Organosilicon heat-conducting gasket forming device

Abstract

The utility model relates to the field of heat-conducting gasket forming, and discloses an organic silicon heat-conducting gasket forming device which comprises a rectangular base, a mold fixing seat is arranged in the center of the top of the base, mounting columns are fixedly arranged on the two sides of the mold fixing seat respectively, and the two mounting columns are located on the left side edge and the right side edge of the top of the base respectively. The two mounting columns are the same in height and are oppositely arranged, a positioning groove is formed in the top of the mold fixing base, a forming mold is arranged at the bottom end of the positioning groove, and a forming groove is formed in the top of the forming mold. Through the arrangement of the rotating cylinder, the organic silicon resin and the inorganic filler can be fully reacted after being uniformly mixed, so that the oil leakage phenomenon of the heat-conducting gasket in subsequent use is reduced, and the heat dissipation efficiency and the performance of a product are improved.

Description

Technical Field

[0001] This utility model belongs to the field of thermal conductive pad molding, and in particular relates to an organosilicon thermal conductive pad molding device. Background Technology

[0002] Silicone thermal conductive materials are high-performance thermal management materials with high thermal conductivity, good flexibility, and adhesion. They are widely used in electronic equipment, LED lighting, automotive electronics, and other fields, especially in high-performance, miniaturized devices. Silicone resin is the main base material for silicone thermal conductive materials, exhibiting excellent heat resistance, insulation, and chemical stability, with its physical properties showing little change with temperature. Silicone thermal pads are primarily made from silicone resin and inorganic fillers. The silicone resin is used as the adhesive base material, and a certain amount of inorganic filler is added, followed by curing.

[0003] Before the existing silicone thermal pads are cured and molded, it is difficult to mix the silicone resin and inorganic filler evenly during the reaction process. This results in the incomplete reaction of the molecular chains in the silicone resin. As the usage time increases, the unreacted molecular chains will seep out from the thermal pad, causing oil seepage. This phenomenon can easily cause product contamination. Utility Model Content

[0004] Therefore, the present invention aims to overcome the shortcomings of the prior art and provide an organosilicon thermal pad forming device.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] An organosilicon thermal pad forming device includes a rectangular base, a mold fixing seat at the top center of the base, mounting columns fixed on both sides of the mold fixing seat, the two mounting columns being located on the left and right edges of the top of the base respectively, the two mounting columns being of the same height and arranged opposite each other, a positioning groove being opened on the top of the mold fixing seat, a forming mold being provided at the bottom end of the positioning groove, and a forming groove being opened on the top of the forming mold.

[0007] Furthermore, a square through hole is provided on the side wall of the front side of the positioning groove. The through hole passes through the mold fixing seat, and the forming mold is inserted into the positioning groove through the through hole. A T-shaped tie rod is welded to the side of the forming mold near the through hole.

[0008] Furthermore, clamps are fixedly installed on the upper part of the two mounting columns, and the ends of the two clamps are arc-shaped. A positioning cylinder is fixedly connected between the two clamps. A conical cylinder is connected to the bottom end of the positioning cylinder. The thickness of the conical cylinder is greater than the thickness of the positioning cylinder. A rotating cylinder is installed inside the positioning cylinder. The outer wall of the rotating cylinder is in smooth contact with the inner wall of the positioning cylinder, and the bottom end is in smooth contact with the top end of the conical cylinder.

[0009] Furthermore, the interior of the rotating cylinder is a cavity, and the bottom and top surfaces of the rotating cylinder are fixed surfaces. A discharge hole is opened at the bottom of the rotating cylinder, and a discharge cylinder is fixedly installed inside the discharge hole. The discharge cylinder is located inside the conical cylinder and extends out from the opening at the bottom end of the conical cylinder. A connecting rod is fixedly installed at the top of the rotating cylinder, and a first transmission wheel is fixedly installed on the outer circumference of the connecting rod. A cover plate is movably installed at the top of the rotating cylinder.

[0010] Furthermore, an assembly frame is provided at the top of the mounting column on the left side, and a rotating shaft hole is opened at the top of the mounting column between the assembly frames. A motor is provided at the top of the assembly frame, and an output shaft is connected to the lower end of the motor. The output shaft is inserted into the rotating shaft hole, and the contact surface between the rotating shaft hole and the output shaft is smooth. A second transmission wheel is fixedly provided on the outer circumference of the output shaft, and a transmission belt is sleeved between the second transmission wheel and the first transmission wheel on the connecting rod.

[0011] Furthermore, an electric telescopic rod is provided on the side of the right mounting column near the mold fixing seat. A circular baffle is provided at the end of the electric telescopic rod. The circular baffle is located below the discharge cylinder and closes the lower opening of the discharge cylinder.

[0012] Furthermore, a placement groove is provided on the right side wall of the lower part of the molding die, and an automatic heating plate is inserted into the placement groove. The right side of the molding groove of the molding die is a movable plate.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. The first drive wheel is driven to rotate by the second drive wheel and the drive belt. The connecting rod fixedly connected to the first drive wheel drives the rotating cylinder inside the positioning cylinder to rotate, so that the molding material of the silicone thermal pad can be mixed evenly, promoting full contact and reaction between the molding materials, and avoiding oil leakage from the molded pad.

[0015] 2. By setting an automatic heating plate at the bottom of the molding die, the curing speed of the silicone thermal pad is improved.

[0016] 3. By setting a fixed mold base, the molding mold is prevented from shifting during the molding process of the silicone thermal pad. At the same time, through holes are provided on the fixed mold base to facilitate the cleaning or replacement of the molding mold. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural schematic diagram of an organosilicon thermal pad molding apparatus according to an embodiment;

[0018] Figure 2 for Figure 1 A three-dimensional schematic diagram of the silicone thermal pad forming device from another perspective;

[0019] Figure 3 This is a cross-sectional view of the inside of the positioning cylinder according to one embodiment;

[0020] Figure 4 This is a schematic diagram of the molding die according to one embodiment.

[0021] In the diagram: 21. Base; 22. Mold fixing seat; 23. Mounting column; 24. Positioning groove; 25. Forming mold; 26. Forming groove; 27. Through hole; 28. T-shaped tie rod; 29. ​​Clamping plate; 30. Positioning cylinder; 31. Conical cylinder; 32. Rotating cylinder; 33. Discharge cylinder; 34. Connecting rod; 35. First transmission wheel; 36. Cover plate; 37. Assembly frame; 38. Rotating shaft hole; 39. Motor; 40. Output shaft; 41. Second transmission wheel; 42. Transmission belt; 43. Electric telescopic rod; 44. Circular baffle; 45. Placement groove; 46. Automatic heating plate; 47. Movable plate; 66. Discharge hole. Detailed Implementation

[0022] To facilitate understanding of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] This utility model provides, for example Figures 1 to 4 The device for molding an organosilicon thermal pad shown includes a rectangular base 21. A mold fixing seat 22 is provided at the center of the top of the base 21. Mounting posts 23 are fixed on both sides of the mold fixing seat 22. The two mounting posts 23 are located on the left and right edges of the top of the base 21, respectively. The two mounting posts 23 are of the same height and are arranged opposite each other. A positioning groove 24 is provided on the top of the mold fixing seat 22. A molding mold 25 is provided at the bottom of the positioning groove 24. The molding mold 25 cannot move left or right in the positioning groove 24. A molding groove 26 is provided on the top of the molding mold 25. The molding groove 26 is used as a curing site for the molding material.

[0024] A square through hole 27 is provided on the side wall of the front side of the positioning groove 24. The through hole 27 passes through the mold fixing seat 22. The forming mold 25 passes through the through hole 27 and is inserted into the positioning groove 24. A T-shaped pull rod 28 is welded to the side of the forming mold 25 near the through hole 27. The forming mold 25 can be taken out by means of the T-shaped pull rod 28.

[0025] Two mounting posts 23 are respectively fixed with clamping plates 29. The ends of the two clamping plates 29 are arc-shaped. A positioning cylinder 30 is fixedly connected between the two clamping plates 29. A conical cylinder 31 is connected to the bottom of the positioning cylinder 30. The thickness of the conical cylinder 31 is greater than the thickness of the positioning cylinder 30. A rotating cylinder 32 is provided inside the positioning cylinder 30. The outer wall of the rotating cylinder 32 is in smooth contact with the inner wall of the positioning cylinder 30, and the bottom end is in smooth contact with the top end of the conical cylinder 31. When the rotating cylinder 32 rotates, it will not be subjected to friction between the inner wall of the positioning cylinder 30 and the top end of the conical cylinder 31.

[0026] The rotating cylinder 32 has a hollow interior. Both the bottom and top surfaces of the rotating cylinder 32 are fixed surfaces. A discharge hole 66 is provided at the bottom of the rotating cylinder 32, and a discharge cylinder 33 is fixedly installed inside the discharge hole 66. The molding material inside the rotating cylinder 32 can enter the discharge cylinder 33 through the discharge hole 66. The discharge cylinder 33 is located inside the conical cylinder 31 and extends from the opening at the bottom end of the conical cylinder 31. The lower opening of the discharge cylinder 33 is opposite to the center of the molding groove 26. A connecting rod 34 is fixedly installed at the top of the rotating cylinder 32, and a first transmission wheel 35 is fixedly installed on the outer circumference of the connecting rod 34. A cover plate 36 is movably installed at the top of the rotating cylinder 32. By opening the cover plate 36, molding material can be added into the rotating cylinder 32. When no molding material needs to be added, the cover plate 36 can be closed to prevent external impurities from entering.

[0027] A mounting bracket 37 is provided on the top of the mounting column 23 on the left side. A pivot hole 38 is provided on the top of the mounting column 23 between the mounting brackets 37. A motor 39 is provided on the top of the mounting bracket 37. An output shaft 40 is connected to the lower end of the motor 39. The output shaft 40 is inserted into the pivot hole 38. The contact surface between the pivot hole 38 and the output shaft 40 is smooth, and the output shaft 40 can rotate without friction in the pivot hole 38. A second transmission wheel 41 is fixed on the outer circumference of the output shaft 40. A transmission belt 42 is sleeved between the second transmission wheel 41 and the first transmission wheel 35 on the connecting rod 34. When the output shaft 40 of the motor 39 rotates, it drives the second transmission wheel 41 to rotate. The first transmission wheel 35, which is connected to the second transmission wheel 41 through the transmission belt 42, will also rotate.

[0028] An electric telescopic rod 43 is provided on the side of the right mounting column 23 near the mold fixing seat 22. A circular baffle 44 is provided at the end of the electric telescopic rod 43. The circular baffle 44 is located below the discharge cylinder 33 and closes the lower opening of the discharge cylinder 33. When the molding material needs to flow out, the electric telescopic rod 43 is activated to retract it, and the circular baffle 44 moves away from the lower opening of the discharge cylinder 33.

[0029] A placement groove 45 is provided on the right side wall of the lower part of the molding mold 25. An automatic heating plate 46 is inserted into the placement groove 45. The automatic heating plate 46 can heat the molding mold 25, so that the molding material flowing into the molding mold 25 is heated and cured faster. To the right of the molding groove 26 of the molding mold 25 is a movable plate 47, which can be opened and closed manually.

[0030] The assembly process is as follows: First, fix the base 21 on the plane. Then, install the mold fixing seat 22 at the center of the top of the base 21. Install the mounting posts 23 on the left and right edges of the top of the base 21. Install the clamping plates 29 on the upper part of the two mounting posts 23 near the mold fixing seat 22. Then, set the connecting rod 34 on the top of the rotating cylinder 32 and install the cover plate 36. Set the discharge cylinder 33 at the discharge hole 66 at the bottom of the rotating cylinder 32. Fix the positioning cylinder 30 to the end of the two clamping plates 29. Install the conical cylinder 31 at the bottom of the positioning cylinder 30. Place the rotating cylinder 32 with the connected parts inside the positioning cylinder 30. The mounting frame 37 is installed, and the motor 39 is installed on the top of the mounting frame 37. At the same time, the output shaft 40 of the motor 39 is inserted into the shaft hole 38 of the mounting column 23. The second transmission wheel 41 is installed on the output shaft 40, and the first transmission wheel 35 is installed on the connecting rod 34. The transmission belt 42 is installed between the first transmission wheel 35 and the second transmission wheel 41. The electric telescopic rod 43 is installed on the right side of the mounting column 23 near the discharge cylinder 33. The circular baffle 44 is installed at the end of the electric telescopic rod 43. Finally, the automatic heating plate 46 is installed in the placement groove 45 of the forming mold 25. The forming mold 25 is inserted into the positioning groove 24 through the through hole 27 of the mold fixing seat 22.

[0031] The specific usage process is as follows: When molding the silicone thermal pad, open the cover plate 36 on the top of the rotating cylinder 32, add the molding material into the rotating cylinder 32, and then close the cover plate 36. Then start the motor 39. The output shaft 40 of the motor 39 drives the second transmission wheel 41 to rotate. The second transmission wheel 41 drives the first transmission wheel 35 to rotate through the transmission belt 42. The connecting rod 34, which is fixedly connected to the first transmission wheel 35, drives the rotating cylinder 32 to rotate, so that the molding material inside the rotating cylinder 32 is evenly mixed. Start the electric telescopic rod 43. The contraction moves the circular baffle 44 away from the lower opening of the discharge cylinder 33, allowing the uniformly mixed molding material to flow out from the discharge cylinder 33 connected to the rotating cylinder 32 and enter the molding groove 26 of the molding mold 25. The electric telescopic rod 43 is closed, and the circular baffle 44 returns to its original position to close the lower opening of the discharge cylinder 33, preventing the molding material from flowing out. The automatic heating plate 46 is activated, and the molding mold 25 is heated. The uniformly mixed molding material in the molding groove 26 is heated and solidified. After molding is completed, the movable plate 47 of the molding mold 25 can be opened to remove it.

[0032] The technical effects and advantages of this invention are as follows: When the motor 39 is in operation, the connecting rod 34 can drive the rotating cylinder 32 to rotate. During the rotation of the rotating cylinder 32, the molding material inside can make more full contact and uniformly mix, resulting in a better molding effect. The circular baffle 44 at the end of the electric telescopic rod 43 prevents the molding material inside the rotating cylinder 32 from flowing out if it is not uniformly mixed, thus avoiding waste of molding material or poor subsequent curing effect. After the molding material is uniformly mixed, the electric telescopic rod 43 is activated to drive the circular baffle 44 away from the discharge cylinder 33, allowing the molding material to flow out, which facilitates the subsequent curing process. After the molding material enters the molding groove 26 of the molding mold 25, the automatic heating plate 46 is activated to heat the molding mold 25, promoting the curing of the molding material in the molding groove 26 and increasing the curing speed. After molding is completed, the molding mold 25 is removed by the T-shaped pull rod 28, which facilitates the picking up of the molding pad and cleaning of the molding mold 25.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicone thermal pad forming device, characterized in that: The base includes a rectangular base (21), a mold fixing seat (22) is provided at the center of the top of the base (21), and mounting posts (23) are fixed on both sides of the mold fixing seat (22). The two mounting posts (23) are located on the left and right edges of the top of the base (21), respectively. The two mounting posts (23) are of the same height and are arranged opposite each other. A positioning groove (24) is provided on the top of the mold fixing seat (22), and a forming mold (25) is provided at the bottom of the positioning groove (24). A forming groove (26) is provided on the top of the forming mold (25).

2. The organosilicon thermal pad forming apparatus according to claim 1, characterized in that: A square through hole (27) is provided on the side wall of the front side of the positioning groove (24). The through hole (27) passes through the mold fixing seat (22). The forming mold (25) passes through the through hole (27) and is inserted into the positioning groove (24). A T-shaped tie rod (28) is welded on the side of the forming mold (25) near the through hole (27).

3. The organosilicon thermal pad forming apparatus according to claim 1, characterized in that: Two mounting posts (23) are respectively fixed with clamps (29) on their upper parts. The ends of the two clamps (29) are arc-shaped. A positioning cylinder (30) is fixedly connected between the two clamps (29). A conical cylinder (31) is connected to the bottom of the positioning cylinder (30). The thickness of the conical cylinder (31) is greater than the thickness of the positioning cylinder (30). A rotating cylinder (32) is provided inside the positioning cylinder (30). The outer wall of the rotating cylinder (32) is in smooth contact with the inner wall of the positioning cylinder (30), and the bottom end is in smooth contact with the top end of the conical cylinder (31).

4. The organosilicon thermal pad forming apparatus according to claim 3, characterized in that: The rotating cylinder (32) has a cavity inside. The bottom and top surfaces of the rotating cylinder (32) are fixed surfaces. The bottom of the rotating cylinder (32) has a discharge hole (66). A discharge cylinder (33) is fixedly installed inside the discharge hole (66). The discharge cylinder (33) is located inside the conical cylinder (31) and extends out from the opening at the bottom of the conical cylinder (31). A connecting rod (34) is fixedly installed at the top of the rotating cylinder (32). A first transmission wheel (35) is fixedly installed on the outer circumference of the connecting rod (34). A cover plate (36) is movably installed at the top of the rotating cylinder (32).

5. The organosilicon thermal pad forming apparatus according to claim 4, characterized in that: A mounting bracket (37) is provided on the top of the mounting column (23) on the left side. A pivot hole (38) is provided on the top of the mounting column (23) between the mounting brackets (37). A motor (39) is provided on the top of the mounting bracket (37). An output shaft (40) is connected to the lower end of the motor (39). The output shaft (40) is inserted into the pivot hole (38). The contact surface between the pivot hole (38) and the output shaft (40) is smooth. A second transmission wheel (41) is fixed on the outer circumference of the output shaft (40). A transmission belt (42) is sleeved between the second transmission wheel (41) and the first transmission wheel (35) on the connecting rod (34).

6. The organosilicon thermal pad forming apparatus according to claim 4, characterized in that: An electric telescopic rod (43) is provided on the side of the right mounting column (23) near the mold fixing seat (22). A circular baffle (44) is provided at the end of the electric telescopic rod (43). The circular baffle (44) is located below the discharge cylinder (33) and closes the lower opening of the discharge cylinder (33).

7. The organosilicon thermal pad forming apparatus according to claim 1, characterized in that: A placement groove (45) is provided on the right side wall of the lower part of the molding mold (25), and an automatic heating plate (46) is inserted in the placement groove (45). The right side of the molding groove (26) of the molding mold (25) is a movable plate (47).

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