Rapid positioning structure of ball mounter for ball mounter to carry out ball mounting on wafer fragments

Abstract

The utility model discloses a quick positioning structure for wafer fragment ball mounting by a ball mounting machine, which comprises a mounting plate, a hollow groove is formed in the middle of the mounting plate, and a horizontal strip is arranged at the position, corresponding to the hollow groove, of the middle of the mounting plate; the two ends of the horizontal strip are connected with sliding rods correspondingly, first sliding grooves are symmetrically formed in the positions, corresponding to the sliding rods, of the mounting plate, and the sliding rods are slidably connected into the first sliding grooves. Threaded moving rods are connected to the upper surfaces of the two sliding rods correspondingly, second sliding grooves are symmetrically formed in the positions, corresponding to the threaded moving rods, of the mounting plate, and the threaded moving rods are slidably connected into the second sliding grooves. After the horizontal adjustment of the horizontal strip in the X-axis direction is completed, when the wafer is placed, the wafer can be quickly positioned only by tightly attaching the wafer to the horizontal strip, and the X-axis levelness of the wafer does not need to be adjusted, so that the operation steps are reduced, the working efficiency is improved, and the adjustment accuracy is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of ball mounting machine, specifically relates to a quick positioning structure of ball mounting machine to wafer residual piece ball mounting. BACKGROUND

[0002] Ball mounting machine is a kind of high-precision automatic production equipment, it is specially used to accurately implant semiconductor chip or other tiny element to the predetermined position on substrate. Ball mounting machine can automatically complete a series of complex operations such as chip picking, positioning, implantation etc. through advanced visual identification technology and precise mechanical positioning system, ensure that each chip can be accurately placed to the target soldering point on substrate, realize the electrical connection between chip and substrate.

[0003] Wafer piece, also known as wafer, is the thin piece of high-purity crystalline silicon. It is the abbreviation of semiconductor crystal wafer, and is the thin slice of cylindrical semiconductor crystal, used as the substrate of carrier in integrated circuit process, and wafer residual piece is the incomplete, defective or edge part produced after wafer is cut or processed in semiconductor manufacturing process.

[0004] At present, in prior art, before wafer residual piece is ball mounted, the X-axis level of wafer residual piece needs to be adjusted, and the common adjustment mode for wafer residual piece is manual adjustment. Although the X-axis level of wafer residual piece can be adjusted through this mode, the operation process is relatively cumbersome, the adjustment efficiency is low, and the adjustment accuracy cannot be guaranteed. UTILITY MODEL CONTENTS

[0005] To solve the technical problems that wafer residual piece adjustment is cumbersome, the adjustment efficiency is low and the adjustment accuracy cannot be guaranteed, the utility model provides a quick positioning structure of ball mounting machine to wafer residual piece ball mounting.

[0006] The purpose of the utility model can be realized by the following technical schemes:

[0007] A kind of quick positioning structure of ball mounting machine to wafer residual piece ball mounting, including mounting plate, hollow slot is set in the middle part of mounting plate, horizontal bar is set in the position of the middle part of mounting plate corresponding to hollow slot;The both ends of horizontal bar are connected with slide rod respectively, the first sliding slot of symmetrical arrangement is set in the position of mounting plate corresponding to slide rod, and slide rod is slidably connected in the first sliding slot;The upper surface of two slide rods is connected with threaded moving rod, the second sliding slot of symmetrical arrangement is set in the position of mounting plate corresponding to threaded moving rod, and threaded moving rod is slidably connected in the second sliding slot;The outer side of two threaded moving rods is screw-connected with internal thread screw rod.

[0008] Preferably, the mounting plate is octagonal, and the shape of the mounting plate is consistent with the platform of the ball mounting machine.

[0009] Preferably, the total length of the mounting plate is consistent with the total length of the ball mounting machine platform, which is 240mm, and the long side length of the mounting plate is consistent with the long side length of the ball mounting machine platform, which is 180mm.

[0010] Preferably, the hollow slot shape is the same as the mounting plate, which is octagonal.

[0011] Preferably, the lower surface of the horizontal bar is attached to the upper surface of the ball mounting machine platform.

[0012] Preferably, the lower surface of the internally threaded screw is attached to the upper surface of the mounting plate.

[0013] Preferably, the first baffle is connected to the front side of the mounting plate, and the second baffle is connected to the left side of the mounting plate.

[0014] Preferably, the first fixed block is connected to the right side of the mounting plate, the first screw is threadedly connected to the middle of the first fixed block, the second fixed block is connected to the rear side of the mounting plate, and the second screw is threadedly connected to the middle of the second fixed block.

[0015] The beneficial effects of the present application are as follows:

[0016] When adjusting the position of the horizontal bar for the first time, the position of one end of the horizontal bar is determined according to the camera of the ball mounting machine, and after the position is determined, the internally threaded screw is tightened through the cooperation of the internally threaded screw and the threaded moving rod, so that the internally threaded screw is tightly attached to the upper surface of the mounting plate, thereby fixing the end of the horizontal bar that has been determined. After the end of the horizontal bar is fixed, the level of the X-axis direction of the horizontal bar is adjusted according to the camera of the ball mounting machine, and after the adjustment is completed, the other end of the horizontal bar is fixed through the cooperation of the internally threaded screw and the threaded moving rod, thereby completing the position adjustment of the horizontal bar. After the position adjustment of the horizontal bar is completed for the first time, the position of the horizontal bar does not need to be adjusted when positioning the wafer residual pieces of the same specification. When positioning wafer residual pieces of different specifications, the above operation can be repeated to complete the position adjustment of the horizontal bar. The operation is simple and fast, the level adjustment of the X-axis direction of the horizontal bar is completed, and when placing the wafer residual pieces, the wafer residual pieces can be quickly positioned by attaching them to the horizontal bar, without the need to adjust the X-axis level of the wafer residual pieces, thereby reducing the operation steps, improving the work efficiency, and improving the adjustment accuracy.

[0017] When installing the mounting plate, place it above the ball-planting machine platform, aligning the first baffle, second baffle, first fixing block, and second fixing block with the front, left, right, and rear sides of the platform, respectively. Lower the mounting plate so its lower surface adheres to the upper surface of the platform. At this point, the first baffle, second baffle, first fixing block, and second fixing block are all located around the periphery of the platform, and the mounting plate's shape and dimensions are identical to the platform. Therefore, the mounting plate can only move vertically and cannot move horizontally, thus initially fixing it. Then, through the cooperation of the first and second screws, the first screw is threaded to the middle of the first fixing block and the right side of the platform, and the second screw is threaded to the middle of the second fixing block and the rear side of the platform. After the first and second screws are connected, the mounting plate cannot move vertically, thus fixing it in place. The installation and removal of the mounting plate is relatively simple, improving efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a perspective view of the rapid positioning structure for planting balls onto wafer fragments using a ball-planting machine according to this utility model;

[0020] Figure 2 This is a top view of the rapid positioning structure for planting balls onto wafer fragments using a ball-planting machine according to this utility model;

[0021] Figure 3 This is a cross-sectional view of the rapid positioning structure of the ball planting machine for planting balls onto wafer fragments according to this utility model.

[0022] Figure 4 This is a perspective view of the horizontal strip in the rapid positioning structure for planting balls onto wafer fragments using a ball-planting machine according to this utility model.

[0023] The attached diagram lists the components represented by each number as follows:

[0024] 1. Mounting plate; 2. Leveling strip;

[0025] 11. Hollow groove; 12. First baffle; 13. Second baffle; 14. First fixing block; 15. First screw; 16. Second fixing block; 17. Second screw;

[0026] 21. Slide rod; 22. First slide groove; 23. Threaded moving rod; 24. Second slide groove; 25. Internal threaded screw. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1 - Figure 4 As shown, a quick positioning structure for planting balls on wafer fragments by a ball planting machine includes a mounting plate 1, which is used to install a horizontal bar 2 and fix the position of the horizontal bar 2.

[0029] Mounting plate 1 is octagonal, and its shape is consistent with that of the ball-planting machine platform.

[0030] The total length of mounting plate 1 is the same as the total length of the ball planting machine platform, which is 240mm;

[0031] The long side of mounting plate 1 is the same as the long side of the ball planting machine platform, which is 180mm.

[0032] This setup offers the following advantages: First, it maximizes the use of space on the ball-planting machine platform, avoiding space waste caused by shape mismatch.

[0033] Second, it can provide more uniform structural support, enhancing overall stability;

[0034] Third, it makes the positioning of mounting plate 1 on the ball-planting machine platform more accurate, which simplifies the installation process;

[0035] Fourth, because of the shape matching, mounting plate 1 can be more easily aligned and fixed with the ball planting machine platform, which can shorten the installation time.

[0036] A hollow groove 11 is provided in the middle of the mounting plate 1. The hollow groove 11 is used to expose the ball planting machine platform and prevent the mounting plate 1 from obstructing the ball planting machine platform.

[0037] The hollow groove 11 has the same shape as the mounting plate 1, and is octagonal. This arrangement allows the ball-planting machine platform to be displayed to the maximum extent, so as not to affect the ball-planting of wafer fragments.

[0038] A first baffle 12 is connected to the front side of the mounting plate 1. The first baffle 12 is used to correspond to the front side of the ball planting machine platform and to assist in positioning the mounting plate 1.

[0039] The mounting plate 1 is connected to a second baffle 13 on the left side. The second baffle 13 is used to correspond to the left side of the ball planting machine platform and to assist in the positioning of the mounting plate 1. The first baffle 12 cooperates with the second baffle 13 to initially position the mounting plate 1 so that the mounting plate 1 corresponds to the ball planting platform.

[0040] The mounting plate 1 has a first fixing block 14 connected to the right side. The first fixing block 14 has a first screw 15 threadedly connected to the middle of the first fixing block 14. The first fixing block 14 is used to correspond to the right side of the ball planting machine platform. The first fixing block 14 and the first screw 15 can connect the first fixing block 14 to the right side of the ball planting machine platform.

[0041] A second fixing block 16 is connected to the rear side of the mounting plate 1. A second screw 17 is threadedly connected to the middle of the second fixing block 16. The second fixing block 16 is used to correspond to the rear side of the ball planting machine platform. The second fixing block 16, in conjunction with the second screw 17, can be connected to the rear side of the ball planting machine platform.

[0042] In practical use, when installing mounting plate 1, it is placed above the ball-planting machine platform, with the first baffle 12, second baffle 13, first fixing block 14, and second fixing block 16 corresponding to the front, left, right, and rear sides of the ball-planting machine platform, respectively. After alignment, mounting plate 1 is lowered so that its lower surface adheres to the upper surface of the ball-planting machine platform. At this time, the first baffle 12, second baffle 13, first fixing block 14, and second fixing block 16 are all located on the periphery of the ball-planting machine platform, and the shape and size of mounting plate 1 are consistent with those of the ball-planting machine platform. Mounting plate 1 can only move vertically and cannot move horizontally, thus initially fixing mounting plate 1. Then, through the cooperation of the first screw 15 and the second screw 17, the first screw 15 is threaded to the middle of the first fixing block 14 and the right side of the ball-planting machine platform, and the second screw 17 is threaded to the middle of the second fixing block 16 and the rear side of the ball-planting machine platform. After the first screw 15 and the second screw 17 are connected, mounting plate 1 cannot move vertically, thus fixing mounting plate 1. Mounting plate 1 is relatively simple to install and remove, which can improve efficiency.

[0043] A horizontal bar 2 is provided in the middle of the mounting plate 1, corresponding to the position of the hollow groove 11. The horizontal bar 2 is used to adjust the level of the wafer fragment.

[0044] The lower surface of the horizontal strip 2 is in contact with the upper surface of the ball-planting machine platform. This setting avoids gaps between the horizontal surface and the ball-planting machine platform, thus preventing wafer fragments from entering the gaps. If wafer fragments enter the gaps, it will be impossible to adjust the level of the wafer fragments.

[0045] The horizontal bar 2 is connected to two sliding rods 21 at its two ends. The mounting plate 1 has symmetrically arranged first sliding grooves 22 at the positions corresponding to the sliding rods 21. The sliding rods 21 are slidably connected in the first sliding grooves 22. The sliding rods 21 cooperate with the first sliding grooves 22 to limit the position of the horizontal bar 2 and allow the horizontal bar 2 to be adjusted in the hollow groove 11.

[0046] Both slide rods 21 are connected to threaded moving rods 23 on their upper surfaces. The mounting plate 1 has symmetrically arranged second slide grooves 24 at the positions corresponding to the threaded moving rods 23. The threaded moving rods 23 are slidably connected in the second slide grooves 24. The threaded moving rods 23 are used to assist in adjusting the position of the horizontal bar 2. The threaded moving rods 23 cooperate with the second slide grooves 24 to further limit the position of the horizontal bar 2.

[0047] Both threaded moving rods 23 are threaded with internal threaded screws 25 on their outer sides. The lower surface of the internal threaded screws 25 is in contact with the upper surface of the mounting plate 1. The internal threaded screws 25, in conjunction with the threaded moving rods 23, can fix the position of the horizontal bar 2 and prevent the horizontal bar 2 from shifting.

[0048] In practical use, when adjusting the position of the horizontal bar 2 for the first time, the position of one end of the horizontal bar 2 is determined by the camera of the ball-planting machine. After the position is determined, the internal threaded screw 25 is tightened by cooperating with the threaded moving rod 23, so that the internal threaded screw 25 is in close contact with the upper surface of the mounting plate 1, thereby fixing the determined position of one end of the horizontal bar 2. After one end of the horizontal bar 2 is fixed, the horizontal bar 2 is adjusted in the X-axis direction by the camera of the ball-planting machine. After the adjustment is completed, the other end of the horizontal bar 2 is fixed by cooperating with the internal threaded screw 25 and the threaded moving rod 23, thus completing the position adjustment of the horizontal bar 2. After the initial adjustment of the position of horizontal bar 2, when positioning wafer fragments of the same specification, there is no need to adjust the position of horizontal bar 2 again. When positioning wafer fragments of different specifications, the above operation can be repeated to complete the adjustment of the position of horizontal bar 2. The operation is simple and quick. After the horizontal adjustment of horizontal bar 2 in the X-axis direction is completed, when placing wafer fragments, it is only necessary to place the wafer fragments close to horizontal bar 2 to quickly position the wafer fragments. There is no need to adjust the horizontal of the wafer fragments in the X-axis, which reduces the operation steps, improves work efficiency, and improves the accuracy of adjustment.

[0049] In the description of this specification, the references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0050] The above description is merely an example and illustration of the structure of this utility model. Those skilled in the art can make various modifications or additions to the specific embodiments described, or use similar methods to replace them, as long as they do not deviate from the structure of the utility model or exceed the scope defined in the claims, all of which should fall within the protection scope of this utility model.

Claims

1. A rapid positioning structure for planting pellets onto wafer fragments using a pellet planting machine, characterized in that: Includes a mounting plate (1), wherein a hollow groove (11) is provided in the middle of the mounting plate (1), and a horizontal strip (2) is provided in the middle of the mounting plate (1) corresponding to the position of the hollow groove (11); The horizontal bar (2) is connected to two sliding rods (21) at both ends. The mounting plate (1) is provided with symmetrically arranged first sliding grooves (22) corresponding to the sliding rods (21). The sliding rods (21) are slidably connected in the first sliding grooves (22). Both slide rods (21) are connected to threaded moving rods (23) on their upper surfaces. The mounting plate (1) is provided with symmetrically arranged second slide grooves (24) corresponding to the positions of the threaded moving rods (23). The threaded moving rods (23) are slidably connected in the second slide grooves (24). Both of the aforementioned threaded moving rods (23) are threaded to the outside with internal threaded screws (25).

2. The rapid positioning structure for planting pellets on wafer fragments using a pellet planting machine according to claim 1, characterized in that: The mounting plate (1) is octagonal, and its shape is consistent with that of the ball planting machine platform.

3. The rapid positioning structure for planting pellets on wafer fragments using a pellet planting machine according to claim 2, characterized in that: The total length of the mounting plate (1) is the same as the total length of the ball planting machine platform, which is 240mm. The length of the long side of the mounting plate (1) is the same as the length of the long side of the ball planting machine platform, which is 180mm.

4. The rapid positioning structure for planting pellets on wafer fragments using a pellet planting machine according to claim 3, characterized in that: The hollow groove (11) has the same shape as the mounting plate (1), and is octagonal.

5. The rapid positioning structure for planting pellets on wafer fragments using a pellet planting machine according to claim 4, characterized in that: The lower surface of the horizontal strip (2) is in contact with the upper surface of the ball planting machine platform.

6. The rapid positioning structure for planting pellets on wafer fragments using a pellet planting machine according to claim 5, characterized in that: The lower surface of the internal threaded screw (25) is in contact with the upper surface of the mounting plate (1).

7. The rapid positioning structure for planting pellets on wafer fragments using a pellet planting machine according to claim 6, characterized in that: The mounting plate (1) is connected to a first baffle (12) on the front side and a second baffle (13) on the left side of the mounting plate (1).

8. The rapid positioning structure for planting pellets on wafer fragments by a pellet planting machine according to claim 7, characterized in that: The mounting plate (1) is connected to a first fixing block (14) on the right side, and a first screw (15) is threadedly connected to the middle of the first fixing block (14). The mounting plate (1) is connected to a second fixing block (16) on the rear side, and a second screw (17) is threadedly connected to the middle of the second fixing block (16).

Images