Refrigeration assembly

Abstract

The utility model provides a refrigeration assembly, which relates to the field of refrigeration and comprises a semiconductor refrigeration box, a semiconductor refrigeration sheet, an ice tray and a heat dissipation module. The semiconductor chilling plate converts electric energy into a cooling effect through a thermoelectric effect, the ice tray is used for absorbing low temperature generated by refrigeration, and efficient refrigeration is achieved. The heat dissipation module is located on the outer wall of the semiconductor refrigeration box and provided with fins and a heat dissipation fan, heat is rapidly dissipated, and system temperature balance is kept. The structural design of the assembly ensures the stability of the refrigeration sheet and the ice tray, prevents displacement caused by vibration, and enhances the overall durability. The turnover motor drives the semiconductor chilling plate and the ice tray to move relatively, and a user can adjust the cooling effect according to requirements. And the design of the driving gear improves the power transmission efficiency, so that the system runs more smoothly. According to the utility model, through optimization design and efficient assembly configuration, the refrigeration efficiency and the stability are obviously improved.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration technology, and in particular to a refrigeration component. Background Technology

[0002] With the continuous development of science and technology and the improvement of people's living standards, refrigeration technology is being used more and more widely in various fields. Traditional refrigeration methods mostly rely on technologies such as compressor refrigeration and absorption refrigeration. Although these technologies perform well in large-scale refrigeration systems, they have problems such as large size, high energy consumption, and low refrigeration efficiency in some specific application scenarios.

[0003] In recent years, semiconductor refrigeration technology has gradually emerged and has attracted increasing attention due to its advantages such as small size, high efficiency, and strong controllability. Semiconductor refrigeration chips utilize the thermoelectric effect to generate a temperature difference when an electric current passes through them, thereby achieving effective cooling. This refrigeration method not only has a high energy efficiency ratio but also can respond quickly to temperature changes, making it suitable for precision refrigeration needs.

[0004] In practical applications, ice-making refrigeration technology typically faces the following challenges:

[0005] 1. Heat dissipation problem: Semiconductor cooling chips generate a certain amount of heat during the cooling process. If the heat cannot be dissipated effectively, it will affect the cooling effect and shorten the service life of the equipment.

[0006] 2. Cooling Efficiency: Although thermoelectric coolers can achieve rapid cooling, their cooling efficiency is often affected by factors such as ambient temperature, heat load, and material properties. Therefore, improving cooling efficiency remains a key focus of technological research and development.

[0007] 3. Structural design: Existing refrigeration components are often difficult to design to achieve a compact layout, resulting in low space utilization and limiting their application in miniaturized devices.

[0008] Based on this, the present invention provides a novel fracture fixation screw to solve one or more of the problems mentioned above. Utility Model Content

[0009] This invention provides a refrigeration component to solve the problems mentioned in the background art.

[0010] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor cooling box, in which a semiconductor cooling chip and an ice plate are movably installed, and a heat dissipation module is installed on the outer wall of the semiconductor cooling box, with the heat dissipation module located on the side close to the semiconductor cooling chip.

[0011] Preferably, both ends of the support plate are fixedly connected to the inner wall of the semiconductor cooling box.

[0012] Preferably, the flip motor is fixedly mounted on the outer wall of the semiconductor refrigeration box.

[0013] Preferably, one end of the rotating shaft is rotatably connected to the inner wall of the semiconductor cooling box, and the other end of the rotating shaft moves through the support plate and extends out of the semiconductor cooling box and is fixedly connected to the output shaft of the flip motor.

[0014] Preferably, one end of the rotating shaft is rotatably connected to the inner wall of the semiconductor refrigeration box, and the other end of the rotating shaft passes through the support plate and is rotatably connected to the inner wall of the semiconductor refrigeration box.

[0015] Preferably, the semiconductor cooling chip is fixedly sleeved on the outer wall of the rotating shaft, and the ice tray is fixedly sleeved on the outer wall of the rotating shaft.

[0016] Preferably, drive gear one is fixedly sleeved on the outer wall of rotating shaft one, drive gear two is fixedly sleeved on the outer wall of rotating shaft two, and drive gear one and drive gear two are located between the support plate and the inner wall of the semiconductor cooling box.

[0017] Preferably, drive gear one and drive gear two mesh with each other.

[0018] Preferably, the heat dissipation module includes: a mounting frame, which is embedded in the outer wall of the semiconductor cooling box, and a fin mounting bracket is fixedly provided in the mounting frame. The fin mounting bracket has several sets of dividing slots, and each set of dividing slots has the same heat-conducting fins after installation.

[0019] Preferably, a louver is fastened to one side of the mounting frame, and a heat-conducting plate is fixedly provided on the other side of the mounting frame, with the heat-conducting plate abutting against the heat-conducting fins, and several sets of cooling fans are installed at the bottom of the mounting frame.

[0020] Compared with the prior art, the beneficial effects of this utility model are:

[0021] 1. High-efficiency cooling: This cooling component utilizes the thermoelectric effect of a semiconductor cooling chip to quickly and effectively convert electrical energy into cooling effect, ensuring that low temperatures are achieved in a short time.

[0022] 2. Optimized space utilization: The design of the semiconductor cooling box allows for a compact configuration of various components (such as cooling chips, ice trays, heat dissipation modules, etc.), optimizing space utilization and making it suitable for use in space-constrained environments.

[0023] 3. Enhanced stability: The support plate fixes the semiconductor cooling chip and ice plate, improving the structural stability and effectively preventing displacement caused by vibration or impact during operation, thereby ensuring the continuity and reliability of the cooling effect.

[0024] 4. Flexibility and adjustability: The design of the flip motor allows the semiconductor cooling chip and the ice plate to move relative to each other, and users can adjust the cooling state according to their needs, increasing the applicability of the system.

[0025] 5. High-efficiency heat exchange: The reliable connection between the semiconductor cooling chip and the ice plate ensures high efficiency of heat exchange, improves the overall performance of the refrigeration system, and reduces energy loss.

[0026] 6. Power transmission efficiency: The drive gears mesh with each other to achieve synchronous movement of the rotating shaft, which improves power transmission efficiency and reduces energy loss.

[0027] 7. Effective heat dissipation management: The heat dissipation module increases the heat dissipation area through the mounting frame and fin design, which can quickly and effectively dissipate heat, maintain the temperature balance of the system, and thus prevent overheating damage.

[0028] 8. Preventing heat interference: The heat-conducting plate design effectively directs the heat generated on the back of the cooling plate to the fins, where it is dissipated by a cooling fan. This prevents heat from affecting the forming speed of the liquid in the ice tray and improves cooling efficiency.

[0029] 9. Easy to maintain and operate: The simple and clear structural design facilitates later maintenance and operation, reducing the difficulty of use for users. Attached Figure Description

[0030] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0031] In the attached diagram:

[0032] Figure 1 This is a top view of the structure of this utility model;

[0033] Figure 2 This is a schematic diagram of the main structure of this utility model;

[0034] Figure 3 This is a three-dimensional structural diagram of the heat dissipation module in this utility model;

[0035] Figure 4 This is a three-dimensional structural diagram of the fin mounting bracket of this utility model.

[0036] In the diagram: 1. Semiconductor cooling box; 2. Tilting motor; 3. Drive gear one; 4. Drive gear two; 5. Support plate; 6. Semiconductor cooling chip; 7. Ice tray; 8. Heat dissipation module; 9. Rotating shaft one; 10. Rotating shaft two; 11. Mounting frame; 12. Fin mounting bracket; 13. Louver; 14. Dividing groove; 15. Heat-conducting fins; 16. Cooling fan; 17. Heat-conducting plate. Detailed Implementation

[0037] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0038] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described using the same technical terms, and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions and features of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination should be considered non-existent and not within the scope of protection claimed by this utility model.

[0039] This utility model provides a technical solution; please refer to [link / reference]. Figure 1-4 The system includes: a thermoelectric cooling box 1, within which a thermoelectric cooling chip 6 and an ice tray 7 are movably installed; a heat dissipation module 8 is installed on the outer wall of the thermoelectric cooling box 1, and the heat dissipation module 8 is located on the side closest to the thermoelectric cooling chip 6. The basic structure of this cooling assembly consists of the thermoelectric cooling box and the internal thermoelectric cooling chip. The cooling chip converts electrical energy into a cooling effect through the thermoelectric effect, and the ice tray absorbs the low temperature generated by the cooling process, thereby achieving cooling. This design effectively centralizes the cooling process, optimizes space utilization, and improves cooling efficiency.

[0040] Furthermore, both ends of the support plate 5 are fixedly connected to the inner wall of the semiconductor cooling box 1. The fixed connection of the support plate ensures the stability of the cooling plate and the ice plate, preventing them from shifting due to vibration or impact during operation, enhancing the overall structural stability, improving the durability and reliability of the components, and ensuring the continuity of the cooling effect.

[0041] Furthermore, the tilting motor 2 is fixedly mounted on the outer wall of the semiconductor cooling box 1. The tilting motor provides power, enabling relative movement between the semiconductor cooling plate and the ice tray, thus adjusting the cooling state. Users can adjust the cooling effect according to actual needs, improving applicability.

[0042] Furthermore, one end of the rotating shaft 9 is rotatably connected to the inner wall of the semiconductor cooling box 1, and the other end is fixedly connected to the output shaft of the flip motor 2. The design of the rotating shaft enables the power of the flip motor to be effectively transmitted to the cooling element, thereby achieving cooling.

[0043] Furthermore, one end of the rotating shaft 10 is rotatably connected to the inner wall of the semiconductor cooling box 1, and the other end is rotatably connected to the inner wall of the semiconductor cooling box 1. Similar to the rotating shaft 1, the rotating shaft 2 is responsible for providing power to the ice plate, which can enhance the flexibility of the system and allow the ice plate to move independently of the cooling plate, thereby optimizing the cooling effect.

[0044] Furthermore, the semiconductor cooling chip 6 is fixedly sleeved on the outer wall of the rotating shaft 9, and the ice plate 7 is fixedly sleeved on the outer wall of the rotating shaft 10. This method ensures a reliable connection between the cooling chip and the ice plate, preventing loosening during operation, thus guaranteeing efficient heat exchange and improving the overall performance of the refrigeration system.

[0045] Furthermore, drive gear 3 is fixedly sleeved on the outer wall of rotating shaft 9, and drive gear 4 is fixedly sleeved on the outer wall of rotating shaft 10. The drive gears achieve synchronous movement of the rotating shafts through meshing, thereby improving power transmission efficiency.

[0046] Furthermore, drive gear 3 and drive gear 4 mesh with each other. Through mutual meshing, drive gears 1 and 2 can achieve relative rotation, forming an effective power transmission chain.

[0047] Furthermore, the heat dissipation module 8 includes: a mounting frame 11, which is embedded in the outer wall of the semiconductor cooling box 1. A fin mounting bracket 12 is fixedly installed inside the mounting frame 11. The fin mounting bracket 12 has several sets of dividing slots 14, and each set of dividing slots 14 has identical heat-conducting fins 15 installed after installation. The heat dissipation module increases the heat dissipation area through fins, quickly dissipates heat, maintains the temperature balance of the system, effectively reduces the operating temperature of the cooling components, improves overall working efficiency, and avoids overheating damage.

[0048] Furthermore, a louver 13 is fastened to one side of the mounting frame 11, and a heat-conducting plate 17 is fixedly installed on the other side of the mounting frame 11, with the heat-conducting plate 17 abutting against the heat-conducting fins 15. Several sets of cooling fans 16 are installed at the bottom of the mounting frame 11. The design of the louver and the heat-conducting plate can better manage the heat dissipation flow, transferring heat to the fins through the heat-conducting plate and improving the heat dissipation effect.

[0049] Working principle: When making ice, the rotating motor 2 is started, which drives the semiconductor cooling chip 6 to rotate downward by 90 degrees. At the same time, the drive gear 3 drives the ice tray 7 to rotate upward by 90 degrees through the drive gear 4 and the rotating shaft 10. At this time, the cooling surface of the semiconductor cooling chip 6 is facing the ice tray 7. The ice tray 7 gradually cools down, thus freezing the liquid inside. Then, the rotating motor 2 reverses, causing the semiconductor cooling chip 6 and the ice tray 7 to rotate 90 degrees in opposite directions. At this time, the heat emitted from the back of the semiconductor cooling chip 6 is transferred to the back of the ice tray 7, so that the ice in the ice tray 7 melts slightly and then falls off naturally.

[0050] In order to prevent the heat generated on the back of the thermoelectric cooler 6 from affecting the forming speed of the liquid in the ice plate 7, the heat-conducting plate 17 can guide the heat generated on the back of the thermoelectric cooler 6 to several sets of heat-conducting fins 15, and then heat out the liquid by activating several sets of cooling fans 16, thereby improving the cooling efficiency.

[0051] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A cooling component, characterized in that: include: A semiconductor cooling box (1) is provided, in which a semiconductor cooling chip (6) and an ice plate (7) are movably installed. A heat dissipation module (8) is installed on the outer wall of the semiconductor cooling box (1), and the heat dissipation module (8) is located on the side close to the semiconductor cooling chip (6).

2. A refrigeration component as described in claim 1, characterized in that: The two ends of the support plate (5) are fixedly connected to the inner wall of the semiconductor cooling box (1).

3. A refrigeration component as described in claim 2, characterized in that: The flip motor (2) is fixed on the outer wall of the semiconductor cooling box (1).

4. A refrigeration component as described in claim 3, characterized in that: One end of the rotating shaft (9) is rotatably connected to the inner wall of the semiconductor cooling box (1), and the other end of the rotating shaft (9) moves through the support plate (5) and extends out of the semiconductor cooling box (1) and is fixedly connected to the output shaft of the flip motor (2).

5. A refrigeration component as described in claim 4, characterized in that: One end of the rotating shaft (10) is rotatably connected to the inner wall of the semiconductor cooling box (1), and the other end of the rotating shaft (10) moves through the support plate (5) and is rotatably connected to the inner wall of the semiconductor cooling box (1).

6. A refrigeration component as described in claim 5, characterized in that: The semiconductor cooling chip (6) is fixedly sleeved on the outer wall of the rotating shaft one (9), and the ice plate (7) is fixedly sleeved on the outer wall of the rotating shaft two (10).

7. A refrigeration component as described in claim 5, characterized in that: Drive gear 1 (3) is fixedly sleeved on the outer wall of rotating shaft 1 (9), drive gear 2 (4) is fixedly sleeved on the outer wall of rotating shaft 2 (10), and drive gear 1 (3) and drive gear 2 (4) are located between the support plate (5) and the inner wall of the semiconductor cooling box (1).

8. A refrigeration component as described in claim 7, characterized in that: Drive gear one (3) and drive gear two (4) mesh with each other.

9. A refrigeration component as described in claim 1, characterized in that: The heat dissipation module (8) includes: a mounting frame (11), which is embedded in the outer wall of the semiconductor cooling box (1). A fin mounting bracket (12) is fixedly provided in the mounting frame (11). Several sets of dividing slots (14) are opened on the fin mounting bracket (12), and each set of dividing slots (14) has the same heat-conducting fins (15) after installation.

10. A refrigeration component as described in claim 9, characterized in that: A louver (13) is fastened to one side of the mounting frame (11), and a heat-conducting plate (17) is fixed on the other side of the mounting frame (11). The heat-conducting plate (17) abuts against the heat-conducting fins (15), and several sets of cooling fans (16) are installed at the bottom of the mounting frame (11).

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