Circuit board sample polishing device
By designing a circuit board sample grinding device, a screw, vertical rod, spring and clamp structure is used to achieve stable fixation and rotation of the sample, which solves the problem of sample tilting during circuit board grinding, and improves the grinding effect and the convenience of operation.
Patent Information
- Application Number
- CN202520474532.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-03-18
AI Technical Summary
During the polishing process of circuit boards, the sample is not fixed and is prone to tilting, resulting in an uneven polishing surface, making it difficult to operate and producing poor polishing results.
A circuit board sample polishing device was designed. The sample is fixed with screws, and a vertical rod, spring and clamp structure are used to ensure that the sample remains horizontal during polishing. The wing nut and locking nut are used to position and rotate the sample to ensure the horizontality of the polishing surface. The anti-splash ring prevents polishing fluid from splashing.
It improved the level of sample grinding and polishing effect, reduced the difficulty of operation, and ensured the flatness and stability of the ground surface.
Smart Images
Figure CN223834133U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board testing technology, and in particular to a circuit board sample polishing device. Background Technology
[0002] During circuit board manufacturing, to control processes such as the copper plating effect, it is often necessary to cut a portion of the circuit board from a test circuit board and then polish its cross-section. After polishing, the thickness of the copper plating on the cross-section is observed and studied using an optical microscope. To facilitate polishing, the circuit board is often fixed in a columnar resin, with the cross-section of the circuit board facing outwards. The resin is processed into a columnar structure in a mold through heating and pressurization. This method facilitates holding and inspection of the sample during polishing. However, during polishing, the operator can easily tilt the polishing surface. Although the provided resin makes it easy to hold, it still presents a challenge for operation. Utility Model Content
[0003] This invention provides a circuit board sample polishing device to overcome the shortcomings of the prior art, facilitates sample preparation and fixation to ensure the levelness of the polishing surface, improves the polishing effect of the sample, and reduces the difficulty of sample polishing, thus having strong practicality.
[0004] In order to achieve the purpose of this utility model, the following technology is proposed to be adopted:
[0005] A circuit board sample polishing device includes a base with a motor inside. Multiple control switches are located on one side of the base. A polishing disc is rotatably mounted on the upper end of the base and connected to the motor's output shaft. A pair of vertical rods are mounted on the base, with movable plates fitted onto the rods. Springs are fitted onto the vertical rods and located below them. A pair of horizontal rods are positioned between the movable plates, with a pair of T-shaped plates movably mounted on them. Rings are welded to the lower ends of the T-shaped plates, and connecting posts are located below the rings. A slot is formed at the lower end of the connecting post, and a central hole is coaxially formed at the upper end of the connecting post, communicating with the slot. A central post passes through the central hole, and a clamp is located at the lower end of the central post. A mounting plate is welded to the lower end of the clamp, which passes through the slot. The sample is mounted on the mounting plate with screws. A locking nut is threaded onto the central post, with its lower end pressing against the connecting post. This method uses screws to fix the sample column, which is then connected and secured to a connecting column. The lower end of the sample can then be polished by pressing the connecting column. During polishing, the sample column moves downwards under the guidance of a vertical rod, ensuring the levelness of the polished surface. Furthermore, the included spring prevents excessive pressure from the operator during polishing, thus avoiding adverse effects.
[0006] Furthermore, the base is equipped with a splash guard, which covers the grinding disc to prevent the grinding fluid or polishing fluid from splashing outwards.
[0007] Furthermore, the slot and the clamp are in a cross shape to avoid relative rotation between the connecting post and the sample, which would affect the polishing effect.
[0008] Furthermore, the locking nut is a wing nut to facilitate the connection and fixing operation between the sample and the connecting column.
[0009] Furthermore, the ring is symmetrically provided with a pair of arc-shaped grooves, and a connecting screw is inserted into each groove. The lower end of the connecting screw has a protrusion, the inner end of which is welded to the outer circumference of the connecting post. The upper end of the connecting screw is threadedly connected to a locking nut, the lower end of which is pressed against the ring. To improve the polishing effect, the sample is usually rotated 90 degrees at regular intervals to ensure that the next polishing covers the polishing marks of the previous polishing. This operation is usually performed after changing the sandpaper. The above structure facilitates the rotation adjustment of the sample.
[0010] Furthermore, the arc groove has a quarter-circle arc structure to ensure that the samples are perpendicular to each other each time they rotate.
[0011] The advantages of the above technical solution are:
[0012] This invention can improve the levelness of sample preparation and enhance the effect of sample grinding and polishing. Attached Figure Description
[0013] To make the objectives, technical solutions, and advantages of this utility model clearer, the following will provide a further detailed description of this utility model in conjunction with the accompanying drawings.
[0014] Figure 1 A three-dimensional structural diagram of one embodiment is shown.
[0015] Figure 2 A magnified view of point A is shown.
[0016] Figure 3 A three-dimensional structural diagram of the mounting plate and sample is shown.
[0017] Figure 4 The three-dimensional structure of the connecting column is shown. Figure 1 .
[0018] Figure 5 The three-dimensional structure of the connecting column is shown. Figure 2 . Detailed Implementation
[0019] like Figures 1-5As shown, a circuit board sample polishing device includes a base 1, a motor is installed inside the base 1, a plurality of control switches 10 are provided on one side of the base 1, a polishing disc 11 is rotatably provided on the upper end of the base 1, the polishing disc 11 is connected to the output shaft of the motor, and a splash guard 12 is provided on the base 1, which covers the polishing disc 11.
[0020] A pair of vertical rods 2 are mounted on the base 1. A movable plate 21 is fitted onto the vertical rod 2. A spring 20 is fitted onto the vertical rod 2 and is located below the vertical rod 2. A pair of horizontal rods 22 are provided between the movable plates 21. A pair of T-shaped plates 24 are movably mounted on the horizontal rods 22. A ring 240 is welded to the lower end of the T-shaped plate 24. A connecting post 29 is provided below the ring 240. A slot 30 is opened at the lower end of the connecting post 29. A central hole 31 is coaxially opened at the upper end of the connecting post 29, and the central hole 31 communicates with the slot 30.
[0021] A central column 32 is inserted through the central hole 31. A clamping element 33 is provided at the lower end of the central column 32. A mounting plate 34 is welded to the lower end of the clamping element 33. The clamping element 33 is inserted into the clamping groove 30. The clamping groove 30 and the clamping element 33 form a cross-shaped structure. The sample 36 is installed on the mounting plate 34 by screws 35. A locking nut 37 is threadedly connected to the central column 32. The locking nut 37 is a wing nut. The lower end of the locking nut 37 is pressed against the connecting column 29.
[0022] The ring 240 is symmetrically provided with a pair of arc-shaped grooves 25. The arc-shaped grooves 25 are quarter-circle arc-shaped structures. A connecting screw 26 is inserted in the arc-shaped grooves 25. The lower end of the connecting screw 26 is provided with a protrusion 28. The inner end of the protrusion 28 is welded to the outer periphery of the connecting post 29. The upper end of the connecting screw 26 is connected to a locking nut 27 by thread. The lower end of the locking nut 27 is pressed against the ring 240.
[0023] When applying the sandpaper, the operator fixes it on the grinding disc 11.
[0024] Next, the operator installs sample 36 onto mounting plate 34 using screws 35. When fixing, it is necessary to ensure that the length direction of the circuit board is parallel to the length direction of one of the support plates of the card 33, so as to provide a reference for the subsequent rotation of the sample.
[0025] The operator then inserts the clip 33 into the slot 30, connects the locking nut 37 to the central column 32, and fixes the clip 33 to the connecting column 29 by rotating it downwards. After fixing, it is also necessary to ensure that the lower end of the locking nut 27 is pressed against the ring 240.
[0026] The motor is then started, and the grinding disc 11 and the sandpaper on it rotate. During rotation, the operator presses down on the sample column, causing its lower end to act on the sandpaper. After one round of grinding, the sandpaper is replaced, and the locking nut 27 is loosened. The sample is then rotated again, and the locking nut 27 is tightened again, with the sample rotating at a 90-degree angle. The grinding process is repeated by pressing down on the sample until the sample is polished. During the grinding process, the spring 20 ensures that the contact force between the sample and the sandpaper is controlled within a certain range, thus preventing deep scratches from forming.
[0027] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations of this utility model fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.
Claims
1. A circuit board sample polishing device, characterized in that, Includes a base (1), a motor is provided inside the base (1), multiple control switches (10) are provided on one side of the base (1), and a grinding disc (11) is rotatably provided on the upper end of the base (1), and the grinding disc (11) is connected to the output shaft of the motor; A pair of vertical rods (2) are installed on the base (1). A movable plate (21) is fitted on the vertical rod (2). A spring (20) is fitted on the vertical rod (2). The spring (20) is located below the vertical rod (2). A pair of horizontal rods (22) are provided between the movable plates (21). A pair of T-shaped plates (24) are movably provided on the horizontal rods (22). A ring (240) is welded to the lower end of the T-shaped plate (24). A connecting post (29) is provided below the ring (240). A slot (30) is opened at the lower end of the connecting post (29). A central hole (31) is coaxially opened at the upper end of the connecting post (29). The central hole (31) communicates with the slot (30). A central column (32) is inserted through the central hole (31). A clamp (33) is provided at the lower end of the central column (32). A mounting plate (34) is welded to the lower end of the clamp (33). The clamp (33) is inserted into the slot (30). The sample (36) is installed on the mounting plate (34) by screws (35). A locking nut (37) is threaded onto the central column (32). The lower end of the locking nut (37) is pressed against the connecting column (29).
2. The circuit board sample polishing device according to claim 1, characterized in that, A splash guard (12) is provided on the base (1), and the splash guard (12) covers the grinding disc (11).
3. The circuit board sample polishing device according to claim 1, characterized in that, The slot (30) and the card (33) are in a cross shape.
4. The circuit board sample polishing device according to claim 1, characterized in that, The locking nut (37) is a wing nut.
5. The circuit board sample polishing apparatus according to claim 1, characterized in that, The ring (240) is symmetrically provided with a pair of arc-shaped grooves (25), and a connecting screw (26) is provided in the arc-shaped grooves (25). The lower end of the connecting screw (26) is provided with a protrusion (28), and the inner end of the protrusion (28) is welded to the outer periphery of the connecting post (29). The upper end of the connecting screw (26) is connected to a locking nut (27) by a thread, and the lower end of the locking nut (27) is pressed against the ring (240).
6. The circuit board sample polishing apparatus according to claim 5, characterized in that, The arc groove (25) has a quarter-circle arc structure.