Evaporation device and preparation system for chip

Abstract

The utility model discloses an evaporation device. The evaporation device comprises a sealing box, a hanging piece and a loading assembly. The suspension part is connected to the sealing box and located in the sealing box. The loading assembly comprises a loading disc and a covering part, the loading disc is detachably connected to the suspension part, a loading position for loading the substrate is arranged on the loading disc, and the covering part is arranged on the loading position so as to fix the substrate on the loading position; the covering part covers a part of the photoresist on the substrate, and the covering part is provided with a process opening in a penetrating manner so as to expose an evaporation region on the substrate. By the adoption of the evaporation device, due to the fact that the covering piece can cover part of the position of the photoresist, a solid film cannot be formed in the covered area of the photoresist, the notch for exposing the photoresist can be formed in the covered area after evaporation is completed, and therefore stripping liquid can directly make contact with the photoresist through the notch, the photoresist can be removed conveniently, and the yield of the photoresist is improved. And the subsequent process is prevented from being influenced. The utility model further discloses a preparation system for the chip.

Description

Technical Field

[0001] This application belongs to the field of chip processing technology, specifically relating to a vapor deposition apparatus and a chip fabrication system. Background Technology

[0002] As an important step in the fabrication of infrared detector chips, the basic principle of vapor deposition is to heat the coating material in a high vacuum environment to evaporate it into gaseous particles. These gaseous particles fly onto the substrate surface and are deposited and condensed on the substrate to form a solid film.

[0003] Currently, to achieve the formation of solid-state thin films at specific locations on a substrate, photoresist is typically coated onto the substrate first, then the photoresist at specific locations is etched to expose those locations, followed by vapor deposition. After vapor deposition, the photoresist is removed using a stripping solution. However, existing vapor deposition processes form a solid-state thin film on the surface of the photoresist, completely covering it. This makes it difficult for the stripping solution to directly contact the photoresist, resulting in difficult photoresist removal and impacting subsequent processes. Utility Model Content

[0004] The technical problem to be solved by this application is that the solid film formed by the existing evaporation process completely covers the surface of the photoresist, making it difficult for the stripping solution to directly contact the photoresist, thus making the photoresist difficult to remove. In order to solve this technical problem, an evaporation device and a chip fabrication system that can facilitate the removal of photoresist are provided.

[0005] The technical solution proposed in this application is as follows:

[0006] A vapor deposition apparatus, comprising:

[0007] Sealed box;

[0008] A suspension component is connected to the sealed box and located inside the sealed box;

[0009] A loading assembly includes a loading tray and a cover, the loading tray being detachably connected to the suspension member, and the loading tray having a loading position for loading a substrate, the cover being installed at the loading position to fix the substrate to the loading position;

[0010] The cover covers a portion of the photoresist on the substrate, and the cover has a through-hole for exposing the vapor deposition area on the substrate.

[0011] Using the aforementioned vapor deposition apparatus, the substrate is placed in the loading position and fixed by a cover. The loading tray is then connected to a suspension device, and the vapor deposition process is performed within a sealed chamber. The process openings in the cover expose the vapor deposition area, thereby forming a solid film in that area. Simultaneously, because the cover partially covers the photoresist, a solid film does not form in the covered area. After vapor deposition, a notch is created in the covered area to expose the photoresist, allowing the stripping solution to directly contact the photoresist through the notch, facilitating photoresist removal and preventing interference with subsequent processes.

[0012] Furthermore, the loading tray is provided with a plurality of loading positions, and the loading assembly includes a plurality of covers.

[0013] Furthermore, the vapor deposition apparatus also includes an evaporator, which is disposed inside the sealed box and is used to evaporate the target material.

[0014] Furthermore, the suspension member is located at the top of the sealed box, the evaporator is located at the bottom of the sealed box and below the loading tray, and the side of the loading tray with the loading position faces the evaporator.

[0015] Furthermore, the loading tray is provided with multiple connection holes, which are spaced apart on the edge of the loading tray, and the suspension member is detachably connected to the multiple connection holes.

[0016] Furthermore, the suspension component is provided with a plurality of connecting posts, each of which is detachably connected to a connecting hole.

[0017] Furthermore, the connecting hole includes a through section and a limiting section that are interconnected, and the connecting post includes a head and a rod that are interconnected. The radial dimension of the through section is greater than the radial dimension of the head, and the radial dimension of the limiting section is less than the radial dimension of the head but greater than the radial dimension of the rod.

[0018] Furthermore, the loading position is provided with a receiving groove for accommodating the substrate and the cover.

[0019] Furthermore, the loading position is also provided with a positioning groove, which is connected to the receiving groove, and the edge of the cover is provided with ears;

[0020] When the cover is placed in the receiving groove, the ear extends into the positioning groove.

[0021] A chip fabrication system includes the vapor deposition apparatus described above.

[0022] In summary, the vapor deposition apparatus and chip fabrication system provided in this application have at least the following advantages:

[0023] 1. During the vapor deposition process, the cover can cover part of the photoresist, forming a gap that exposes the photoresist, which facilitates the direct contact of the stripping solution with the photoresist and makes it easier to remove the photoresist;

[0024] 2. The loading tray and the suspension components are detachably connected via connecting holes and connecting posts, making operation more convenient;

[0025] 3. The loading tray has a loading position on one side facing the evaporator, which facilitates the direct ejection of gaseous particles to the evaporation area of ​​the substrate;

[0026] 4. It can deposit multiple substrates simultaneously, resulting in high efficiency. Attached Figure Description

[0027] The accompanying drawings are provided to further understand this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof.

[0028] Figure 1 This is a schematic diagram of the structure of a vapor deposition apparatus for removing loading components according to an embodiment of this application;

[0029] Figure 2 For application Figure 1 A schematic diagram of the loading components and substrate in the structure shown;

[0030] Figure 3 for Figure 2 The diagram shows the structure of the cover in the loading assembly.

[0031] Label Explanation:

[0032] 20. Substrate; 100. Sealed box; 200. Suspension component; 210. Connecting post; 300. Loading assembly; 310. Loading tray; 311. Connecting hole; 312. Through section; 313. Limiting section; 314. Receiving groove; 315. Positioning groove; 320. Cover; 321. Process opening; 322. Ear; 323. Locking hole; 400. Evaporator. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0034] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0035] On the one hand, this application provides a vapor deposition apparatus that can be used to vapor deposit a solid film on the surface of a substrate. The solid film formed by the vapor deposition apparatus does not completely cover the photoresist on the substrate, thereby facilitating direct contact between the stripping liquid and the photoresist and reducing the difficulty of removing the photoresist.

[0036] like Figures 1 to 3 As shown, in one embodiment, the vapor deposition apparatus includes a sealed chamber 100, a suspension member 200, and a loading assembly 300. The suspension member 200 is connected to and located inside the sealed chamber 100; the loading assembly 300 is also located inside the sealed chamber 100 and connected to the suspension member 200. The loading assembly 300 is used to load the substrate 20, thereby enabling vapor deposition of the substrate 20 within the sealed chamber 100.

[0037] Furthermore, the loading assembly 300 includes a loading tray 310 and a cover 320. The loading tray 310 is detachably connected to the suspension member 200, and the loading tray 310 has a loading position for loading the substrate 20. The cover 320 is installed at the loading position to fix the substrate 20 at the loading position.

[0038] The cover 320 covers a portion of the photoresist on the substrate 20, and the cover 320 has a process opening 321 to expose the vapor deposition area on the substrate 20.

[0039] It should be noted that, in practical applications, the upper surface of the substrate 20 includes a vapor deposition area and a protective area. The vapor deposition area is used to form a solid thin film through vapor deposition, thereby forming a metal layer on the upper surface of the substrate 20; while the protective area is covered with photoresist. In this embodiment, the cover 320 can cover part of the photoresist, so as to fix the substrate 20 in the mounting position and facilitate the formation of a notch to expose the photoresist during the subsequent vapor deposition process; while the process opening 321 of the cover 320 can expose the vapor deposition area, thereby ensuring the smooth progress of the vapor deposition process.

[0040] Using the aforementioned vapor deposition apparatus, the substrate 20 is placed in the loading position and fixed by the cover 320. Then, the loading tray 310 is connected to the suspension member 200, and the vapor deposition process is performed within the sealed chamber 100. The process opening 321 of the cover 320 exposes the vapor deposition area, thereby forming a solid film in the vapor deposition area. Simultaneously, since the cover 320 covers part of the photoresist, a solid film will not form in the covered area. After vapor deposition, a notch is formed in the covered area to expose the photoresist, allowing the stripping solution to directly contact the photoresist through the notch, facilitating photoresist removal and preventing interference with subsequent processes.

[0041] In one embodiment, the vapor deposition apparatus further includes an evaporator 400 disposed within a sealed chamber 100 and used to evaporate the target material, thereby evaporating the target material into gaseous particles within the sealed chamber 100. Further, a suspension member 200 is located at the top of the sealed chamber 100, and the evaporator 400 is located at the bottom of the sealed chamber 100, below a loading tray 310. The side of the loading tray 310 with the loading position faces the evaporator 400, so that the vapor deposition area of ​​the substrate 20 faces the evaporator 400 below, allowing the gaseous particles generated by the evaporator 400 evaporating the target material to be directly ejected into the vapor deposition area.

[0042] In one embodiment, the loading tray 310 is also provided with a plurality of connection holes 311, which are spaced apart on the edge of the loading tray 310. The suspension member 200 is detachably connected to the plurality of connection holes 311, thereby achieving a stable connection between the loading tray 310 and the suspension member 200.

[0043] Furthermore, the suspension member 200 is provided with multiple connecting posts 210, each connecting post 210 being detachably connected to a connecting hole 311. In practical applications, the connecting hole 311 includes an interconnected passage section 312 and a limiting section 313, and the connecting post 210 includes an interconnected head and a rod portion. The radial dimension of the passage section 312 is larger than the radial dimension of the head, the radial dimension of the head is larger than the radial dimension of the limiting section 313, and the radial dimension of the limiting section 313 is larger than the radial dimension of the rod portion. Thus, the head passes through the passage section 312, and the position of the loading disc 310 is adjusted so that the connecting post 210 moves along the connecting hole 311 until the rod portion enters the limiting section 313. Since the radial dimension of the head is larger than that of the limiting section 313, the loading disc 310 is confined within the connecting post 210, thereby achieving the connection between the loading disc 310 and the suspension member 200.

[0044] Specifically Figure 2In the illustrated embodiment, the loading disc 310 has three evenly spaced connecting holes 311 along its circumference, corresponding to three connecting posts 210 on the suspension member 200. To connect the loading disc 310 to the suspension member 200, the connecting post 210 is passed through the passage section 312, and then the loading disc 310 is rotated until the rod enters the limiting section 313. Optionally, the connecting post 210 is a bolt.

[0045] In one embodiment, the loading tray 310 has multiple loading positions to simultaneously place multiple substrates 20, thereby improving processing efficiency. Further, the loading assembly 300 includes multiple covers 320, with each loading position having a cover 320 to fix the substrate 20 at the loading position and cover a portion of the photoresist on the substrate 20.

[0046] In one embodiment, the loading position has a receiving groove 314 for receiving the substrate 20 and the cover 320. Specifically, after the substrate 20 is placed in the receiving groove 314, the receiving groove 314 can limit the substrate 20, while the cover 320 is connected to the loading tray 310 and located in the receiving groove 314, which can completely fix the substrate 20 in the receiving groove 314 and prevent the substrate 20 from falling out of the receiving groove 314.

[0047] Furthermore, the loading position is also provided with a positioning groove 315, which communicates with the receiving groove 314. The edge of the cover 320 is provided with ears 322. When the cover 320 is placed in the receiving groove 314, the ears 322 extend into the positioning groove 315, thereby positioning the cover 320. At the same time, the cover 320 can be placed or removed through the positioning groove 315 without having to be placed or removed through the receiving groove 314, thus avoiding damage to the substrate 20 and other structures during the placement or removal process.

[0048] In one embodiment, the ear portion 322 has a locking hole 323 extending through it; the loading assembly 300 also includes a locking member that can pass through the locking hole 323 and connect to the loading tray 310 to lock the cover 320 in the loading position. Further, the locking member is a screw, and the bottom wall of the positioning groove 315 has a threaded hole. The screw connects to the threaded hole to fix the cover 320 in the loading position. Preferably, the receiving groove 314 has limit grooves on both opposite sides, and the cover 320 has ears 322 on both opposite sides, each ear 322 having a locking hole 323, to improve the stability of the connection between the cover 320 and the loading tray 310.

[0049] On the other hand, this application also provides a chip fabrication system, which includes the vapor deposition apparatus described in the above embodiments. It should be noted that the vapor deposition apparatus is used to form a solid film on the vapor deposition area of ​​the substrate 20 in a high vacuum environment. After vapor deposition, the photoresist needs to be removed, and the stripping solution can directly contact the photoresist through the gaps formed on the solid film by the cover 320.

[0050] In summary, the vapor deposition apparatus and chip fabrication system provided in this application have at least the following advantages:

[0051] 1. During the vapor deposition process, the cover 320 can cover part of the photoresist, forming a gap that exposes the photoresist, which facilitates the direct contact of the stripping solution with the photoresist and makes it easier to remove the photoresist;

[0052] 2. The loading plate 310 and the suspension component 200 are detachably connected via the connecting hole 311 and the connecting post 210, making operation more convenient;

[0053] 3. The loading tray 310 has a loading position on one side facing the evaporator 400, which facilitates the direct ejection of gaseous particles to the evaporation area of ​​the substrate 20.

[0054] 4. It can simultaneously deposit multiple substrates 20, with high efficiency.

[0055] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vapor deposition apparatus, characterized in that, include: Sealed box; A suspension component is connected to the sealed box and located inside the sealed box; A loading assembly includes a loading tray and a cover, the loading tray being detachably connected to the suspension member, and the loading tray having a loading position for loading a substrate, the cover being installed at the loading position to fix the substrate to the loading position; The cover covers a portion of the photoresist on the substrate, and the cover has a through-hole for exposing the vapor deposition area on the substrate.

2. The vapor deposition apparatus according to claim 1, characterized in that, The loading disk has multiple loading positions, and the loading assembly includes multiple covers.

3. The vapor deposition apparatus according to claim 1, characterized in that, It also includes an evaporator, which is disposed inside the sealed chamber and is used to evaporate the target material.

4. The vapor deposition apparatus according to claim 3, characterized in that, The suspension component is located at the top of the sealed box, the evaporator is located at the bottom of the sealed box and below the loading tray, and the side of the loading tray with the loading position faces the evaporator.

5. The vapor deposition apparatus according to claim 1, characterized in that, The loading tray is also provided with multiple connection holes, which are spaced apart on the edge of the loading tray, and the suspension member is detachably connected to the multiple connection holes.

6. The vapor deposition apparatus according to claim 5, characterized in that, The suspension component is provided with multiple connecting posts, each of which is detachably connected to a connecting hole.

7. The vapor deposition apparatus according to claim 6, characterized in that, The connecting hole includes a through section and a limiting section that are interconnected. The connecting post includes a head and a rod that are interconnected. The radial dimension of the through section is greater than the radial dimension of the head. The radial dimension of the limiting section is less than the radial dimension of the head, but greater than the radial dimension of the rod.

8. The vapor deposition apparatus according to claim 1, characterized in that, The loading position has a receiving groove for receiving the substrate and the cover.

9. The vapor deposition apparatus according to claim 8, characterized in that, The loading position is also provided with a positioning groove, which is connected to the receiving groove, and the edge of the cover is provided with ears; When the cover is placed in the receiving groove, the ear extends into the positioning groove.

10. A system for fabricating a chip, characterized in that, Includes the vapor deposition apparatus according to any one of claims 1-9.

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