Heat dissipation structure and electronic equipment

Abstract

The utility model discloses a heat dissipation structure and an electronic device, a bottom plate housing is provided with an inlet pipeline and an outlet pipeline, and the upper end surface of the bottom plate housing is partially recessed to form a plurality of liquid cooling chambers arranged at intervals; the radiators are used for radiating the SiC modules, and the bottoms of the radiators are mounted in the corresponding liquid cooling chambers; a heat dissipation channel is formed in the bottom surface of the radiator, so that after the bottom of the radiator is mounted in the liquid cooling cavity, the liquid inlet end of the heat dissipation channel communicates with the inlet pipeline, and the liquid outlet end of the heat dissipation channel communicates with the outlet pipeline; and the inlet pipeline and the outlet pipeline are arranged in a step shape. Compared with the prior art, the inlet pipeline and the outlet pipeline are arranged to be of the ladder-shaped structure, the extending directions of the ladder shapes of the inlet pipeline and the outlet pipeline are opposite, the flow of cooling liquid flowing through the heat dissipation channel is adjusted through the inlet pipeline and the outlet pipeline, the heat dissipation difference of different radiators is improved, and the heat dissipation uniformity of the radiators is improved; therefore, the reliability of the radiator in work is improved, and the service life of the SiC power module is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation technical field, especially a heat dissipation structure and electronic equipment. BACKGROUND

[0002] SiC power module as the third generation semiconductor material has excellent electrical performance and thermal performance etc., and the application in the high efficiency electronic system is more and more, but at the same time, high power density also means high heat density, so higher efficiency heat dissipation scheme is needed to reach the purpose of system stable operation.

[0003] The current SiC module application is often equipped with water channel shell structure, and the heat dissipation of the traditional water channel shell structure is uneven, which reduces the service life of SiC power module.

[0004] In summary, how to improve the heat dissipation uniformity of each radiator and then improve the service life of SiC power module is the problem to be solved by the technical personnel in the field at present. UTILITY MODEL CONTENT

[0005] Therefore, the utility model provides a heat dissipation structure, by setting up the inlet pipeline and outlet pipeline as the ladder structure, to improve the heat dissipation uniformity of each radiator, and then the service life of SiC power module.

[0006] The utility model also provides an electronic equipment comprising the heat dissipation structure.

[0007] To achieve the above object, the utility model provides the following technical scheme:

[0008] A heat dissipation structure is applied to SiC module system and comprises:

[0009] The bottom plate shell has an inlet pipeline and an outlet pipeline, and the upper end surface part of the bottom plate shell is recessed to form a liquid cooling chamber, the number of liquid cooling chambers is multiple, and the multiple liquid cooling chambers are arranged at intervals.

[0010] The radiator is used for dissipating heat for SiC module, the number of radiators is the same as that of liquid cooling chambers, and each radiator bottom is installed in the corresponding liquid cooling chamber; the bottom surface of the radiator is provided with a heat dissipation channel, so that after the radiator bottom is installed in the liquid cooling chamber, the liquid inlet end of the heat dissipation channel is communicated with the inlet pipeline, and the liquid outlet end of the heat dissipation channel is communicated with the outlet pipeline.

[0011] The inlet pipe is arranged in a stepped manner, and has multiple liquid outlet steps with a step-by-step descending along the liquid inlet direction, and each liquid outlet step is connected to the liquid inlet end of the corresponding heat dissipation channel.

[0012] Preferably, each liquid outlet step is connected to the liquid inlet end of the corresponding heat dissipation channel through a shunt outlet, and the cross-sectional area of each shunt outlet is equal.

[0013] Each liquid inlet step is connected to the liquid outlet end of the corresponding heat dissipation channel through a converging outlet, and the cross-sectional area of each converging outlet is equal.

[0014] Preferably, the number of the liquid cooling chamber, the heat sink, the shunt outlet and the converging outlet is three.

[0015] The liquid cooling chamber includes a first liquid cooling chamber, a second liquid cooling chamber and a third liquid cooling chamber; the heat sink includes a first heat sink, a second heat sink and a third heat sink; the shunt outlet includes a first shunt outlet, a second shunt outlet and a third shunt outlet arranged along the liquid inlet direction; and the converging outlet includes a first converging outlet, a second converging outlet and a third converging outlet arranged along the liquid outlet direction.

[0016] After the first heat sink is installed at the rear of the first liquid cooling chamber, the liquid inlet end of the first heat sink is connected to the first shunt outlet, and the liquid outlet end of the first heat sink is connected to the first converging outlet; after the second heat sink is installed at the rear of the second liquid cooling chamber, the liquid inlet end of the second heat sink is connected to the second shunt outlet, and the liquid outlet end of the second heat sink is connected to the second converging outlet; and after the third heat sink is installed at the rear of the third liquid cooling chamber, the liquid inlet end of the third heat sink is connected to the third shunt outlet, and the liquid outlet end of the third heat sink is connected to the third converging outlet.

[0017] Preferably, a first inclined surface is connected between adjacent liquid outlet steps, and the included angle between the first inclined surface and the normal of the liquid outlet step is 45 degrees.

[0018] Preferably, a second inclined surface is connected between adjacent liquid inlet steps, and the included angle between the second inclined surface and the normal of the liquid inlet step is 45 degrees.

[0019] Preferably, the bottom of the heat sink is provided with a boss for clamping the liquid cooling chamber, and the surface of the boss is partially recessed to form the heat dissipation channel.

[0020] Preferably, the heat dissipation channel comprises a liquid inlet straight flow channel, a serpentine flow channel and a liquid outlet straight flow channel connected in sequence.

[0021] After the heat sink bottom is mounted to the liquid cooling chamber, the liquid inlet straight flow channel communicates with the corresponding liquid distribution outlet as a liquid inlet end of the heat dissipation channel, and the liquid outlet straight flow channel communicates with the liquid collection outlet as a liquid outlet end of the heat dissipation channel.

[0022] Preferably, the bottom plate shell further has a liquid inlet quick connector.

[0023] The inlet pipe is connected to the liquid supply system through the liquid inlet quick connector.

[0024] Preferably, the inlet pipe and the outlet pipe are symmetrically arranged.

[0025] An electronic device comprises a SiC module system, and further comprises the heat dissipation structure as described above.

[0026] As can be seen from the above technical solution, compared with the prior art, the heat dissipation structure provided by the present application sets the inlet pipe and the outlet pipe as a ladder-shaped structure, and the extension directions of the ladder-shaped structures of the inlet pipe and the outlet pipe are opposite, the flow of the cooling liquid through the heat dissipation channel is adjusted through the inlet pipe and the outlet pipe, the heat dissipation difference of different heat sinks is improved, the heat dissipation uniformity of each heat sink is improved, and thus the reliability of the heat sink in actual work is improved, and the service life of the SiC power module is improved.

[0027] The utility model also provides an electronic device, because adopt above-mentioned heat dissipation structure, therefore it also has corresponding beneficial effect, can refer to the preceding explanation specifically, and this will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any creative labor.

[0029] Figure 1 The explosion schematic view of the heat dissipation structure provided by the embodiments of the present application;

[0030] Figure 2 The cooling liquid flow direction schematic view provided by the embodiments of the present application;

[0031] Figure 3 The top view of the heat dissipation structure provided by the embodiments of the present application;

[0032] Figure 4The schematic view of the inlet pipeline and the outlet pipeline structure is provided for the embodiment of the utility model;

[0033] Figure 5 The structure schematic view of the radiator is provided for the embodiment of the utility model;

[0034] Figure 6 The bottom view schematic view of the radiator is provided for the embodiment of the utility model.

[0035] The meanings of various reference numerals in the drawing are as follows:

[0036] 10 is a bottom plate shell, 1010 is a liquid inlet quick connector, 1021 is a first liquid cooling chamber, 1022 is a second liquid cooling chamber, 1023 is a third liquid cooling chamber, 1031 is a first shunt outlet, 1032 is a second shunt outlet, 1033 is a third shunt outlet, 1034 is a first inclined surface, 1041 is a first flow outlet, 1042 is a second flow outlet, 1043 is a third flow outlet, 1044 is a second inclined surface, 1050 is an inlet pipeline, 1060 is an outlet pipeline;

[0037] 20 is a radiator, 21 is a boss, 221 is a liquid inlet straight channel, 222 is a serpentine flow channel, and 223 is a liquid outlet straight channel. DETAILED DESCRIPTION

[0038] The cooling pipeline of the water channel shell structure adopts a series-parallel flow channel form, and this series-parallel structure often causes the liquid pressure to be the largest at the inlet pipeline close to the liquid outlet and the liquid back pressure to be the smallest at the outlet pipeline close to the liquid outlet due to the inertia of the fluid, that is, the cooling liquid pressure difference is the largest at the position closest to the outlet, resulting in the largest flow rate at the position closest to the outlet, and thus the cooling liquid flow is the largest at the position closest to the outlet.

[0039] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0040] The heat dissipation structure provided by the embodiment of the utility model is applied to a SiC module system, such as Figures 1-6 as shown,

[0041] The bottom plate shell 10 has an inlet pipeline 1050 and an outlet pipeline 1060, the upper end surface part of the bottom plate shell 10 is recessed to form liquid cooling chambers, the number of the liquid cooling chambers is multiple, and the multiple liquid cooling chambers are arranged at intervals;

[0042] The heat sink 20 is used for heat dissipation of the SiC module, the number of the heat sink 20 is the same as the number of the liquid cooling chamber, and each heat sink 20 is installed at the bottom of the corresponding liquid cooling chamber; the bottom surface of the heat sink 20 is provided with a heat dissipation channel, so that after the heat sink 20 is installed at the bottom of the liquid cooling chamber, the liquid inlet end of the heat dissipation channel is communicated with the inlet pipeline 1050, and the liquid outlet end of the heat dissipation channel is communicated with the outlet pipeline 1060;

[0043] The inlet pipeline 1050 is arranged in a stepped manner, and has a plurality of liquid outlet steps which are gradually reduced in the liquid inlet direction, and each liquid outlet step is communicated with the liquid inlet end of the corresponding heat dissipation channel; the outlet pipeline 1060 is arranged in a stepped manner, and has a plurality of liquid inlet steps which are gradually increased in the liquid outlet direction, and each liquid inlet step is communicated with the liquid outlet end of the corresponding heat dissipation channel.

[0044] In the above technical solution, the cooling liquid enters from the inlet pipeline 1050, and in the process of flowing along the liquid inlet direction X (as indicated by the arrow of Figure 4 , the cooling liquid enters the heat dissipation channel through the liquid outlet steps, and then enters the outlet pipeline 1060 through the liquid inlet steps of the heat dissipation channel, and then flows out from the liquid outlet end of the outlet pipeline 1060 along the liquid outlet direction Y (as indicated by the arrow of Figure 4 , and the cooling liquid carries away heat in the process of flowing; compared with the prior art, the inlet pipeline 1050 and the outlet pipeline 1060 are arranged in a stepped manner, and the extension directions of the two are opposite, the flow of the cooling liquid flowing through the heat dissipation channel is adjusted through the inlet pipeline and the outlet pipeline, the difference in heat dissipation of different heat sinks 20 is improved, the uniformity of heat dissipation of each heat sink is improved, and the reliability of the heat sink in actual work is improved, and the service life of the SiC power module is improved.

[0045] In the above technical solution, according to the actual situation, the height and flow cross section of each liquid outlet step and each liquid inlet step can be designed to ensure that the cooling liquid flow speed of the heat dissipation channel is the same, so that the flow is the same at the same time, and the effect of uniform heat dissipation is achieved.

[0046] In a possible embodiment, each liquid outlet step is communicated with the liquid inlet end of the corresponding heat dissipation channel through a shunt outlet, and the cross-sectional areas of the shunt outlets are equal;

[0047] Each liquid inlet step is communicated with the liquid outlet end of the corresponding heat dissipation channel through a converging outlet, and the cross-sectional areas of the converging outlets are equal.

[0048] In the above technical solution, the setting of the shunt outlet and the confluence outlet makes the cooling liquid flow more smoothly; as preferred, the thickness of the shunt passage where the shunt outlet is located gradually increases along the liquid inlet direction X, and the thickness of the confluence passage where the confluence outlet is located gradually decreases along the liquid outlet direction Y, as shown in Figure 4 .

[0049] The above technical solution is optimized, as shown in Figures 2-4 , the number of the liquid cooling chamber, the heat sink 20, the shunt outlet and the confluence outlet is three;

[0050] The liquid cooling chamber comprises a first liquid cooling chamber 1021, a second liquid cooling chamber 1022 and a third liquid cooling chamber 1023 arranged at intervals along the length direction of the bottom plate shell 10; the heat sink 20 comprises a first heat sink, a second heat sink and a third heat sink; the shunt outlet comprises a first shunt outlet 1031, a second shunt outlet 1032 and a third shunt outlet 1033 arranged along the liquid inlet direction; and the confluence outlet comprises a first confluence outlet 1041, a second confluence outlet 1042 and a third confluence outlet 1043 arranged along the liquid outlet direction;

[0051] The first heat sink is installed behind the first liquid cooling chamber 1021, the liquid inlet end of the first heat sink is communicated with the first shunt outlet 1031, and the liquid outlet end of the first heat sink is communicated with the first confluence outlet 1041; the second heat sink is installed behind the second liquid cooling chamber 1022, the liquid inlet end of the second heat sink is communicated with the second shunt outlet 1032, and the liquid outlet end of the second heat sink is communicated with the second confluence outlet 1042; and the third heat sink is installed behind the third liquid cooling chamber 1023, the liquid inlet end of the third heat sink is communicated with the third shunt outlet 1033, and the liquid outlet end of the third heat sink is communicated with the third confluence outlet 1043.

[0052] In the above technical solution, the inlet pipe 1050 and the outlet pipe 1060 are connected with the heat dissipation channels of the three heat sinks 20 in parallel, so as to take away the heat of the heat sink 20, and the specific cooling liquid flow direction is shown by the arrows in Figure 2 , and since the inlet pipe 1050 and the outlet pipe 1060 are both arranged in a stepped manner, the flow rates of the three heat sinks 20 flowing at the same time are not much different, so as to improve the uniformity of the heat dissipation of the three heat sinks 20.

[0053] In the above technical solution, it is also necessary to point out that the pressure difference of different flow channels is mainly adjusted through the pipe stepped structure, further solving the problem of uneven distribution of cooling liquid in the liquid cooling chamber, and further enhancing the equality of the cooling liquid in the three liquid cooling chambers, so as to greatly solve the problem of different heat dissipation effects of different cooling chambers, which helps to maintain the reliability and safety of the SiC module system.

[0054] In a possible embodiment, as shown inFigure 4 As shown, the first inclined surface 1034 is connected between adjacent liquid outlet steps, and the angle between the normal of the first inclined surface 1034 and the liquid outlet step is 45 degrees, so that the volume of the cooling liquid carried by the liquid outlet step extending along the liquid inlet direction X is less and less, which is beneficial to the uniform heat dissipation of each heat sink.

[0055] The above technical solutions are optimized, for example, Figure 4 As shown, the second inclined surface 1044 is connected between adjacent liquid inlet steps, and the angle between the normal of the second inclined surface 1044 and the liquid inlet step is 45 degrees, so that the volume of the cooling liquid carried by the liquid inlet step extending along the liquid inlet direction Y is more and more, which is beneficial to the uniform heat dissipation of each heat sink.

[0056] In a possible embodiment, as shown, Figure 5 As shown, the heat sink 20 is provided with a boss 21 for clamping the liquid cooling chamber, so as to realize detachable installation of the heat sink 20 and the liquid cooling chamber, and the boss 21 is partially recessed to form a heat dissipation channel, wherein part of the upper surface of the liquid cooling chamber is used as a sealing surface to seal part of the heat dissipation channel.

[0057] The above technical solutions are optimized, for example, Figure 6 As shown, the heat dissipation channel includes a liquid inlet straight channel 221, a serpentine flow channel 222 and a liquid outlet straight channel 223 connected in sequence; preferably, the heat dissipation channel is a single fluid channel which is thin, narrow and long.

[0058] After the heat sink 20 is installed on the liquid cooling chamber, the liquid inlet straight channel 221 is connected with the corresponding branch outlet as the liquid inlet end of the heat dissipation channel, and the liquid outlet straight channel 223 is connected with the converging outlet as the liquid outlet end of the heat dissipation channel.

[0059] In the above technical solutions, part of the upper surface of the liquid cooling chamber is used as a sealing surface to seal part of the serpentine flow channel 222, and the serpentine flow channel 222 is arranged to accelerate the heat dissipation speed of the heat sink 20, which is beneficial to improve the heat dissipation capacity of the heat dissipation structure.

[0060] In a possible embodiment, in order to realize quick connection and disconnection of the inlet pipe 1050, as shown, Figure 1 As shown, the bottom plate shell 10 is further provided with a liquid inlet quick connector 1010, and the inlet pipe 1050 is connected to the liquid supply system through the liquid inlet quick connector 1010; further, the outlet pipe 1060 is connected to the liquid supply system through a liquid outlet quick connector to circulate the cooling liquid, and of course, the liquid supply system has a cooling function.

[0061] The above technical solutions are optimized, and the inlet pipe 1050 and the outlet pipe 1060 are symmetrically arranged, so that the heat dissipation structure is compact, which is beneficial to improve the heat dissipation capacity.

[0062] The utility model example still provides an electronic equipment, include: SiC module system, still include: the heat dissipation structure as above. Because this scheme has adopted above-mentioned heat dissipation structure, therefore it also has corresponding beneficial effect, can refer to the foregoing description specifically, here no longer tediously.

[0063] The technical features mentioned above, the technical features to be mentioned below, and the technical features shown in the drawings alone can be combined with each other arbitrarily, as long as the combined technical features are not contradictory. All feasible combinations of features are explicitly described herein. Any one of the multiple sub-features included in the same sentence can be applied independently, and does not have to be applied together with other sub-features.

[0064] The present application will be further described in conjunction with specific embodiments:

[0065] In an embodiment, by setting the inlet pipe 1050 and the outlet pipe 1060 as a stepped structure, the pressure resistance of different flow channels is adjusted, further avoiding uneven distribution of the cooling liquid in different liquid cooling chambers, thereby avoiding differences in heat dissipation due to uneven distribution of the cooling liquid in different heat dissipation areas in actual electronic module applications. By setting the pipe stepped structure, the purpose of adjusting the flow of different liquid cooling chambers is achieved, thereby improving the uniformity of the distribution of the cooling liquid in different liquid cooling chambers and improving the reliability and service life of the corresponding electronic components. It should be noted that the liquid in the liquid cooling chamber can be understood as the liquid in the heat dissipation channel.

[0066] In another embodiment, by setting the stepped structure of the inlet and outlet pipes of the heat sink flow channel, the distribution of different parallel flow channels is achieved. The main purpose in this embodiment is to average the speed of the cooling medium flowing through different liquid cooling chambers to prevent different heat dissipation effects due to different amounts of cooling medium flowing through different liquid cooling chambers in the same time, thereby preventing unreliable factors and safety hazards caused by uneven heating.

[0067] In yet another embodiment, the waterway bottom plate shell 10 in this embodiment integrates a series-parallel structure, and the flow distribution problem of the flow channel in the series-parallel structure is also considered. Therefore, the inlet and outlet pipes are designed in a decreasing stepped flow channel form, and a single flow channel heat sink 20 is designed to further plan the fluid in the liquid cooling chamber to achieve the purpose of uniform and reliable high-efficiency heat exchange.

[0068] Each embodiment in the specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other.

[0069] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation structure applied to a SiC module system, characterized in that, include: The base plate housing (10) has an inlet pipe (1050) and an outlet pipe (1060). The upper end face of the base plate housing (10) is partially recessed to form a liquid cooling chamber. There are multiple liquid cooling chambers, and the multiple liquid cooling chambers are arranged at intervals. A heat sink (20) is used to dissipate heat for the SiC module. The number of heat sinks (20) is the same as the number of liquid cooling chambers. The bottom of each heat sink (20) is installed in the corresponding liquid cooling chamber. The bottom surface of the heat sink (20) is provided with a heat dissipation channel so that after the bottom of the heat sink (20) is installed in the liquid cooling chamber, the liquid inlet end of the heat dissipation channel is connected to the inlet pipe (1050), and the liquid outlet end of the heat dissipation channel is connected to the outlet pipe (1060). The inlet pipe (1050) is arranged in a stepped manner, and the inlet pipe (1050) has multiple liquid outlet steps that gradually decrease along the liquid inlet direction. Each liquid outlet step is connected to the liquid inlet end of the corresponding heat dissipation channel. The outlet pipe (1060) is arranged in a stepped manner, and the outlet pipe (1060) has multiple liquid inlet steps that gradually increase along the liquid outlet direction. Each liquid inlet step is connected to the liquid outlet end of the corresponding heat dissipation channel.

2. The heat dissipation structure according to claim 1, characterized in that, Each of the liquid outlet steps is connected to the liquid inlet of the corresponding heat dissipation channel through a diversion outlet, and the cross-sectional area of ​​each diversion outlet is equal. Each of the inlet steps is connected to the outlet of the corresponding heat dissipation channel through a manifold outlet, and the cross-sectional area of ​​each manifold outlet is equal.

3. The heat dissipation structure according to claim 2, characterized in that, The number of the liquid cooling chamber, the radiator (20), the branch outlet, and the confluence outlet are all three; The liquid cooling chamber includes: a first liquid cooling chamber (1021), a second liquid cooling chamber (1022), and a third liquid cooling chamber (1023); the radiator (20) includes: a first radiator, a second radiator, and a third radiator; the diversion outlet includes: a first diversion outlet (1031), a second diversion outlet (1032), and a third diversion outlet (1033) arranged along the liquid inlet direction; the confluence outlet includes: a first confluence outlet (1041), a second confluence outlet (1042), and a third confluence outlet (1043) arranged along the liquid outlet direction. Wherein, after the first radiator is installed in the first liquid cooling chamber (1021), the liquid inlet end of the first radiator is connected to the first branch outlet (1031), and the liquid outlet end of the first radiator is connected to the first confluence outlet (1041); after the second radiator is installed in the second liquid cooling chamber (1022), the liquid inlet end of the second radiator is connected to the second branch outlet (1032), and the liquid outlet end of the second radiator is connected to the second confluence outlet (1042); after the third radiator is installed in the third liquid cooling chamber (1023), the liquid inlet end of the third radiator is connected to the third branch outlet (1033), and the liquid outlet end of the third radiator is connected to the third confluence outlet (1043).

4. The heat dissipation structure according to claim 1, characterized in that, A first inclined surface (1034) is connected between adjacent liquid outlet steps, and the angle between the first inclined surface (1034) and the normal of the liquid outlet step is 45 degrees.

5. The heat dissipation structure according to claim 4, characterized in that, A second inclined surface (1044) is connected between adjacent liquid inlet steps, and the angle between the second inclined surface (1044) and the normal of the liquid inlet step is 45 degrees.

6. The heat dissipation structure according to claim 2, characterized in that, The bottom of the radiator (20) is provided with a boss (21) that engages with the liquid cooling chamber, and the surface of the boss (21) is partially recessed to form the heat dissipation channel.

7. The heat dissipation structure according to claim 6, characterized in that, The heat dissipation channel includes an inlet direct flow channel (221), a serpentine flow channel (222), and an outlet direct flow channel (223) connected in sequence. After the bottom of the radiator (20) is installed in the liquid cooling chamber, the liquid inlet direct channel (221) serves as the liquid inlet end of the heat dissipation channel and is connected to the corresponding diversion outlet, and the liquid outlet direct channel (223) serves as the liquid outlet end of the heat dissipation channel and is connected to the confluence outlet.

8. The heat dissipation structure according to claim 1, characterized in that, The base plate housing (10) also has a quick-connect fitting (1010) for liquid inlet. The inlet pipe (1050) is connected to the liquid supply system via the quick-connect fitting (1010).

9. The heat dissipation structure according to claim 8, characterized in that, The inlet pipe (1050) and the outlet pipe (1060) are arranged symmetrically.

10. An electronic device, comprising: The SiC module system is characterized by further comprising a heat dissipation structure as described in any one of claims 1-9.

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