Silicon wafer transmission device

Abstract

The utility model relates to a silicon wafer transmission device comprising an upper roller member comprising a first axis part and a first shaft sleeve part sleeving the first axis part, a gap is formed between the first shaft sleeve part and the first axis part, and the first shaft sleeve part can move up and down relative to the first axis part; the pressure detection pieces are arranged in one-to-one correspondence with the first shaft sleeve parts, the pressure detection pieces are arranged above the corresponding first shaft sleeve parts, and the pressure detection pieces and the first shaft center parts are kept relatively fixed; under the condition that no silicon wafer passes through the lower part of the first shaft sleeve part, a gap is formed between the first shaft sleeve part and the corresponding pressure detection piece; and under the condition that a silicon wafer passes through the lower part of the first shaft sleeve part, the first shaft sleeve part can be jacked up by the silicon wafer to be in contact with the corresponding pressure detection piece. According to the invention, the wafer connecting and blocking abnormity can be detected in real time, the maintenance personnel can more quickly lock the abnormal position and timely solve the abnormity, and the product yield and the production efficiency of the silicon wafer are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of solar cell manufacturing, and in particular to a silicon wafer conveying device. BACKGROUND

[0002] With the increase of silicon wafer production capacity, the length and width of the silicon wafer processing equipment will also be lengthened and widened accordingly. Among them, the silicon wafer of the wet process equipment is in a chain type continuous feeding mode, and the silicon wafer conveying device in the machine table will continuously transport hundreds or thousands of silicon wafers. The longer the machine table is, the more silicon wafers are in the machine table. Affected by the internal environment of the wet process equipment, the machine table cannot detect the position of the silicon wafer in real time, so when an abnormality such as wafer blocking occurs, it is difficult to discover in time, and a large amount of fragments and defects are easily caused. CONTENT OF THE UTILITY MODEL

[0003] The silicon wafer conveying device provided by the embodiments of the present application can detect continuous wafer and wafer blocking in real time, and improve the product yield and production efficiency of the silicon wafer.

[0004] The silicon wafer conveying device provided by the embodiments of the present application comprises:

[0005] The upper roller member comprises a first shaft core portion and a first shaft sleeve portion sleeved on the first shaft core portion, a gap is formed between the first shaft sleeve portion and the first shaft core portion, and the first shaft sleeve portion can move up and down relative to the first shaft core portion; and

[0006] The pressure detection member is arranged one by one corresponding to the first shaft sleeve portion, the pressure detection member is arranged above the corresponding first shaft sleeve portion, and the pressure detection member is relatively fixed with the first shaft core portion;

[0007] In the case that no silicon wafer passes below the first shaft sleeve portion, a gap is formed between the first shaft sleeve portion and the corresponding pressure detection member;

[0008] In the case that a silicon wafer passes below the first shaft sleeve portion, the first shaft sleeve portion can be lifted up by the silicon wafer to contact the corresponding pressure detection member.

[0009] In some embodiments, the first shaft sleeve portion can also rotate relative to the first shaft core portion around the axis of the first shaft core portion.

[0010] In some embodiments, the silicon wafer conveying device is used for conveying the silicon wafer in a first direction, and the silicon wafer conveying device comprises a plurality of upper roller members arranged at intervals in the first direction.

[0011] In some embodiments, the first shaft portion is configured as a rod structure extending along a second direction perpendicular to the first direction, and the upper roller member includes a plurality of the first sleeve portions, which are uniformly spaced along the second direction.

[0012] In some embodiments, the first sleeve portion is a cylinder structure extending along the second direction.

[0013] In some embodiments, the first sleeve portion and the pressure detection member are in line contact when the first sleeve portion abuts against the corresponding pressure detection member.

[0014] In some embodiments, the pressure detection member is a pressure sensor.

[0015] In some embodiments, the wafer conveying device further includes an alarm, and each of the pressure detection members is connected to the alarm.

[0016] In some embodiments, the wafer conveying device further includes a first lower roller member corresponding to each of the upper roller members, the first lower roller member is located below the corresponding upper roller member, and a conveying channel for conveying the wafer along the first direction is formed between the first lower roller member and the corresponding upper roller member.

[0017] In some embodiments, the first lower roller member includes a second shaft portion and a second sleeve portion fixed to the second shaft portion, and the second sleeve portion is arranged one-to-one corresponding to the first sleeve portion.

[0018] Compared with the prior art, the beneficial effects of the embodiments of this application are as follows: The silicon wafer transport device includes an upper roller component, including a first shaft core and a first bushing portion sleeved on the first shaft core, with a gap between the first bushing portion and the first shaft core, and the first bushing portion being able to move up and down relative to the first shaft core; and pressure detection components, each corresponding to a first bushing portion, are disposed above the corresponding first bushing portion, and the pressure detection components remain relatively fixed to the first shaft core; through the embodiments of this application, when no silicon wafer passes under the first bushing portion, the gap between the first bushing portion and the corresponding pressure detection component prevents the pressure detection component from moving up and down. The device will be subjected to pressure from the corresponding first bushing. When a silicon wafer passes under the first bushing, the first bushing can be pushed upward by the silicon wafer until it contacts the corresponding pressure detection element, so that the pressure detection element is subjected to pressure from the corresponding first bushing, thereby enabling the pressure detection element to detect that a silicon wafer has passed under the corresponding first bushing. When the pressure detection element is subjected to pressure for a duration longer than a preset duration, a wafer connection or blockage abnormality may have occurred at the first bushing. The device can detect wafer connection and blockage abnormalities in real time, making it easier for maintenance personnel to quickly locate the abnormality and resolve the abnormality in a timely manner, thereby improving the product yield and production efficiency of silicon wafers. Attached Figure Description

[0019] Figure 1 This is a partial structural diagram of the silicon wafer transmission device according to an embodiment of this application;

[0020] Figure 2 This is a partial structural diagram of the silicon wafer transmission device according to an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of the silicon wafer transmission device structure according to an embodiment of this application;

[0022] Figure 4 for Figure 3 Top view;

[0023] Figure 5 This is a schematic diagram of the silicon wafer transmission device structure according to an embodiment of this application;

[0024] Figure 6 for Figure 5 Top view;

[0025] Figure 7 This is a schematic diagram of the upper roller component in the silicon wafer transport device according to an embodiment of this application;

[0026] Wherein: 1 - upper roller member (1a - upper roller member, 1b - upper roller member, 101 - first shaft part, 102 - first shaft sleeve part), 2 - pressure detection member, 3 - silicon wafer, 4 - first lower roller member (401 - second shaft part, 402 - second shaft sleeve part), 5 - transmission channel, 6 - second lower roller member, 7 - silicon wafer processing equipment. DETAILED DESCRIPTION

[0027] For the purpose of facilitating the understanding of the present application, a more complete understanding of the present application can be had by reference to the relevant drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It will be apparent, however, to one of ordinary skill in the art that the application can be practiced without these details.

[0028] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for describing particular embodiments only and is not intended to be limiting of the application.

[0030] Reference will now be made to Figures 1 to 7 The silicon wafer conveying device of the embodiments of the present application comprises an upper roller member 1 and a pressure detection member 2. The upper roller member 1 comprises a first shaft part 101 and a first shaft sleeve part 102, the first shaft sleeve part 102 is sleeved on the first shaft part 101, and there is a gap between the first shaft sleeve part 102 and the first shaft part 101, and the first shaft sleeve part 102 can move up and down relative to the first shaft part 101. The pressure detection member 2 is arranged one-to-one with the first shaft sleeve part 102, each pressure detection member 2 is arranged above the corresponding first shaft sleeve part 102, and the pressure detection member 2 is relatively fixed with the first shaft part 101. In the case that there is no silicon wafer 3 passing below the first shaft sleeve part 102, there is a gap between the first shaft sleeve part 102 and the corresponding pressure detection member 2, that is, the pressure detection member 2 will not be subjected to the pressure from the corresponding first shaft sleeve part 102. In the case that there is a silicon wafer 3 passing below the first shaft sleeve part 102, the first shaft sleeve part 102 can be lifted up by the silicon wafer 3 to contact the corresponding pressure detection member 2, so that the pressure detection member 2 is subjected to the pressure from the corresponding first shaft sleeve part 102, thereby enabling the pressure detection member 2 to detect that there is a silicon wafer 3 passing below the corresponding first shaft sleeve part 102.

[0031] In the embodiments of the present application, please refer toFigure 1 When no silicon wafer 3 passes under the first bushing portion 102, there is a gap between the first bushing portion 102 and the corresponding pressure detection element 2. In other words, the pressure detection element 2 is not subjected to pressure from the corresponding first bushing portion 102. Please refer to... Figure 2 When a silicon wafer 3 passes under the first bushing 102, the first bushing 102 can be lifted upwards by the silicon wafer 3 until it contacts the corresponding pressure detection element 2. This causes the pressure detection element 2 to be subjected to pressure from the corresponding first bushing 102, thereby enabling the pressure detection element 2 to detect the presence of a silicon wafer 3 passing under the corresponding first bushing 102. Each pressure detection element 2 operates independently, and each pressure detection element 2 is configured in a one-to-one correspondence with the first bushing 102. Furthermore, since the length of the silicon wafer 3 and the transmission speed of the silicon wafer transport device are known, for example, if the length of the silicon wafer 3 is L and the transmission speed of the silicon wafer transport device is V, then the time T for the silicon wafer 3 to pass through the first bushing 102 is T = L / V. As an example, the preset time can be set to the time T for the silicon wafer 3 to normally pass through the first bushing 102. When the time T1 for the pressure detection element 2 to be subjected to pressure is equal to the preset time T, it indicates that the silicon wafer 3 has passed through the first bushing 102 normally without any wafer contamination or blockage. When the pressure detection element 2 is subjected to pressure for a duration T1 greater than the preset duration T, at least two silicon wafers 3 may be connected together at the first bushing part 102, resulting in a wafer connection abnormality, or the silicon wafer 3 may be unable to pass through the first bushing part 102 normally, resulting in a wafer blockage abnormality. The wafer connection and wafer blockage abnormalities can be detected in real time, and the first bushing part 102 where the wafer connection and wafer blockage abnormalities occur can be accurately located. This makes it easier for maintenance personnel to quickly locate the abnormality and resolve the abnormality in a timely manner, thereby improving the product yield and production efficiency of the silicon wafer 3.

[0032] As an example, the silicon wafer transport device can be applied in the silicon wafer processing equipment 7 to transport silicon wafers. In some examples, the silicon wafer transport device can be a wet processing equipment. Alternatively, the silicon wafer transport device can also be applied to other silicon wafer processing equipment, which can be configured according to actual conditions, and will not be elaborated here.

[0033] In some embodiments, the first bushing portion 102 can also rotate relative to the first axis portion 101 about the axis of the first axis portion 101. When the silicon wafer 3 passes under the first bushing portion 102 along the transmission direction of the silicon wafer transport device, since the first bushing portion 102 is in contact with the silicon wafer 3, under the action of the moving silicon wafer 3, the first bushing portion 102 can rotate about the axis of the first axis portion 101, thereby effectively reducing the friction between the first bushing portion 102 and the silicon wafer 3 and preventing the first bushing portion 102 from interfering with the movement of the silicon wafer 3.

[0034] In some implementation methods, please refer to Figures 3 to 6The silicon wafer transport device is used to transport silicon wafers 3 along a first direction. The silicon wafer transport device includes multiple upper rollers 1, and all upper rollers 1 are spaced apart along the first direction.

[0035] In this embodiment, the silicon wafer transport device includes a plurality of upper rollers 1 spaced apart along a first direction, which can more fully and effectively monitor the state of the silicon wafer 3 during the transport process and promptly detect wafer contamination and blockage abnormalities.

[0036] It is understandable that the structure of each upper roller component 1 can be the same, and each upper roller component 1 is independent of each other and does not interfere with each other.

[0037] As one implementation method, please refer to Figures 3 to 6 All the upper rollers 1 are evenly spaced along the first direction, so as to more accurately and continuously detect the state of the silicon wafer 3 during the transmission process.

[0038] In some implementation methods, please refer to Figure 7 Each upper roller component 1 includes a first shaft core 101 and a plurality of first bushing portions 102. The first shaft core 101 is configured as a rod structure extending along a second direction perpendicular to the first direction. All the first bushing portions 102 are evenly spaced along the second direction, and the positions of the first bushing portions 102 in the second direction are fixed. That is, the first bushing portions 102 will not move relative to the first shaft core 101 along the second direction, which improves the stability of the overall structure and avoids the inability to effectively monitor the corresponding silicon wafer 3 due to the first bushing portions 102 moving to misalignment with the corresponding silicon wafer 3. It also avoids interference between the first bushing portions 102. In this embodiment, each first bushing portion 102 is independent of each other. That is, each first bushing portion 102 can move up and down relative to the first shaft core 101, and each first bushing portion 102 can also rotate relative to the first shaft core 101 about the axis of the first shaft core 101.

[0039] In this embodiment, under normal circumstances, at most one set of silicon wafers 3 can pass under one upper roller 1 at any given time. Please refer to... Figure 4 and Figure 6As shown, a set of silicon wafers 3 includes a plurality of silicon wafers 3 evenly spaced along a second direction. Correspondingly, each upper roller member 1 includes a plurality of first bushing portions 102, the number of first bushing portions 102 in each upper roller member 1 being equal to the number of silicon wafers 3 in the set of silicon wafers 3, and the pressure detection element 2 corresponding to each first bushing portion 102 is used to monitor the corresponding silicon wafer 3. It can be understood that since the pressure detection element 2 is arranged in a one-to-one correspondence with the first bushing portion 102, the number of pressure detection elements 2 corresponding to each upper roller member 1 is equal to the number of first bushing portions 102 included in each upper roller member 1. As an example, a group of silicon wafers 3 pass through upper roller 1a and upper roller 1b in sequence. That is, for both upper roller 1a and upper roller 1b, upper roller 1a is the previous upper roller 1 and upper roller 1b is the next upper roller 1. If S1 pressure detection devices 2 corresponding to upper roller 1a sense that silicon wafers 3 have passed through upper roller 1a, and S2 pressure detection devices 2 corresponding to upper roller 1b sense that silicon wafers 3 have passed through upper roller 1b, when S2 is less than S1, it means that the number of silicon wafers 3 passing through upper roller 1b is less than the number of silicon wafers 3 passing through upper roller 1a, and a shortage of wafers has occurred. In other words, the number of silicon wafers 3 passing through the next upper roller 1 can be compared with the number of silicon wafers 3 passing through the previous upper roller 1 to monitor in real time whether there are missing silicon wafers 3. This allows for more comprehensive and effective monitoring of the status of silicon wafers 3 during transmission, making it easier for maintenance personnel to resolve missing wafer anomalies in a timely manner.

[0040] In some implementation methods, please refer to Figure 7 The first bushing 102 is a cylindrical structure extending along the second direction. The cylindrical outer surface of the first bushing 102 contacts the silicon wafer 3, which can not only effectively prevent the first bushing 102 from scratching the silicon wafer 3, but also make the silicon wafer 3 more uniformly stressed, avoiding damage to the silicon wafer 3 caused by stress concentration.

[0041] In some embodiments, when the first bushing portion 102 abuts against the corresponding pressure sensing element 2, the first bushing portion 102 and the pressure sensing element 2 are in line contact. This line contact allows for more even force distribution between the pressure sensing element 2 and the first bushing portion 102, preventing scratches on the first bushing portion 102. It also effectively reduces friction between the first bushing portion 102 and the pressure sensing element 2, preventing the pressure sensing element 2 from hindering the rotation of the first bushing portion 102 around the axis of the first central portion 101.

[0042] As an example, pressure detection element 2 is a pressure sensor. It should be noted that pressure detection element 2 can also be other pressure detection structures, which can be set according to the actual situation, and will not be elaborated here.

[0043] In some embodiments, the silicon wafer transport device also includes an alarm (not shown in the figure), and each pressure detection element 2 is connected to the alarm. When the pressure detection element 2 detects a wafer blockage, a wafer shortage, or a wafer failure, it can trigger the alarm to sound an alarm.

[0044] In one implementation, an alarm can be set up one-to-one with a pressure detection element 2. When the pressure detection element 2 detects an abnormality, it can trigger the corresponding alarm to sound an alarm, thereby accurately locating the abnormal position without the need for manual inspection, thus improving the efficiency of abnormality handling. As an example, the pressure detection element 2 can be connected to a control system (not shown in the figure), and the alarm can be connected to the control system.

[0045] It should be noted that the control system and alarm in this embodiment are existing technologies, and therefore will not be described in detail.

[0046] In some implementation methods, please refer to Figures 1 to 6 The silicon wafer transport device also includes a first lower roller 4, which is arranged in a one-to-one correspondence with the upper roller 1. Each first lower roller 4 is located below the corresponding upper roller 1, and a transport channel 5 is formed between the first lower roller 4 and the corresponding upper roller 1. The transport channel 5 is used to transport the corresponding silicon wafer 3 along the first direction.

[0047] In some implementation methods, please refer to Figure 1 and Figure 2 The first lower roller component 4 includes a second shaft portion 401 and a second bushing portion 402. The axis of the second shaft portion 401 is parallel to the axis of the first shaft portion 101, and the relative positions of the second shaft portion 401 and the first shaft portion 101 remain fixed. The second bushing portion 402 is fixed to the second shaft portion 401 and can rotate synchronously with the second shaft portion 401 around its axis. The second bushing portion 402 and the first bushing portion 102 are arranged in a one-to-one correspondence.

[0048] As an example, the silicon wafer transport device may also include a driving device (not shown in the figure), which can drive the second shaft portion 401 of all the first lower rollers 4 to rotate synchronously. The second shaft portion 401 drives the second bushing portion 402 fixed to the second shaft portion 401 to rotate synchronously, so that the silicon wafer transport device can transport the silicon wafer 3 at a uniform speed along the first direction.

[0049] It is understood that in other embodiments, each first lower roller member 4 may include only a second shaft portion 401 and a second bushing portion 402, with the second bushing portion 402 corresponding to all the first bushing portions 102 on the corresponding upper roller member 1.

[0050] In some implementation methods, please refer to Figure 1When no silicon wafer 3 passes under the first bushing portion 102, the first bushing portion 102 can move downward under the action of gravity, so that there is a gap between the first bushing portion 102 and the pressure detection element 2.

[0051] As one implementation method, please refer to Figure 1 When no silicon wafer 3 passes under the first bushing 102, the first bushing 102 contacts the corresponding second bushing 402. Under the action of the rotating first lower roller 4, the first bushing 102 of the corresponding upper roller 1 rotates in the opposite direction to the rotation direction of the second bushing 402, thereby more effectively guiding the silicon wafer 3 to move in the first direction between the first bushing 102 and the corresponding second bushing 402.

[0052] It should be noted that, in other embodiments, when the silicon wafer 3 does not pass below the first bushing portion 102, the first bushing portion 102 is suspended above the second bushing portion 402 via the first axis portion 101, and there may be a gap between the first bushing portion 102 and the corresponding second bushing portion 402. When the second bushing portion 402 drives the silicon wafer 3 to move along the first direction between the first bushing portion 102 and the corresponding second bushing portion 402, since the silicon wafer 3 is in contact with the second bushing portion 402, the silicon wafer 3 can drive the second bushing portion 402 to rotate in the opposite direction to the rotation direction of the second bushing portion 402.

[0053] In some implementation methods, please refer to Figure 3 and Figure 4 The silicon wafer transport device also includes a second lower roller 6. At least one second lower roller 6 is disposed between two adjacent first lower rollers 4. The second lower roller 6 rotates synchronously with the first lower rollers 4 and can jointly drive the silicon wafer 3 to move along the first direction. The structure of the second lower roller 6 can be the same as that of the first lower roller 4. The difference between the second lower roller 6 and the first lower roller 4 is that the second lower roller 6 does not have an upper roller 1 and a pressure detection element 2 above it.

[0054] It should be noted that, in other implementation methods, please refer to... Figure 5 and Figure 6 The silicon wafer transport device may not include the second lower roller 6, and can be set according to the actual situation, which will not be elaborated here.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The above embodiments merely illustrate preferred implementations of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this patent application should be determined by the appended claims.

Claims

1. A silicon wafer transmission device, characterized in that, include: The upper roller component includes a first shaft portion and a first bushing portion sleeved on the first shaft portion, wherein there is a gap between the first bushing portion and the first shaft portion, and the first bushing portion is capable of moving up and down relative to the first shaft portion; and Pressure detection elements are provided one-to-one with the first bushing portions. The pressure detection elements are located above the corresponding first bushing portions and are relatively fixed to the first shaft portion. When no silicon wafer passes under the first bushing portion, there is a gap between the first bushing portion and the corresponding pressure detection element; When a silicon wafer passes under the first bushing portion, the first bushing portion can be lifted upward by the silicon wafer until it contacts the corresponding pressure detection element.

2. The silicon wafer transmission device as described in claim 1, characterized in that, The first bushing portion can also rotate relative to the first shaft portion about the axis of the first shaft portion.

3. The silicon wafer transmission device as described in claim 1, characterized in that, The silicon wafer transport device is used to transport the silicon wafer along a first direction, and the silicon wafer transport device includes a plurality of upper rollers spaced apart along the first direction.

4. The silicon wafer transport device as described in claim 3, characterized in that, The first shaft portion is configured as a rod structure extending along a second direction perpendicular to the first direction, and the upper roller includes a plurality of first bushing portions, which are evenly spaced along the second direction.

5. The silicon wafer transport device as described in claim 4, characterized in that, The first bushing portion is a cylindrical structure extending along the second direction.

6. The silicon wafer transmission device as described in claim 1, characterized in that, When the first bushing portion abuts against the corresponding pressure detection element, the first bushing portion and the pressure detection element are in line contact.

7. The silicon wafer transport device as claimed in claim 1, characterized in that, The pressure detection element is a pressure sensor.

8. The silicon wafer transport device as claimed in claim 1, characterized in that, The silicon wafer transport device also includes an alarm, and each of the pressure detection elements is connected to the alarm.

9. The silicon wafer transport device as claimed in claim 1, characterized in that, The silicon wafer transport device further includes a first lower roller member that is configured in a one-to-one correspondence with the upper roller member. The first lower roller member is located below the corresponding upper roller member, and a transport channel for transporting the silicon wafer along a first direction is formed between the first lower roller member and the corresponding upper roller member.

10. The silicon wafer transport device as claimed in claim 9, characterized in that, The first lower roller component includes a second shaft core and a second bushing fixed to the second shaft core, with the second bushing and the first bushing being configured in a one-to-one correspondence.

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