Detection equipment for IC (Integrated Circuit) carrier plate

Abstract

The utility model discloses a detection device for an IC carrier plate, and the device comprises a device body which is provided with a first installation cavity and a second installation cavity which are distributed in a first direction. A detection structure and a control structure, the detection structure is arranged in the first mounting cavity, the detection structure is used for detecting the IC carrier plate, the control structure is arranged in the second mounting cavity, and the control structure is used for controlling the detection structure; wherein the first mounting cavity is configured to be a first heat dissipation cavity, the first heat dissipation cavity is used for dissipating heat of the detection structure, the second mounting cavity is configured to be a second heat dissipation cavity, and the second heat dissipation cavity is used for dissipating heat of the control structure. The detection equipment for the IC support plate is clear in structure and convenient to maintain, the detection structure and the control structure can be independently cooled, the air circulation possibility between the detection structure and the control structure is low, the dust-free environment in the detection equipment is ensured, and the accuracy of detecting surface defects of the IC support plate is improved.

Description

Technical Field

[0001] This utility model relates to the field of IC substrate manufacturing technology, and in particular to an IC substrate testing device. Background Technology

[0002] IC substrates are crucial semiconductor electronic components, serving as the support for semiconductor chips. IC substrates are increasingly evolving towards miniaturization, density, and integration. During the IC substrate manufacturing process, it is essential to accurately and quickly detect and identify scratches, dents, and other defects on the substrate surface and other areas to promptly filter out defective products and prevent them from reaching the customer. Existing inspection equipment can automatically detect defects in IC substrates, but poor heat dissipation and inadequate cleanroom conditions within the equipment result in low inspection accuracy, indicating room for improvement. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an IC substrate testing device with a clear structure, convenient maintenance, and independent heat dissipation for the testing and control structures, minimizing the possibility of airflow between them. This ensures a dust-free environment inside the testing device and improves the accuracy of detecting surface defects on IC substrates.

[0004] An IC carrier board testing device according to an embodiment of the present invention includes: a device body having a first mounting cavity and a second mounting cavity distributed along a first direction; a testing structure and a control structure, wherein the testing structure is disposed in the first mounting cavity and is used to test the IC carrier board; and the control structure is disposed in the second mounting cavity and is used to control the testing structure; wherein the first mounting cavity is configured as a first heat dissipation cavity for dissipating heat from the testing structure, and the second mounting cavity is configured as a second heat dissipation cavity for dissipating heat from the control structure.

[0005] According to the IC carrier board testing equipment of this utility model embodiment, by setting the testing structure and the control structure to be installed in the first mounting cavity and the second mounting cavity respectively, the layout of the testing structure and the control structure can be separated, the structure is clear, and the installation and maintenance are more convenient. Moreover, the testing structure and the control structure can be cooled independently, reducing the possibility of air flow between them, ensuring a dust-free environment inside the testing equipment, and improving the accuracy of detecting defects on the surface of the IC carrier board.

[0006] According to some embodiments of the present invention, the IC carrier board testing device has a first air inlet and a first air outlet communicating with the first heat dissipation cavity, and a first airflow fan is provided at the first air inlet and / or the first air outlet.

[0007] And / or, the device body is provided with a second air inlet and a second air outlet communicating with the second heat dissipation cavity, and a second airflow fan is provided at the second air inlet and / or the second air outlet.

[0008] According to some embodiments of the present invention, the IC carrier board testing device has the first direction along the vertical direction, and the first mounting cavity is located above the second mounting cavity.

[0009] According to some embodiments of the present invention, the IC carrier board testing device has the first air inlet and the first air outlet located on different walls of the first mounting cavity.

[0010] And / or, the second air inlet and the second air outlet are located on different walls of the second mounting cavity.

[0011] According to some embodiments of the present invention, the IC carrier board testing equipment has a first air inlet on at least one side of the first mounting cavity and a first air outlet on the top surface of the first mounting cavity.

[0012] And / or, at least one side of the second mounting cavity is provided with the second air inlet, and at least one side of the second mounting cavity is provided with the second air outlet.

[0013] According to some embodiments of the present invention, an IC carrier board testing device is provided, wherein the testing structure includes a loading bin, a testing module, and a unloading bin. The loading bin, the testing module, and the unloading bin are connected by a loading / unloading transport module for transferring the IC carrier board. The testing module is used to test the IC carrier board.

[0014] The IC carrier board testing equipment according to some embodiments of the present invention further includes a mounting bracket, and the loading and unloading conveying module is mounted on the mounting bracket.

[0015] The first mounting cavity is located above the second mounting cavity, and the mounting bracket penetrates the bottom wall of the first mounting cavity and is supported within the second mounting cavity.

[0016] According to some embodiments of the present invention, an IC carrier board testing device is provided, wherein the testing module includes a flipping platform, the testing module has a first testing position and a second testing position, and a testing camera is respectively provided for the first testing position and the second testing position.

[0017] The flipping platform is used to flip the IC carrier board after it has been detected by the first detection position and then transfer it to the second detection position.

[0018] According to some embodiments of the present invention, an IC carrier board testing device is provided, wherein the device body includes an upper housing, a partition plate, and a lower housing, the upper housing is connected above the lower housing, and the partition plate is located between the upper housing and the lower housing;

[0019] The first mounting cavity is formed between the upper housing and the partition plate, and the second mounting cavity is formed between the lower housing and the partition plate. The partition plate is used to separate the first mounting cavity and the second mounting cavity.

[0020] The IC carrier board testing device according to some embodiments of the present invention further includes an operating computer, which is installed outside the device body. The control structure includes an electrical control box, which is electrically connected to the testing structure. The operating computer is connected to a computer host, and both the computer host and the electrical control box are located in the second mounting cavity.

[0021] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0022] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0023] Figure 1 This is a schematic diagram of the structure of an IC carrier board testing device according to an embodiment of the present invention. Figure 1 ;

[0024] Figure 2 This is a schematic diagram of the structure of an IC carrier board testing device according to an embodiment of the present invention. Figure 2 .

[0025] Figure label:

[0026] IC substrate testing equipment 100

[0027] Equipment body 1, first mounting cavity 11, first air inlet 111, first air outlet 112, first airflow fan 113, second mounting cavity 12, second air inlet 121, second air outlet 122, second airflow fan 123, upper shell 13, partition plate 14, lower shell 15, detection structure 2, loading bin 21, detection module 22, first detection position 221, second detection position 222, detection camera 223, unloading bin 23, loading and unloading transfer module 24, loading and unloading transfer module 241, unloading and unloading transfer module 242, flipping platform 25, bearing plate 251, moving platform 26, control structure 3, electrical control box 31, mounting bracket 4, operating computer 5, computer host 51, IC carrier board 6. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0029] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] The following is for reference. Figures 1-2 The IC carrier board testing device 100 according to an embodiment of the present invention is described. By setting the testing structure 2 and the control structure 3 to be installed in the first mounting cavity 11 and the second mounting cavity 12 respectively, the layout of the testing structure 2 and the control structure 3 can be separated, the structure is clear, and the installation and maintenance are more convenient. Moreover, the testing structure 2 and the control structure 3 can be cooled independently, reducing the possibility of air flow between them, ensuring a dust-free environment inside the testing device, and improving the accuracy of detecting surface defects on the IC carrier board 6.

[0032] like Figures 1-2 As shown, an IC carrier board testing device 100 according to an embodiment of the present invention includes: a device body 1, a testing structure 2, and a control structure 3.

[0033] The device body 1 has a first mounting cavity 11 and a second mounting cavity 12 distributed along a first direction. The detection structure 2 is disposed in the first mounting cavity 11 and is used to detect the IC carrier board 6. The control structure 3 is disposed in the second mounting cavity 12 and is used to control the detection structure 2.

[0034] Specifically, the device body 1 is the main body of the IC carrier board testing device 100. Its internal support structure can be made of steel or aluminum tubular materials to support other internal structures and ensure the stability of the IC carrier board testing device 100. The device body 1 has a first mounting cavity 11 and a second mounting cavity 12, which are distributed along a first direction. The first mounting cavity 11 is used for the installation of the detection structure 2, and the second mounting cavity 12 is used for the installation of the control structure 3. The first mounting cavity 11 and the second mounting cavity 12 are spaced apart, allowing the detection structure 2 and the control structure 3 to be installed in their respective spaces. Furthermore, the spaced-apart distribution of the detection structure 2 and the control structure 3 along the first direction allows for independent installation and maintenance, making installation and maintenance more convenient. The first direction can be vertical, horizontal, or front-back, etc.

[0035] Furthermore, the detection structure 2 is a functional part of the IC carrier board detection equipment 100, used to detect the IC carrier board 6, and the control structure 3 is a control part of the IC carrier board detection equipment 100, which is connected to the detection structure 2 and used to control the operating status of the detection structure 2.

[0036] It should be noted that with technological advancements, the IC substrate 6, as an indispensable component of electronic products, is gradually moving towards miniaturization, densification, and integration, leading to increased production demand. During the production process of the IC substrate 6, it is necessary to accurately and quickly detect and identify scratches, dents, and other defects on its surface, promptly filtering out defective products and preventing them from reaching the customer. In this embodiment, by combining the detection structure 2 and the control structure 3, the detection structure 2 can automatically detect defects on the surface of the IC substrate 6, achieving high detection efficiency and replacing traditional manual inspection, thereby improving the efficiency of defect detection on the IC substrate 6.

[0037] The first mounting cavity 11 is configured as a first heat dissipation cavity, which is used to dissipate heat from the detection structure 2. The second mounting cavity 12 is configured as a second heat dissipation cavity, which is used to dissipate heat from the control structure 3.

[0038] In other words, the first mounting cavity 11 can be used as the mounting space for the detection structure 2, and the first mounting cavity 11 can also be used as the first heat dissipation cavity for the detection structure 2, thus realizing the installation and heat dissipation of the detection structure 2. The second mounting cavity 12 can be used as the mounting space for the control structure 3, and the second mounting cavity 12 can also be used as the second heat dissipation cavity for the control structure 3, thus realizing the installation and heat dissipation of the control structure 3.

[0039] Specifically, when the detection equipment is working, both the detection structure 2 and the control structure 3 are in operation. Both the detection structure 2 and the control structure 3 generate heat during operation. The first heat dissipation cavity can dissipate heat from the detection structure 2, keeping its operating temperature within the normal range, which helps improve the stability and accuracy of the detection. The second heat dissipation cavity can dissipate heat from the control structure 3, keeping its operating temperature within the normal range, which helps improve its stability and safety.

[0040] Furthermore, the first and second heat dissipation cavities are spaced apart along the first direction, allowing the detection structure 2 and the control structure 3 to dissipate heat independently. This prevents large-scale airflow between the first and second heat dissipation cavities, ensuring a dust-free environment inside the detection equipment and improving detection accuracy. Additionally, setting their respective mounting cavities as heat dissipation cavities shortens the heat dissipation path, thereby improving the heat dissipation efficiency and effect of the detection structure 2 and the control structure 3.

[0041] According to the IC carrier board testing equipment 100 of this utility model embodiment, by setting the testing structure 2 and the control structure 3 to be respectively installed in the first mounting cavity 11 and the second mounting cavity 12, the layout of the testing structure 2 and the control structure 3 can be separated, the structure is clear, and the installation and maintenance are more convenient. Moreover, the testing structure 2 and the control structure 3 can be independently cooled, reducing the possibility of air flow between them, ensuring a dust-free environment inside the testing equipment, improving the accuracy of surface defect detection of IC carrier board 6, and the overall structure has a high degree of automation, which can replace manual inspection, thereby improving the production efficiency of IC carrier board 6.

[0042] In some embodiments, the device body 1 is provided with a first air inlet 111 and a first air outlet 112 communicating with the first heat dissipation cavity, and a first airflow fan 113 is provided at the first air inlet 111 and / or the first air outlet 112.

[0043] Specifically, the first air inlet 111 is used for air intake of the first heat dissipation cavity, and the first air outlet 112 is used for air outlet of the first heat dissipation cavity. The first air inlet 111 and the first air outlet 112 are respectively connected to the first heat dissipation cavity and respectively penetrate the device body 1, so that the first heat dissipation cavity can be connected to the external space, so that the hot air in the first heat dissipation cavity can flow out.

[0044] The first airflow fan 113 can be installed at either the first air inlet 111 or the first air outlet 112. Specifically, the first airflow fan 113 can be installed at the first air inlet 111, or at the first air outlet 112. Alternatively, the first airflow fan 113 can be installed at both the first air inlet 111 and the first air outlet 112. Any of the above installation methods can drive the airflow, and the installation methods are diverse and can be flexibly selected.

[0045] In this embodiment, as Figure 2 As shown, the first airflow fan 113 is connected to the first air outlet 112.

[0046] Furthermore, the first airflow fan 113 can drive external air to enter the first heat dissipation cavity from the first air inlet 111. After the incoming air carries away the heat of the detection structure 2 and the outer periphery of the detection structure 2 in the first heat dissipation cavity, it is discharged from the device body 1 from the first air outlet 112, thereby achieving heat dissipation for the detection structure 2.

[0047] Furthermore, the first airflow fan 113 can be detachably connected to the first air inlet 111 and / or the first air outlet 112 via bolts or other connecting parts. The connection method is simple and facilitates the disassembly and replacement of the first airflow fan 113.

[0048] In some other embodiments, the device body 1 is provided with a second air inlet 121 and a second air outlet 122 communicating with the second heat dissipation cavity, and a second airflow fan 123 is provided at the second air inlet 121 and / or the second air outlet 122.

[0049] Specifically, the second air inlet 121 is used for air intake of the second heat dissipation cavity, and the second air outlet 122 is used for air outlet of the second heat dissipation cavity. The second air inlet 121 and the second air outlet 122 are respectively connected to the second heat dissipation cavity and respectively penetrate the device body 1, so that the second heat dissipation cavity can be connected to the external space, so that the hot air in the second heat dissipation cavity can flow out.

[0050] The second airflow fan 123 can be installed in one of the second air inlet 121 and the second air outlet 122. That is, the second airflow fan 123 can be installed at the second air inlet 121, or at the second air outlet 122, or the second airflow fan 123 can be installed at both the second air inlet 121 and the second air outlet 122. Any of the above-mentioned installation methods can drive the airflow. The installation methods are diverse and can be flexibly selected.

[0051] In this embodiment, as Figure 2 As shown, the second airflow fan 123 is connected to the second air outlet 122.

[0052] Furthermore, the second airflow fan 123 can drive external air from the second air inlet 121 into the second heat dissipation cavity. After the incoming air carries away the heat from the control structure 3 and the outer periphery of the control structure 3 in the second heat dissipation cavity, it is discharged from the device body 1 from the second air outlet 122, thereby achieving heat dissipation for the control structure 3.

[0053] Furthermore, the second airflow fan 123 can be detachably connected to the second air inlet 121 and / or the second air outlet 122 via bolts or other connecting parts. The connection method is simple and facilitates the disassembly and replacement of the second airflow fan 123.

[0054] In some embodiments, the first direction is along the vertical direction, and the first mounting cavity 11 is located above the second mounting cavity 12. The first mounting cavity 11 and the second mounting cavity 12 are spaced apart along the vertical direction. The first mounting cavity 11 is used for the installation of the detection structure 2, and the second mounting cavity 12 is used for the installation of the control structure 3. This allows the detection structure 2 and the control structure 3 to be distributed spaced apart along the vertical direction, enabling their respective layouts and installations. Furthermore, the heat transfer between the two is minimal, reducing the heat impact between them.

[0055] Furthermore, the detection structure 2 is located above the control structure 3, making its installation height higher than that of the control structure 3. This ensures that operators can easily and intuitively observe the operation of the detection structure 2 while standing, reducing fatigue from prolonged work, improving operator comfort and observation efficiency, and making the observation process more standardized and accurate, thereby improving the quality and efficiency of the detection work. Moreover, if a problem occurs with the detection structure 2, repairs can be performed directly on the upper detection structure 2; similarly, if a problem occurs with the control structure 3, repairs can be performed directly on the lower control structure 3, improving maintenance efficiency.

[0056] In some embodiments, the first air inlet 111 and the first air outlet 112 are located on different walls of the first mounting cavity 11. This allows different walls of the first mounting cavity 11 to be used for air intake and exhaust. Compared to setting the first air inlet 111 and the first air outlet 112 on the same wall, the diffusion range of air in the first mounting cavity 11 can be increased, ensuring effective contact between air and the detection structure 2 and improving the heat dissipation effect of the detection structure 2.

[0057] Furthermore, under the action of the first airflow fan 113, external air flows into the first mounting cavity 11 from one wall, exchanges heat with the hot airflow in the first mounting cavity 11, and then flows out of the first mounting cavity 11 from the other wall, so as to achieve heat dissipation of the detection structure 2 in the first mounting cavity 11.

[0058] Therefore, through the above arrangement, the first air inlet 111 and the first air outlet 112 can be spaced at a certain distance and angle, which can increase the air flow range in the first mounting cavity 11, facilitate the uniform distribution and full flow of air inside the first mounting cavity 11, and thus improve the heat dissipation efficiency.

[0059] In other embodiments, the second air inlet 121 and the second air outlet 122 are located on different walls of the second mounting cavity 12. This allows different walls of the second mounting cavity 12 to be used for air intake and exhaust. Compared to setting the second air inlet 121 and the second air outlet 122 on the same wall, the diffusion range of air in the second mounting cavity 12 can be increased, ensuring effective contact between air and the control structure 3 and improving the heat dissipation effect of the detection structure 2.

[0060] Furthermore, under the action of the second airflow fan 123, external air flows into the second mounting cavity 12 from one wall, exchanges heat with the hot airflow inside the second mounting cavity 12, and then flows out of the second mounting cavity 12 from the other wall, so as to achieve heat dissipation of the detection structure 2 inside the second mounting cavity 12.

[0061] Therefore, through the above arrangement, the second air inlet 121 and the second air outlet 122 are spaced at a certain distance and angle, which can increase the air flow range in the second mounting cavity 12, facilitate the uniform distribution and full flow of air inside the second mounting cavity 12, and thus improve the heat dissipation efficiency.

[0062] In some embodiments, at least one side of the first mounting cavity 11 is provided with a first air inlet 111, and the top surface of the first mounting cavity 11 is provided with a first air outlet 112.

[0063] Specifically, the first mounting cavity 11 includes a side surface, a top surface, and a bottom surface. A first air inlet 111 can be provided on one side of the first mounting cavity 11, or a first air inlet 111 can be provided on two or three sides of the first mounting cavity 11. By any of the above multiple setting methods, side air intake of the first mounting cavity 11 can be achieved. The setting methods are diverse and can be flexibly selected.

[0064] And such as Figure 2 As shown, a first air outlet 112 is provided on the top surface of the first mounting cavity 11, which enables air to be discharged from the top surface of the first mounting cavity 11. Multiple first air outlets 112 are provided, spaced apart on the top surface of the first mounting cavity 11, and each first air outlet 112 is equipped with a first airflow fan 113, allowing air from the first mounting cavity 11 to flow out from multiple locations on the top surface. Multiple first air inlets 111 are also provided, which can be configured as ventilation holes. Multiple ventilation holes are spaced apart, allowing external air to flow into the first mounting cavity 11 from multiple locations on the side.

[0065] Furthermore, under the action of the first airflow fan 113, external air flows into the first mounting cavity 11 from multiple first air inlets 111 on at least one side of the first mounting cavity 11, exchanges heat with the hot airflow in the first mounting cavity 11, and then flows out of the first mounting cavity 11 from multiple positions on the top surface of the first mounting cavity 11, so as to achieve heat dissipation of the detection structure 2 in the first mounting cavity 11.

[0066] Therefore, by setting multiple first air inlets 111 and multiple first air outlets 112, the airflow range can be expanded to improve the heat dissipation efficiency of the detection structure 2. In addition, multiple first airflow fans 113 are located on the top of the device body 1, which makes the surface structure of the device body 1 simple and flat.

[0067] The first air inlet 111 can be constructed as a ventilation hole with a small aperture, which can allow air to enter and prevent external impurities from entering the first mounting cavity 11, thereby achieving a dust-free environment in the first mounting cavity 11. Its design is reasonable and reliable.

[0068] Furthermore, a first air inlet 111 can be provided on the top surface of the first mounting cavity 11, and a first air outlet 112 can be provided on at least one side of the first mounting cavity 11. The configuration methods are diverse and can be flexibly configured according to actual space requirements and appearance requirements.

[0069] In other embodiments, at least one side of the second mounting cavity 12 is provided with a second air inlet 121, and at least one side of the second mounting cavity 12 is provided with a second air outlet 122.

[0070] Specifically, the second mounting cavity 12 includes a side surface, a top surface, and a bottom surface. A second air inlet 121 can be provided on one side of the second mounting cavity 12, or second air inlets 121 can be provided on two or three sides of the second mounting cavity 12. A second air outlet 122 can be provided on one side of the second mounting cavity 12, or second air inlets 121 can be provided on two or three sides of the second mounting cavity 12. By using any of the above multiple configuration methods, side air intake of the second mounting cavity 12 can be achieved. The configuration methods are diverse and can be flexibly selected.

[0071] And such as Figure 2As shown, a second air outlet 122 is provided on the left and / or right sides of the second mounting cavity 12, enabling side airflow from the second mounting cavity 12. Multiple second air outlets 122 are provided, spaced apart on the left and / or right sides of the second mounting cavity 12, and each second air outlet 122 is equipped with a second airflow fan 123, allowing air from the second mounting cavity 12 to flow out from multiple locations on the left and / or right sides. Furthermore, multiple second air inlets 121 are provided on the front and / or rear sides of the second mounting cavity 12. These second air inlets 121 can be configured as ventilation holes, spaced apart, allowing external air to flow into the second mounting cavity 12 from multiple locations on the side.

[0072] Furthermore, under the action of the second airflow fan 123, external air flows into the second mounting cavity 12 from multiple second air inlets 121 on at least one side of the second mounting cavity 12, exchanges heat with the hot airflow in the second mounting cavity 12, and then flows out of the second mounting cavity 12 from multiple positions on at least one side of the second mounting cavity 12, so as to achieve heat dissipation of the detection structure 2 in the second mounting cavity 12.

[0073] Therefore, by setting multiple second air inlets 121 and multiple second air outlets 122, the airflow range can be expanded to improve the heat dissipation efficiency of the detection structure 2. In addition, multiple second airflow fans 123 are located on the left and right sides of the device body 1, so that the front side structure of the device body 1 can be simple and flat.

[0074] The second air inlet 121 can be constructed as a ventilation hole with a small aperture, which can allow air to enter and prevent external impurities from entering the second mounting cavity 12, thereby achieving a dust-free environment in the second mounting cavity 12. Its design is reasonable and reliable.

[0075] Furthermore, a first air inlet 111 can be provided on the left and / or right sides of the second mounting cavity 12, and a second air outlet 122 can be provided on the rear side of the second mounting cavity 12. The configuration methods are diverse and can be flexibly configured according to actual space requirements and appearance requirements.

[0076] In some embodiments, the detection structure 2 includes a loading bin 21, a detection module 22, and a unloading bin 23. The loading bin 21, the detection module 22, and the unloading bin 23 are connected by a loading / unloading transport module 24 to transfer the IC carrier board 6. The detection module 22 is used to detect the IC carrier board 6.

[0077] Specifically, the loading bin 21 is used to store IC carrier boards 6 to be inspected, the unloading bin 23 is used to store IC carrier boards 6 that have already been inspected, and the detection module 22 is used to inspect the IC carrier boards 6, wherein, for example... Figure 1As shown, the loading bin 21 and unloading bin 23 are spaced apart along a second direction, and a loading / unloading transfer module 24 is provided between the loading bin 21 and the unloading bin 23 to realize the transfer of IC carrier board 6 between the two. A detection module 22 is located between the loading bin 21 and the unloading bin 23 to detect the IC carrier board 6 transported to the detection position. The second direction can be the left-right direction of the device body 1.

[0078] Furthermore, when the loading / unloading transfer module 24 moves the IC carrier board 6 to be inspected from the loading bin 21 to the inspection position, the inspection module 22 inspects the IC carrier board 6. After the inspection is completed, the loading / unloading transfer module 24 moves the inspected IC carrier board 6 to the unloading bin 23, thus realizing the loading, inspection, and unloading of the IC carrier board 6. The entire process of the equipment is automatically controlled, which improves the production efficiency of the IC carrier board 6.

[0079] The loading bin 21 has storage space for storing multiple untested IC carrier boards 6. At least one loading bin 21 can be configured to increase its storage capacity. The unloading bin 23 has unloading space for storing multiple tested IC carrier boards 6. At least two unloading bins 23 can be configured to increase their storage capacity. The testing results of the IC carrier boards 6 include qualified and unqualified products. At least two unloading bins 23 are used to place qualified and unqualified products respectively, facilitating the classification of the IC carrier boards 6. Through the above configuration, the storage capacity of IC carrier boards 6 in the loading bin 21 and unloading bin 23 can be increased, thereby improving the production capacity per unit time.

[0080] Specifically, such as Figure 1 As shown, there are two feeding bins 21, which are spaced apart along the second direction, and three discharging bins 23, which are spaced apart along the second direction.

[0081] Furthermore, the structures of the loading bin 21 and the unloading bin 23 can be identical, both having upward-facing open openings for loading / unloading modules 24 or operators to retrieve and place materials. Both the loading bin 21 and the unloading bin 23 are movably connected relative to the equipment body 1, and can be pulled out of the equipment body 1. Thus, when the loading bin 21 is low on material, the operator can pull it out relative to the equipment body 1 to replenish it, and then push it back into the equipment body 1. Similarly, when the unloading bin 23 is full, the operator can pull it out relative to the equipment body 1, unload it, and then push it back into the equipment body 1. This design, similar to a drawer-type design, facilitates manual operation of the loading bin 21 and the unloading bin 23, and is beneficial for monitoring the loading and unloading of the equipment. It features a simple structure and high safety.

[0082] In some embodiments, the IC carrier board testing equipment 100 further includes a mounting bracket 4, a loading and unloading conveying module 24 is mounted on the mounting bracket 4, a first mounting cavity 11 is located above a second mounting cavity 12, and the mounting bracket 4 penetrates the bottom wall of the first mounting cavity 11 and is supported in the second mounting cavity 12.

[0083] Specifically, the loading and unloading conveying module 24 is detachably connected to the mounting bracket 4, which enables the connection and fixation of the loading and unloading conveying module 24. For example... Figure 1 As shown, the loading and unloading conveying module 24 is located in the first mounting cavity 11. At least part of the structure of the mounting bracket 4 is also located in the first mounting cavity 11, and another part is located in the second mounting cavity 12. The first mounting cavity 11 is located above the second mounting cavity 12. That is, the mounting bracket 4 extends from top to bottom and extends through the bottom wall of the first mounting cavity 11 to the second mounting cavity 12. The bottom of the mounting bracket 4 is supported by the second mounting cavity 12, which can realize the connection and fixation of the mounting bracket 4 in the equipment body 1.

[0084] Furthermore, the detection module 22, the loading bin 21, and the unloading bin 23 are all located in the first mounting cavity 11 and are respectively connected to the first mounting cavity 11. The loading and unloading conveying module 24 is the main conveying mechanism, which will generate vibration during operation. The vibration generated will be transmitted to the second mounting cavity 12 through the mounting bracket 4, so that the vibration can be transmitted in the second mounting cavity 12, which can avoid the vibration from affecting the loading bin 21, the unloading bin 23, and the detection module 22 in the first mounting cavity 11.

[0085] Therefore, by setting the mounting bracket 4 of the fixed loading and unloading conveying module 24 to be connected in the second mounting cavity 12, and the detection module 22 to be installed in the first mounting cavity 11, the fixing structures of the loading and unloading conveying module 24 and the detection module 22 can be set in different spaces, isolating the vibration source, which can effectively reduce the shaking of the detection module 22 caused by the vibration generated by the loading and unloading conveying module 24 during operation, thereby improving the detection accuracy and stability of the detection module 22.

[0086] The loading and unloading transport module 24 includes a loading transport module 241 and an unloading transport module 242. Both the loading transport module 241 and the unloading transport module 242 are mounted on the upper end of the mounting bracket 4. The loading transport module 241 and the unloading transport module 242 can be configured as two linear modules or as right-angle modules. In this embodiment, for example... Figure 1 As shown, both the loading and unloading transport module 241 and the unloading transport module 242 can move along the second direction and the first direction, that is, both the loading and unloading transport module 241 and the unloading transport module 242 can move along the up-down direction and the left-right direction, so that the loading and unloading transport module 241 and the unloading transport module 242 can realize material transfer.

[0087] In some embodiments, the detection module 22 includes a flipping platform 25. The detection module 22 has a first detection position 221 and a second detection position 222. The first detection position 221 and the second detection position 222 are respectively provided with a detection camera 223. The flipping platform 25 is used to flip the IC carrier board 6 after detection at the first detection position 221 and transfer it to the second detection position 222.

[0088] Specifically, the flipping platform 25 is used to flip the IC carrier board 6. The detection module 22 has a first detection position 221 and a second detection position 222. The first detection position 221 and the second detection position 222 are respectively used to place the IC carrier board 6 to be detected, and the first detection position 221 and the second detection position 222 are respectively located on both sides of the flipping platform 25 for flipping the IC carrier board 6 on the first detection position 221 to the second detection position 222. Furthermore, each of the first detection position 221 and the second detection position 222 is equipped with a detection camera 223, which can respectively take pictures of the IC carrier board 6 at the first detection position 221 and the second detection position 222 for detection.

[0089] Furthermore, the detection module 22 also includes a moving platform 26, which can move the first detection position 221 or the second detection position 222. The detection camera 223 and the loading / unloading conveying module 24 are spaced apart along a third direction, which can be the front-to-back direction of the equipment body 1, such as... Figure 1 As shown, the detection camera 223 is located on the rear side of the loading and unloading conveying module 24. The moving platform 26 can reciprocate the IC carrier board 6 of the first detection position 221 or the second detection position 222 between the flipping platform 25 and the detection camera 223.

[0090] Furthermore, the first detection position 221 is equipped with a first detection camera, and the second detection position 222 is equipped with a second detection camera, such as... Figure 1 As shown, the feeding bin 21, the first detection position 221, the tilting platform 25, the second detection position 222, and the unloading bin 23 are distributed from right to left, that is, feeding is carried out in the right side area of ​​the equipment body 1 and unloading is carried out in the left side area of ​​the equipment body 1.

[0091] Taking this layout as an example, in actual operation, the loading and handling module 241 first descends to the material handling position of the loading bin 21, grabs the IC carrier board 6 from the loading bin 21, rises, then moves to the left and down to the first detection position 221, transferring the IC carrier board 6 to the first detection position 221. The moving platform 26 then moves the IC carrier board 6 from the first detection position 221 to the position corresponding to the first detection camera. The first detection camera takes a picture of the IC carrier board 6 for detection. After the detection is completed, the moving platform 26 moves the IC carrier board 6 from the first detection position 221 back to its initial position. Then, through the loading... The material handling module 241 moves the IC carrier board 6 that has been inspected on the first inspection position 221 to the flipping platform 25. The flipping platform 25 then flips the IC carrier board 6 that has been inspected once by 180° and transfers the flipped IC carrier board 6 to the second inspection position 222. After the same operation, the second inspection camera inspects the flipped IC carrier board 6. After the inspection is completed, the unloading and handling module 242 transfers the IC carrier board 6 that has been inspected on the second inspection position 222 to the unloading area of ​​the unloading bin 23 to achieve defect inspection on both sides of the IC carrier board 6 in one operation.

[0092] It should be noted that there are two mobile platforms 26 and two inspection cameras 223, arranged in a one-to-one correspondence. The two sets of mobile platforms 26 and inspection cameras 223 are symmetrically distributed on both sides of the flip platform 25 to respectively inspect the TOP and BOT surfaces of the IC carrier board 6. The mobile platform 26 can also be constructed as a linear module, which offers high operational precision, facilitating the alignment accuracy between the first inspection position 221 and the inspection camera 223, and improving the repeatability of the mobile platform 26. The inspection camera 223 is detachably connected to the support structure of the first mounting cavity 11, and can be connected to the support structure via a linear module. The position of the inspection camera 223 can be adjusted to ensure the relative positional accuracy between the inspection camera 223 and the first inspection position 221. Furthermore, by setting the mounting bracket 4 of the loading / unloading conveying module 24 and the support structure of the inspection camera 223 in a partitioned manner, the impact of vibration on the image acquisition by the inspection camera 223 can be better mitigated, thereby improving the accuracy and stability of the inspection.

[0093] Furthermore, the loading and handling module 241 can be connected to two gripping structures, which are distributed in the left-right direction. One of the gripping structures can be used for the initial loading of the first detection position 221. After the IC carrier board 6 at the first detection position 221 is detected, the right gripping structure first grabs the IC carrier board 6 to be tested from the loading bin 21, while the left gripping structure transfers the tested IC carrier board 6 at the first detection position 221 to the flipping platform 25. The right gripping structure then transports the grabbed IC carrier board 6 to be tested back to the first detection position 221. This shortens the transfer time of the IC carrier board 6 and improves the overall detection efficiency. The unloading and handling module 242 is also connected to a gripping structure. This gripping structure can use a suction cup to pick up the IC carrier board 6, thus transferring it. The suction cup method reduces damage to the IC carrier board 6 and has good performance.

[0094] Furthermore, the flipping platform 25 includes a driving component and a carrier plate 251. The driving component can drive the IC carrier plate 6 on the carrier plate 251 to flip 180° to realize the flipping function of the flipping platform 25. The carrier plate 251 and the IC carrier plate 6 can also be attached together, which can realize the positioning of the IC carrier plate 6 and prevent the IC carrier plate 6 from falling off during the flipping process.

[0095] In some embodiments, the device body 1 includes an upper housing 13, a partition plate 14, and a lower housing 15. The upper housing 13 is connected above the lower housing 15, and the partition plate 14 is located between the upper housing 13 and the lower housing 15. A first mounting cavity 11 is formed between the upper housing 13 and the partition plate 14, and a second mounting cavity 12 is formed between the lower housing 15 and the partition plate 14. The partition plate 14 is used to separate the first mounting cavity 11 and the second mounting cavity 12.

[0096] Specifically, such as Figure 1 and Figure 2 As shown, the upper housing 13, partition plate 14, and lower housing 15 are arranged sequentially in the vertical direction. The upper housing 13 is located above the lower housing 15, and the partition plate 14 is located between the upper housing 13 and the lower housing 15. The partition plate 14 is horizontally distributed, located inside the equipment body 1, and connected to the equipment body 1. The upper housing 13 and the partition plate 14 define a first mounting cavity 11, and the lower housing 15 and the partition plate 14 define a second mounting cavity 12. The partition plate 14 separates the first mounting cavity 11 and the second mounting cavity 12 in the vertical direction, allowing the first mounting cavity 11 and the second mounting cavity 12 to form separate spaces, enabling the separate arrangement of the detection structure 2 and the control structure 3, respectively. The partition plate 14 also provides support between the upper housing 13 and the lower housing 15, and its upper and lower sides can provide installation positions for the detection structure 2 and the control structure 3, respectively, making the installation of the detection structure 2 and the control structure 3 more reliable and stable. Its structure is clear and easy to install.

[0097] Furthermore, the mounting bracket 4 of the loading and unloading transport module 24 used to fix the detection structure 2 passes through the partition plate 14 to fix the mounting bracket 4 to the bottom of the second mounting cavity 12. The partition plate 14 is provided with a clearance hole to allow the mounting bracket 4 to pass.

[0098] The upper shell 13 and the lower shell 15 are the outer surfaces of the equipment body 1, which can shield the detection structure 2, control structure 3, etc., and serve as protection and dustproof for these structures, making the overall external structure of the detection equipment simpler and more regular.

[0099] In some embodiments, the IC substrate testing device 100 further includes an operating computer 5, which is installed outside the device body 1, and the control structure 3 includes an electrical control box 31, which is electrically connected to the testing structure 2.

[0100] Specifically, the operating computer 5 serves as the operating interface and control center for the testing equipment. It receives instructions from the operator and converts these instructions into signals that the equipment can execute. Simultaneously, the operating computer 5 displays the operating status and testing results of the equipment, facilitating real-time monitoring and recording by the operator. The operating computer 5 can be detachably connected to the equipment body 1 via bolts or other connecting components. Figure 2 As shown, the operating computer 5 can be connected to the front side of the equipment body 1, facilitating operation and observation by production personnel. Alternatively, the operating computer 5 can be directly embedded in the front side of the equipment body 1; various installation methods are available to flexibly choose according to actual space requirements.

[0101] Furthermore, the control structure 3 includes an electrical control box 31, which is the electrical control component of the testing equipment. The electrical control box 31 is electrically connected to the testing structure 2, specifically to the testing module 22, the loading bin 21, the unloading bin 23, the loading / unloading conveying module 24, the tilting platform 25, and the testing camera 223. During operation, the electrical control box 31 receives instructions from the operating computer 5 and uses internal electrical components and circuits to systematically control multiple structures within the testing structure 2 to perform testing of the IC carrier board 6. The testing structure 2 then feeds back the testing results to the electrical control box 31, which in turn transmits the data to the operating computer 5 for display and recording. The entire testing process is highly automated, improving testing efficiency and accuracy. The electrical control box 31 can also monitor and protect parameters such as current and voltage in the power system, ensuring the safe operation of the testing equipment.

[0102] Operating computer 5 is connected to computer host 51, such as Figure 1As shown, the computer host 51 and the electrical control box 31 are both located in the second mounting cavity 12. The computer host 51 is the core part of the operating computer 5, responsible for processing various data and instructions. The computer host 51 and the electrical control box 31 are connected together in the second mounting cavity 12. They communicate and transmit data with other parts of the operating computer 5 through the internal bus and interface. The connection is simple and convenient.

[0103] In this way, the above setup ensures that the computer host 51 and the electrical control box 31 operate in a relatively enclosed and safe environment, preventing damage to the computer host 51 and the electrical control box 31 from external factors such as dust and moisture. At the same time, placing the computer host 51 and the electrical control box 31 together facilitates communication and data transmission between them, improves the overall performance and reliability of the equipment, and facilitates the layout, connection, and subsequent maintenance of the wiring between the electrical structures.

[0104] Therefore, through the automatic handling of the equipment and the automatic imaging of the inspection camera 223, the minute defects of the IC carrier board 6 can be accurately detected. Furthermore, through the logical control interaction of the control structure 3, defective and qualified products are placed in different unloading bins 23, which enables automatic tracking and tracing of product defects on each IC carrier board, and enables rapid location of defects in defective products, allowing for more intuitive manual handling of defects.

[0105] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0106] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A testing device for IC substrates, characterized in that, include: The device body has a first mounting cavity and a second mounting cavity distributed along a first direction; The system includes a detection structure and a control structure. The detection structure is located in the first mounting cavity and is used to detect the IC carrier board. The control structure is located in the second mounting cavity and is used to control the detection structure. The first mounting cavity is configured as a first heat dissipation cavity, which is used to dissipate heat from the detection structure. The second mounting cavity is configured as a second heat dissipation cavity, which is used to dissipate heat from the control structure.

2. The IC carrier board testing equipment according to claim 1, characterized in that, The device body is provided with a first air inlet and a first air outlet communicating with the first heat dissipation cavity, and a first airflow fan is provided at the first air inlet and / or the first air outlet. And / or, the device body is provided with a second air inlet and a second air outlet communicating with the second heat dissipation cavity, and a second airflow fan is provided at the second air inlet and / or the second air outlet.

3. The IC carrier board testing equipment according to claim 2, characterized in that, The first direction is along the vertical direction, and the first mounting cavity is located above the second mounting cavity.

4. The IC carrier board testing equipment according to claim 3, characterized in that, The first air inlet and the first air outlet are located on different walls of the first mounting cavity; And / or, the second air inlet and the second air outlet are located on different walls of the second mounting cavity.

5. The IC carrier board testing equipment according to claim 4, characterized in that, The first air inlet is provided on at least one side of the first mounting cavity, and the first air outlet is provided on the top surface of the first mounting cavity. And / or, at least one side of the second mounting cavity is provided with the second air inlet, and at least one side of the second mounting cavity is provided with the second air outlet.

6. The IC carrier board testing equipment according to claim 1, characterized in that, The detection structure includes a loading bin, a detection module, and a unloading bin. The loading bin, the detection module, and the unloading bin are connected by an loading / unloading transport module for transferring IC carrier boards. The detection module is used to detect the IC carrier boards.

7. The IC carrier board testing equipment according to claim 6, characterized in that, It also includes a mounting bracket, on which the loading and unloading handling module is mounted; The first mounting cavity is located above the second mounting cavity, and the mounting bracket penetrates the bottom wall of the first mounting cavity and is supported within the second mounting cavity.

8. The IC carrier board testing equipment according to claim 6, characterized in that, The detection module includes a flipping platform, and the detection module has a first detection position and a second detection position, with a detection camera corresponding to each of the first detection position and the second detection position. The flipping platform is used to flip the IC carrier board after it has been detected by the first detection position and then transfer it to the second detection position.

9. The testing equipment for IC substrates according to any one of claims 1-5, characterized in that, The device body includes an upper housing, a partition plate, and a lower housing. The upper housing is connected above the lower housing, and the partition plate is located between the upper housing and the lower housing. The first mounting cavity is formed between the upper housing and the partition plate, and the second mounting cavity is formed between the lower housing and the partition plate. The partition plate is used to separate the first mounting cavity and the second mounting cavity.

10. The testing equipment for IC substrates according to any one of claims 1-5, characterized in that, It also includes an operating computer, which is installed outside the device body. The control structure includes an electrical control box, which is electrically connected to the detection structure. The operating computer is connected to a computer host, and both the computer host and the electrical control box are located in the second mounting cavity.

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