Forming die of circuit board base with buckle structure

Abstract

The utility model discloses a circuit board base forming die with a buckle structure, which comprises an upper die, a lower die, an upper sliding mechanism and a lower sliding mechanism, the upper die is provided with a first sliding chute along the inclined direction, the lower die is provided with a second forming cavity, the upper sliding mechanism is provided with an upper ejector rod, the upper ejector rod is inserted into the first sliding chute in a sliding manner, the upper ejector rod is provided with a first forming end, and the lower sliding mechanism is provided with a second forming cavity. The lower sliding mechanism is provided with a first lower ejector rod and a second lower ejector rod, the first lower ejector rod is connected with the lower die, the second lower ejector rod is inserted into the lower die in a sliding mode, and the first lower ejector rod is connected with the first lower ejector rod. And the second lower ejector rod is connected with the first lower ejector rod through a mold locker. The upper ejector rod sliding in the inclined direction is arranged, the buckle does not interfere with the movement of the upper ejector rod in the demolding process, so that the buckle structure can be formed and demolded, meanwhile, the lower sliding mechanism forms a secondary ejection mechanism, and the circuit board base and the lower mold can be demolded.

Description

Technical Field

[0001] This utility model relates to the field of mold technology, and in particular to a molding mold for a circuit board base with a snap-fit ​​structure. Background Technology

[0002] As an indispensable component of electronic devices, the continuous optimization of circuit board mounting base design and manufacturing technology is crucial for improving the overall performance and reliability of the device. Traditional circuit board mounting bases mostly adopt simple flat plate or frame structures, which can meet basic support and fixation requirements to a certain extent, but their limitations and shortcomings are gradually becoming apparent when facing complex and ever-changing electronic device application scenarios.

[0003] like Figure 1 , 2 The newly designed circuit board base mechanism shown adopts an innovative U-shaped opening structure. This design not only reduces the overall weight of the base, but also improves its structural strength and resistance to deformation. On the other side of the plate, the base is equipped with four columns, and the ends of the columns are equipped with a snap-fit ​​structure for connection, which improves the convenience of base connection.

[0004] However, traditional mold structures are often unable to adapt to such complex and varied shapes and sizes. Due to the existence of snap-fit ​​structures, direct mold opening will cause the snap-fit ​​structure to be damaged by direct tensile force. Utility Model Content

[0005] This application provides a snap-fit ​​structure molding die to realize the molding and mold opening functions of a circuit board mounting base with snap-fit.

[0006] This application provides a molding die for a circuit board base with a snap-fit ​​structure, including:

[0007] The upper mold has a first groove cut along an oblique direction;

[0008] The lower mold has a second forming cavity;

[0009] The upper sliding mechanism has an upper push rod that is slidably inserted into the first slide groove. The upper push rod has a first forming end that extends into the first slide groove and forms a first forming cavity in the first slide groove. The first forming cavity is used for the snap-fit ​​forming of the circuit board base. When the snap-fit ​​is demolded, the first slide groove guides the first forming end to move toward the side away from the snap-fit.

[0010] The sliding mechanism has a first lower ejector rod and a second lower ejector rod. The first lower ejector rod is connected to the lower mold, and the second lower ejector rod is slidably inserted into the lower mold. The second lower ejector rod and the first lower ejector rod are connected by a mold clamping device. The second lower ejector rod is used to eject the circuit board base from the lower mold.

[0011] The beneficial effects of the above embodiments are as follows: by setting an upper ejector rod that can move laterally away from the buckle during the mold opening process, the separation action of the upper ejector rod from the buckle does not interfere with the movement of the buckle, thereby enabling the buckle structure to be formed and demolded. At the same time, the lower sliding mechanism forms a secondary ejection mechanism, enabling the circuit board base to be demolded from the lower mold.

[0012] Based on the above embodiments, the embodiments of this application can be further improved as follows:

[0013] In one embodiment of this application: the upper sliding mechanism further includes: an upper sliding plate, a first upper guide post, and an upper connecting rod. The first upper guide post is disposed on the upper mold, the upper sliding plate is slidably disposed on the first upper guide post, and the upper connecting rod is connected to the upper sliding plate. The upper connecting rod has a second sliding groove and a second guide block, and the upper push rod has a third sliding groove and a third guide block. The second guide block is slidably inserted into the third sliding groove, and the third guide block is slidably inserted into the second sliding groove. The beneficial effect of this step is that the upper connecting rod and the upper push rod form a mutually sliding hook relationship, achieving transmission while avoiding interference between their movements.

[0014] In one embodiment of this application: the upper sliding mechanism further includes: an upper end plate and an upper support plate, the upper support plate being connected between the upper end plate and the upper mold, and the upper sliding plate being disposed between the upper end plate and the upper mold. The beneficial effect of this step is that a movement space for the upper sliding plate is formed between the upper end plate and the upper mold.

[0015] In one embodiment of this application: the sliding mechanism includes: a lower end plate, a lower support plate, a first lower slide plate, a second lower slide plate, and a first lower guide post. The lower support plate is connected between the lower end plate and the lower mold. The first lower guide post is disposed on the lower mold. The first and second lower slide plates are slidably disposed on the first lower guide post. The second lower slide plate is disposed between the first lower slide plate and the lower mold. The first and second lower slide plates are connected by the mold clamping device. The lower support plate is provided with a positioning surface corresponding to the first lower slide plate. The beneficial effect of this step is that the above structure realizes a secondary ejection structure.

[0016] In one embodiment of this application, it further includes an elastic element disposed between the second lower slide plate and the lower die, which applies a thrust to the second lower slide plate. The beneficial effect of this step is that the elastic element enables the first and second lower slide plates to reset after ejection. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0018] Figure 1 This is a schematic diagram of the first structure of the circuit board base;

[0019] Figure 2 This is a schematic diagram of the second structure of the circuit board base;

[0020] Figure 3 This is a three-dimensional structural diagram of the molding die;

[0021] Figure 4 This is a two-dimensional structural diagram of the molding die;

[0022] Figure 5 for Figure 4 A sectional view along the middle AA;

[0023] Figure 6 for Figure 4 A sectional view along the middle edge BB;

[0024] Figure 7 This is a schematic diagram of the connection between the upper connecting rod and the upper push rod;

[0025] Figure 8 for Figure 4 A sectional view along the center CC;

[0026] Figure 9 for Figure 4 A sectional view along the middle DD;

[0027] Figure 10 for Figure 4 A sectional view along the middle of EE;

[0028] Figure 11 for Figure 4 Sectional view along the middle FF.

[0029] Among them, 1 is the upper mold, 101 is the first sliding groove, 102 is the upper mold sleeve, and 103 is the upper mold core;

[0030] 2. Lower mold, 201. Lower mold sleeve, 202. Lower outer mold core, 203. Lower inner mold core, 204. Lower template, 205. Positioning plate;

[0031] 3 Upper sliding mechanism, 301 Upper push rod, 302 Upper slide plate, 303 First upper guide post, 304 Upper connecting rod, 305 Second slide groove, 306 Second guide block, 307 Third slide groove, 308 Third guide block, 309 Upper end plate, 310 Upper support plate, 311 Upper support post, 312 Second upper guide post;

[0032] 4. Lower sliding mechanism, 401 first lower push rod, 402 second lower push rod, 403 lower end plate, 404 lower support plate, 405 first lower sliding plate, 406 second lower sliding plate, 407 first lower guide post, 408 lower support post, 409 block, 410 elastic element, 411 positioning rod.

[0033] 5. Flow channel tube;

[0034] 6. Mold guide pillars. Detailed Implementation

[0035] In this application, unless otherwise expressly specified and limited, the terminology used should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of different terms in this utility model according to the specific circumstances, and the scope of the specific meaning should be limited to achieving the function of this application.

[0036] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0037] like Figure 3 , 4As shown in Figures 5 and 8, a molding die for a circuit board base with a snap-fit ​​structure includes: an upper die 1, a lower die 2, an upper sliding mechanism 3, and a lower sliding mechanism 4. The upper die 1 has a first groove 101 obliquely opened, the lower die 2 has a second molding cavity, and the upper sliding mechanism 3 has an upper ejector rod 301. The upper ejector rod 301 is slidably inserted into the first groove 101 and has a first molding end that extends into the first groove 101 and forms a first molding cavity in the first groove 101. The first molding cavity is used for snap-fit ​​molding of the circuit board base. When the snap-fit ​​is demolded, the first slide groove 101 guides the first molding end to move toward the side away from the snap-fit. The lower sliding mechanism 4 has a first lower ejector rod 401 and a second lower ejector rod 402. The first lower ejector rod 401 is connected to the lower mold 2, and the second lower ejector rod 402 is slidably inserted into the lower mold 2. The second lower ejector rod 402 is connected to the first lower ejector rod 401 through a mold clamping device. The second lower ejector rod 402 is used to eject the circuit board base from the lower mold 2.

[0038] In some embodiments of this application, such as Figure 5 As shown, the upper mold 1 has an upper mold sleeve 102 and an upper mold core 103. The upper mold core 103 is connected to the upper mold sleeve 102. The first sliding groove 101 is opened in the upper mold core 103. The upper mold sleeve 102 is provided with an upper cooling channel around the upper mold core 103. The upper cooling channel is used to pass in circulating coolant.

[0039] In some embodiments of this application, such as Figure 5 , 8 As shown, the lower mold 2 has a lower mold sleeve 201, a lower outer mold core 202, a lower inner mold core 203, a lower template 204, and a positioning plate 205. The lower outer mold core 202 is connected to the lower mold sleeve 201. The lower mold sleeve 201 has a lower cooling channel around the lower outer mold core 202, which is used to introduce circulating coolant. The lower outer mold core 202 has a second groove, and the lower inner mold core 203 is inserted into the second groove. The surface of the lower outer mold core 202 that contacts the lower inner mold core 203 has a draft angle. The lower inner mold core 203 has an insertion hole, and the lower template 204 is inserted into the insertion hole. The positioning plate 205 is connected to the lower inner mold core 203 and closes the lower template 204 in the insertion hole. The other end of the lower template 204 forms a third groove with the insertion hole. The third groove matches the protrusion structure in the U-shaped opening of the circuit board base.

[0040] In some embodiments of this application, such as Figure 5 , 6As shown in Figures 7 and 8, the upper sliding mechanism 3 further includes: an upper sliding plate 302, a first upper guide post 303, and an upper connecting rod 304. The first upper guide post 303 is disposed on the upper mold 1, the upper sliding plate 302 is slidably disposed on the first upper guide post 303, and the upper connecting rod 304 is connected to the upper sliding plate 302. The upper connecting rod 304 has a second sliding groove 305 and a second guide block 306. The upper ejector rod 301 has a third sliding groove 307 and a third guide block 308. The second guide block 306 is slidably inserted into the third sliding groove 307, and the three guide blocks are slidably inserted into the second sliding groove 305. The upper connecting rod 304 and the upper ejector rod 301 form a mutual sliding hook relationship. In the mold opening direction of the upper mold 1 and the lower mold 2, the upper connecting rod 304 can drive the upper ejector rod 301 to reciprocate. In the direction perpendicular to the mold opening direction, the upper ejector rod 301 can also perform lateral movement, thereby achieving transmission while avoiding interference between the two movements, thus realizing the demolding operation of the snap-fit.

[0041] In some embodiments of this application, such as Figure 3 As shown, the upper sliding mechanism 3 also includes: an upper end plate 309 and an upper support plate 310. The upper support plate 310 is connected between the upper end plate 309 and the upper mold 1. The upper slide plate 302 is disposed between the upper end plate 309 and the upper mold 1, and the upper slide plate 302 forms a movement space between the upper end plate 309 and the upper mold 1.

[0042] In some embodiments of this application, such as Figure 8 As shown, the upper end plate 309 is connected to the fixed base of the injection molding machine. One end of the first upper guide post 303 is set on the upper end plate 309 and the other end is inserted into the upper mold 1. There are two upper support plates 310, which are symmetrically arranged on both sides of the upper mold 1. The upper end plate 309 and the upper mold 1 are also equipped with upper support posts 311 connected to the upper end plate 309. A flow channel 5 is provided between the upper support posts 311. The flow channel 5 has a flow channel that communicates with the first molding cavity and the second molding cavity.

[0043] In some embodiments of this application, such as Figure 9 As shown, the upper slide plate 302 includes an upper plate A and an upper plate B connected to each other. The upper plate A and the upper plate B are connected by a second upper guide post 312 that is slidably inserted into the upper mold 1 and the lower mold 2. The second upper guide post 312 has a first sliding section and a second sliding section. The diameter of the first sliding section is larger than the diameter of the second sliding section. The first sliding section is slidably inserted into the upper mold 1, and the second sliding section is slidably inserted into the lower mold 2.

[0044] In some embodiments of this application, such as Figure 5As shown, the lower sliding mechanism 4 includes: a lower end plate 403, a lower support plate 404, a first lower slide plate 405, a second lower slide plate 406, and a first lower guide post 407. The lower support plate 404 is connected between the lower end plate 403 and the lower mold 2. The first lower guide post 407 is disposed on the lower mold 2. The first lower slide plate 405 and the second lower slide plate 406 are slidably disposed on the first lower guide post 407. The second lower slide plate 406 is disposed between the first lower slide plate 405 and the lower mold 2. The first lower slide plate 405 and the second lower slide plate 406 are connected by a mold clamping device. The lower support plate 404 is configured with a positioning surface corresponding to the first lower slide plate 405. The above structure realizes the secondary ejection structure. The mold clamping device is also called a mold locking buckle or a mold opening and closing device, which is a commonly used existing product in this field.

[0045] In some embodiments of this application, such as Figure 11 As shown, the molding die also includes a mold guide post 6, one end of which is disposed on the upper end plate 309, and the other end is slidably inserted into the upper mold 1 and the lower mold 2.

[0046] In some embodiments of this application, such as Figure 3 , 5 As shown, there are two lower support plates 404 that are symmetrically connected to both sides of the lower end plate 403. The lower end plate 403 is also connected to the lower mold 2 by bolts. The lower end plate 403 is connected by bolts to the lower support columns 408 that are set between the lower support plates 404. There are multiple lower support columns 408, and the ends of the lower support columns 408 are in contact with the surface of the lower mold 2.

[0047] In some embodiments of this application, such as Figure 5 , 8 As shown, the second lower slide plate 406 includes a second lower plate A and a second lower plate B connected to each other by bolts. One end of the first lower push rod 401 is connected to the first lower slide plate 405, and the other end passes through the positioning plate 205 and is connected to the lower inner mold core 203. One end of the second lower push rod 402 is connected between the second lower plate A and the second lower plate B, and the surface of the other end is flush with the upper surface of the lower inner mold core 203.

[0048] In some embodiments of this application, such as Figure 8 As shown, the second lower plate A is connected to a block 409. The lower end plate 403 has a through hole corresponding to the block 409. Power is applied to the block 409 by an external device, which drives the second lower slide plate 406 to move the first lower slide plate 405. The first lower slide plate 405 drives the upper ejector rod to push out the lower inner mold core 203. Then the first lower slide plate 405 is limited by the positioning surface, the mold clamping device is unlocked, the second slide plate moves independently, and the second lower ejector rod 402 generates a thrust on the circuit board base, separating the base from the lower inner mold core 203.

[0049] In some embodiments of this application, such as Figure 10As shown, the lower sliding mechanism 4 also includes an elastic element 410. The elastic element 410 is disposed between the second lower slide plate 406 and the lower mold 2 and applies a pushing force to the second lower slide plate 406. The first lower slide plate 405 and the second lower slide plate 406 are reset after ejection through the elastic element 410.

[0050] In some embodiments of this application, such as Figure 10 As shown, the lower sliding mechanism 4 also includes: a positioning rod 411, one end of which is connected to the second slide plate, and the other end is inserted into the through hole of the lower outer mold core 202. The elastic element 410 is a compression spring, which is sleeved on the positioning rod 411, and one end of the compression spring is inserted into the corresponding hole of the lower outer mold core 202.

[0051] When this type of molding die is working, the injection molding machine injects molding material into the runner tube 5, and the circuit board base is formed by the first molding cavity and the second molding cavity. Then, the mold opening operation is performed. During the separation of the upper mold 1 and the lower mold 2, the upper slide plate 302 drives the upper ejector rod 301 to move. The upper ejector rod 301 slides to the side at the same time, so that the snap-fit ​​structure is disengaged from the first molding end, thereby realizing the demolding operation of the snap-fit ​​structure. Then, the lower mold 2 part performs two ejection operations. The first time, the upper ejector rod pushes the lower inner mold core 203 to separate from the lower outer mold core 202. The second time, the second lower ejector rod 402 pushes the base out of the lower inner mold core 203, thereby realizing the overall demolding operation of the product.

[0052] The above are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are aware of all existing technologies in that field, and have the ability to apply conventional experimental methods prior to that date. Those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in combination with their own capabilities. Some typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent.

Claims

1. A molding die for a circuit board base with a snap-fit ​​structure, characterized in that, include: The upper mold has a first groove cut along an oblique angle; The lower mold has a second forming cavity; The upper sliding mechanism has an upper push rod that is slidably inserted into the first slide groove. The upper push rod has a first forming end that extends into the first slide groove and forms a first forming cavity in the first slide groove. The first forming cavity is used for the snap-fit ​​forming of the circuit board base. When the snap-fit ​​is demolded, the first slide groove guides the first forming end to move toward the side away from the snap-fit. The sliding mechanism has a first lower ejector rod and a second lower ejector rod. The first lower ejector rod is connected to the lower mold, and the second lower ejector rod is slidably inserted into the lower mold. The second lower ejector rod and the first lower ejector rod are connected by a mold clamping device. The second lower ejector rod is used to eject the circuit board base from the lower mold.

2. The molding die according to claim 1, characterized in that, The upper sliding mechanism further includes: an upper sliding plate, a first upper guide post, and an upper connecting rod. The first upper guide post is disposed on the upper mold, the upper sliding plate is slidably disposed on the first upper guide post, and the upper connecting rod is connected to the upper sliding plate. The upper connecting rod has a second sliding groove and a second guide block, and the upper push rod has a third sliding groove and a third guide block. The second guide block is slidably inserted into the third sliding groove, and the third guide block is slidably inserted into the second sliding groove.

3. The molding die according to claim 2, characterized in that, The upper sliding mechanism further includes: an upper end plate and an upper support plate, the upper support plate being connected between the upper end plate and the upper mold, and the upper sliding plate being disposed between the upper end plate and the upper mold.

4. The molding die according to claim 1, characterized in that, The sliding mechanism includes: a lower end plate, a lower support plate, a first lower slide plate, a second lower slide plate, and a first lower guide post. The lower support plate is connected between the lower end plate and the lower mold. The first lower guide post is disposed on the lower mold. The first and second lower slide plates are slidably disposed on the first lower guide post. The second lower slide plate is disposed between the first lower slide plate and the lower mold. The first and second lower slide plates are connected by the mold clamping device. The lower support plate is provided with a positioning surface corresponding to the first lower slide plate.

5. The molding die according to claim 4, characterized in that, Also includes: An elastic element is disposed between the second lower slide plate and the lower mold and applies a thrust to the second lower slide plate.

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