Brake controller, brake control system and vehicle
By separating high-current and low-current operating devices on the circuit board and using bus filtering and isolation channels, the problem of electromagnetic interference in the brake-by-wire system is solved, and the stability and reliability of the brake controller are improved.
Patent Information
- Application Number
- CN202520158224.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-23
AI Technical Summary
Electromagnetic interference in brake-by-wire systems leads to a decrease in equipment stability and reliability.
High-current and low-current operating devices are separated on the circuit board. The signal input interface, communication module, protection module and control module are located in the input protection area, and the three-phase connector interface and drive module are located in the three-phase drive area. Electromagnetic interference is reduced through the bus filter module and isolation channel.
This improves the stability and reliability of the braking controller, reduces electromagnetic interference between high-current and low-current operating devices, and enhances the overall performance of the system.
Smart Images
Figure CN223835569U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of vehicle technology, and in particular relates to a brake controller, a brake control system, and a vehicle. Background Technology
[0002] The automotive safety braking system, also known as the brake-by-wire system, is the underlying electronic control system of a vehicle. It is not only a crucial component of automotive safety braking but also the core of the vehicle's underlying electronic control system. With continuous innovation and improvement, the advantages of brake-by-wire systems in terms of safety, economy, and environmental friendliness will become even more significant. In the future, brake-by-wire systems are expected to become the mainstream technology for automotive braking systems, ushering in a more intelligent and efficient era for the automotive industry.
[0003] Brake-by-wire systems achieve system integration by integrating control and drive modules. This not only simplifies the braking system structure and improves overall system stability, but also provides more intelligent braking control for automobiles. Brake-by-wire systems use electronic control units to precisely control the braking system. Traditional mechanical braking methods are gradually being replaced by electronic signals. Through brake-by-wire systems, drivers can more accurately adjust braking force, achieving a more relaxed and precise driving experience. Electromechanical braking systems are a pure electric braking solution that completely abandons traditional hydraulic systems. It uses an electric motor to directly drive the brake calipers for braking operation. This system does not require hydraulic components; instead, it relies on electronic equipment to precisely control braking pressure and force, thereby achieving a faster and more precise braking response.
[0004] Driven by technology, brake-by-wire systems have achieved remarkable success. With the development of brake-by-wire systems, the functions of electromechanical braking systems have become more and more comprehensive, but this has also brought some defects. The most significant problem is electromagnetic interference. The complex connection and communication requirements between different modules and interfaces have led to complex wiring on the circuit board. Due to mutual interference between the lines, electromagnetic interference problems may occur on the circuit board, affecting the stability and reliability of the equipment. Utility Model Content
[0005] This application provides a brake controller, a brake control system, and a vehicle, which can solve the problem of electromagnetic interference generated by the brake controller affecting the stability and reliability of the equipment.
[0006] In a first aspect, embodiments of this application provide a brake controller, including a circuit board, a signal input interface, a three-phase connector interface, a power supply module, a drive module, a communication module, a protection module, a bus filter module, and a control module; the circuit board has a first edge and a second edge that are far apart from each other, and a three-phase drive area near the first edge, an input protection area near the second edge, and a power supply area are disposed on a first mounting surface of the circuit board, the power supply area being disposed between the three-phase drive area and the input protection area, the signal input interface, the communication module, the protection module, and the control module being disposed within the input protection area, the three-phase connector interface, the bus filter module, and the drive module being disposed within the three-phase drive area, and the power supply module being disposed within the power supply area.
[0007] In one possible implementation of the first aspect, the signal input interface is located near the second edge, and the three-phase connector interface is located near the first edge.
[0008] In one possible implementation of the first aspect, the protection module includes a communication protection circuit and a power protection circuit, both of which are electrically connected to the signal input interface. The communication protection circuit is electrically connected to the communication module, and the power protection circuit is electrically connected to the power module.
[0009] In one possible implementation of the first aspect, the electrolytic capacitor and inductor in the power protection circuit are disposed on a second mounting surface on the circuit board away from the first mounting surface.
[0010] In one possible implementation of the first aspect, the bus filter module includes a bus filter circuit disposed within the three-phase drive zone, and the bus filter circuit is electrically connected to the drive module.
[0011] In one possible implementation of the first aspect, the electrolytic capacitors and inductors in the bus filter circuit are disposed on a second mounting surface on the circuit board, away from the first mounting surface.
[0012] In one possible implementation of the first aspect, the brake controller further includes a parking module and a brake drive circuit, the parking module and the brake drive circuit being disposed within the three-phase drive zone, and the parking module being electrically connected to the brake drive circuit.
[0013] In one possible implementation of the first aspect, an isolation channel is provided between the three-phase drive area and the input protection area.
[0014] Secondly, embodiments of this application provide a braking control system, including at least two braking controllers as described in any one of the first aspects, wherein the circuit boards of all the braking controllers are integrated on a single circuit board.
[0015] Thirdly, embodiments of this application provide a vehicle including the braking control system described in the second aspect.
[0016] The beneficial effects of the embodiments in this application compared with the prior art are:
[0017] The braking controller provided in this application includes a circuit board, a signal input interface, a three-phase connector interface, a power supply module, a drive module, a communication module, a protection module, a bus filter module, and a control module. The circuit board has a first edge and a second edge that are far apart. A three-phase drive area near the first edge, an input protection area near the second edge, and a power supply area are disposed on the first mounting surface of the circuit board. The power supply area is located between the three-phase drive area and the input protection area. The signal input interface, communication module, protection module, and control module are all located within the input protection area. The three-phase connector interface, bus filter module, and drive module are all located within the three-phase drive area. The power supply module is located within the power supply area.
[0018] The signal input interface, communication module, protection module, and control module all operate at relatively low currents and are located within the input protection zone. The three-phase connector interface and drive module operate at higher currents and are located within the three-phase drive zone. The three-phase drive zone is positioned near the first edge of the circuit board, while the input protection zone is positioned near the second edge. These two edges are far apart, thus separating high-current and low-current operating devices on the circuit board. This minimizes electromagnetic interference between these devices, thereby improving the stability and reliability of the braking controller. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of a brake controller provided in an embodiment of this application;
[0021] Figure 2 This is a schematic diagram of a brake controller provided in another embodiment of this application;
[0022] Figure 3 This is a schematic diagram of a braking control system provided in an embodiment of this application.
[0023] In the diagram: 10. Circuit board; 11. First edge; 12. Second edge; 13. Three-phase drive area; 131. Three-phase connector interface; 132. Drive module; 133. Bus filter module; 14. Input protection area; 141. Signal input interface; 142. Communication module; 143. Protection module; 144. Control module; 15. Power supply area; 151. Power supply module. Detailed Implementation
[0024] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.
[0025] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.
[0026] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.
[0027] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if [the described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [the described condition or event] is detected," or "in response to detection of [the described condition or event]."
[0028] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0029] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.
[0030] Figure 1 A schematic diagram of a brake controller according to an embodiment of this application is shown. See also Figure 1 As shown, the brake controller includes a circuit board 10, a signal input interface 141, a three-phase connector interface 131, a power module 151, a drive module 132, a communication module 142, a protection module 143, a bus filter module 133, and a control module 144. The circuit board 10 has a first edge 11 and a second edge 12 that are far apart. A three-phase drive area 13 near the first edge 11, an input protection area 14 near the second edge 12, and a power area 15 are disposed on the first mounting surface of the circuit board 10. The power area 15 is located between the three-phase drive area 13 and the input protection area 14. The signal input interface 141, communication module 142, protection module 143, and control module 144 are all located within the input protection area 14. The three-phase connector interface 131, bus filter module 133, and drive module 132 are all located within the three-phase drive area 13. The power module 151 is located within the power area 15.
[0031] Specifically, signal input interface 141 is electrically connected to protection module 143. Protection module 143 is electrically connected to power module 151 and communication module 142. Power module 151, communication module 142, and drive module 132 are all electrically connected to control module 144. Drive module 132 is electrically connected to three-phase connector interface 131. The input terminal of bus filter module 133 is electrically connected to the bus, and the output terminal of bus filter module 133 is electrically connected to brake motor through three-phase connector interface 131. The communication signal input through signal input interface 141 can be transmitted to power module 151 and communication module 142 through protection module 143. Power module 151 can supply power to control module 144, and communication module 142 can transmit communication signals to control module 144. Control module 144 can control drive module 132 to drive brake motor according to communication signals.
[0032] The signal input interface 141, communication module 142, protection module 143, and control module 144 all have relatively low operating currents and are located within the input protection zone 14. The bus filter module 133 filters the electrical signals on the bus and transmits the filtered signals to the drive module 132. The three-phase connector interface 131 connects to the brake motor. The drive module 132 includes multiple switch drive circuits, a three-phase drive chip, and a current sampling circuit. Both the three-phase connector interface 131 and the drive module 132 have relatively high operating currents and are located within the three-phase drive zone 13. The three-phase drive area 13 is located near the first edge 11 of the circuit board 10, and the input protection area 14 is located near the second edge 12 of the circuit board 10. The first edge 11 and the second edge 12 are two edges that are far apart, thereby realizing the separation of high-current operating devices and low-current operating devices on the circuit board 10, minimizing electromagnetic interference between high-current operating devices and low-current operating devices, and thus improving the stability and reliability of the brake controller.
[0033] For example, such as Figure 2 As shown, the drive module 132 includes a MOS drive circuit, a three-phase pre-drive circuit, and a current sampling circuit. The high-current devices in the MOS drive circuit, the three-phase pre-drive circuit, and the current sampling circuit are arranged in a concentrated manner. The MOS drive circuit and the three-phase pre-drive circuit are arranged adjacent to each other to shorten the length of the high-current traces between the devices. The high-current traces should be configured with correspondingly thicker traces according to the current size to reduce the impedance of the high-current signal.
[0034] The MOS drive circuit includes multiple switching chips (e.g., MOS switching chips), and the three-phase pre-drive circuit is used to control the switching chips to turn on and off, thereby realizing the control of the rotation of the brake motor.
[0035] The current sampling circuit includes a three-phase series sampling resistor, a three-phase pre-drive circuit and the sampling resistor are connected together. The sampling circuit can collect the current of the U phase, V phase and W phase of the brake motor and transmit the collected current information to the control module 144 so that the control module 144 can monitor the brake motor.
[0036] For example, the control module 144 uses an MCU (Micro Control Unit) chip. The MCU chip includes a crystal oscillator and an MCU power supply. The MCU power supply is located close to the MCU chip and has a large area of copper plating to improve the stability of the chip power supply circuit.
[0037] The three-phase connector interface 131 has three pins, which are respectively connected to the U phase, V phase and W phase of the brake motor. The current of the three pins of the three-phase connector interface 131 is relatively large, so the circuit board 10 at the mounting position of the three-phase connector interface 131 adopts 6 layers, each layer is copper-plated and maintains a wide path, and multiple vias are used to complete the connection of each layer.
[0038] like Figure 1 As shown, the power supply area 15 is located between the three-phase drive area 13 and the input protection area 14, and the power supply module 151 is located within the power supply area 15. This allows the power supply module 151 to be positioned in the middle of each module, facilitating power supply to each module and minimizing the power supply distance.
[0039] When laying out the power module 151, attention needs to be paid to both the boost circuit and the buck circuit. The aim is to reduce power supply noise and electromagnetic interference, and improve the overall performance and reliability of the system. The back of the power module 151 is treated with bare copper to facilitate the addition of heat dissipation devices, which helps dissipate heat from the power chips within the module, reducing their temperature rise and improving power efficiency.
[0040] The components in the boost converter of power module 151 are placed as compactly as possible. The filter capacitors, inductors, and diodes are all placed close to the power chip pins and kept on the same layer to minimize loop length. All ground wires of the boost converter are connected to a common planetary ground reference point, and then from this planetary ground reference point are connected to the main ground plane or ground wire of the system. This ensures circuit stability and reduces mutual interference between signals.
[0041] In the power management module, the components in the buck converter are placed as compactly as possible. Inductors and capacitors are positioned close to the power chip pins and kept on the same layer to minimize loop length. Similarly, all ground wires of the buck converter are connected to a common planetary ground reference point, which is then connected to the system's main ground to optimize circuit performance and reduce noise. This connection method is particularly important in buck converters, as these converters typically generate significant noise that directly impacts the EMC performance of board 10.
[0042] The power management module also integrates an SPI interface, a synchronous serial communication interface used for fast, short-distance data transmission. The SPI interface is primarily used to communicate with the MCU chip to perform some control functions. The matching resistors for the SPI interface are placed close to the power supply chip; the matching resistor for the MISO pin is close to the power supply chip pin, and the other three are close to the MCU chip pins. This ensures complete impedance matching and reduces signal reflection and distortion. Since the MISO pin is the source receiver of the power supply chip, this matching resistor is close to the source end of the power supply chip, while the other matching resistors are close to the receiver end of the MCU chip. The four SPI interface wires are also isolated from other signals by ground to reduce signal interference.
[0043] In some embodiments, such as Figure 2 As shown, the brake controller also includes a parking module and a brake drive circuit. The parking module and the brake drive circuit are located in the three-phase drive zone 13, and the parking module is electrically connected to the brake drive circuit.
[0044] In some embodiments, the signal input interface 141 is connected to a low-current device, and the current flowing through the signal input interface 141 is relatively small. The three-phase connector interface 131 needs to be connected to a three-phase brake motor, and the current flowing through the three-phase connector interface 131 is relatively large. By placing the signal input interface 141 near the second edge 12 and the three-phase connector interface 131 near the first edge 11, the signal input interface 141 and the three-phase connector interface 131 are kept as far apart as possible. This reduces electromagnetic interference between the high-current and low-current operating devices, thereby improving the stability and reliability of the brake controller.
[0045] In some embodiments, the bus filter module 133 includes a bus filter circuit disposed within the three-phase drive area 13 and electrically connected to the drive module 132. The bus filter circuit consists of multiple electrolytic capacitors and one inductor, designed to filter bus voltage ripple. The parallel electrolytic capacitors can filter out most of the fluctuating AC components, making the DC voltage more stable and beneficial for the operation of the brake motor. The electrolytic capacitors and inductor in the bus filter circuit are disposed on a second mounting surface of the circuit board 10, away from the first mounting surface. This arrangement allows larger components such as the electrolytic capacitors and inductors in the bus filter circuit to be mounted on the second mounting surface of the circuit board 10, facilitating the smooth mounting of smaller components (e.g., surface mount devices) on the first mounting surface. It also reduces the overall height of the circuit board 10, contributing to its miniaturization.
[0046] It should be noted that the first mounting surface and the second mounting surface on the circuit board 10 are two mounting surfaces that are far apart. For example, the first mounting surface is the front side of the circuit board 10, and the second mounting surface is the back side of the circuit board 10.
[0047] In some embodiments, the electrolytic capacitors and inductors in the power protection circuit are disposed on a second mounting surface of the circuit board 10, away from the first mounting surface. Disposing the electrolytic capacitors and inductors in the power protection circuit on the second mounting surface of the circuit board 10, away from the first mounting surface, also facilitates the smooth mounting of smaller devices (e.g., surface mount devices) on the first mounting surface, while simultaneously reducing the overall height of the circuit board 10, thus contributing to its miniaturization.
[0048] In some embodiments, an isolation channel is provided between the three-phase drive area 13 and the input protection area 14. The isolation channel can prevent signal interference and further reduce electromagnetic interference between high-current and low-current operating devices, thereby improving the stability and reliability of the brake controller.
[0049] For example, the distance between the three-phase drive area 13 and the input protection area 14 is set to a preset distance, so that the distance between the three-phase drive area 13 and the input protection area 14 is large enough to form an isolation channel. The isolation channel can prevent signal interference and further reduce electromagnetic interference between high-current and low-current operating devices, thereby improving the stability and reliability of the braking controller.
[0050] In some embodiments, the MOS driving circuit in the driving module 132 includes a plurality of switching chips (e.g., MOS switching chips). The switching chips are disposed on the first mounting surface of the circuit board 10, and exposed copper is disposed in the central region of the switching chips corresponding to the second mounting surface of the circuit board 10, so that the switching chips can be equipped with heat sink devices to improve heat dissipation efficiency and thereby reduce the power consumption of the switching chips.
[0051] In some embodiments, the protection module 143 includes a communication protection circuit (e.g., Figure 2 The CAN protector and power protection circuit are electrically connected to the signal input interface 141. The communication protection circuit is electrically connected to the communication module 142, and the power protection circuit is electrically connected to the power module 151. The communication protection circuit is positioned close to the signal input interface 141 to improve signal interference immunity. Furthermore, positioning the communication protection circuit close to the signal input interface 141 shortens the communication trace length, thereby increasing signal interference immunity.
[0052] The signal input interface 141 includes a power input terminal, and the protection circuit for the power input terminal (power protection circuit) includes an X capacitor, a Y capacitor, a varistor, and a fuse circuit, etc. The purpose of the power protection circuit is to protect the subsequent circuits from surge and noise interference.
[0053] The signal input interface 141 has multiple signal terminals for connecting to sensors. The sensor signals pass through a communication protection circuit (which includes TVS and capacitors, among other protective devices) before being connected to the MCU chip. Upon receiving the sensor signals, the MCU chip processes and analyzes them. Based on the processed signals, the MCU chip sends control commands to the actuators in the braking system.
[0054] The communication module 142 includes a CAN communication module, which is connected to the communication terminals on the signal input interface 141 via a CAN protector (the CAN protector includes a TVS and a common-mode choke). The CAN signal is processed by the CAN protector and then transmitted to the CAN chip. The TVS should be placed close to the input signal. The communication protection circuit's function is to suppress electromagnetic interference, surges, and absorb electrostatic discharge, ensuring the integrity of subsequent signal circuits. Because the CAN signal is an interference signal, the CAN traces are isolated or grounded during routing on the circuit board 10 to prevent interference with other sensitive signals. The CAN communication module is also connected to the MCU chip, and data communication is accomplished through communication between the MCU chip and the CAN communication module.
[0055] The crystal oscillator in the MCU chip is placed as close as possible to the MCU chip's pins, and its ground is kept isolated, meaning the crystal oscillator's ground and the ground plane of circuit board 10 are connected through a single grounding point to prevent interference. The MCU chip has multiple sensor analog signal pins, and the RC filter circuits for these analog signals are placed close to the MCU chip. The SPI and CAN communication lines of the MCU chip are grounded to prevent signal interference. The core voltage module of the MCU chip is placed close to the MCU chip, and the power supply copper network beneath the MCU chip is the core voltage.
[0056] For example, circuit board 10 adopts a six-layer design: The first layer of circuit board 10 is the component layer, where most components are located. The traces on the first layer are kept as short as possible, maintaining the integrity of the ground plane to improve the EMC performance of circuit board 10. The second layer is a complete ground plane (GND) layer, providing a better ground return path for the first layer. The third layer is the signal layer, mainly housing critical signals. This layer can also refer to the second layer, providing a good return path for the traces on this layer. The area outside the signal lines on this layer is also grounded, maintaining the integrity of the ground plane as much as possible to minimize the signal return path. The fourth layer is also a signal layer, and the fourth layer and the third layer are distributed as perpendicularly as possible to reduce signal interference. The area outside the signal lines on this layer is also grounded, maintaining the integrity of the ground plane as much as possible. The fifth layer contains a small amount of power and ground copper, providing a return path for the fourth layer. The sixth layer contains a small number of components and traces. Larger components in the braking controller (e.g., electrolytic capacitors and inductors in the bus filter circuit and the power protection circuit) are placed on the sixth layer to allow smaller components (e.g., surface mount devices) to be easily mounted on the first layer, reducing the overall height and assembly size of the circuit board 10, which is beneficial for miniaturization. The traces on the sixth layer are kept short, and the sixth layer itself has a ground plane integrity, and can also reference the ground plane of the fifth layer. In summary, each layer of the circuit board 10 has a reference ground plane, which can improve signal integrity and reduce power supply noise. It also shortens the signal return path, reducing the loop area and thus reducing EMI (Electromagnetic Interference), improving the circuit's anti-interference capability. A short return path also improves signal stability and integrity.
[0057] This application also provides a braking control system including at least two brake controllers as described above, with all circuit boards 10 of the brake controllers integrated on a single circuit board 10. Integrating multiple brake controllers onto a single circuit board 10 helps reduce the overall size of the braking control system, facilitating installation on a vehicle.
[0058] For example, such as Figure 3 As shown, the braking control system includes two brake controllers as described above. The two circuit boards 10 in the brake controller are integrated on one circuit board 10. A braking control system can be set on the left and right sides of the vehicle respectively. One braking control system controls the two wheels on the left side, and the other braking control system controls the two wheels on the right side.
[0059] This application also provides a vehicle including the aforementioned braking control system. The braking control system includes a brake controller, which comprises a circuit board, a signal input interface, a three-phase connector interface, a power module, a drive module, a communication module, a protection module, and a control module. The circuit board has a first edge and a second edge that are far apart. A three-phase drive area near the first edge, an input protection area near the second edge, and a power area are disposed on a first mounting surface of the circuit board. The power area is located between the three-phase drive area and the input protection area. The signal input interface, communication module, protection module, and control module are all located within the input protection area. The three-phase connector interface and the drive module are both located within the three-phase drive area. The power module is located within the power area. The signal input interface is electrically connected to the protection module. The protection module is electrically connected to both the power module and the communication module. The power module, communication module, and drive module are all electrically connected to the control module. The drive module is electrically connected to the three-phase connector interface.
[0060] The signal input interface, communication module, protection module, and control module all operate at relatively low currents and are located within the input protection zone. The three-phase connector interface and drive module operate at higher currents and are located within the three-phase drive zone. The three-phase drive zone is positioned near the first edge of the circuit board, while the input protection zone is positioned near the second edge. These two edges are far apart, thus separating high-current and low-current operating devices on the circuit board. This minimizes electromagnetic interference between these devices, thereby improving the stability and reliability of the braking controller.
[0061] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.
Claims
1. A brake controller, characterized in that, The device includes a circuit board, a signal input interface, a three-phase connector interface, a power supply module, a drive module, a communication module, a protection module, a bus filter module, and a control module. The circuit board has a first edge and a second edge that are far apart from each other. A three-phase drive area near the first edge, an input protection area near the second edge, and a power supply area are provided on the first mounting surface of the circuit board. The power supply area is located between the three-phase drive area and the input protection area. The signal input interface, the communication module, the protection module, and the control module are all located within the input protection area. The three-phase connector interface, the bus filter module, and the drive module are all located within the three-phase drive area. The power supply module is located within the power supply area.
2. The brake controller according to claim 1, characterized in that, The signal input interface is located near the second edge, and the three-phase connector interface is located near the first edge.
3. The brake controller according to claim 1, characterized in that, The protection module includes a communication protection circuit and a power protection circuit. Both the communication protection circuit and the power protection circuit are electrically connected to the signal input interface. The communication protection circuit is electrically connected to the communication module, and the power protection circuit is electrically connected to the power module.
4. The brake controller according to claim 3, characterized in that, The electrolytic capacitor and inductor in the power protection circuit are disposed on a second mounting surface on the circuit board, away from the first mounting surface.
5. The brake controller according to claim 1, characterized in that, The bus filter module includes a bus filter circuit, which is disposed in the three-phase drive area and is electrically connected to the drive module.
6. The brake controller according to claim 5, characterized in that, The electrolytic capacitors and inductors in the bus filter circuit are disposed on a second mounting surface on the circuit board, away from the first mounting surface.
7. The brake controller according to claim 1, characterized in that, The brake controller also includes a parking module and a brake drive circuit, which are located within the three-phase drive zone. The parking module is electrically connected to the brake drive circuit.
8. The brake controller according to claim 1, characterized in that, An isolation channel is provided between the three-phase drive area and the input protection area.
9. A braking control system, characterized in that, It includes at least two brake controllers as described in any one of claims 1-8, wherein the circuit boards of all the brake controllers are integrated on a single circuit board.
10. A vehicle, characterized in that, Includes the braking control system as described in claim 9.