Device with inflation function and capability of breaking vacuum residues of suction cup and test equipment

Abstract

The utility model provides a device with an inflation function and capable of breaking vacuum residues of a suction cup and test equipment, and is applied to the technical field of chip testing. The input end of a flow valve is used for receiving gas, the output end of the flow valve is communicated with one end of a switch valve through a pipeline, and the other end of the switch valve is connected with a gas inlet connector through a pipeline; the air inlet connector is installed on the suction cup and communicated with the cavity. When a wafer is operated and unloaded, vacuum residues exist in a cavity of the suction cup, the flow valve receives gas and controls the flow of the passing gas, the switching valve controls opening of the passing gas, the gas is filled into the cavity through the gas inlet connector, the gas filled into the cavity breaks the vacuum residues, and the air pressure in the cavity is rapidly restored to the normal state, such as the atmospheric state. Therefore, the wafer can be normally unloaded, the probability of alarm is reduced, the probability of downtime is reduced, the downtime is shortened, and the risk of influence on appearance damage of product quality can be reduced under the condition that manual processing is needed.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, specifically to a device and testing equipment with an inflation function that can break the vacuum residue of the suction cup. Background Technology

[0002] Currently, the PRECIO OCTO chip test probe station primarily uses the Taiko Chuck type as the test platform for wafers (SGT / TVS / IGBT / SIC). Here, "wafer" refers to a wafer; "SGT" stands for Shielded Gate Transistor; "TVS" stands for Transient Voltage Suppressor; "IGBT" stands for Insulated Gate Bipolar Transistor; "SIC" represents silicon carbide semiconductor devices; and "Chuck" refers to a chuck. During wafer unloading, a step involves the Bernoulli arm picking up and removing the wafer after the Chuck releases its vacuum. In some cases, even after the vacuum solenoid valve closes, residual negative pressure inside the Chuck can prevent the wafer from being properly removed, triggering an alarm and potentially causing system crashes.

[0003] Therefore, a new technological solution is needed. Utility Model Content

[0004] In view of this, embodiments of this specification provide a device and testing equipment with an inflation function that can break the vacuum residue of the suction cup.

[0005] The embodiments in this specification provide the following technical solutions:

[0006] This specification provides an embodiment of a device with an inflation function that can break the vacuum residue of a suction cup. The suction cup is used for loading and unloading wafers. The suction cup has a chamber and is provided with a vacuum connector communicating with the chamber. The vacuum connector is used to extract gas from the chamber to create a negative pressure in the chamber. The suction cup has a disk surface for contacting the wafer. A hole is provided between the chamber and the disk surface so that the negative pressure chamber can suck the wafer at the disk surface position through the hole.

[0007] The device includes an inlet connector, a switching valve, and a flow valve. The input end of the flow valve is used to receive gas, and the output end of the flow valve is connected to one end of the switching valve through a pipeline. The other end of the switching valve is connected to the inlet connector through a pipeline. The inlet connector is mounted on a suction cup and connects to a chamber. The flow valve is used to control the flow rate of the gas passing through it, and the switching valve is used to control the switching of the gas passing through it, so that the gas passing through the inlet connector fills the chamber. The gas filling the chamber is used to break the vacuum residue.

[0008] Preferably, there are multiple air intake connectors, and the switching valve is configured with multiple corresponding air intake connectors;

[0009] The output end of the flow valve is connected to a flow divider via a pipeline, and the flow divider is connected to a corresponding on / off valve via a pipeline.

[0010] Preferably, there are two switching valves, and the diverter is a tee connector.

[0011] Preferably, the switching valve is a solenoid valve.

[0012] Preferably, the pipeline is a six-point pipeline.

[0013] Preferably, the switching time of the switching valve and the flow rate of the flow valve are adjustable, so that the switching time of the switching valve and the flow rate of the flow valve are set according to the volume of the chamber.

[0014] Preferably, the volume of the chamber is 376.8 cm³. 3 The switching valve is set to have a switching time of 2 seconds, and the flow rate valve is set to have a flow rate of less than 11.3 L / min.

[0015] Preferably, the switching valve is equipped with a manual button for manually controlling the switching of the gas.

[0016] The embodiment of this specification provides a testing device characterized in that it includes a suction cup, a vacuum solenoid valve, an arm for loading and unloading wafers, and any of the above-mentioned devices having an inflation function and capable of breaking the vacuum residue of the suction cup.

[0017] The vacuum solenoid valve is connected to a vacuum connector.

[0018] In one embodiment, two vacuum connectors are provided;

[0019] The holes are configured as multiple holes, and the holes are needle-shaped holes, and the multiple holes are distributed in an array around the center of the disk surface.

[0020] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0021] When the device described in this application is unloading a wafer, a vacuum residue exists in the chamber of the suction cup. The flow valve receives gas and controls the flow rate of the gas, and the switching valve controls the opening of the gas. The gas enters the chamber through the gas inlet connector. The gas entering the chamber breaks the vacuum residue, allowing the gas pressure in the chamber to quickly return to a normal state, such as atmospheric pressure. The wafer can then be unloaded normally, thereby reducing the probability of alarms, the probability of system crashes, and downtime. In cases where manual handling is required, it can also reduce the risk of damage to the appearance of the product. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the device in this application;

[0024] Figure 2 This is a cross-sectional schematic diagram of the chamber of the suction cup in this application.

[0025] Reference numerals: 1. Flow valve; 2. Solenoid valve; 3. Inlet connector; 4. Vacuum connector. Detailed Implementation

[0026] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0027] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0029] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0030] Additionally, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be carried out without these specific details.

[0031] In light of this, the applicant, through in-depth research and improvement exploration of wafer testing, discovered that: the TAIKO CHUCK type, with its vacuum solenoid valve release and Bernoulli arm suction, has a relatively high probability of triggering a vacuum alarm; while the WAT low-leakage CHUCK type, with its vacuum solenoid valve release and 3-pin physical removal, does not trigger a vacuum alarm. The TAIKO CHUCK lacks a 3-pin (probe) structure, making it impossible to physically remove vacuum residue, thus making it more prone to vacuum alarms, primarily leading to system crashes. Improper manual handling may also result in product damage.

[0032] Chinese utility model patent document CN216207363U discloses a device for detecting the airtightness and expiratory resistance of an exhalation valve. This device records and controls the expiratory flow rate by adding an exhalation valve. The exhalation valve is clamped onto a fixture and sealed to a constant-volume chamber. Air is pumped into the constant-volume chamber to a specified negative pressure via an airtightness detection air path. The change in negative pressure within the constant-volume chamber is recorded to obtain the airtightness of the exhalation valve. Conversely, air is pumped into the constant-volume chamber via an expiratory resistance detection air path. When the pumping flow rate reaches a specified value, the pressure within the constant-volume chamber is measured to obtain the expiratory resistance of the exhalation valve. Therefore, this device simultaneously performs both airtightness and expiratory resistance detection functions. The exhalation valve seat is detachably mounted on a moving block. When different specifications of exhalation valves need to be tested, only the different exhalation valves need to be replaced, thus adapting to the testing needs of exhalation valves of different specifications.

[0033] Based on this, the technical solutions provided by the various embodiments of this application will be described below with reference to the accompanying drawings.

[0034] This specification provides an embodiment of a device that has an inflation function and can break the vacuum residue of the suction cup, such as... Figure 1 As shown, the chuck is used for loading and unloading wafers. The chuck has a chamber and a vacuum connector 4 communicating with the chamber. A vacuum solenoid valve is connected to the vacuum connector 4 so that the vacuum connector 4 can extract gas from the chamber, creating a negative pressure within the chamber. The chuck has a surface for contacting the wafer, and a hole connects the chamber and the surface, allowing the negative pressure chamber to hold the wafer positioned on the surface through the hole. The chuck can be, for example, a wafer testing platform.

[0035] The device includes an inlet connector 3, a switching valve, and a flow valve 1. The input end of the flow valve 1 is used to receive gas, and the output end of the flow valve 1 is connected to one end of the switching valve through a pipeline. The other end of the switching valve is connected to the inlet connector 3 through a pipeline. The inlet connector 3 is mounted on a suction cup and connects to the chamber. The flow valve 1 is used to control the flow rate of the gas passing through it, and the switching valve is used to control the switching of the gas passing through it, so that the gas passing through the inlet connector 3 fills the chamber. The gas filling the chamber is used to break the vacuum residue.

[0036] In one embodiment, such as Figure 1 As shown, there are multiple air inlet connectors 3, and multiple air inlet connectors 3 are set corresponding to the switching valves; the output end of the flow valve 1 is connected to the flow divider connector through a pipeline, and the flow divider connector is connected to the switching valve through a pipeline.

[0037] In one embodiment, such as Figure 1 As shown, there are two switching valves, and the diversion connector is a three-way connector.

[0038] In one embodiment, such as Figure 1 As shown, the switching valve is a switching solenoid valve 2.

[0039] In one embodiment, as Figure 1 shown, the pipeline is a six - minute pipeline.

[0040] In this application, hardware modification is carried out on the Chuck: A pipeline is branched from the total pipeline of Prober GAS (gas passing through the prober) and connected to the flow valve 1 to control the flow rate of the gas blown into the Chuck. After the flow valve 1, a tee is used to branch out two pipelines to connect to the 6” / 8” switch solenoid valve 2 to control the opening of the gas and close the gas after a preset time, for example, the preset time is 2S; Two 6” / 8” air inlet joints 3 are opened on the Chuck and connected with a six - minute pipeline. The flow rate control of the flow valve 1 needs to follow that the solenoid valve opening the gas for 2S can assist in restoring the inside of the Chuck TopPlate (suction cup top plate) to the atmospheric state. When unloading the wafer, the blowing solenoid valve is immediately opened when the vacuum solenoid valve is closed, so that the Pincette can pick up the wafer smoothly and is not prone to alarm. The switching valve can be set differently. One of the two solenoid valves is used for blowing during the production of 6 - inch wafers, and the other is used for blowing during the production of 8 - inch wafers. The gas used inside the prober can use a six - minute pipeline.

[0041] As Figure 1 shown, the Chinese translation of solenoid valve is solenoid valve; the Chinese translation of flow valve is flow valve 1; the Chinese translation of adjust size is adjust size; the Chinese translation of Air is air; the Chinese translation of vaccum is vacuum; the Chinese translation of Prober front is probe table front; the Chinese translation of 6” / 8”air is 6 / 8 - inch air hole; Figure 1 For the two vacuum joints 4 on the left and right in , the Chinese translations of Vaccum 6” and Vaccum 8” are 6 / 8 - inch vacuum holes.

[0042] In one embodiment, as Figure 1 shown, the switching time of the switching valve and the flow rate of the flow valve 1 can be adjusted so that the switching time of the switching valve and the flow rate of the flow valve 1 are set according to the volume of the chamber.

[0043] In one embodiment, as Figure 1 shown, the volume of the chamber is 376.8cm 3 , the switching time set for the switching valve is 2s, and the flow rate set for the flow valve 1 is less than 11.3L / min.

[0044] Given the size of the Chuck Top Plate, the volume of the Vacuum Chamber (vacuum chamber) is calculated: 376.8cm 3 . According to the flow rate required to fill this volume in 2S, 11.3L / min is obtained. In actual situations, it is necessary to adjust to a flow rate less than this value to avoid the situation of rapid gas overflow as much as possible. As Figure 2 As shown, the volume of the cylindrical surface = πr 2 h = 376.8 cm 3 , set the step of completing inflation within 2S, and convert it to the flow rate of the flow valve 1 ≤ 11.3 L / min. r represents the radius of the chamber, for example, the diameter is 200 mm, and h represents the height of the chamber, for example, it is 12 mm.

[0045] In one embodiment, a manual button is provided on the switching valve for manually controlling the on / off of the gas passing through.

[0046] In one embodiment, if an alarm still occurs in special cases, develop and add an interface for manual blowing in the TEL software, set the button to blow for 1S each time until the vacuum is broken, and then safely remove the wafer. The software operation is synchronously extended. Add a button for manual inflation switch at the manual (manual) switch of the vacuum solenoid valve for convenient emergency handling. Add a button for 6 / 8-inch blowing in the interface for manually controlling the vacuum switch of 6 / 8 inches in the software. The purpose is to be able to manually click the button through software control to slowly release the vacuum residue inside the chuck when an alarm occurs, so that the wafer can be safely separated from the chuck and the alarm can be eliminated.

[0047] The Chinese translation of Solution Flow is solution process. This application can make the blowing solenoid valve work for 2 seconds when the vacuum solenoid valve is off in the normal run wafer state, so that the air pressure in the top plate chamber can quickly return to the normal state. There will be no alarm during Unload wafer, which does not affect the Down Time, and also avoids the risk of appearance damage when processing products in abnormal states. This device is to solve the problem of reducing and尽可能杜绝关于类似的真空报警,减少Down Time(停机时间)。如需要手动处理的情况也能对于产品质量的外观的影响风险降到最低。

[0048] That is, a comparison of the manual processing of Solution Flow before and after improvement, comparing the processing procedures before and after improvement when a wafer taking alarm occurs and the wafer cannot be taken off from the chuck. The processing procedure before improvement: 1. A wafer taking alarm occurs and the wafer cannot be taken off from the chuck. 2. Manually close the solenoid valve and the main vacuum valve. If the operation is effective, the wafer can be completely released and taken off. If the operation is ineffective, it may cause incomplete release of the wafer, and there is a risk of hidden crack scratches when manually peeling the wafer.

[0049] This embodiment of the specification also discloses a test device, such as Figure 1 It should be noted that there seems to be some inaccuracies or unclear expressions in the original text, especially in the part of "尽可能杜绝关于类似的真空报警" which may need further clarification in the original content.As shown, it includes a suction cup, a vacuum solenoid valve, an arm for loading and unloading wafers, and any of the above embodiments with an inflation function that can break the vacuum residue of the suction cup; the vacuum solenoid valve is connected to vacuum connector 4.

[0050] In one embodiment, two vacuum connectors 4 are provided; multiple holes are provided, and the holes are needle-shaped holes, and the multiple holes are arranged in an array around the center of the disk surface. The holes are initially distributed in a straight line with the center of the disk surface as the endpoint, and the multiple holes after forming a straight line are arranged in an array around the center of the disk surface.

[0051] In this specification, the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the descriptions of the embodiments described later are relatively simple, and relevant parts can be referred to the descriptions of the foregoing embodiments.

[0052] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A device with an inflation function and capable of breaking vacuum residue from suction cups, characterized in that, The suction cup is used for loading and unloading wafers; the suction cup has a chamber and is provided with a vacuum connector communicating with the chamber. The vacuum connector is used to extract gas from the chamber to create a negative pressure in the chamber. The suction cup has a disk surface for contacting the wafer. A hole is provided between the chamber and the disk surface so that the negative pressure chamber can hold the wafer at the disk surface position through the hole. The device includes an inlet connector, a vacuum solenoid valve, a switching valve, and a flow valve. The input end of the flow valve is used to receive gas. The vacuum solenoid valve is connected to a vacuum connector. The output end of the flow valve is connected to one end of the switching valve through a pipeline. The other end of the switching valve is connected to the inlet connector through a pipeline. The inlet connector is mounted on a suction cup and connects to a chamber. The flow valve is used to control the flow rate of the gas passing through it, and the switching valve is used to control the switching of the gas passing through it, so that the gas passing through the inlet connector fills the chamber. The gas filling the chamber is used to break the vacuum residue.

2. The device with inflation function and capable of breaking vacuum residue in the suction cup according to claim 1, characterized in that, The air inlet connector is configured in multiple ways, and the switch valve is configured in multiple ways corresponding to the air inlet connector; The output end of the flow valve is connected to a flow divider via a pipeline, and the flow divider is connected to a corresponding on / off valve via a pipeline.

3. The device with inflation function and capable of breaking vacuum residue in the suction cup according to claim 2, characterized in that, The switching valve is configured as two, and the diversion connector is a three-way connector.

4. The device with inflation function and capable of breaking vacuum residue in the suction cup according to any one of claims 1-3, characterized in that, The switching valve is a solenoid valve.

5. The device with inflation function and capable of breaking vacuum residue in the suction cup according to any one of claims 1-3, characterized in that, The pipeline is a 6-point pipeline.

6. The device with inflation function and capable of breaking vacuum residue in the suction cup according to claim 1, characterized in that, The switching time of the switching valve and the flow rate of the flow valve are adjustable so that the switching time of the switching valve and the flow rate of the flow valve are set according to the volume of the chamber.

7. The device with inflation function and capable of breaking vacuum residue in the suction cup according to claim 4, characterized in that, The volume of the chamber is 376.8 cm³. 3 The switching valve is set to have a switching time of 2 seconds, and the flow rate valve is set to have a flow rate of less than 11.3 L / min.

8. The device with inflation function and capable of breaking vacuum residue in the suction cup according to claim 1, characterized in that, The switching valve is equipped with a manual button for manually controlling the flow of gas.

9. A testing device, characterized in that, It includes a suction cup, an arm for loading and unloading wafers, and a device according to any one of claims 1 to 8 that has an inflation function and can break the vacuum residue of the suction cup.

10. The testing equipment according to claim 9, characterized in that, Two vacuum connectors are provided; The holes are configured as multiple holes, and the holes are needle-shaped holes, and the multiple holes are distributed in an array around the center of the disk surface.

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