Simple chip sintering structure

Abstract

The utility model discloses a simple chip sintering structure which comprises a lower base, supporting springs are installed at the four corners of the top of the lower base, an upper carrier is installed at the tops of the supporting springs, a hollowed-out groove is formed in the center of the upper carrier, and a sample containing groove is formed in the top of the hollowed-out groove of the upper carrier. And the surface of the lower base is provided with a heat conduction boss corresponding to the hollow groove. The utility model provides a simple chip sintering structure, which can be matched with an existing common press for use, realizes the sintering of a chip, keeps a sample at a low temperature when no pressure exists before sintering and enables the sample to be rapidly heated during sintering and pressurizing, and is simple in structure, low in production and manufacturing cost, high in use flexibility and high in practicability. And application in colleges and laboratories is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model belongs to chip sintering technical field, concretely relates to a simple chip sintering structure. BACKGROUND

[0002] Power chip (Power chip) refers to power switch device, such as insulated gate bipolar transistor (IGBT), metal-oxide semiconductor field effect transistor (MOSFET), fast recovery diode (FWD) etc., utilizes the external package to form the package single tube or module, passes through the external gate circuit board and control unit, completes the both sides conversion of direct current / alternating current, utilizes the battery or other energy and drives motor operation.

[0003] In the package in power module, to guarantee the reliable connection of chip, and the better heat dissipation performance, usually adopts the welding or sintering mode.In recent years, the sintering mode is more and more applied to the connection of chip, especially the package of SiC device, and sintering becomes the standard connection mode.

[0004] In the present chip sintering process, standard package equipment is adopted, and specific sintering mould, as shown in Figure 1 The temperature of upper and lower pressing plates of the existing sintering equipment is controllable, can guarantee that the sample is in low temperature stage before sintering, the temperature rapidly rises when the upper and lower pressing plates start to press, realizes the sintering of high temperature and high pressure, and if the temperature rises in advance before pressing, then the sintering effect will be influenced.

[0005] At present, the sintering equipment and mould that can realize the pressing and heating simultaneously are expensive, and the flexibility is poor, and there are certain difficulties in the application in colleges and laboratories. UTILITY MODEL CONTENTS

[0006] In view of the problems in the above background art, the purpose of the utility model is to provide a simple chip sintering structure.

[0007] To realize the above technical purpose, the technical scheme adopted by the utility model is as follows:

[0008] A simple chip sintering structure, including lower base, the top four corners of the lower base are all installed with supporting spring, the top of the supporting spring is installed with upper carrier, the center of the upper carrier is equipped with hollow slot, the top of the hollow slot of the upper carrier is equipped with sample placing groove, the surface of the lower base is equipped with heat conduction boss at the hollow slot.

[0009] It is further limited that the lower base and heat conduction boss are integrally formed structure, and the lower base and heat conduction boss are all produced by using metal material with good heat conduction performance.The structure design can realize the quick heat conduction effect.

[0010] Furthermore, the upper carrier is manufactured from a non-metallic material with poor thermal conductivity. This structural design facilitates the support of the sample to be sintered.

[0011] Furthermore, both the lower base and the upper carrier are provided with mounting slots at the corresponding support springs, and the upper and lower sides of the support springs are installed in the mounting slots. This structural design facilitates installation and use.

[0012] The beneficial effects of this utility model are as follows: This utility model proposes a simple chip sintering structure that can be used with existing ordinary presses to achieve chip sintering. Before sintering, the sample is kept at a low temperature when there is no pressure, and the sample is rapidly heated when pressure is applied during sintering. This utility model has a simple structure, low production cost, and high flexibility of use, making it easy to apply in universities and laboratories. Attached Figure Description

[0013] This utility model can be further illustrated by the non-limiting embodiments given in the accompanying drawings;

[0014] Figure 1 This is a schematic diagram of the existing sintering equipment structure;

[0015] Figure 2 This is a schematic diagram of the axial side structure of a simplified chip sintering structure according to an embodiment of the present invention;

[0016] Figure 3 This is a cross-sectional schematic diagram of a simplified chip sintering structure according to an embodiment of the present invention;

[0017] The symbols for the main components are explained below:

[0018] 1. Lower base, 2. Support spring, 3. Upper carrier, 4. Hollowed-out groove, 5. Sample placement groove, 6. Heat-conducting boss, 7. Assembly groove. Detailed Implementation

[0019] To enable those skilled in the art to better understand this utility model, the technical solution of this utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0020] Example 1, as Figure 2 and Figure 3 As shown, a simple chip sintering structure is provided. Supporting springs 2 are installed at the four corners of the top of the lower base 1. An upper carrier 3 is installed on the top of the supporting springs 2. A hollow groove 4 is provided in the center of the upper carrier 3. A sample placement groove 5 is provided on the top of the hollow groove 4 of the upper carrier 3. A heat-conducting protrusion 6 is provided on the surface of the lower base 1 at the corresponding hollow groove 4.

[0021] In this embodiment, during use, a conventional press can be used to sinter the chip. The sample to be sintered is placed in the sample placement groove 5 inside the upper carrier 3, ensuring that the upper surface of the sample and the surface of the upper carrier 3 are in the same plane during sintering, so as to achieve a balanced distribution of sintering pressure. Since the lower base 1 and the upper carrier 3 are connected by the support spring 2, the lower base 1 and the upper carrier 3 do not contact each other before sintering. When there is no pressure before sintering, the upper carrier 3 is suspended by the support spring 2, which can keep the sample inside the upper carrier 3 at a low temperature. During sintering pressurization, the heat-conducting protrusion 6 contacts the sintering sample through the hollow groove 4, which plays a role in support and rapid heating.

[0022] In order to meet the sintering of samples of different shapes, the upper carrier 3 is equipped with sample placement grooves 5 of different shapes. During use, the lower base 1, support spring 2 and upper carrier 3 can be quickly replaced according to the specific situation.

[0023] Example 2, as Figure 3 As shown, this embodiment adds the following structure based on embodiment 1: the lower base 1 and the heat-conducting boss 6 are integrally formed structures, and both the lower base 1 and the heat-conducting boss 6 are made of metal materials with good thermal conductivity.

[0024] In this embodiment, since the lower base 1 and the heat-conducting protrusion 6 are integrally formed and are made of metal material with good thermal conductivity, the lower base 1 and the heat-conducting protrusion 6 can achieve rapid heat conduction. At the same time, they can also support the sample during sintering, and can quickly conduct heat to transfer heat to the sample, so that the sample can heat up rapidly when pressure is applied.

[0025] Example 3, as Figure 3 As shown, this embodiment adds the following structure to embodiment 1: the upper carrier 3 is made of a non-metallic material with poor thermal conductivity. This structural design facilitates the support of the sample to be sintered.

[0026] In this embodiment, since the upper carrier 3 is made of a non-metallic material with poor thermal conductivity, it can ensure that the temperature of the sample before sintering is not too high.

[0027] Example 4, as Figure 3 As shown, this embodiment adds the following structure based on embodiment 1: the lower base 1 and the upper carrier 3 are both provided with mounting grooves 7 at the corresponding support springs 2, and the upper and lower sides of the support springs 2 are installed in the mounting grooves 7.

[0028] In this embodiment, by setting the mounting groove 7 on the lower base 1 and the upper carrier 3, the support spring 2 can be positioned and installed, thereby enabling the upper carrier 3 to be suspended before sintering through the support spring 2.

[0029] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A simple chip sintering structure, characterized in that: The device includes a lower base (1), with support springs (2) installed at the four corners of the top of the lower base (1), an upper carrier (3) installed on the top of the support springs (2), a hollow groove (4) provided in the center of the upper carrier (3), a sample placement groove (5) provided on the top of the hollow groove (4) of the upper carrier (3), and a heat-conducting boss (6) provided on the surface of the lower base (1) at the corresponding hollow groove (4).

2. The simplified chip sintering structure according to claim 1, characterized in that: The lower base (1) and the heat-conducting boss (6) are integrally formed structures, and both the lower base (1) and the heat-conducting boss (6) are made of metal materials with good thermal conductivity.

3. The simplified chip sintering structure according to claim 2, characterized in that: The upper vehicle (3) is made of non-metallic materials with poor thermal conductivity.

4. The simplified chip sintering structure according to claim 3, characterized in that: The lower base (1) and the upper carrier (3) are both provided with mounting grooves (7) at the corresponding support springs (2), and the upper and lower sides of the support springs (2) are installed in the mounting grooves (7).

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