Turnover mechanism applied to turnover of silicon wafer

Abstract

The utility model relates to the technical field of silicon wafer processing, in particular to a turnover mechanism applied to turnover of a silicon wafer. The device comprises a device shell, a rotating unit arranged on a platform of the device shell, a jacking mechanism arranged in the device shell and in the middle of the rotating unit, and a clamping mechanism arranged above the jacking mechanism and used for clamping a silicon wafer. Compared with the prior art, the silicon wafer overturning device has the advantages that the silicon wafers inside are ejected out and separated from the wafer basket through the jacking mechanism, then the wafer basket is rotated and overturned by 180 degrees, and then the silicon wafers are placed in the overturned wafer basket, so that overturning of the silicon wafers is achieved, compared with the prior art, the silicon wafer overturning device overturns all the silicon wafers at a time, efficiency is improved, and production cost is reduced. And the processing time is greatly saved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a flipping mechanism for flipping silicon wafers. Background Technology

[0002] Currently, silicon wafer manufacturing inevitably involves the use of carriers such as baskets and graphite boats to switch between different process steps. Generally, there are two automation requirements: transferring silicon wafers from baskets to graphite boats and vice versa. With the industrialization of silicon wafer production, the demand for automated handling and placement capacity is increasing.

[0003] The existing technology, application number CN2020213798129, describes a silicon wafer handling mechanism that uses a clamping method to transfer wafers by flipping them one by one in a wafer basket and placing them in another wafer basket for subsequent work. This method is inefficient and time-consuming.

[0004] Therefore, it is necessary to design a flipping mechanism for silicon wafer flipping to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a flipping mechanism for silicon wafer flipping, so as to overcome the above-mentioned shortcomings of the existing technology.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A flipping mechanism for silicon wafer flipping includes a device housing, characterized in that it further includes a rotating unit disposed on the platform of the device housing, a lifting mechanism disposed inside the device housing and in the middle of the rotating unit, and a clamping mechanism disposed above the lifting mechanism for clamping the silicon wafer. The clamping mechanism includes a drive slide rail, a drive block slidably mounted on the drive slide rail via a slider, a clamping screw module threadedly connected to the drive block, a drive motor for driving the clamping screw module, connecting rods rotatably disposed at both ends of the drive block via shafts, a drive rod rotatably mounted on the rear surface of the device housing at one end via a shaft and connected to the connecting rod at the other end, and a clamping block interconnected with the drive rod and driven to flip by the drive rod.

[0008] Preferably, the rotating unit includes a motor mounting base mounted on the bottom surface of the equipment housing, a rotating motor mounted on the motor mounting base, a main drive roller driven by the rotating motor, a driven drive roller corresponding to the main drive roller and intertwined with it by a conveyor belt, a rotating shaft connected to the driven drive roller by a coupling shaft, and a rotating plate that is fitted to the rotating unit.

[0009] Preferably, a number of limit blocks are provided on the rotating plate, and a sensor is also provided on the side of the limit blocks.

[0010] Preferably, the rotating plate is provided with a clearance groove for use with the lifting mechanism.

[0011] Preferably, the lifting mechanism includes a lifting mounting block disposed within the equipment housing, a slide rail disposed on the side of the lifting mounting block, a lead screw module disposed on the lifting mounting block and corresponding to the slide rail, a sliding block threaded onto the lead screw module and slidably mounted on the slide rail via a slider, a drive unit for driving the lead screw module to rotate, and a lifting block mounted on the sliding block.

[0012] Preferably, the lifting block consists of two vertical plates arranged symmetrically on the left and right, with the top of the vertical plates set at an inclined angle.

[0013] Preferably, a clamping mounting base is also provided outside the clamping block, and the other end of the clamping block is mounted to the clamping mounting base via a rotating shaft. A clamping fixture is provided on the inner wall of the clamping block, and the clamping fixture has a clamping groove for mounting the silicon wafer.

[0014] The beneficial effects of this utility model are as follows: This technical solution uses a lifting mechanism to push out the internal silicon wafers and separate them from the wafer basket. Then, by rotating the wafer basket and flipping it 180°, the silicon wafers are placed back into the flipped wafer basket, thereby realizing the flipping of the silicon wafers. Compared with the prior art, this utility model flips all silicon wafers at once, thereby improving efficiency and greatly saving processing time. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a flipping mechanism for silicon wafer flipping according to the present invention;

[0016] Figure 2 This is a schematic diagram of the internal structure of a flipping mechanism for silicon wafer flipping according to the present invention;

[0017] Figure 3 This is a schematic diagram of a clamping mechanism for a flipping mechanism applied to silicon wafer flipping according to the present invention;

[0018] Figure 4 This is a schematic diagram of the rotating unit of a flipping mechanism for silicon wafer flipping according to the present invention;

[0019] In the diagram: 1. Equipment housing; 2. Rotating unit; 3. Lifting mechanism; 4. Clamping mechanism; 21. Motor mounting base; 22. Rotating motor; 23. Main drive roller; 24. Conveyor belt; 25. Driven drive roller; 26. Rotating shaft; 27. Rotating plate; 28. Limit block; 29. ​​Sensor; 271. Clearance groove; 31. Lifting mounting block; 32. Slide rail; 33. Screw module; 34. Sliding block; 36. Lifting block; 41. Drive slide rail; 42. Drive block; 43. Clamping screw module; 44. Connecting rod; 45. Drive rod; 46. Clamping block; 47. Clamping mounting base; 48. Clamping fixture. Detailed Implementation

[0020] Reference Figures 1 to 4 A flipping mechanism for flipping silicon wafers includes a device housing 1, a rotating unit 2 disposed on the platform of the device housing, a lifting mechanism 3 disposed inside the device housing and in the middle of the rotating unit, and a clamping mechanism 4 disposed above the lifting mechanism for clamping the silicon wafer.

[0021] The rotating unit 2 includes a motor mounting base 21 mounted on the bottom surface of the equipment housing, a rotating motor 22 mounted on the motor mounting base, a main drive roller 23 driven by the rotating motor, a driven drive roller 25 corresponding to the main drive roller and intertwined with it by a transmission belt 24, a rotating shaft 26 connected to the driven drive roller by a connecting shaft, and a rotating plate 27 that is mounted in conjunction with the rotating unit.

[0022] To facilitate the installation and positioning of the tray, several sets of limiting blocks 28 are provided on the rotating plate, and sensors 29 are also provided on the side of the limiting blocks. The sensors detect whether the corresponding tray is installed in place, thereby ensuring the installation position of the tray and avoiding errors in the installation of the lifting mechanism or rotation.

[0023] Since the bottom of the tray has two protruding strip blocks, the entire tray can be fixed by limiting the bottom strip blocks. Specifically, strip-shaped limiting blocks are set on the left and right sides of the rotating plate to limit the sides of the strip blocks. Trapezoidal blocks are set on the front and rear sides of the rotating plate. The grooves on both sides of the trapezoidal blocks are used to limit one side of the strip blocks and limit the ends of the strip blocks. The cooperation of the two strip-shaped limiting blocks on both sides limits the strip blocks on all four sides, thus achieving fixation. The sensor is set on one side of the strip-shaped limiting block and close to the tray. When the tray is placed in place, the sensor will be deactivated, thus sensing that the tray is installed in place. Both the strip-shaped limiting blocks and the trapezoidal blocks are fixed to the mounting plate with nuts. The limiting modules can be replaced according to the tray model.

[0024] In order to be used in conjunction with the lifting mechanism, a clearance groove 271 for use with the lifting mechanism is provided on the rotating plate 27; a clearance groove for clearance is also provided at the corresponding position on the equipment housing.

[0025] The lifting mechanism 3 includes a lifting mounting block 31 disposed in the equipment housing, a slide rail 32 disposed on the side of the lifting mounting block, a lead screw module 33 disposed on the lifting mounting block and corresponding to the slide rail, a sliding block 34 threadedly mounted on the lead screw module and slidably mounted on the slide rail via a slider, a drive unit for driving the lead screw module to rotate, and a lifting block 36 mounted on the sliding block.

[0026] Specifically, the drive unit drives the lead screw module 33 to rotate, thereby enabling the sliding block 34 to move along the lead screw module 33, and the slide rail 32 assists in the movement, driving the lifting block 36 to move up and down, thereby achieving lifting or lowering.

[0027] The lifting block consists of two vertical plates arranged symmetrically on the left and right. In order to effectively support the silicon wafer, the top of the vertical plates is set at an inclined angle to restrict the silicon wafer.

[0028] The clamping mechanism 4 includes a drive slide rail 41, a drive block 42 slidably mounted on the drive slide rail via a slider, a clamping screw module 43 threadedly connected to the drive block, a drive motor that drives the clamping screw module, connecting rods 44 rotatably mounted at both ends of the drive block via a shaft, a drive rod 45 rotatably mounted on the rear surface of the equipment housing 1 at one end via a shaft and connected to the connecting rod at the other end, and a clamping block 46 connected to the drive rod and driven to flip by the drive rod.

[0029] Specifically, the drive motor drives the rotation of the clamping screw module 43, which in turn drives the drive block 42 to move up and down along the drive slide rail 41. When the drive block moves upward, it drives the connecting rod 44 to move upward, which in turn drives one end of the drive rod 45 to move. Since one end of the drive rod 45 is mounted on a shaft and placed inside the side plate, it rotates around the shaft to achieve clockwise rotation, which in turn drives the clamping block connected to it to rotate clockwise synchronously. Similarly, when it moves downward, it rotates counterclockwise. By synchronously driving the clamping blocks on both sides to rotate, the silicon wafer is clamped. When the clamping blocks on both sides are set opposite each other, the gap between them is the smallest, and the clamping force is the largest. Different angles result in different clamping forces.

[0030] To facilitate the rotation of the clamping block, a clamping mounting base 47 is provided outside the clamping block. The other end of the clamping block is mounted to the clamping mounting base via a rotating shaft, thereby enabling the clamping block to rotate.

[0031] In order to clamp and limit the silicon wafers one by one, a clamping fixture 48 is provided on the inner wall of the clamping block. The clamping fixture has clamping grooves that are used to fit the silicon wafers; thereby preventing the silicon wafers from contacting each other.

[0032] In this implementation scheme, a robotic arm moves a wafer basket containing silicon wafers onto the housing of the equipment and places it onto the rotating unit 2 as required. The basket is then positioned with the help of a limiting block. After the sensor detects that the basket is in place, the robotic arm moves away. Once the basket is in place, the bottom lifting mechanism 3 is activated, driving the lead screw module 33 to rotate. This causes the sliding block 34 to move upwards along the lead screw module 33. Simultaneously, the slide rail 32 assists in the movement, causing the lifting block 36 to move upwards. The lifting block passes through the rotating plate, lifting all the silicon wafers inside the basket and removing them from the basket. Simultaneously, the clamping mechanism 4 is activated, driving the clamping lead screw module 43 to rotate. This causes the driving block 42 to move upwards along the driving slide rail 41. At the same time, the connecting rod 44 moves upwards, causing one end of the driving rod 45 to move. The driving rod 45 then rotates around its axis, achieving a coordinated clamping connection. The clamping blocks rotate clockwise synchronously, and the spacing between the clamping blocks on both sides decreases after synchronous rotation, thus clamping the silicon wafer. Each silicon wafer is placed in the clamping slot of the clamping fixture 48. After the silicon wafer is ejected and clamped, the rotating unit 2 is driven, which drives the main drive roller 23 through the rotating motor 22, and drives the driven drive roller 25 through the conveyor belt 24, thereby driving the entire rotating plate 27 to rotate. Since the wafer basket is placed on the rotating plate 27, the wafer basket rotates synchronously. After rotating 180°, the entire wafer basket is flipped over. The clamping mechanism is driven, and the clamping blocks rotate counterclockwise to reset, releasing the silicon wafer. The silicon wafer is placed on the lifting block, and the lifting block moves down to reset, placing the silicon wafer back into the wafer basket. Since the wafer basket has been flipped over, and the silicon wafer is normally placed in the flipped wafer basket, it is then picked up again by the robot arm. After the wafer basket is removed, it is placed normally with the front facing up, so the silicon wafer inside is in a flipped state.

[0033] The advantages of this invention are that the lifting mechanism pushes out the silicon wafers inside and separates them from the wafer basket. Then, by rotating the wafer basket and flipping it 180°, the silicon wafers are placed back into the flipped wafer basket, thus achieving the flipping of the silicon wafers. Compared with the prior art, this invention flips all the silicon wafers at once, thereby improving efficiency and greatly saving processing time.

[0034] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A flipping mechanism for silicon wafer flipping, comprising a housing, characterized in that: It also includes a rotating unit disposed on the platform of the device housing, a lifting mechanism disposed inside the device housing and in the middle of the rotating unit, and a clamping mechanism disposed above the lifting mechanism for clamping silicon wafers. The clamping mechanism includes a drive slide rail, a drive block slidably mounted on the drive slide rail via a slider, a clamping screw module threadedly connected to the drive block, a drive motor for driving the clamping screw module, connecting rods rotatably disposed at both ends of the drive block via a shaft, a drive rod rotatably mounted on the rear surface of the device housing at one end via a shaft and connected to the connecting rod at the other end, and a clamping block connected to the drive rod and driven to flip by the drive rod.

2. The flipping mechanism for silicon wafer flipping according to claim 1, characterized in that: The rotating unit includes a motor mounting base installed on the bottom surface of the equipment housing, a rotating motor installed on the motor mounting base, a main drive roller driven by the rotating motor, a driven drive roller corresponding to the main drive roller and intertwined with it by a conveyor belt, a rotating shaft connected to the driven drive roller by a connecting shaft, and a rotating plate that is fitted to the rotating unit.

3. The flipping mechanism for silicon wafer flipping according to claim 2, characterized in that: Several sets of limiting blocks are provided on the rotating plate, and sensors are also provided on the side of the limiting blocks.

4. A flipping mechanism for silicon wafer flipping according to claim 2, characterized in that: The rotating plate is provided with clearance grooves for use with the lifting mechanism.

5. A flipping mechanism for silicon wafer flipping according to claim 1, characterized in that: The lifting mechanism includes a lifting mounting block disposed within the equipment housing, a slide rail disposed on the side of the lifting mounting block, a lead screw module disposed on the lifting mounting block and corresponding to the slide rail, a sliding block threaded onto the lead screw module and slidably mounted on the slide rail via a slider, a drive unit for driving the lead screw module to rotate, and a lifting block mounted on the sliding block.

6. A flipping mechanism for silicon wafer flipping according to claim 5, characterized in that: The lifting block consists of two vertical plates arranged symmetrically on the left and right, with the top of each vertical plate set at an inclined angle.

7. A flipping mechanism for silicon wafer flipping according to claim 1, characterized in that: A clamping mounting base is provided outside the clamping block. The other end of the clamping block is mounted to the clamping mounting base via a rotating shaft. A clamping fixture is provided on the inner wall of the clamping block. The clamping fixture has a clamping groove for mounting the silicon wafer.

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