MOSFET device with protection structure
By protecting MOSFET devices with thermally conductive gel and a metal protective layer, combined with a limiting mechanism and heat dissipation design, the problem of easy bending of MOSFET device leads during transportation is solved, improving mechanical strength and heat dissipation performance, and ensuring reliability and soldering effect.
Patent Information
- Application Number
- CN202520039042.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-01-08
AI Technical Summary
MOSFET devices are prone to pin bending during transportation due to external forces, which reduces mechanical strength and affects reliability and lifespan.
The MOSFET motherboard is protected by thermally conductive gel and a metal protective layer. The pins are fixed by a protective shell and a limiting mechanism. Combined with a multi-layer gap layer and heat dissipation port design, the mechanical strength and heat dissipation effect are enhanced.
It effectively protects MOSFET device pins from bending damage, improves reliability and soldering results, enhances heat dissipation, and extends service life.
Smart Images
Figure CN223829824U_ABST
Abstract
Description
Technical Field
[0001] This utility model mainly relates to the field of MOSFET device technology, and specifically to a MOSFET device with a protection structure. Background Technology
[0002] A MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) is a voltage-controlled semiconductor device that controls conduction and cutoff through an electric field. It consists of a source, drain, gate, and substrate, and is classified into two main categories: enhancement-mode and depletion-mode, as well as N-channel and P-channel types. The working principle of a MOSFET is to control the electron channel between the drain and source by controlling the gate voltage, thereby controlling the current. It features high input impedance, low noise, low power consumption, and ease of integration, and is widely used in electronic and circuit applications, such as switching power supplies, high-frequency induction heating, inverters, welding machines, and communication power supplies. It also plays an important role in RF technology, power control, and amplifier circuits.
[0003] During transportation, MOSFET devices may be subjected to external forces such as shock and compression, which can cause their leads to bend. This can damage the internal metal structure and reduce mechanical strength, making the leads more prone to breakage during subsequent soldering or use, thus affecting the reliability and lifespan of the MOSFET device. Utility Model Content
[0004] 1. The technical problem to be solved by the utility model:
[0005] This invention provides a MOSFET device with a protective structure to solve the technical problems existing in the background art.
[0006] 2. Technical Solution:
[0007] To achieve the above objectives, the technical solution provided by this utility model is as follows: a MOSFET device with a protective structure, including a MOSFET main board, the MOSFET main board being encapsulated in a package shell, the package shell being provided with a metal protective layer, and having a plurality of evenly distributed first heat dissipation vents on the top, and a thermally conductive gel being provided between the bottom of the metal protective layer and the top of the MOSFET main board.
[0008] The pins of the MOSFET motherboard extend to the outside of the package and are fitted with a protective shell. The protective shell includes a first shell and a second shell. One end of the first shell is fixedly connected to the outside of the package and the other end has an annular slot. The second shell is inserted into the annular slot and locked by a limiting mechanism provided on the first shell.
[0009] Furthermore, the limiting mechanism includes a mounting frame, which is fixed on the first housing and has a movable rod slidably mounted thereon. The movable rod is provided with a spring that drives it downward, and a limiting block is provided at its bottom end. The limiting block matches a limiting groove opened on the second housing. There are multiple limiting grooves, which are linearly arranged along the extension direction of the second housing.
[0010] Furthermore, the bottom of the limiting block is provided with an inclined surface, which is inclined along the extension direction of the second housing.
[0011] Furthermore, both the first and second housings have multiple evenly distributed second heat dissipation vents on their sides.
[0012] Furthermore, the metal protective layer includes a bottom plate and a top plate, which are connected by multiple gap layers. The gap layers include a first gap plate and a second gap plate, and there are multiple gap plates of each type, which are stacked in a linear arrangement on a horizontal plane in mutually perpendicular directions.
[0013] Furthermore, silicone is applied between the top of the thermal conductive gel and the bottom of the base plate, and between the bottom of the gel and the top of the MOSFET motherboard.
[0014] Furthermore, a mounting block is provided on the side of the package shell away from the MOSFET motherboard pins, the bottom of the mounting block is lower than the bottom of the package shell, and double-sided adhesive is provided.
[0015] 3. Beneficial effects:
[0016] Compared with the prior art, the technical solution provided by this utility model has the following beneficial effects: the thermal conductive gel has the characteristics of shock absorption and thermal conduction, so in conjunction with the metal protective layer, it can not only protect the MOSFET motherboard, but also dissipate the heat generated by the MOSFET motherboard from the first heat dissipation port.
[0017] The first and second housings protect the pins of the MOSFET motherboard from bending during transportation, which would affect the subsequent soldering results. During soldering, the second housing is pushed into the annular slot until the pins protrude to a suitable soldering length, and then locked by the limiting mechanism. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0019] Figure 2 This is a schematic diagram of the exploded structure of the first and second shells of this utility model;
[0020] Figure 3 For the present utility model Figure 2Enlarged structural diagram at point A in the middle;
[0021] Figure 4 This is a schematic diagram of the overall cross-sectional structure of this utility model;
[0022] Figure 5 This is a schematic diagram of the exploded structure of the metal protective layer of this utility model.
[0023] Figure label:
[0024] 1. MOSFET mainboard; 2. Package housing; 21. First heat sink; 3. Protective housing; 31. First housing; 311. Annular slot; 32. Second housing; 321. Limiting groove; 3132. Second heat sink; 33. Limiting mechanism; 331. Mounting bracket; 332. Movable rod; 333. Spring; 334. Limiting block; 4. Metal protective layer; 41. Base plate; 42. Top plate; 43. Gap layer; 431. First gap plate; 432. Second gap plate; 5. Thermal conductive gel; 6. Mounting block; 7. Double-sided adhesive. Detailed Implementation
[0025] To facilitate understanding of this utility model, a more comprehensive description of the utility model will be given below with reference to the accompanying drawings, which show several embodiments of the utility model. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the utility model will be more thorough and complete.
[0026] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "page", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0028] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," and "equipped with" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. Example
[0029] See attached document Figure 1-5 A MOSFET device with a protective structure includes a MOSFET main board 1, which is encapsulated in a package 2. A metal protective layer 4 is provided in the package 2, and a plurality of uniformly distributed first heat dissipation vents 21 are opened on the top. A thermally conductive gel 5 is provided between the bottom of the metal protective layer 4 and the top of the MOSFET main board 1.
[0030] The pins of the MOSFET main board 1 extend to the outside of the package shell 2 and are fitted with a protective shell 3. The protective shell 3 includes a first shell 31 and a second shell 32. One end of the first shell 31 is fixedly connected to the outside of the package shell 2, and the other end is provided with an annular slot 311. The second shell 32 is inserted into the annular slot 311 and locked by a limiting mechanism 33 provided on the first shell 31.
[0031] In this embodiment, the thermally conductive gel 5 has the properties of shock absorption and thermal conductivity. Thus, in conjunction with the metal protective layer 4, it can not only protect the MOSFET motherboard 1, but also dissipate the heat generated by the MOSFET motherboard 1 from the first heat dissipation port 21.
[0032] The first housing 31 and the second housing 32 can protect the pins of the MOSFET motherboard 1 to prevent them from bending during transportation and affecting the subsequent soldering effect. During soldering, the second housing 32 is pushed into the annular slot 311 until the pin protrudes to a suitable length for soldering, and then locked by the limiting mechanism 33.
[0033] The limiting mechanism 33 includes a mounting frame 331, which is fixed on the first housing 31 and has a movable rod 332 slidably mounted thereon. The movable rod 332 is provided with a spring 333 that drives it downward, and a limiting block 334 is provided at its bottom end. The limiting block 334 matches the limiting groove 321 opened on the second housing 32. There are multiple limiting grooves 321, which are linearly arranged along the extension direction of the second housing 32.
[0034] In this embodiment, after the spring 333 drives the movable rod 332 downward, the limiting block 334 can be engaged in the limiting groove 321, thereby locking the second housing 32. There are multiple limiting grooves 321, which are linearly arranged along the extension direction of the second housing 32. Therefore, the second housing 32 can be locked in different positions, so that even if the pins of the MOSFET motherboard 1 need to be trimmed, they can still be exposed to a length suitable for soldering.
[0035] A preferred embodiment is provided below based on the above embodiments: the bottom of the limiting block 334 is provided with an inclined surface, which is inclined along the extension direction of the second housing 32.
[0036] In this embodiment, when the second housing 32 is pushed into the annular slot 311, and the limiting block 334 matches one of the limiting grooves 321, the spring 333 will drive the limiting block 334 to engage in the limiting groove 321. In conjunction with the inclined surface at the bottom of the limiting block 334, when the second housing 32 is pushed into the annular slot 311, the limiting block 334 will slide out of the limiting groove 321, thus eliminating the need to manually pull the movable rod 332 to drive the limiting block 334 away from the limiting groove 321.
[0037] Both the first housing 31 and the second housing 32 have multiple evenly distributed second heat dissipation vents 3132 on both sides for heat dissipation of the pins of the MOSFET motherboard 1.
[0038] The metal protective layer 4 includes a bottom plate 41 and a top plate 42. The bottom plate 41 and the top plate 42 are connected by multiple gap layers 43. The gap layer 43 includes a first gap plate 431 and a second gap plate 432. There are multiple gap plates of each type, which are stacked in a linear arrangement on a horizontal plane in mutually perpendicular directions.
[0039] In this embodiment, the structure of the multi-layer gap layer 43 can increase the heat dissipation area while ensuring the strength of the structure, and is lighter than a solid structure.
[0040] Silicone is applied between the top of the thermal conductive gel 5 and the bottom of the base plate 41, and between the bottom of the gel and the top of the MOSFET main board 1, to reduce the gap between them and improve the thermal conductivity.
[0041] A mounting block 6 is provided on the side of the package shell 2 away from the pins of the MOSFET motherboard 1. The bottom of the mounting block 6 is lower than the bottom of the package shell 2 and is provided with double-sided adhesive tape 7.
[0042] In this embodiment, after the bottom of the mounting block 6 is bonded to the circuit board to be soldered using double-sided adhesive 7, the bottom of the encapsulation shell 2 is suspended to reduce heat transfer between it and the circuit board.
[0043] The above-described embodiments are merely illustrative of certain implementations of this utility model, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
[0044] It should be noted that the above content falls within the scope of the inventor's technical knowledge. Due to the vast and complex nature of the technical content in this field, the above content of this application does not necessarily constitute prior art.
Claims
1. A MOSFET device with a protection structure, comprising a MOSFET motherboard (1), characterized in that: The MOSFET main board (1) is encapsulated in a package shell (2). A metal protective layer (4) is provided inside the package shell (2), and a plurality of evenly distributed first heat dissipation vents (21) are opened on the top. A thermal conductive gel (5) is provided between the bottom of the metal protective layer (4) and the top of the MOSFET main board (1). The pins of the MOSFET main board (1) extend to the outside of the package shell (2) and are fitted with a protective shell (3). The protective shell (3) includes a first shell (31) and a second shell (32). One end of the first shell (31) is fixedly connected to the outside of the package shell (2), and the other end is provided with an annular slot (311). The second shell (32) is inserted into the annular slot (311) and locked by a limiting mechanism (33) provided on the first shell (31).
2. A MOSFET device with a protection structure according to claim 1, characterized in that: The limiting mechanism (33) includes a mounting bracket (331), which is fixed on the first housing (31) and has a movable rod (332) slidably mounted thereon. The movable rod (332) is provided with a spring (333) that drives it downward, and a limiting block (334) is provided at its bottom end. The limiting block (334) matches the limiting groove (321) opened on the second housing (32). There are multiple limiting grooves (321), which are linearly arranged along the extension direction of the second housing (32).
3. A MOSFET device with a protection structure according to claim 2, characterized in that: The bottom of the limiting block (334) is provided with an inclined surface, which is inclined along the extension direction of the second shell (32).
4. A MOSFET device with a protection structure according to claim 1, characterized in that: Multiple evenly distributed second heat dissipation vents (3132) are provided on both sides of the first housing (31) and the second housing (32).
5. A MOSFET device with a protection structure according to claim 1, characterized in that: The metal protective layer (4) includes a bottom plate (41) and a top plate (42). The bottom plate (41) and the top plate (42) are connected by multiple gap layers (43). The gap layer (43) includes a first gap plate (431) and a second gap plate (432). There are multiple gap plates of both types, which are stacked in a linear arrangement on a horizontal plane in mutually perpendicular directions.
6. A MOSFET device with a protection structure according to claim 5, characterized in that: Silicone is applied between the top of the thermal conductive gel (5) and the bottom of the base plate (41), and between the bottom of the base plate and the top of the MOSFET main board (1).
7. A MOSFET device with a protection structure according to claim 1, characterized in that: The package (2) has a mounting block (6) on the side away from the pins of the MOSFET motherboard (1). The bottom of the mounting block (6) is lower than the bottom of the package (2) and is provided with double-sided adhesive (7).