Storage chip holder
By designing a socket compatible with heterogeneous memory chips, the problem of existing sockets being unable to adapt to heterogeneous BGA packages was solved, enabling efficient mass production of heterogeneous memory chips and compatibility with traditional chips, thus improving mass production efficiency.
Patent Information
- Application Number
- CN202520110045.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-15
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-01-15
AI Technical Summary
Existing memory chip sockets are incompatible with non-standard BGA packaged Flash memory, resulting in low mass production efficiency.
A memory chip socket is designed, including a carrier and a limiting frame. The carrier has guide holes and ejector pins. The limiting frame is detachably installed and has spacers to divide irregularly shaped slots. Combined with a cover device, it achieves a stable electrical connection. It is compatible with irregularly shaped memory chips and can adapt to regular memory chips by replacing the limiting frame.
It enables efficient mass production of irregularly shaped memory chips, improving mass production efficiency, while being compatible with traditional square memory chips, thus improving adaptability and production efficiency.
Smart Images
Figure CN223829850U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of Flash technology, and in particular to a memory chip socket. Background Technology
[0002] NAND Flash (abbreviated as Flash) is used for data storage and is one of the mainstream storage media in the storage industry. For example, USB flash drives, SD cards and solid-state drives all use Flash to play the role of data storage.
[0003] For Flash memory to function as a data storage device, it needs to be mass-produced. Mass production involves storing the firmware system that manages the Flash memory into the Flash memory. The hardware used for mass-producing Flash memory includes a host, a socket, and a card opening board, where the socket is the component that enables the electrical connection between the Flash memory and the card opening board.
[0004] Because most existing Flash memory chips use square storage chips (such as...) Figure 1 As shown, the number and distribution of pins in the socket are designed based on the square memory chip 50. A non-standard memory chip 60 has now been launched on the market, whose pin number and distribution are based on the square memory chip 50 with slight modifications. Therefore, it is urgent to design a socket that can adapt to this non-standard memory chip 60. Utility Model Content
[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a memory chip socket that is compatible with irregularly shaped BGA packaged Flash.
[0006] The first aspect of this application provides a memory chip socket, comprising:
[0007] The base includes a carrier and a limiting frame. The carrier has a receiving groove, and the bottom of the receiving groove has guide holes with the same number of pins as the memory chip. A pin is provided in the guide hole. The limiting frame is detachably installed in the receiving groove. The limiting frame has a partition strip, which is used to block part of the guide holes and divide the receiving groove into two independent irregular grooves. The carrier has a locking protrusion.
[0008] A cover-closing device includes a rotator, a cover body, a pressing member, and a snap-fit member. The rotator is mounted on the carrier and connected to the cover body so that the cover body can rotate relative to the carrier. The pressing member is mounted on the cover body and is used to press and hold the memory chip. The snap-fit member is mounted on the cover body and is used to snap and engage with the card protrusion.
[0009] Furthermore, in one preferred embodiment, the rotator includes a central shaft and a first spring, the central shaft being mounted on the carrier, the cover being mounted on the central shaft, the first spring being sleeved on the central shaft, the first spring having a contact end and two insertion ends, the contact end abutting against the cover, and both insertion ends being inserted into the carrier.
[0010] Furthermore, in one preferred embodiment, the pressing member includes a rotating shaft, a second spring, and a pressing part. The rotating shaft is mounted on the cover, the second spring is sleeved on the rotating shaft, the pressing part is mounted on the rotating shaft, and the pressing part is connected to the second spring.
[0011] Furthermore, in one preferred embodiment, the pressing portion has a cross-shaped groove.
[0012] Furthermore, in one preferred embodiment, the snap-fit component includes a shaft, a third spring, and a buckle. The shaft is mounted on the cover, the third spring is mounted on the shaft, and the buckle is mounted on the shaft. The buckle is connected to the third spring, and the buckle has an L-shaped buckle for engaging with the snap-fit protrusion.
[0013] Furthermore, in one preferred embodiment, the buckle is provided with a pushing portion.
[0014] Furthermore, in one preferred embodiment, the limiting frame includes a retaining frame and a threaded component, the spacer is disposed on the retaining frame, the retaining frame has a through hole, the receiving groove has a threaded hole, and the threaded component passes through the through hole and is screwed into the threaded hole.
[0015] Furthermore, in one preferred embodiment, the card frame is provided with a clearance groove.
[0016] Furthermore, in one preferred embodiment, a clearance groove is provided at the corner of the receiving groove.
[0017] Furthermore, in one preferred embodiment, an adapter plate is also included, which is detachably mounted on the bottom of the carrier. The adapter plate has the same number of pins as the ejector pins, and each pin is connected to each ejector pin in a one-to-one correspondence.
[0018] The technical solution of this application includes: a base, the base including a carrier and a limiting frame, the carrier having a receiving groove, the bottom of the receiving groove having the same number of guide holes as the number of pins of the memory chip, a pin being provided in the guide hole, the limiting frame being detachably installed in the receiving groove, the limiting frame having a partition strip, the partition strip being used to block part of the guide holes and divide the receiving groove into two independent irregular grooves, the carrier having a locking protrusion; a cover device, the cover device including a rotator, a cover, a pressing component and a locking component, the rotator being installed on the carrier and connected to the cover so that the cover can rotate relative to the base, the pressing component being installed on the cover and used to press the memory chip, the locking component being installed on the cover and used to lock with the locking protrusion.
[0019] The technical solution of this application has the following advantages:
[0020] 1) It is compatible with non-standard memory chips, enabling the memory chip socket to mass-produce two non-standard memory chips at the same time, which helps to improve mass production efficiency;
[0021] 2) In addition to being compatible with non-standard memory chips, traditional square memory chips can be adapted by replacing the appropriate limiting frame (i.e., a limiting frame without spacers). Attached Figure Description
[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the structure of a square memory chip according to an embodiment of this application;
[0024] Figure 2 This is a schematic diagram of the structure of a heterogeneous memory chip shown in one embodiment of this application;
[0025] Figure 3 This is a schematic diagram of the structure of a memory chip socket (open state) according to an embodiment of this application;
[0026] Figure 4 This is a schematic diagram of the structure of a memory chip socket (closed state) according to an embodiment of this application;
[0027] Figure 5 This is a cross-sectional schematic diagram of a memory chip socket shown in one embodiment of this application;
[0028] Figure 6 This is an exploded view of a memory chip socket and adapter board according to an embodiment of this application. Detailed Implementation
[0029] To facilitate understanding of this utility model, a more comprehensive description of it is provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.
[0030] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0032] In related technologies, since most existing Flash memory uses square BGA packaging, the number and distribution of pins on the socket are designed with reference to square BGA packaged Flash memory. Now, a non-standard BGA packaged Flash memory has been launched on the market, and there is an urgent need to design a socket that can adapt to this type of Flash memory.
[0033] Therefore, in order to solve the above-mentioned technical problems, this application provides a memory chip socket that can accommodate irregularly shaped BGA packaged Flash.
[0034] The technical solution of this application will be described in detail below with reference to the accompanying drawings.
[0035] It should be noted that in this application, whether it is a square memory chip or an irregularly shaped memory chip, it refers to the memory chip Flash, and their functions are the same. They are all packaged in BGA, and the difference lies in the shape of the package, the number of chip pins, and their distribution.
[0036] Please see Figure 3 A memory chip socket 10 includes a socket body 100 and a cover device 200.
[0037] It should be noted that the housing 100 serves to hold the memory chip (i.e., Flash) and is the core structural component of the memory chip socket 10. The cover device 200 is used to cover the memory chip mounted in the housing 100, providing a holding force to the memory chip so that the memory chip can stably achieve electrical connection with the internal circuit structure of the housing 100.
[0038] Please see Figure 3 and Figure 5 The base 100 includes a carrier 110 and a limiting frame 120. The carrier 110 has a receiving groove 111. The bottom of the receiving groove 111 has guide holes 1111 with the same number of pins as the memory chip. The guide holes 1111 have ejector pins 1111a inside. The limiting frame 120 is detachably installed in the receiving groove 111. The limiting frame 120 has a spacer 120a. The spacer 120a is used to block part of the guide holes 1111 and divide the receiving groove 111 into two independent irregular grooves 1111b. The carrier 110 has a locking protrusion 112.
[0039] It should be noted that the receiving slot 111 is the area for loading the memory chip. Its bottom has guide holes 1111 with the same number of pins as the memory chip. The internal ejector pins 1111a are key components for achieving electrical connection. Simultaneously, a limiting frame 120 is installed inside the receiving slot 111. The limiting frame 120 is detachable, meaning it can be removed and replaced. The limiting frame 120 serves to limit the memory chip and prevent it from shifting.
[0040] It should also be noted that the spacer 120a is used to block part of the guide holes 1111 and divide the receiving slot 111 into two independent irregularly shaped slots 1111b. This is because the number of guide holes 1111 is corresponding to the number of pins of the square memory chip, while the number of pins of the irregularly shaped memory chip is relatively reduced compared to the square memory chip. The reduced part is the part blocked by the spacer 120a. In addition, the receiving slot 111 is divided into two independent irregularly shaped slots 1111b by the spacer 120a, which also allows the memory chip socket 10 to load two irregularly shaped memory chips at the same time. This enables the application end to open and mass-produce two memory chips at once, greatly improving mass production efficiency.
[0041] Please see Figure 3 and Figure 5 The cover assembly 200 includes a rotator 210, a cover 220, a pressing member 230, and a snap-fit member 240. The rotator 210 is mounted on the carrier 110 and connected to the cover 220 so that the cover 220 can rotate relative to the carrier 110. The pressing member 230 is mounted on the cover 220 and is used to press the memory chip. The snap-fit member 240 is mounted on the cover 220 and is used to snap-fit with the snap-fit protrusion 112.
[0042] It should be noted that the rotator 210 serves to rotate, allowing the cover 220 to rotate relative to the carrier 110 at a certain angle. The cover 220, the pressing component 230, and the snap-fit component 240 are used to provide pressing force to the memory chip, allowing the pins of the memory chip to connect with the ejector pin 1111a.
[0043] Technical principle explanation:
[0044] When mass production of irregularly shaped memory chips is required, the pins of the irregularly shaped memory chips are aligned with their corresponding guide holes 1111, and the irregularly shaped memory chips are placed in the limiting frame 120. Then, the cover 220 is rotated, moving it closer to the carrier 110. When the latching member 240 begins to contact the latching protrusion 112, under the force of the latching protrusion 112, the latching member 240 can rotate relative to the cover 220. As the cover 220 continues to rotate (when the cover 220 and the carrier 110 are parallel to each other), the latching member 240 resets and completes the mutual latching with the latching protrusion 112. At this time, the memory chip holder 10 is completely closed. In the closed state, the pressing member 230 will contact the irregularly shaped memory chip, providing a slight downward pressure to the irregularly shaped memory chip, so that the pins of the irregularly shaped memory chip can fully contact the ejector pins 1111a in the guide holes 1111, achieving a stable electrical connection.
[0045] The technical solution of this application has the following advantages:
[0046] 1) It is compatible with heterogeneous memory chips, enabling the memory chip socket 10 to mass-produce two heterogeneous memory chips at the same time, which helps to improve mass production efficiency;
[0047] 2) In addition to being compatible with non-standard memory chips, traditional square memory chips can be adapted by replacing the appropriate limiting frame 120 (i.e., the limiting frame 120 without the spacer 120a). That is, the memory chip socket 10 of this application can be compatible with both non-standard memory chips and square memory chips.
[0048] Further, please refer to Figure 3 and Figure 5 The rotator 210 includes a central shaft 211 and a first spring 212. The central shaft 211 is mounted on the carrier 110, and the cover 220 is mounted on the central shaft 211. The first spring 212 is sleeved on the central shaft 211. The first spring 212 has a contact end (not shown in the figure) and two insertion ends (not shown in the figure). The contact end abuts against the cover 220, and both insertion ends are inserted into the carrier 110.
[0049] It should be noted that the central shaft 211 serves as a support, providing a rotational support point for the cover 220. The first spring 212 serves as a reset function. When the cover 220 rotates towards the carrier 110, the first spring 212 provides an opposing force to the cover 220, enabling the cover 220 to be stably engaged with the latching protrusion 112 via the latching member 240.
[0050] Further, please refer to Figure 3 and Figure 5 The pressing component 230 includes a rotating shaft 231, a second spring (not shown in the figure), and a pressing part 232. The rotating shaft 231 is mounted on the cover 220, the second spring is sleeved on the rotating shaft 231, and the pressing part 232 is mounted on the rotating shaft 231 and connected to the second spring.
[0051] It should be noted that the pivot 231 serves as a support, providing a certain range of rotation for the pressing part 232. The second spring provides a restoring force to the pressing part 232, allowing it to stably hold the memory chip. In this embodiment, the pressing part 232 has a cross-shaped groove 2321. The cross-shaped groove 2321 allows for more even force distribution on the upper and lower memory chips.
[0052] Further, please refer to Figure 3 , Figure 4 and Figure 5 The snap-fit component 240 includes a shaft 241, a third spring (not shown in the figure), and a snap fastener 242. The shaft 241 is mounted on the cover 220, the third spring is mounted on the shaft 241, and the snap fastener 242 is mounted on the shaft 241. The snap fastener 242 is connected to the third spring. The snap fastener 242 is provided with an L-shaped buckle 2421, which is used to snap with the snap protrusion 112.
[0053] It should be noted that the shaft 241 provides support and allows the latch 242 a certain range of rotation. The third spring provides a restoring force to the latch 242, ensuring that the L-shaped latch 2421 of the latch 242 can stably engage with the latching protrusion 112. In this embodiment, the latch 242 is provided with a pushing part 2422. The pushing part 2422 is a component that allows the latch 242 to be rotated easily, allowing the L-shaped latch 2421 to separate from the latching protrusion 112, thereby opening the memory chip socket 10.
[0054] Further, please refer to Figure 1 The limiting frame 120 includes a retaining frame 121 and a threaded component 122. A spacer 120a is provided on the retaining frame 121. The retaining frame 121 has a through hole (not shown in the figure). The receiving groove 111 has a threaded hole 1112. The threaded component 122 passes through the through hole (not shown in the figure) and is screwed into the threaded hole 1112.
[0055] It should be noted that the card frame 121 is the main body of the limiting frame 120, serving to limit the memory chip. The threaded part 122, the threaded hole 1112, and the threaded part 122 cooperate with each other to achieve threaded locking of the card frame 121, allowing the card frame 121 to be detachably installed on the carrier 110. In this embodiment, the card frame 121 has a foolproof groove 121a. The foolproof groove 121a is used to indicate the first pin of the memory chip.
[0056] Further, please refer to Figure 1 The card frame 121 has a clearance groove 121a. It should be noted that the clearance groove 121a is provided to avoid the chip from being worn on the edges and corners of the memory chip.
[0057] Further, please refer to Figure 6 The memory chip socket 10 also includes an adapter board 300, which is detachably mounted on the bottom of the carrier 110. The adapter board 300 has the same number of pins 310 as the ejector pins 1111a, and each pin 310 is connected to each ejector pin 1111a in a one-to-one correspondence.
[0058] It should be noted that the adapter board 300 serves as an adapter. Some card opening boards may not be compatible with the ejector pins 1111a on the carrier 110, and compatibility can be achieved by relying on the pins 300 on the adapter board 300, thereby further improving the compatibility of the memory chip socket 10.
[0059] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.
Claims
1. A memory chip socket, characterized in that, include: The base includes a carrier and a limiting frame. The carrier has a receiving groove, and the bottom of the receiving groove has guide holes with the same number of pins as the memory chip. A pin is provided in the guide hole. The limiting frame is detachably installed in the receiving groove. The limiting frame has a partition strip, which is used to block part of the guide holes and divide the receiving groove into two independent irregular grooves. The carrier has a locking protrusion. A cover-closing device includes a rotator, a cover body, a pressing component, and a snap-fit component. The rotator is mounted on the carrier and connected to the cover body so that the cover body can rotate relative to the carrier. The pressing component is mounted on the cover body and is used to press and hold the memory chip. The snap-fit component is mounted on the cover body and is used to snap and engage with the card protrusion.
2. The memory chip socket according to claim 1, characterized in that, The rotator includes a central shaft and a first spring. The central shaft is mounted on the carrier, and the cover is mounted on the central shaft. The first spring is sleeved on the central shaft and has a contact end and two insertion ends. The contact end abuts against the cover, and both insertion ends are inserted into the carrier.
3. The memory chip socket according to claim 1, characterized in that, The pressing component includes a rotating shaft, a second spring, and a pressing part. The rotating shaft is mounted on the cover, the second spring is sleeved on the rotating shaft, and the pressing part is mounted on the rotating shaft and connected to the second spring.
4. The memory chip socket according to claim 3, characterized in that, The pressing part has a cross-shaped groove.
5. The memory chip socket according to claim 1, characterized in that, The snap-fit component includes a shaft, a third spring, and a buckle. The shaft is mounted on the cover, the third spring is mounted on the shaft, and the buckle is mounted on the shaft. The buckle is connected to the third spring, and the buckle has an L-shaped buckle for engaging with the snap-fit protrusion.
6. The memory chip socket according to claim 5, characterized in that, The buckle is provided with a pushing part.
7. The memory chip socket according to claim 1, characterized in that, The limiting frame includes a retaining frame and a threaded component. The spacer is disposed on the retaining frame. The retaining frame has a through hole. The receiving groove has a threaded hole. The threaded component passes through the through hole and is screwed into the threaded hole.
8. The memory chip socket according to claim 7, characterized in that, The card frame has a foolproof groove.
9. The memory chip socket according to claim 7, characterized in that, The card frame has a clearance slot.
10. The memory chip socket according to claim 1, characterized in that, It also includes an adapter plate, which is detachably mounted on the bottom of the carrier. The adapter plate has the same number of pins as the ejector pins, and each pin is connected to each ejector pin in a one-to-one correspondence.