Glue dipping device
By integrating the adhesive application and placement stations into one station, and utilizing the adhesive application head and placement device in the adhesive application unit to perform adhesive application and placement on the substrate, the problems of low efficiency and high cost of adhesive application and placement machines are solved, achieving efficient adhesive application processing and cost reduction.
Patent Information
- Application Number
- CN202520207290.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-02-10
AI Technical Summary
In existing adhesive-dip placement machines, the adhesive-dip process and the placement process are separated into two stations, which increases the substrate transport time, reduces placement efficiency, and requires two sets of vision positioning systems, thus increasing costs.
The adhesive application and chip mounting stations are integrated into one station. The adhesive application head and chip mounting device in the adhesive application device apply adhesive and mount chips on the substrate while the substrate remains stationary. The adhesive thickness is adjusted by the adhesive application tray assembly and the adhesive scraper assembly, and the adhesive application head moves in a U-shape to complete the adhesive application process.
It improves the efficiency of adhesive bonding, reduces substrate transport time and the need for a vision positioning system, and reduces costs.
Smart Images
Figure CN223832707U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip mounting technology, specifically to an adhesive applicator. Background Technology
[0002] A chip mounter is a device used to precisely mount chips onto a printed circuit board (or substrate). It works by applying adhesive (usually epoxy resin or conductive silver paste) to the substrate and then mounting the chip onto the substrate to achieve chip fixation and electrical connection.
[0003] The adhesive-coated chip mounter mainly includes an adhesive-coating head, a chip mounter, a conveying system, and a control system. During adhesive-coated chip mounter operation, the adhesive-coating process and the chip mounter process are completed at two different stations. The substrate first arrives at the adhesive-coating station via the conveying system, where the adhesive-coating head applies adhesive to the substrate. Then, the conveying system further transports the substrate to the chip mounter station, where the chip mounter mounts the chip onto the substrate.
[0004] The above-mentioned adhesive-dip placement machine has the following problems in actual use: 1. The adhesive-dip process and the placement process are two different workstations, which means that the substrate needs to spend a certain amount of time during the transfer process, greatly reducing the placement efficiency. 2. The substrate needs the assistance of a vision positioning system to be positioned when it arrives at both the adhesive-dip station and the placement station. This requires two sets of vision positioning systems, which increases the cost. At the same time, the vision positioning system also needs a certain amount of time to work, which further reduces the placement efficiency.
[0005] To address the aforementioned problems, the inventors developed a high-speed adhesive-dip placement machine. This machine integrates the adhesive dipping and placement stations, transforming the serial process of existing technologies into a parallel one. Throughout the entire adhesive dipping and placement process, the substrate remains stationary. The adhesive dipping device and the placement device respectively move the adhesive and the chip to their respective positions on the substrate, thereby improving the overall efficiency of the adhesive dipping and placement process. Therefore, designing the adhesive dipping device has become a pressing technical problem. Utility Model Content
[0006] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is: how to provide an adhesive applicator that can move the adhesive to the substrate position and provide adhesive application to the substrate.
[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0008] A glue-dip device includes a glue-dip mounting base, a glue-dip head assembly, a glue-dip tray assembly, and a glue-scraping head assembly, wherein the glue-dip head assembly, the glue-dip tray assembly, and the glue-scraping head assembly are all disposed on the glue-dip mounting base.
[0009] The adhesive tray assembly is used to place adhesive, the adhesive scraper head assembly is used to adjust the thickness of the adhesive in the adhesive tray assembly, and the adhesive scraper head assembly is used to apply the adhesive in the adhesive tray assembly to the substrate patch to perform adhesive application on the substrate.
[0010] The adhesive dispensing head assembly includes an adhesive dispensing head and an adhesive dispensing head moving component; the adhesive dispensing head and the adhesive dispensing head moving component are connected, and the adhesive dispensing head moving component drives the adhesive dispensing head to move between the adhesive dispensing tray assembly and the substrate, so that the adhesive dispensing head can apply the adhesive in the adhesive dispensing tray assembly to the substrate patch.
[0011] The glue-dipping tray assembly includes a glue tray and a glue tray rotating component. The glue tray and the glue tray rotating component are connected. Glue is placed inside the glue tray. The glue tray rotating component drives the glue tray to rotate, so that the glue-dipping head can pick up glue from different positions on the glue tray through the rotation of the glue tray.
[0012] The scraper head assembly includes a scraper head and a scraper head adjusting component. The scraper head and the scraper head adjusting component are connected. The scraper head extends into the glue tray, and the scraper head adjusting component adjusts the position of the scraper head extending into the glue tray.
[0013] The principle of this invention is as follows: The adhesive tray assembly holds the required adhesive. The adhesive scraper head assembly adjusts the thickness of the adhesive in the tray assembly according to the substrate's adhesive requirements. Then, the adhesive scraper head assembly applies the adhesive from the tray assembly to the substrate mounting area, completing the adhesive application process. Specifically, the adhesive tray in the tray assembly holds the adhesive, while the tray rotation component drives the tray to rotate. During application, the rotating component drives the tray to rotate, allowing the adhesive scraper head to pick up adhesive from different locations within the tray, thus meeting the adhesive application requirements. When applying adhesive to different types of substrates, the required adhesive thickness varies. In this case, the adhesive scraper head adjustment component adjusts the position of the scraper head within the tray, thereby adjusting the adhesive thickness to better meet the adhesive application needs of different substrates. The adhesive applicator moving part is used to drive the adhesive applicator to move. First, the adhesive applicator is moved to the glue tray to apply adhesive. Then, the adhesive applicator is moved upward to leave the glue tray and move towards the substrate. When it moves above the substrate, the adhesive applicator is controlled to move downward to apply adhesive to the substrate. Therefore, the adhesive applicator moving part drives the adhesive applicator to make a U-shaped reciprocating motion to complete the adhesive application to the substrate.
[0014] Preferably, the adhesive tray rotating component includes an adhesive tray rotating motor, a driving wheel, and a driven wheel. The adhesive tray rotating motor is mounted on the adhesive mounting base. The driving wheel is connected to the rotating shaft of the adhesive tray rotating motor so that the driving wheel can be driven to rotate by the adhesive tray rotating motor. The driving wheel and the driven wheel are connected by a transmission belt so that the driving wheel can drive the driven wheel to rotate by the transmission belt. The driven wheel and the adhesive tray are connected by an adhesive tray rotating shaft so that the rotation of the driven wheel can drive the adhesive tray to rotate.
[0015] In this way, when applying glue, the glue tray rotation motor is started, which drives the drive wheel to rotate. The drive wheel drives the driven wheel to rotate through the transmission belt. The driven wheel then drives the glue tray to rotate through the glue tray rotation shaft, so that the glue application head can pick up glue from different positions in the glue tray, thus meeting the glue application head's glue requirements during the glue application process.
[0016] Preferably, the scraper head adjusting component includes a scraper head linear guide rail, a preload spring, and an adjusting knob. The guide rail portion of the scraper head linear guide rail is disposed on the adhesive mounting base, and the slider portion of the scraper head linear guide rail is connected to the scraper head so that the position of the scraper head can be adjusted by the movement of the slider portion of the scraper head linear guide rail along its guide rail. One end of the adjusting knob passes through the adhesive mounting base and is connected to the slider portion of the scraper head linear guide rail. The preload spring is sleeved on the adjusting knob between the adhesive mounting base and the slider portion of the scraper head linear guide rail so that the rotation of the adjusting knob drives the slider portion of the scraper head linear guide rail to move along its guide rail.
[0017] In this way, when different types of substrates require different thicknesses of adhesive, turning the adjustment knob causes the slider of the adhesive scraper head linear guide to move along its guide rail. This, in turn, adjusts the position of the adhesive scraper head by moving the slider of the linear guide rail. The part of the adhesive scraper head that extends into the annular groove applies force to the adhesive in the adhesive tray under the action of the pre-compression spring, thereby adjusting the thickness of the adhesive in the adhesive tray to better meet the adhesive application requirements of different types of substrates.
[0018] Preferably, the glue tray is further provided with an annular groove, the annular groove is used to place glue, and the glue dipping head and the glue scraping head both extend into the annular groove.
[0019] In this way, an annular groove is set up to hold the glue, and the glue-dipping head and glue-scraping head are inserted into the annular groove, which facilitates the storage and adjustment of the glue.
[0020] Preferably, the portion of the scraper head that extends into the annular groove has an arc-shaped structure that adapts to the annular groove.
[0021] In this way, the part of the scraper head that extends into the annular groove has an arc-shaped structure that adapts to the annular groove, which allows the scraper head to better cooperate with the annular groove to adjust the thickness of the adhesive.
[0022] Preferably, the portion of the scraper head that extends into the annular groove is further provided with an inverted U-shaped groove, the opening end of which is connected to the annular groove.
[0023] In this way, the inverted U-shaped groove can be adjusted at the position of the glue scraper head to provide space for excess glue in the glue tray, so as to better adjust the thickness of the glue in the glue tray. Attached Figure Description
[0024] Appendix Figure 1 This is a schematic diagram of the adhesive application device of this utility model;
[0025] Appendix Figure 2 This is a structural schematic diagram of the glue-dipping disc assembly and the glue-scraping head assembly from one perspective of the glue-dipping device of this utility model.
[0026] Appendix Figure 3 This is a structural schematic diagram of the glue-dipping disc assembly and the glue-scraping head assembly in the glue-dipping device of this utility model from another perspective;
[0027] Appendix Figure 4 This is a schematic diagram showing the movement of the adhesive dispensing head in the adhesive dispensing device of this utility model;
[0028] Appendix Figure 5 This is a schematic diagram of the structure of an adhesive applicator with the adhesive applicator of this utility model.
[0029] Explanation of reference numerals in the attached drawings: 1. Adhesive head; 2. Adhesive head moving parts; 3. Adhesive disc rotating motor; 4. Drive wheel; 5. Driven belt; 6. Adhesive disc rotating shaft; 7. Adhesive disc; 8. Adhesive scraper head; 9. Adhesive scraper head linear guide rail; 10. Preload spring; 11. Adjustment knob; 12. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0031] As attached Figure 1 To the attached Figure 4 As shown, an adhesive application device includes an adhesive application mounting base, an adhesive application head assembly, an adhesive application tray assembly, and an adhesive scraper head assembly. The adhesive application head assembly, adhesive application tray assembly, and adhesive scraper head assembly are all disposed on the adhesive application mounting base. The adhesive application tray assembly is used to hold the adhesive, the adhesive scraper head assembly is used to adjust the thickness of the adhesive in the adhesive application tray assembly, and the adhesive application head assembly is used to apply the adhesive in the adhesive application tray assembly to the substrate patch for adhesive application treatment of the substrate.
[0032] Specifically, the adhesive applicator assembly includes an adhesive applicator 1 and an adhesive applicator moving part 2; the adhesive applicator 1 and the adhesive applicator moving part 2 are connected, and the adhesive applicator moving part 2 drives the adhesive applicator 1 to move between the adhesive applicator tray assembly and the substrate, so that the adhesive applicator 1 can apply the adhesive in the adhesive applicator tray assembly to the substrate patch; the adhesive applicator tray assembly includes an adhesive tray 8 and an adhesive tray rotating part, the adhesive tray 8 and the adhesive tray rotating part are connected, the adhesive tray 8 contains adhesive, and the adhesive tray rotating part drives the adhesive tray 8 to rotate, so that the adhesive applicator 1 can pick up adhesive from different positions on the adhesive tray 8 through the rotation of the adhesive tray 8; the adhesive scraper assembly includes an adhesive scraper 9 and an adhesive scraper adjusting part, the adhesive scraper 9 and the adhesive scraper adjusting part are connected, the adhesive scraper 9 extends into the adhesive tray 8, and the adhesive scraper adjusting part adjusts the position of the adhesive scraper 9 extending into the adhesive tray 8.
[0033] In this specific embodiment, the glue tray rotating component includes a glue tray rotating motor 3, a driving wheel 4, and a driven wheel 6. The glue tray rotating motor 3 is mounted on the glue-dip mounting base. The driving wheel 4 is connected to the rotating shaft of the glue tray rotating motor 3 so that the driving wheel 4 can be driven to rotate by the glue tray rotating motor 3. The driving wheel 4 and the driven wheel 6 are connected by a transmission belt 5 so that the driving wheel 4 can drive the driven wheel 6 to rotate by the transmission belt 5. The driven wheel 6 and the glue tray 8 are connected by a glue tray rotating shaft 7 so that the rotation of the driven wheel 6 can drive the glue tray 8 to rotate.
[0034] In this way, when applying glue, the glue tray rotation motor 3 is started, which drives the drive wheel 4 to rotate. The drive wheel 4 drives the driven wheel 6 to rotate through the transmission belt 5. The driven wheel 6 then drives the glue tray 8 to rotate through the glue tray rotation shaft 7, so that the glue application head 1 can pick up glue from different positions in the glue tray 8, thus meeting the glue requirements of the glue application head 1 during the glue application process.
[0035] For example, see appendix. Figure 2 and attached Figure 3As shown, in this specific embodiment, the scraper head adjustment component includes a scraper head linear guide 10, a preload spring 11, and an adjustment knob 12. The guide rail portion of the scraper head linear guide 10 is mounted on the adhesive mounting base. The slider portion of the scraper head linear guide 10 is connected to the scraper head 9 so that the position of the scraper head 9 can be adjusted by the movement of the slider portion of the scraper head linear guide 10 along its guide rail. One end of the adjustment knob 12 passes through the adhesive mounting base and is connected to the slider portion of the scraper head linear guide 10. The preload spring 11 is sleeved on the adjustment knob 12 between the adhesive mounting base and the slider portion of the scraper head linear guide 10 so that the slider portion of the scraper head linear guide 10 can be driven to move along its guide rail by the rotation of the adjustment knob 12.
[0036] In this way, when different types of substrates require different thicknesses of adhesive, rotating the adjustment knob 12 causes the slider of the adhesive scraper head linear guide 10 to move along its guide rail. This, in turn, causes the slider of the adhesive scraper head linear guide 10 to adjust the position of the adhesive scraper head 9. The part of the adhesive scraper head 9 that extends into the annular groove will apply force to the adhesive in the adhesive tray 8 under the action of the pre-compression spring 11, thereby adjusting the thickness of the adhesive in the adhesive tray 8 to better meet the adhesive application requirements of different types of substrates.
[0037] In this specific embodiment, the glue tray 8 is also provided with an annular groove, which is used to place glue. The glue dipping head 1 and the glue scraping head 9 both extend into the annular groove.
[0038] In this way, an annular groove is set to hold the glue, and the glue-dipping head 1 and the glue-scraping head 9 are inserted into the annular groove, which facilitates the storage and adjustment of the glue.
[0039] In this specific embodiment, the portion of the scraper head 9 that extends into the annular groove has an arc-shaped structure that adapts to the annular groove.
[0040] In this way, the part of the scraper head 9 that extends into the annular groove has an arc-shaped structure that adapts to the annular groove, which allows the scraper head 9 to better cooperate with the annular groove to adjust the thickness of the glue.
[0041] In this specific embodiment, an inverted U-shaped groove is also provided in the part of the scraper head 9 that extends into the annular groove, and the opening end of the inverted U-shaped groove is connected to the annular groove.
[0042] In this way, the inverted U-shaped groove can be adjusted at the position of the glue scraper head 9 to provide space for excess glue in the glue tray 8, so as to better adjust the thickness of the glue in the glue tray 8.
[0043] The principle of this invention is as follows: The adhesive tray assembly holds the required adhesive. The adhesive scraper head assembly adjusts the thickness of the adhesive in the tray assembly according to the substrate's adhesive requirements. Then, the adhesive scraper head assembly applies the adhesive from the tray assembly to the substrate mounting area to complete the adhesive application process. Specifically, the adhesive tray 8 in the tray assembly holds the adhesive, while the tray rotation component drives the tray 8 to rotate. During adhesive application, the rotating component drives the tray 8 to rotate, allowing the adhesive scraper head 1 to pick up adhesive from different locations within the tray 8, meeting the adhesive requirements of the adhesive scraper head 1. When applying adhesive to different types of substrates, the required adhesive thickness varies. In this case, the adhesive scraper head adjustment component adjusts the position of the scraper head 9 within the tray 8, thereby adjusting the adhesive thickness within the tray 8 to better meet the adhesive application needs of different substrates. The adhesive applicator moving component 2 drives the adhesive applicator 1 to move. First, it moves the adhesive applicator 1 to the adhesive tray 8 for adhesive application. Then, it moves the adhesive applicator 1 upwards, away from the adhesive tray 8, and towards the substrate. When it reaches above the substrate, it controls the adhesive applicator 1 to move downwards to apply adhesive to the substrate. Therefore, the adhesive applicator moving component 2 drives the adhesive applicator 1 in a U-shaped reciprocating motion to complete the adhesive application to the substrate, as shown in the attached diagram. Figure 4 As shown.
[0044] As attached Figure 5 The image shows a glue-dip bonding machine equipped with the glue-dip device of this solution. The glue-dip device of this solution can ultimately apply the glue to the substrate at the correct position.
[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and not to limit the technical solutions. Those skilled in the art should understand that any modifications or equivalent substitutions to the technical solutions of this utility model that do not depart from the spirit and scope of this technical solution should be covered within the scope of the claims of this utility model.
Claims
1. A glue-applying device, characterized in that, It includes an adhesive-dipping mounting base, an adhesive-dipping head assembly, an adhesive-dipping tray assembly, and an adhesive-scraping head assembly, wherein the adhesive-dipping head assembly, the adhesive-dipping tray assembly, and the adhesive-scraping head assembly are all mounted on the adhesive-dipping mounting base; The adhesive tray assembly is used to place adhesive, the adhesive scraper head assembly is used to adjust the thickness of the adhesive in the adhesive tray assembly, and the adhesive scraper head assembly is used to apply the adhesive in the adhesive tray assembly to the substrate patch to perform adhesive application on the substrate. The adhesive dispensing head assembly includes an adhesive dispensing head and an adhesive dispensing head moving component; the adhesive dispensing head and the adhesive dispensing head moving component are connected, and the adhesive dispensing head moving component drives the adhesive dispensing head to move between the adhesive dispensing tray assembly and the substrate, so that the adhesive dispensing head can apply the adhesive in the adhesive dispensing tray assembly to the substrate patch. The glue-dipping tray assembly includes a glue tray and a glue tray rotating component. The glue tray and the glue tray rotating component are connected. Glue is placed inside the glue tray. The glue tray rotating component drives the glue tray to rotate, so that the glue-dipping head can pick up glue from different positions on the glue tray through the rotation of the glue tray. The scraper head assembly includes a scraper head and a scraper head adjusting component. The scraper head and the scraper head adjusting component are connected. The scraper head extends into the glue tray, and the scraper head adjusting component adjusts the position of the scraper head extending into the glue tray.
2. The adhesive applicator according to claim 1, characterized in that, The glue tray rotating component includes a glue tray rotating motor, a driving wheel, and a driven wheel. The glue tray rotating motor is mounted on the glue-dipping mounting base. The driving wheel is connected to the rotating shaft of the glue tray rotating motor so that the driving wheel can be driven to rotate by the glue tray rotating motor. The driving wheel and the driven wheel are connected by a transmission belt so that the driving wheel can drive the driven wheel to rotate by the transmission belt. The driven wheel and the glue tray are connected by a glue tray rotating shaft so that the rotation of the driven wheel can drive the glue tray to rotate.
3. The adhesive applicator according to claim 2, characterized in that, The scraper head adjustment component includes a scraper head linear guide rail, a preload spring, and an adjustment knob. The guide rail portion of the scraper head linear guide rail is mounted on the adhesive mounting base. The slider portion of the scraper head linear guide rail is connected to the scraper head, so that the position of the scraper head can be adjusted by the movement of the slider portion of the scraper head linear guide rail along its guide rail. One end of the adjustment knob passes through the adhesive mounting base and is connected to the slider portion of the scraper head linear guide rail. The preload spring is sleeved on the adjustment knob between the adhesive mounting base and the slider portion of the scraper head linear guide rail, so that the rotation of the adjustment knob drives the slider portion of the scraper head linear guide rail to move along its guide rail.
4. The adhesive applicator according to claim 1, characterized in that, The glue tray is also provided with an annular groove, which is used to hold glue. The glue-dipping head and the glue-scraping head both extend into the annular groove.
5. The adhesive applicator according to claim 4, characterized in that, The portion of the scraper head that extends into the annular groove has an arc-shaped structure that conforms to the annular groove.
6. The adhesive applicator according to claim 5, characterized in that, The portion of the scraper head that extends into the annular groove is also provided with an inverted U-shaped groove, the opening end of which is connected to the annular groove.