Detection equipment for IC (Integrated Circuit) carrier plate

Abstract

The utility model discloses a detection device for an IC carrier plate, and the device comprises a device body which is internally provided with a first installation region and a second installation region, and the first installation region is disposed above the second installation region; an upper material bin, a detection module and a lower material bin, the upper material bin, the detection module and the lower material bin are all located in the first installation area, the upper material bin, the detection module and the lower material bin transfer the IC carrier plate through the upper and lower material carrying module, and the detection module is used for detecting the IC carrier plate; the mounting support is supported in the second mounting area, and at least part of the mounting support is located in the first mounting area so as to be used for mounting the feeding and discharging carrying module. According to the detection equipment of the IC carrier plate, the detection module is installed in the first installation area, and the installation support is connected to the second installation area, so that vibration generated when the feeding and discharging carrying module operates can be transmitted into the second installation area, and the stability of the detection module and the accuracy of a detection result are improved.

Description

Technical Field

[0001] This utility model relates to the field of IC carrier board testing technology, and in particular to an IC carrier board testing device. Background Technology

[0002] IC substrates are crucial semiconductor electronic components, serving as the support for semiconductor chips. IC substrates are increasingly evolving towards miniaturization, density, and integration. During the IC substrate manufacturing process, it is essential to accurately and quickly detect and identify scratches, dents, and other defects on the substrate surface and other areas to promptly filter out defective products and prevent them from reaching the customer. In existing inspection equipment, vibrations generated by the loading and unloading transport modules are transmitted to the inspection camera, causing camera shake, reducing image acquisition stability, and resulting in low inspection accuracy. There is room for improvement in this area. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a testing device for IC carrier boards, which can reduce the impact of vibration on the testing module, thereby improving the stability of the testing module and the accuracy of the testing results.

[0004] An IC carrier board testing device according to an embodiment of the present invention includes: a device body, wherein a first mounting area and a second mounting area are formed within the device body, the first mounting area being disposed above the second mounting area; a loading bin, a testing module, and a unloading bin, wherein the loading bin, the testing module, and the unloading bin are all located within the first mounting area, and the loading bin, the testing module, and the unloading bin are connected by a loading / unloading transport module for transferring the IC carrier board, the testing module being used to test the IC carrier board; and a mounting bracket, wherein the mounting bracket is supported within the second mounting area, at least a portion of the mounting bracket being located within the first mounting area for mounting the loading / unloading transport module.

[0005] According to the IC carrier board testing equipment of this utility model embodiment, by forming a first mounting area and a second mounting area within the equipment body, the various components within the equipment body can be distributed at intervals to facilitate the installation and maintenance of each component. Furthermore, the testing module is installed in the first mounting area, and the mounting bracket for fixing the loading and unloading conveying module is connected to the second mounting area, so that the vibration generated by the loading and unloading conveying module during operation can be transmitted to the second mounting area, thereby reducing the impact of vibration on the testing module and improving the stability of the testing module and the accuracy of the testing results.

[0006] The IC carrier board testing device according to some embodiments of the present invention further includes a partition plate, which is installed in the device body and disposed between the first mounting area and the second mounting area. The partition plate has a clearance opening, and the mounting bracket passes through the clearance opening.

[0007] According to some embodiments of the present invention, the IC carrier board testing equipment includes at least two mounting brackets, which are spaced apart; wherein, there are at least two clearance openings, and the at least two mounting brackets are correspondingly inserted into the at least two clearance openings.

[0008] According to some embodiments of the present invention, the IC carrier board testing equipment includes a feeding bin, a testing module, and a discharging bin arranged sequentially in a first direction. There are two clearance openings, and the two clearance openings are respectively located at both ends of the partition plate in the first direction.

[0009] According to some embodiments of the present invention, in the IC carrier board testing equipment, a buffer and shock-absorbing component is provided between the mounting bracket and the inner wall of the second mounting area.

[0010] According to some embodiments of the present invention, in the IC carrier board testing equipment, the lower end of the mounting bracket is supported on the inner bottom wall of the second mounting area, and the buffer shock absorber is clamped between the lower end face of the mounting bracket and the inner bottom wall of the second mounting area.

[0011] According to some embodiments of the present invention, the IC carrier board testing equipment uses a buffer and shock absorber made of nylon material.

[0012] According to some embodiments of the present invention, an IC carrier board testing device is provided, wherein the testing module includes a flipping platform, the testing module has a first testing position and a second testing position, and a testing camera is respectively provided for the first testing position and the second testing position; wherein, the flipping platform is used to flip the IC carrier board after testing at the first testing position and transfer it to the second testing position.

[0013] According to some embodiments of the present invention, an IC carrier board testing device is provided at the first testing position and the second testing position, wherein the linear transport module is used to transport the IC carrier board at the first testing position or the second testing position to the area below the corresponding testing camera.

[0014] According to some embodiments of the present invention, the IC carrier board testing equipment includes a mounting bracket comprising a main beam and at least one side support beam. The main beam extends in the vertical direction, the top of the main beam is used to mount the loading and unloading conveying module, the bottom of the main beam is supported on the inner bottom of the second mounting area, the side support beam is inclined relative to the vertical direction, the top of the side support beam is connected to the top of the main beam, and the bottom of the side support beam is supported on the inner bottom of the second mounting area and spaced apart from the main beam.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram of the structure of an IC carrier board testing device according to an embodiment of the present invention. Figure 1 ;

[0018] Figure 2 This is a schematic diagram of the structure of an IC carrier board testing device according to an embodiment of the present invention. Figure 2 .

[0019] Figure label:

[0020] IC substrate testing equipment 100

[0021] Equipment body 1, first installation area 11, second installation area 12,

[0022] 2. Loading bin; 3. Detection module; 31. Tilting platform; 311. Bearing plate; 32. First detection position; 33. Second detection position; 34. Detection camera; 35. Linear transport module; 4. Unloading bin; 5. Loading and unloading handling module; 51. Unloading and handling module; 52. Mounting bracket; 6. Main beam; 61. Side support beam; 62.

[0023] 7. Separator plate; 71. Clearance opening; 8. Buffer and shock absorber; 9. Control structure.

[0024] IC carrier board 101. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0026] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] The following is for reference. Figures 1-2 The IC carrier board testing device 100 according to an embodiment of the present invention is described. By forming a first mounting area 11 and a second mounting area 12 within the device body 1, the components within the device body 1 can be spaced out to facilitate the installation and maintenance of each component. The testing module 3 is installed in the first mounting area 11, and the mounting bracket 6 for fixing the loading and unloading conveying module 5 is connected to the second mounting area 12. This allows the vibration generated by the loading and unloading conveying module 5 during operation to be transmitted into the second mounting area 12, thereby reducing the impact of vibration on the testing module 3 and improving the stability of the testing module 3 and the accuracy of the testing results.

[0029] like Figure 1 As shown, an IC carrier board testing device 100 according to an embodiment of the present invention includes: a device body 1, a feeding bin 2, a testing module 3, a discharging bin 4, and a mounting bracket 6.

[0030] The equipment body 1 has a first installation area 11 and a second installation area 12, with the first installation area 11 located above the second installation area 12. The loading bin 2, the detection module 3, and the unloading bin 4 are all located in the first installation area 11. The loading bin 2, the detection module 3, and the unloading bin 4 are transferred to each other via the loading / unloading transport module 5. The detection module 3 is used to detect the IC carrier board 101. The mounting bracket 6 is supported in the second installation area 12, and at least a portion of the mounting bracket 6 is located in the first installation area 11 for mounting the loading / unloading transport module 5.

[0031] Specifically, the equipment body 1, as the main body of the IC carrier board testing equipment 100, has an internal support structure made of steel or aluminum tubular materials to support other internal structures and ensure the stability of the IC carrier board testing equipment 100. The equipment body 1 contains a first mounting area 11 and a second mounting area 12. The first mounting area 11 is used to install the loading bin 2, the testing module 3, and the unloading bin 4. The second mounting area 12 is used to install the control structure 9. By placing the first mounting area 11 above the second mounting area 12, the first mounting area 11 and the second mounting area 12 are spaced apart vertically. This also means that the loading bin 2, the testing module 3, and the unloading bin 4 are all spaced apart from the control structure 9, allowing for individual installation and maintenance of each component, making installation and maintenance more convenient.

[0032] The system includes a loading bin 2 for storing IC substrates 101 awaiting inspection, a unloading bin 4 for storing inspected IC substrates 101, and a testing module 3 for inspecting the IC substrates 101. A loading / unloading transfer module 5 is located between the loading bin 2, the testing module 3, and the unloading bin 4 to facilitate the transfer of IC substrates 101 between the loading bin 2 and the testing module 3, or between the testing module 3 and the unloading bin 4. The testing module 3, located between the loading bin 2 and the unloading bin 4, is used to inspect the IC substrates 101 transported to the testing position. Furthermore, a control structure 9 is connected to the testing module 3, the loading / unloading transfer module 5, and other components to control their operational status.

[0033] Furthermore, when the loading / unloading transfer module 5 transports the IC carrier board 101 to be inspected from the loading bin 2 to the inspection position, the inspection module 3 can inspect the IC carrier board 101. After the inspection is completed, the loading / unloading transfer module 5 can transport the inspected IC carrier board 101 to the unloading bin 4, thereby realizing the loading, inspection, and unloading of the IC carrier board 101. The entire execution process is automatically controlled, improving the production efficiency of the IC carrier board 101.

[0034] The loading bin 2 has storage space for storing multiple untested IC carrier boards 101. At least one loading bin 2 can be configured to increase its storage capacity. The unloading bin 4 has storage space for storing multiple tested IC carrier boards 101. At least two unloading bins 4 can be configured to increase their storage capacity. The testing results of the IC carrier boards 101 include qualified and unqualified products. At least two unloading bins 4 can be used to place qualified and unqualified products respectively, facilitating the classification of IC carrier boards 101. Through the above configuration, the storage capacity of IC carrier boards 101 in both the loading bin 2 and the unloading bin 4 can be increased, thereby improving the production capacity per unit time.

[0035] For example, such as Figure 1 As shown, there are two feeding hoppers 2, which are spaced apart in the left and right directions. There are three discharging hoppers 4, which are spaced apart in the left and right directions.

[0036] Furthermore, the loading bin 2 and unloading bin 4 can be configured with identical structures, both having upward-facing open openings for loading / unloading the material handling module 5 or for operators to retrieve and place materials. Both loading bins 2 and 4 are movably connected relative to the equipment body 1, and can be pulled out of the equipment body 1. This allows the operator to remove the loading bin 2 relative to the equipment body 1 when it is low on material, replenish it, and then push it back into the equipment body 1. Similarly, when the unloading bin 4 is full, the operator can remove it relative to the equipment body 1, unload it, and then push it back into the equipment body 1. This drawer-like design facilitates manual operation of the loading bins 2 and 4, and makes it easy to monitor the loading and unloading process. It also features a simple structure and high safety.

[0037] Furthermore, the mounting bracket 6 is used to mount the loading / unloading transfer module 5. Connecting the loading / unloading transfer module 5 to the mounting bracket 6 can achieve the connection and fixation of the loading / unloading transfer module 5. For example, Figures 1-2 As shown, the loading and unloading transfer module 5 is located in the first installation area 11 to facilitate the transfer of the IC carrier board 101 between the loading bin 2, the detection module 3, and the unloading bin 4. At least a portion of the mounting bracket 6 is also located in the first installation area 11 to facilitate connection with the loading and unloading transfer module 5. The mounting bracket 6 and the loading and unloading transfer module 5 can be connected by bolts or other connectors. The other portion of the mounting bracket 6 is located in the second installation area 12, allowing the mounting bracket 6 to extend from top to bottom, passing through the first installation area 11 and extending to the second installation area 12. The bottom of the mounting bracket 6 is supported in the second installation area 12, enabling the mounting bracket 6 to be connected and fixed within the equipment body 1, thereby enabling the installation of the loading and unloading transfer module 5 within the equipment body 1.

[0038] Furthermore, both the detection module 3 and the loading / unloading transport module 5 are located within the first installation area 11, and the loading / unloading transport module 5 is the main transport mechanism. It will generate vibration during operation. The loading / unloading transport module 5 is connected to the second installation area 12 through the mounting bracket 6, so that the vibration generated can be transmitted to the second installation area 12 through the mounting bracket 6, thereby reducing the impact of vibration on the detection module 3.

[0039] Therefore, by connecting the mounting bracket 6 of the fixed loading and unloading conveying module 5 to the second mounting area 12 and installing the detection module 3 in the first mounting area 11, the fixing structures of the loading and unloading conveying module 5 and the detection module 3 are respectively set in different spaces, isolating the vibration source. This can effectively reduce the shaking of the detection module 3 caused by the vibration generated by the loading and unloading conveying module 5 during operation, thereby improving the detection accuracy and stability of the detection module 3.

[0040] According to the IC carrier board testing equipment 100 of this utility model embodiment, by forming a first mounting area 11 and a second mounting area 12 in the equipment body 1, the components in the equipment body 1 can be distributed at intervals to facilitate the installation and maintenance of each component. The testing module 3 is installed in the first mounting area 11, and the mounting bracket 6 for fixing the loading and unloading conveying module 5 is connected to the second mounting area 12, so that the vibration generated by the loading and unloading conveying module 5 during operation can be transmitted into the second mounting area 12, thereby reducing the impact of vibration on the testing module 3 and improving the stability of the testing module 3 and the accuracy of the testing results.

[0041] In some embodiments, the IC carrier board testing device 100 further includes a partition plate 7, which is installed inside the device body 1. The partition plate 7 is located between the first mounting area 11 and the second mounting area 12. The partition plate 7 has a clearance opening 71, through which the mounting bracket 6 passes.

[0042] Specifically, the partition plate 7 is located between the first installation area 11 and the second installation area 12. The partition plate 7 is horizontally distributed, separating the first and second installation areas 11 and 12 vertically. This allows each area to form its own independent space, enabling separate arrangement of the feeding hopper 2, the detection module 3, the unloading hopper 4, and the control structure 9. The partition plate 7 also provides support between the two areas. Its upper and lower sides provide installation positions for the feeding hopper 2, the detection structure, and the unloading hopper 4 and control structure 9, respectively, ensuring more reliable and stable installation. Its structure is clear and installation is convenient.

[0043] Furthermore, the partition plate 7 is provided with a clearance opening 71, which is used to avoid the mounting bracket 6. By passing the mounting bracket 6 through the clearance opening 71, the mounting bracket 6 can be extended from the first mounting area 11 to the second mounting area 12 and fixed to the second mounting area 12. This allows the vibration generated by the loading and unloading conveying module 5 connected to the mounting bracket 6 during operation to be transmitted to the second mounting area 12, thereby reducing the shaking of the detection module 3 caused by vibration and improving the stability of the detection module 3 and the accuracy of the detection results.

[0044] In some embodiments, there are at least two mounting brackets 6, which are spaced apart; and there are at least two clearance openings 71, with at least two mounting brackets 6 correspondingly inserted into at least two clearance openings 71.

[0045] Specifically, the mounting bracket 6 is used to install the loading and unloading transfer module 5. At least two mounting brackets 6 are provided, that is, the number of mounting brackets 6 can be two, three or more, so that the loading and unloading transfer module 5 can be installed by at least two mounting brackets 6 together, thereby improving the reliability of the installation of the loading and unloading transfer module 5. Furthermore, by distributing at least two mounting brackets 6 at intervals, the loading and unloading transfer module 5 can be installed at at least two positions simultaneously, thereby improving the stability of the installation of the loading and unloading transfer module 5.

[0046] The clearance opening 71 is used to avoid the mounting bracket 6, so that the mounting bracket 6 can extend from the first mounting area 11 to the second mounting area 12 through the clearance opening 71. There are at least two clearance openings 71, that is, the number of clearance openings 71 can be two, three or more. By passing at least two mounting brackets 6 one-to-one through at least two clearance openings 71, the number of clearance openings 71 is the same as the number of mounting brackets 6. Thus, for each mounting bracket 6, there is a clearance opening 71 to avoid it, so that the mounting bracket 6 can extend from the first mounting area 11 to the second mounting area 12, thereby improving the reliability of transmitting the vibration of the loading and unloading conveying module 5 to the second mounting area 12.

[0047] In some embodiments, the feeding bin 2, the detection module 3, and the unloading bin 4 are distributed sequentially in the first direction, and there are two clearance openings 71, which are located at the two ends of the partition plate 7 in the first direction.

[0048] Specifically, the loading bin 2, the testing module 3, and the unloading bin 4 are arranged sequentially in the first direction. The testing module 3 is located between the loading bin 2 and the unloading bin 4, so that the IC carrier board 101 can be transferred from the loading bin 2 to the testing module 3 under the action of the loading and unloading transfer module 5. After testing at the testing module 3, it is transferred to the unloading bin 4 under the action of the loading and unloading transfer module 5. This facilitates the handling of the IC carrier board 101 by the loading and unloading transfer module 5, and also makes the distance between the testing module 3 and the loading bin 2 and the unloading bin 4 relatively short, thereby saving handling time and improving the efficiency of the IC carrier board testing equipment 100.

[0049] Simultaneously, two clearance openings 71 are provided, meaning there are also two mounting brackets 6. The two clearance openings 71 are respectively positioned at both ends of the partition plate 7 in the first direction, thus allowing the two mounting brackets 6 to be positioned at both ends of the partition plate 7 in the first direction. Figures 1-2 As shown, the loading and unloading conveying module 5 includes a loading conveying module 51 and an unloading conveying module 52. The loading conveying module 51 and the unloading conveying module 52 are respectively installed on the upper ends of two mounting brackets 6. This allows the loading conveying module 51 and the unloading conveying module 52 to be respectively positioned at both ends of the partition plate 7 in a first direction, thereby enabling the loading conveying module 51 and the unloading conveying module 52 to approach the upper material bin 2 and the lower material bin 4 respectively, facilitating loading and unloading. The first direction can be a front-back direction or a left-right direction.

[0050] In this application, for ease of description, the first direction is defined as the left-right direction shown in the figure.

[0051] It should also be noted that the loading and unloading module 51 and the unloading module 52 can be constructed as two linear modules or as right-angle modules. In this embodiment, both the loading and unloading module 51 and the unloading module 52 can move in the vertical and horizontal directions to enable material transfer.

[0052] In some embodiments, a buffer and shock absorber 8 is provided between the mounting bracket 6 and the inner wall of the second mounting area 12.

[0053] Specifically, the mounting bracket 6 used to fix the loading and unloading conveying module 5 is supported in the second mounting area 12, so that the vibration generated by the loading and unloading conveying module 5 during operation can be transmitted to the second mounting area 12 through the mounting bracket 6. A buffer and shock absorber 8 is provided between the mounting bracket 6 and the inner wall of the second mounting area 12. The buffer and shock absorber 8 is placed between the mounting bracket 6 and the part of the equipment body 1 located in the second mounting area 12, so that the buffer and shock absorber 8 can absorb and dissipate the vibration transmitted from the mounting bracket 6 to the second mounting area 12, thereby reducing the vibration transmitted from the mounting bracket 6 to the equipment body 1 and improving the stability of the equipment body 1. The buffer and shock absorber 8 can be made of a material with certain flexible properties.

[0054] In some embodiments, the lower end of the mounting bracket 6 is supported on the inner bottom wall of the second mounting area 12, and the buffer shock absorber 8 is sandwiched between the lower end face of the mounting bracket 6 and the inner bottom wall of the second mounting area 12.

[0055] Specifically, the upper end of the mounting bracket 6 is connected to the loading / unloading conveying module 5 to enable the installation of the loading / unloading conveying module 5. The lower end of the mounting bracket 6 is supported on the inner bottom wall of the second installation area 12, thereby connecting the lower end of the mounting bracket 6 to the inner bottom wall of the second installation area 12. This allows both ends of the mounting bracket 6 to be connected to the loading / unloading conveying module 5 and the inner bottom wall of the second installation area 12, respectively, to achieve reliable installation of the loading / unloading conveying module 5. At the same time, the buffer and shock absorber 8 is clamped between the lower end face of the mounting bracket 6 and the inner bottom wall of the second installation area 12. This allows the vibration generated by the loading / unloading conveying module 5 during operation to be transmitted downward from the mounting bracket 6 to the buffer and shock absorber 8, partially absorbed by the buffer and shock absorber 8, and then transmitted to the inner bottom wall of the second installation area 12. This effectively reduces the vibration transmitted to the equipment body 1, thereby improving the stability of the equipment body 1.

[0056] The buffer damper 8 can be connected to the inner bottom wall of the second installation area 12 by bolts or other connecting parts to fix the buffer damper 8 and ensure its reliable operation.

[0057] In some embodiments, the shock absorber 8 is made of nylon material.

[0058] Specifically, the buffer damper 8 is sandwiched between the lower end face of the mounting bracket 6 and the inner bottom wall of the second mounting area 12, and is used to partially absorb the vibration transmitted from the mounting bracket 6 to the second mounting area 12. The buffer damper 8 can be made of nylon material. Because nylon material has the characteristics of high rigidity, high strength and good elasticity, the buffer damper 8 can reliably support the mounting bracket 6 at the lower end face of the mounting bracket 6, so as to ensure the reliability of the installation of the loading and unloading transfer module 5, and can absorb the vibration transmitted from the loading and unloading transfer module 5 to the second mounting area 12, so as to improve the stability of the equipment body 1.

[0059] In some embodiments, the detection module 3 includes a flipping platform 31, and the detection module 3 has a first detection position 32 and a second detection position 33, with a detection camera 34 corresponding to the first detection position 32 and the second detection position 33 respectively; wherein, the flipping platform 31 is used to flip the IC carrier board 101 after detection by the first detection position 32 and transfer it to the second detection position 33.

[0060] Specifically, the flipping platform 31 is used to flip the IC carrier board 101. The detection module 3 has a first detection position 32 and a second detection position 33. The first detection position 32 and the second detection position 33 are respectively used to place the IC carrier board 101 to be tested. The first detection position 32 and the second detection position 33 are respectively located on both sides of the flipping platform 31, so that the flipping platform 31 can flip the IC carrier board 101 located on the first detection position 32 to the second detection position 33. Thus, by flipping, one side of the IC carrier board 101 located on the first detection position 32 can be tested first, and then the IC carrier board 101 that has been tested can be flipped to the second detection position 33, and the other side of the IC carrier board 101 can be tested at the second detection position 33.

[0061] Furthermore, each of the first detection position 32 and the second detection position 33 is provided with a detection camera 34. The two detection cameras 34 can take pictures of the IC carrier board 101 located at the first detection position 32 and the second detection position 33 respectively, thereby taking pictures of the two opposite sides of the IC carrier board 101 to improve the reliability of detecting surface defects of the IC carrier board 101.

[0062] In some embodiments, a linear transport module 35 is provided at the first detection position 32 and the second detection position 33. The linear transport module 35 is used to transport the IC carrier board 101 of the first detection position 32 or the second detection position 33 to the area below the corresponding detection camera 34.

[0063] Specifically, the linear transport module 35 can move the first detection position 32 or the second detection position 33, thereby transporting the IC carrier board 101 located at the first detection position 32 or the second detection position 33 to below the corresponding detection camera 34, so that the detection camera 34 can take pictures and detect it. Furthermore, by setting the linear transport module 35, the stability and repeatability of the IC carrier board detection equipment 100 can be guaranteed. For example, Figures 1-2 As shown, the detection camera 34 and the loading / unloading conveying module 5 are spaced apart in the front-to-back direction. The detection camera 34 is located on the rear side of the loading / unloading conveying module 5. The linear transport module 35 can reciprocate the IC carrier board 101 of the first detection position 32 or the second detection position 33 between the flipping platform 31 and the detection camera 34.

[0064] Furthermore, the first detection position 32 is equipped with a first detection camera, and the second detection position 33 is equipped with a second detection camera, such as... Figure 1 As shown, the feeding bin 2, the first detection position 32, the tilting platform 31, the second detection position 33 and the unloading bin 4 are distributed from right to left, that is, feeding is carried out in the right area of ​​the equipment body 1 and unloading is carried out in the left area of ​​the equipment body 1.

[0065] Taking this layout as an example, in actual operation, the loading and handling module 51 first descends to the material picking position of the loading bin 2, grabs the IC carrier board 101 from the loading bin 2, rises, then moves to the left and down to the first detection position 32, transferring the IC carrier board 101 to the first detection position 32. The linear transport module 35 then moves the IC carrier board 101 from the first detection position 32 to the position corresponding to the first detection camera. The first detection camera takes a picture of the IC carrier board 101 for detection. After the detection is completed, the linear transport module 35 moves the IC carrier board 101 from the first detection position 32 back to its initial position. Then, through... The loading and handling module 51 moves the IC carrier board 101 that has been inspected on the first inspection position 32 to the flipping platform 31. The flipping platform 31 then flips the IC carrier board 101 that has been inspected once by 180° and transfers the flipped IC carrier board 101 to the second inspection position 33. After going through the same operation mode, the second inspection camera inspects the flipped IC carrier board 101. After the inspection is completed, the unloading and handling module 52 transfers the IC carrier board 101 that has been inspected on the second inspection position 33 to the unloading area of ​​the unloading bin 4 to realize defect detection on both sides of the IC carrier board 101.

[0066] It should be noted that there are two linear transport modules 35 and two corresponding inspection cameras 34, which are symmetrically distributed on both sides of the flipping platform 31 to inspect the TOP and BOT surfaces of the IC carrier board 101, respectively. The linear transport module 35 has high operating accuracy, which is beneficial for the alignment accuracy between the first inspection position 32 and the inspection camera 34, and can improve the repeatability accuracy of the linear transport module 35. The inspection camera 34 is detachably connected to the support structure of the first mounting area 11, and can be connected to the support structure through the linear transport module 35. The position of the inspection camera 34 can be adjusted to ensure the relative positional accuracy between the inspection camera 34 and the first inspection position 32. Furthermore, by setting the mounting bracket 6 of the loading / unloading conveying module 5 and the support structure of the inspection camera 34 in a partitioned manner, the impact of vibration on the image acquisition of the inspection camera 34 can be better mitigated, thereby improving the accuracy and stability of the inspection.

[0067] Furthermore, the loading and handling module 51 can be connected to two gripping structures, which are distributed in the left-right direction. One of the gripping structures can be used for the initial loading of the first detection position 32. After the IC carrier board 101 at the first detection position 32 is detected, the right gripping structure first grabs the IC carrier board 101 to be tested from the loading bin 2, while the left gripping structure transfers the tested IC carrier board 101 at the first detection position 32 to the flipping platform 31. The right gripping structure then transports the grabbed IC carrier board 101 to be tested back to the first detection position 32. This shortens the transfer time of the IC carrier board 101 to be tested and improves the overall detection efficiency. The unloading and handling module 52 is also connected to a gripping structure. This gripping structure can use a suction cup to pick up the IC carrier board 101, realizing the transfer of the IC carrier board 101. The suction cup method reduces damage to the IC carrier board 101 and has good performance.

[0068] Furthermore, the flipping platform 31 includes a driving component and a carrier plate 311. The driving component can drive the IC carrier plate 101 on the carrier plate 311 to flip 180° to realize the flipping function of the flipping platform 31. The carrier plate 311 and the IC carrier plate 101 can also be attached together, which can realize the positioning of the IC carrier plate 101 and prevent the IC carrier plate 101 from falling off during the flipping process.

[0069] In some embodiments, the mounting bracket 6 includes a main beam 61 and at least one side support beam 62. The main beam 61 extends in the vertical direction, the top of the main beam 61 is used to mount the loading and unloading conveying module 5, the bottom of the main beam 61 is supported on the inner bottom of the second mounting area 12, the side support beam 62 is inclined relative to the vertical direction, the top of the side support beam 62 is connected to the top of the main beam 61, and the bottom of the side support beam 62 is supported on the inner bottom of the second mounting area 12 and spaced apart from the main beam 61.

[0070] Specifically, the mounting bracket 6 is used to install the loading and unloading transport module 5. The main beam 61 extends in the vertical direction so that the main beam 61 can be extended from the first mounting area 11 to the second mounting area 12. Thus, the top of the main beam 61 can be used to install the loading and unloading transport module 5, and the bottom of the main beam 61 can be supported on the inner bottom wall of the second mounting area 12. The two ends of the main beam 61 in the vertical direction can be connected to the loading and unloading transport module 5 and the inner bottom wall of the second mounting area 12 respectively to realize the installation of the loading and unloading transport module 5.

[0071] Meanwhile, by connecting the top of the side support beam 62 to the top of the main beam 61, the main beam 61 and the side support beam 62 can be connected by welding or connectors, making the mounting bracket 6 a whole. This can improve the structural strength and operational reliability of the mounting bracket 6. Furthermore, by tilting the side support beam 62 relative to the vertical direction, the side support beam 62 and the main beam 61 can form a certain angle, thereby separating the bottom of the side support beam 62 from the bottom of the main beam 61. The bottom of the side support beam 62 is also supported on the inner bottom wall of the second mounting area 12. The mounting bracket 6 can be connected to the inner bottom wall of the second mounting area 12 at multiple locations, which can improve the reliability and stability of the connection between the two, thereby improving the reliability of the installation of the loading and unloading handling module 5.

[0072] Furthermore, there is at least one side support beam 62, meaning that the number of side support beams 62 can be one, two, or three, etc., so that the loading and unloading transfer module 5 can be installed simultaneously through the main beam 61 and at least one side support beam 62. Moreover, the main beam 61 and at least one side support beam 62 can be connected to the inner bottom wall of the second installation area 12 from multiple positions, which can improve the stability of the installation of the loading and unloading transfer module 5.

[0073] In such Figures 1-2 In the embodiment shown, there is only one side support beam 62, which allows the loading and unloading transfer module 5 to be installed simultaneously through the main beam 61 and the side support beam 62, thereby improving the reliability and stability of the installation of the loading and unloading transfer module 5.

[0074] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0075] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A testing device for IC substrates, characterized in that, include: The equipment body has a first mounting area and a second mounting area formed within it, with the first mounting area located above the second mounting area; The system includes a loading hopper, a testing module, and a unloading hopper. All three hoppers are located within the first installation area. The IC carrier boards are transferred between the loading hopper, the testing module, and the unloading hopper via a loading and unloading transport module. The testing module is used to test the IC carrier boards. The mounting bracket is supported within the second mounting area, and at least a portion of the mounting bracket is located within the first mounting area for mounting the loading and unloading handling module.

2. The IC carrier board testing equipment according to claim 1, characterized in that, It also includes a partition plate, which is installed inside the device body and is located between the first installation area and the second installation area. The partition plate has a clearance opening, and the mounting bracket passes through the clearance opening.

3. The IC carrier board testing equipment according to claim 2, characterized in that, The mounting bracket is at least two, and the at least two mounting brackets are spaced apart. There are at least two clearance openings, and at least two mounting brackets are inserted into at least two clearance openings in a one-to-one correspondence.

4. The IC carrier board testing equipment according to claim 2, characterized in that, The feeding hopper, the detection module, and the unloading hopper are arranged sequentially in the first direction. There are two clearance openings, and the two clearance openings are respectively located at both ends of the partition plate in the first direction.

5. The testing equipment for IC carrier boards according to any one of claims 1-4, characterized in that, A buffer and shock-absorbing component is provided between the mounting bracket and the inner wall of the second mounting area.

6. The IC carrier board testing equipment according to claim 5, characterized in that, The lower end of the mounting bracket is supported on the inner bottom wall of the second mounting area, and the buffer shock absorber is sandwiched between the lower end face of the mounting bracket and the inner bottom wall of the second mounting area.

7. The IC carrier board testing equipment according to claim 5, characterized in that, The shock absorber is made of nylon material.

8. The testing equipment for IC carrier boards according to any one of claims 1-4, characterized in that, The detection module includes a flipping platform and has a first detection position and a second detection position, with a detection camera corresponding to each of the first detection position and the second detection position. The flipping platform is used to flip the IC carrier board after it has been detected by the first detection position and then transfer it to the second detection position.

9. The IC carrier board testing equipment according to claim 8, characterized in that, A linear transport module is provided at the first detection position and the second detection position. The linear transport module is used to transport the IC carrier board of the first detection position or the second detection position to the bottom of the corresponding detection camera.

10. The testing equipment for IC carrier boards according to any one of claims 1-4, characterized in that, The mounting bracket includes a main beam and at least one side support beam. The main beam extends in the vertical direction. The top of the main beam is used to mount the loading and unloading conveying module. The bottom of the main beam is supported on the inner bottom of the second mounting area. The side support beam is inclined relative to the vertical direction. The top of the side support beam is connected to the top of the main beam, and the bottom of the side support beam is supported on the inner bottom of the second mounting area and spaced apart from the main beam.

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