Diffusion furnace
By introducing diffuser components and baffle components into the diffusion furnace, the problem of insufficient chip diffusion was solved, achieving uniform chip diffusion and resistance consistency, and improving product yield.
Patent Information
- Application Number
- CN202520200895.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-08
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-02-08
AI Technical Summary
Insufficient diffusion of chips in existing diffusion furnaces leads to poor resistance consistency, affecting product yield.
A diffusion furnace was designed, comprising a diffuser assembly and a baffle assembly. The diffuser assembly consists of multiple interconnected diffuser plates for dispersing the airflow. The baffle assembly is poreless near the outlet end to slow down the gas discharge speed and ensure that the gas is evenly distributed within the containment space.
Uniform diffusion of the chip was achieved, improving resistance consistency and product yield.
Smart Images
Figure CN223829786U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a diffusion furnace. Background Technology
[0002] In semiconductor manufacturing, chips are placed on quartz boats, which are then fed into diffusion furnaces for diffusion processing. However, current diffusion furnaces do not achieve sufficient diffusion of the chips, thus affecting the product yield. Utility Model Content
[0003] To overcome the technical problems mentioned in the above background, this application provides a diffusion furnace, the diffusion furnace comprising:
[0004] The diffusion furnace body and the accommodating space enclosed by the diffusion furnace body, the diffusion furnace body including an inlet end and an outlet end arranged opposite to each other;
[0005] A diffuser assembly is located within the accommodating space and is disposed near the inlet end of the diffusion furnace body. The diffuser assembly includes a plurality of interconnected diffuser plates, and each diffuser plate includes at least one through hole.
[0006] A support boat, located within the accommodating space and close to the current dissipation component, is used to support the chip;
[0007] A baffle assembly is provided on the support boat and near the gas outlet end of the diffusion furnace body, wherein the baffle assembly includes a plurality of interconnected baffles, and the surface of the baffles is non-porous.
[0008] In one possible implementation, the diffuser includes a first diffuser, a second diffuser, and a third diffuser arranged sequentially at intervals along the line connecting the inlet end and the outlet end, with the first diffuser being close to the inlet end of the diffusion furnace body.
[0009] The first diffuser includes a plurality of first through holes, wherein a portion of the first through holes are evenly distributed on a circumference with a first radius centered on the center of the first diffuser, and another portion of the first through holes are evenly distributed on a circumference with a second radius centered on the center of the first diffuser. The second diffuser includes a plurality of second through holes, wherein the second through holes are evenly distributed on a circumference with a third radius centered on the center of the second diffuser. The surface of the third diffuser is free of holes.
[0010] The second radius is greater than the first radius, the second radius is greater than the third radius, the third radius is greater than the first radius, the first radius is 35 mm to 40 mm, the second radius is 70 mm to 75 mm, and the third radius is 45 mm to 55 mm.
[0011] In one possible implementation, the number of the first through holes is greater than the number of the second through holes;
[0012] The inner diameter of the first through hole is a first inner diameter, and the inner diameter of the second through hole is a second inner diameter. The first inner diameter is smaller than the second inner diameter. The first inner diameter is 4.5 mm to 5.5 mm, and the second inner diameter is 9.5 mm to 10.5 mm.
[0013] In one possible implementation, the first through hole and the second through hole are circular in shape.
[0014] In one possible implementation, the distance between the first diffuser and the second diffuser is a first distance, and the distance between the second diffuser and the third diffuser is a second distance, wherein the first distance and the second distance are equal;
[0015] The first distance and the second distance are between 25 mm and 35 mm.
[0016] In one possible implementation, the diffuser assembly further includes connecting rods, which include a first connecting rod, a second connecting rod, a third connecting rod, and a fourth connecting rod, wherein the first connecting rod, the second connecting rod, the third connecting rod, and the fourth connecting rod sequentially connect the first diffuser plate, the second diffuser plate, and the third diffuser plate.
[0017] The first connecting rod and the second connecting rod are located on one side of the first diffuser plate, the second diffuser plate and the third diffuser plate, and the third connecting rod and the fourth connecting rod are located on the other side of the first diffuser plate, the second diffuser plate and the third diffuser plate.
[0018] In one possible implementation, the diffuser assembly further includes a pickup element that connects the third connecting rod and the fourth connecting rod;
[0019] The pickup element has an L-shaped shape.
[0020] In one possible implementation, the baffle assembly further includes a connecting plate located on the side of the baffle away from the support boat, the connecting plate connecting a plurality of the baffles;
[0021] The number of baffles is multiple, and the multiple baffles are arranged at equal intervals on the side of the connecting plate near the supporting boat, wherein the distance between two adjacent baffles is 30 mm to 35 mm, and the number of baffles is 5 to 10.
[0022] In one possible implementation, the baffle assembly further includes a fifth connecting rod that sequentially connects the plurality of baffles.
[0023] In one possible implementation, the baffle has a fork slot on the side near the support boat, and the baffle engages with the support boat through the fork slot;
[0024] The side of the baffle away from the fork slot is planar.
[0025] Based on any of the above aspects, this application provides a diffusion furnace. In this structure, the diffuser assembly is placed near the gas inlet end of the diffusion furnace body, which disperses the converged gas flow within the containment space. The gas concentration is the same on both the flat and round edges of the chip, resulting in sufficient and uniform chip diffusion. Simultaneously, a baffle assembly is provided at the gas outlet end of the support boat near the diffusion furnace body, effectively slowing down the gas exhaust rate and reducing gas loss. This ensures that the gas remains saturated during the chip diffusion process, leading to more complete chip diffusion, consistent chip resistance, and ultimately improved chip yield. Attached Figure Description
[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 This is a schematic diagram of a diffusion furnace in the prior art;
[0028] Figure 2 This is a schematic diagram of a diffusion furnace provided in this embodiment;
[0029] Figure 3 This is a schematic diagram of the chip provided in this embodiment;
[0030] Figure 4 for Figure 2 One of the schematic diagrams of the diffuser assembly;
[0031] Figure 5 for Figure 4 A schematic diagram of the first diffuser in the middle;
[0032] Figure 6 for Figure 4 Schematic diagram of the second diffuser in the middle;
[0033] Figure 7 for Figure 4 A schematic diagram of the third diffuser in the middle;
[0034] Figure 8 for Figure 2 Schematic diagram of the diffuser assembly (Part 2);
[0035] Figure 9 for Figure 2 Schematic diagram of the middle baffle assembly;
[0036] Figure 10 for Figure 9 A schematic diagram of the middle baffle.
[0037] Icons: 1-Priority diffusion furnace, 10-Furnace tail, 11-Furnace opening, 2-Chip, 3-Diffusion furnace, 30-Diffusion furnace body, 31-Accommodation space, 32-Diffusion assembly, 33-Support boat, 34-Baffle assembly, 300-Inlet end, 301-Outlet end, 320-Diffusion plate, 3201-First diffusion plate, 3201a-First through hole, 3202-Second diffusion plate, 3202a-Second through hole, 3203-Third diffusion plate 321-Connecting rod, 3210-First connecting rod, 3210b-First connecting rod connection point, 3211-Second connecting rod, 3211b-Second connecting rod connection point, 3212-Third connecting rod, 3212b-Third connecting rod connection point, 3213-Fourth connecting rod, 3213b-Fourth connecting rod connection point, 322-Pick-up component, 340-Baffle, 341-Connecting plate, 3401-Fork slot, 342-Fifth connecting rod. Detailed Implementation
[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0039] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0040] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0041] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0042] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.
[0043] The inventors discovered that in semiconductor manufacturing, chips are typically placed inside a quartz boat, which is then sent into a diffusion furnace for diffusion processing. Chips have flat, standard edges, and are usually placed with the flat edges facing upwards inside the quartz boat, which is positioned slightly below the diffusion furnace. Figure 1 As indicated by the middle arrow, Figure 1 A schematic diagram of a prior art diffusion furnace 1 is provided. During diffusion processing, gas enters from the furnace tail 10 and exits from the furnace opening 11. Due to the unidirectional gas flow and the small obstruction above the flat edge of the chip 2 compared to the large obstruction at the opposite round edge, the diffusion effect is sufficient at the flat edge of the chip 2, resulting in low resistance, while the diffusion effect is insufficient at the round edge, resulting in high resistance. This leads to poor resistance consistency of the chip 2. Furthermore, because there is no obstruction within the diffusion furnace 1, the gas flow rate is high, resulting in significant gas loss. This leads to insufficient gas supply within the diffusion furnace 1, reducing the diffusion effect of the chip 2 and consequently affecting the product yield of the chip 2.
[0044] In order to solve the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, and the specific implementation scheme of this application will be described in detail below with reference to the accompanying drawings.
[0045] Please see Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of a diffusion furnace 3 provided in this embodiment. Figure 3 This is a schematic diagram of the chip 2 provided in this embodiment. In this embodiment, the diffusion furnace 3 includes a diffusion furnace body 30 and an accommodating space 31 enclosed by the diffusion furnace body 30, a diffusion assembly 32, a support boat 33, and a baffle 34. The diffusion furnace body 30 is the main structural part of the diffusion furnace 3, and is usually made of high-temperature resistant material. The chip 2 is placed on the support boat 33 and then placed in the accommodating space 31 for diffusion treatment.
[0046] The diffusion furnace body 30 includes an inlet end 300 and an outlet end 301 disposed opposite to each other. Thus, gas (e.g., phosphorus-containing gas) enters from the inlet end 300 of the diffusion furnace body 30, passes through the accommodating space 31, and exits from the outlet end 301, forming a complete gas path. In this embodiment, the diffuser assembly 32 is located within the accommodating space 31 and is positioned close to the inlet end 300 of the diffusion furnace body 30. The diffuser assembly 32 includes multiple interconnected diffuser plates 320, each diffuser plate 320 including at least one through hole. Thus, as... Figure 2 As indicated by the middle arrow, the gas enters from the inlet 300 of the diffusion furnace body 30. After passing through the diffuser assembly 32, it is dispersed into a dispersed gas, preventing the gas from becoming a converging flow. Subsequently, when the dispersed gas flows through the chip 2, the flat edge 20 and the round edge 21 of the chip 2 are covered with gas, and the gas flow rate is the same. This ensures that the gas concentration on the flat edge 20 and the round edge 21 of the chip 2 is basically the same during diffusion, resulting in a sufficient and uniform diffusion effect. This ensures the resistance consistency of the chip 2 and improves the product yield of the chip 2.
[0047] The support boat 33 is located within the accommodating space 31 and is positioned near the diffusion assembly 32 to support the chip 2. In this embodiment, the purpose of the support boat 33 is to ensure the stability of the chip 2 during diffusion. The chip 2 is placed in the support boat 33 with its flat edge 20 facing upwards. The baffle assembly 34 is located on the support boat 33 and is positioned near the gas outlet 301 of the diffusion furnace body 30. The baffle assembly 34 includes multiple interconnected baffles 340, and the surfaces of the baffles 340 are non-porous. Thus, after the gas flows through the chip 2, because the surfaces of the baffles 340 are non-porous, the gas can only pass through the edges of the baffles 340, effectively slowing down the gas exhaust rate, reducing gas loss, and ensuring that the gas surrounding the chip 2 remains saturated during diffusion, resulting in more complete diffusion of the chip 2 and ensuring the uniformity of the chip 2's resistance.
[0048] Further, please see Figure 2 and Figure 4 , Figure 4 This is a schematic diagram of the diffuser assembly 32 provided in this embodiment. The diffuser plate 320 includes a first diffuser plate 3201, a second diffuser plate 3202 and a third diffuser plate 3203 arranged sequentially at intervals along the line connecting the inlet end 300 and the outlet end 301. The first diffuser plate 3201 is close to the inlet end 300 of the diffusion furnace body 30.
[0049] Please see Figure 5 , Figure 6 and Figure 7 , Figure 5 This is a schematic diagram of the first diffuser 3201 provided in this embodiment. Figure 6 This is a schematic diagram of the second diffuser 3202 provided in this embodiment. Figure 7This is a schematic diagram of the third diffuser plate 3203 provided in this embodiment. The first diffuser plate 3201 includes a plurality of first through holes 3201a, some of which are evenly distributed on a circumference of a first radius R1 with the center of the first diffuser plate 3201 as the center, and others are evenly distributed on a circumference of a second radius R2 with the center of the first diffuser plate 3201 as the center. The second diffuser plate 3202 includes a plurality of second through holes 3202a, which are evenly distributed on a circumference of a third radius R3 with the center of the second diffuser plate 3202 as the center. The surface of the third diffuser plate 3203 is non-porous. Thus, gas enters from the gas inlet 300 of the diffusion furnace body 30, first passes through the first diffuser plate 3201, and is dispersed through the first through holes 3201a of the first diffuser plate 3201, no longer converging into a single gas stream. Then, it passes through the second diffuser plate 3202, where the gas is further dispersed into smaller streams. Finally, the gas flows through the third diffuser plate 3203. Since the surface of the third diffuser plate 3203 is non-porous, the gas passes through the edge of the third diffuser plate 3203. At this time, the gas has completely become a dispersed gas. When this dispersed gas flows through the chip 2, it ensures the uniformity of the diffusion effect of the chip 2.
[0050] In this embodiment, the second radius R1 is greater than the first radius R2, the second radius R2 is greater than the third radius R3, and the third radius R3 is greater than the first radius R1. The first radius R1 is 35 mm to 40 mm. For example, the first radius R1 is 35 mm, 35 mm, 37 mm, 38 mm, 39 mm, and 40 mm, etc. Preferably, the first radius R1 is 36.25 mm.
[0051] The second radius R2 is 70 mm to 75 mm. Exemplarily, the second radius R2 is 70 mm, 71 mm, 72 mm, 73 mm, 74 mm, and 75 mm, etc. Preferably, the second radius R2 is 72 mm or 74 mm. The third radius R3 is 45 mm to 55 mm. Exemplarily, the third radius R3 is 45 mm, 46 mm, 47 mm, 48 mm, 49 mm, 50 mm, 51 mm, 52 mm, 53 mm, 54 mm, and 55 mm, etc. Preferably, the third radius R3 is 50 mm.
[0052] Further, please see Figure 5 and Figure 6The number of first through holes 3201a is greater than the number of second through holes 3202a. The inner diameter of the first through hole 3201a is the first inner diameter, and the inner diameter of the second through hole 3202a is the second inner diameter. The first inner diameter is smaller than the second inner diameter of the second through hole 3202a. The first inner diameter is 4.5 mm to 5.5 mm. For example, the first inner diameter is 4.5 mm, 4.6 mm, 4.7 mm, 4.8 mm, 4.9 mm, 5.0 mm, 5.1 mm, 5.2 mm, 5.3 mm, 5.4 mm, and 5.5 mm, etc. Preferably, the first inner diameter is 4.7 mm or 5.3 mm.
[0053] The second inner diameter is 9.5 mm to 10.5 mm. Exemplarily, the second inner diameter is 9.5 mm, 9.6 mm, 9.7 mm, 9.8 mm, 9.9 mm, 10.0 mm, 10.1 mm, 10.2 mm, 10.3 mm, 10.4 mm, and 10.5 mm, etc. Preferably, the second inner diameter is 9.7 mm or 10.3 mm. Thus, when the gas passes through the first diffuser plate 3201, the first diffuser plate 3201 initially disperses the gas. The first through-hole 3201a of the first diffuser plate 3201 ensures that the gas is rapidly and evenly distributed when it enters the accommodating space 31. When the gas passes through the second diffuser plate 3202, the second through-hole 3202a of the second diffuser plate 3202 further ensures that the gas is fully dispersed.
[0054] Furthermore, please see again Figure 5 and Figure 6 The first through-hole 3201a and the second through-hole 3202a are circular in shape. This circular through-hole design ensures that the gas flow rate is uniform when passing through the first through-hole 3201a or the second through-hole 3202a, thus improving gas uniformity.
[0055] Further, please see Figure 4 The distance between the first diffuser 3201 and the second diffuser 3202 is the first distance D1, and the distance between the second diffuser 3202 and the third diffuser 3203 is the second distance D2. The first distance D1 and the second distance D2 are equal. In this way, the gas is ensured to be evenly distributed between two adjacent diffusers 320, so as to achieve uniform gas flow.
[0056] The size of the first distance D1 and the second distance D2 is 25 mm to 35 mm. For example, the size of the first distance D1 and the second distance D2 is 25 mm, 26 mm, 27 mm, 28 mm, 29 mm, 30 mm, 31 mm, 32 mm, 33 mm, 34 mm and 35 mm. Preferably, the size of the first distance D1 and the second distance D2 is 29.5 mm or 30.5 mm.
[0057] Further, please see Figure 4 and Figure 8 , Figure 8 This is a top view of the diffuser assembly 32 provided in this embodiment. The diffuser assembly 32 also includes a connecting rod 321, which includes a first connecting rod 3210, a second connecting rod 3211, a third connecting rod 3212, and a fourth connecting rod 3213.
[0058] The first connecting rod 3210, the second connecting rod 3211, the third connecting rod 3212, and the fourth connecting rod 3213 sequentially connect the first diffuser 3201, the second diffuser 3202, and the third diffuser 3203. In this embodiment, one end of each of the first connecting rod 3210, the second connecting rod 3211, the third connecting rod 3212, and the fourth connecting rod 3213 is connected to the first diffuser 3201, passes through the second diffuser 3202, and the other end is connected to the third diffuser 3203, thereby fixing the three diffusers 320.
[0059] Please see Figure 5 , Figure 6 and Figure 7 Each diffuser 320 includes a first connecting rod connection point 3210b, a second connecting rod connection point 3211b, a third connecting rod connection point 3212b, and a fourth connecting rod connection point 3213b. For example, one end of the first connecting rod 3210 is connected to the first connecting rod connection point 3210b of the first diffuser 3201, passes through the first connecting rod connection point 3210b of the second diffuser 3202, and the other end is connected to the first connecting rod connection point 3210b of the third diffuser 3203, thus fixing the three diffusers 320. The connection methods of the second connecting rod 3211, the third connecting rod 3212, and the fourth connecting rod 3213 are the same as those of the first connecting rod 3210, and will not be described in detail here.
[0060] It is worth noting that the two ends of the connecting rod 321 can be connected to the first diffuser plate 3201 and the third diffuser plate 3203 by welding. The connecting rod 321 and the diffuser plate 320 are made of materials including quartz, and the specific material is not specifically limited here, but can be selected according to the actual situation.
[0061] The first connecting rod 3210 and the second connecting rod 3211 are located on one side of the first diffuser 3201, the second diffuser 3202, and the third diffuser 3203, while the third connecting rod 3212 and the fourth connecting rod 3213 are located on the other side of the first diffuser 3201, the second diffuser 3202, and the third diffuser 3203. This secures the upper and lower ends of the first diffuser 3201, the second diffuser 3202, and the third diffuser 3203, ensuring their reliability and stability.
[0062] Further, please see Figure 4 and Figure 8 The diffusion assembly 32 also includes a pickup 322, which connects the third connecting rod 3212 and the fourth connecting rod 3213. Thus, during the diffusion process of the chip 2, the diffusion assembly 32 can be inserted or removed by connecting it to the pickup 322 via a quartz hook, improving work efficiency.
[0063] It is worth noting that the shape of the pickup 322 includes L-shape. The specific shape of the pickup 322 is not specifically limited here and can be selected according to the actual situation.
[0064] Further, please see Figure 1 and Figure 9 , Figure 9 This is a schematic diagram of the baffle assembly 34 provided in this embodiment. The baffle assembly 34 also includes a connecting plate 341, which is located on the side of the baffle 340 away from the support boat 33. The connecting plate 341 connects multiple baffles 340. In this way, the deformation and movement of the baffles 340 can be reduced by the connecting plate 341, ensuring the stability and reliability of the connection of multiple baffles 340.
[0065] There are multiple baffles 340, which are arranged at equal intervals on the side of the connecting plate 341 near the support boat 33. The distance D between two adjacent baffles 340 is 30 mm to 35 mm. For example, the distance D between two adjacent baffles 340 is 30 mm, 31 mm, 32 mm, 33 mm, 34 mm and 35 mm. Preferably, the distance between two adjacent baffles 340 is 32.75 mm.
[0066] The number of baffles 340 is 5 to 10. For example, the number of baffles 340 is 5, 6, 7, 8, 9, and 10, etc. Preferably, the number of baffles 340 is 5. In this way, the number of baffles 340 can be selected according to the actual situation to avoid the gas concentration in some areas of the accommodating space 31 being too high and the gas concentration in some areas being too low due to the excessive number of baffles 340, which would affect the uniformity of diffusion. At the same time, it also avoids the gas flow being too fast and the chip diffusion being uneven due to the insufficient number of baffles 340.
[0067] Furthermore, please see again Figure 9The baffle assembly 34 also includes a fifth connecting rod 342, which connects multiple baffles 340 sequentially. Thus, in this embodiment, the multiple baffles 340 are fundamentally fixed by the connecting plate 341, and further fixed by the fifth connecting rod 342, improving the stability and reliability of the baffle connection. Multiple fifth connecting rods 342 can be used. One end of each fifth connecting rod 342 connects to a baffle 340 near the chip 2, and then the fifth connecting rod 342 passes through multiple baffles 340 and connects to a baffle 340 near the gas outlet 301 of the diffusion furnace body 30. It is worth noting that the fifth connecting rod 342 can be connected to the baffle 340 by welding. The fifth connecting rod 342 and the baffle 340 can be made of quartz; the specific material is not specifically limited here and can be selected according to actual conditions.
[0068] Further, please see Figure 1 and Figure 10 , Figure 10 This is a schematic diagram of the baffle 340 provided in this embodiment. The baffle 340 has a fork groove 3401 on the side near the support boat 33, and the baffle 340 engages with the support boat 33 through the fork groove 3401. In this embodiment, for example, the support boat 33 has a rectangular protrusion, and the baffle 340 can be designed as a rectangular groove. This design ensures a tight fit between the baffle 340 and the support boat 33, thereby improving the stability of the baffle 340.
[0069] It is worth noting that the support boat 33 can be a quartz boat.
[0070] The side of the baffle 340 away from the fork slot 3401 is flat. This design prevents the baffle 340 from touching the inner wall of the diffusion furnace body 30 and causing damage.
[0071] In summary, this application provides a diffusion furnace, comprising a diffusion furnace body and an enclosure space formed by the diffusion furnace body, a diffusion assembly, a support boat, and a baffle assembly. The diffusion furnace body includes an inlet end and an outlet end disposed opposite to each other. The diffusion assembly is located within the enclosure space and near the inlet end of the diffusion furnace body, and includes multiple interconnected diffusion plates, wherein each diffusion plate includes at least one through hole. The support boat is located within the enclosure space and near the diffusion assembly, and is used to support the chip. The baffle assembly is on the support boat and near the outlet end of the diffusion furnace body, wherein the baffle assembly includes multiple interconnected baffles, and the surface of the baffles is non-porous. Thus, the above structure ensures sufficient and uniform diffusion of the chip in the diffusion furnace, thereby improving the product yield of the chip.
[0072] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A diffusion furnace, characterized in that, The diffusion furnace includes: The diffusion furnace body and the accommodating space enclosed by the diffusion furnace body, the diffusion furnace body including an inlet end and an outlet end arranged opposite to each other; A diffuser assembly is located within the accommodating space and is disposed near the inlet end of the diffusion furnace body. The diffuser assembly includes a plurality of interconnected diffuser plates, and each diffuser plate includes at least one through hole. A support boat, located within the accommodating space and close to the current dissipation component, is used to support the chip; A baffle assembly is provided on the support boat and near the gas outlet end of the diffusion furnace body, wherein the baffle assembly includes a plurality of interconnected baffles, and the surface of the baffles is non-porous.
2. The diffusion furnace as described in claim 1, characterized in that, The diffuser plate includes a first diffuser plate, a second diffuser plate, and a third diffuser plate arranged sequentially at intervals along the line connecting the air inlet end and the air outlet end, with the first diffuser plate being close to the air inlet end of the diffusion furnace body. The first diffuser includes a plurality of first through holes, wherein a portion of the first through holes are evenly distributed on a circumference with a first radius centered on the center of the first diffuser, and another portion of the first through holes are evenly distributed on a circumference with a second radius centered on the center of the first diffuser. The second diffuser includes a plurality of second through holes, wherein the second through holes are evenly distributed on a circumference with a third radius centered on the center of the second diffuser. The surface of the third diffuser is free of holes. The second radius is greater than the first radius, the second radius is greater than the third radius, the third radius is greater than the first radius, the first radius is 35 mm to 40 mm, the second radius is 70 mm to 75 mm, and the third radius is 45 mm to 55 mm.
3. The diffusion furnace as described in claim 2, characterized in that, The number of the first through holes is greater than the number of the second through holes; The inner diameter of the first through hole is a first inner diameter, and the inner diameter of the second through hole is a second inner diameter. The first inner diameter is smaller than the second inner diameter. The first inner diameter is 4.5 mm to 5.5 mm, and the second inner diameter is 9.5 mm to 10.5 mm.
4. The diffusion furnace as described in claim 2, characterized in that, The first through hole and the second through hole are both circular in shape.
5. The diffusion furnace as described in claim 2, characterized in that, The distance between the first diffuser and the second diffuser is the first distance, and the distance between the second diffuser and the third diffuser is the second distance. The first distance and the second distance are equal. The first distance and the second distance are between 25 mm and 35 mm.
6. The diffusion furnace as described in claim 2, characterized in that, The diffuser assembly further includes connecting rods, which include a first connecting rod, a second connecting rod, a third connecting rod, and a fourth connecting rod. The first connecting rod, the second connecting rod, the third connecting rod, and the fourth connecting rod sequentially connect the first diffuser plate, the second diffuser plate, and the third diffuser plate. The first connecting rod and the second connecting rod are located on one side of the first diffuser plate, the second diffuser plate and the third diffuser plate, and the third connecting rod and the fourth connecting rod are located on the other side of the first diffuser plate, the second diffuser plate and the third diffuser plate.
7. The diffusion furnace as described in claim 6, characterized in that, The diffuser assembly further includes a pickup element that connects the third connecting rod and the fourth connecting rod; The pickup element has an L-shaped shape.
8. The diffusion furnace as described in claim 1, characterized in that, The baffle assembly further includes a connecting plate located on the side of the baffle away from the support boat, and the connecting plate connects a plurality of the baffles; The number of baffles is multiple, and the multiple baffles are arranged at equal intervals on the side of the connecting plate near the supporting boat, wherein the distance between two adjacent baffles is 30 mm to 35 mm, and the number of baffles is 5 to 10.
9. The diffusion furnace as described in claim 1, characterized in that, The baffle assembly further includes a fifth connecting rod, which connects the plurality of baffles in sequence.
10. The diffusion furnace as described in claim 1, characterized in that, The baffle has a fork groove on the side near the support boat, and the baffle engages with the support boat through the fork groove; The side of the baffle away from the fork slot is planar.