to make the intake pipe assembly (300) seal the connection between the intake pipe assembly (300) and the inner wall of the pipe hole, or seal the connection between the intake pipe assembly (300) and the end face of the pipe hole.

10. The novel wafer cleaning apparatus according to claim 8, characterized in that, The cross-sectional area of ​​the air intake pipe of the air intake pipe assembly (300) is greater than the sum of the areas of the various air outlets (21) on the novel wafer blow-off disk.

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