Silicon wafer drying tank and heat conduction uniform flow plate thereof

Abstract

The utility model relates to a silicon wafer drying groove heat conduction uniform flow plate and a silicon wafer drying groove, and the silicon wafer drying groove heat conduction uniform flow plate comprises a main body which is constructed to be of a plate-shaped structure perpendicular to a first direction, and a plurality of first air outlet holes which are uniformly distributed at intervals and penetrate through the main body in the first direction are formed in the main body; the heat conduction part is arranged on the end face of one end of the main body in the first direction in a protruding mode and extends in the second direction, the heat conduction part supports the bottom rod in the first direction so as to transmit heat to the bottom rod, and a plurality of second air outlet holes which are evenly distributed at intervals and communicate with the first air outlet holes in the first direction are formed in the heat conduction part. The drying effect can be improved, flower basket tooth marks and water marks are prevented from existing on the silicon wafers, and therefore the product yield of the silicon wafers is increased.

Description

Technical Field

[0001] This application relates to the field of solar cell manufacturing, and in particular to a heat-conducting uniform plate for a silicon wafer drying tank and a silicon wafer drying tank. Background Technology

[0002] In the manufacturing process of solar cells, the surface of silicon wafers needs to be treated with chemicals and cleaning agents before drying. Drying is typically done using a silicon wafer drying tank. Ineffective drying can leave liquid residue on the wafer surface, and uneven heating or contact with the drying basket can result in basket welts and watermarks on the wafer. Utility Model Content

[0003] This application provides a heat-conducting and uniform flow plate for a silicon wafer drying tank and a silicon wafer drying tank, which can improve the drying effect, avoid basket-tooth marks and watermarks on the silicon wafers, and thus improve the product yield of silicon wafers.

[0004] In a first aspect, the heat-conducting and flow-equalizing plate for the silicon wafer drying tank provided in the embodiments of this application is disposed at the bottom of the silicon wafer drying tank and supports a basket in a first direction. The basket includes a bottom rod for supporting the silicon wafer in the first direction and extending along a second direction perpendicular to the first direction. The heat-conducting and flow-equalizing plate for the silicon wafer drying tank includes:

[0005] The main body is constructed as a plate-like structure perpendicular to the first direction, and the main body has a plurality of evenly spaced first air outlet holes that penetrate the main body along the first direction; and

[0006] A heat-conducting part protrudes from one end face of the main body in the first direction and extends along the second direction. The heat-conducting part supports the bottom rod in the first direction to transfer heat to the bottom rod. The heat-conducting part has a plurality of second air outlets that are evenly spaced and connected to the first air outlet in the first direction.

[0007] In some embodiments, the main body is provided with a plurality of heat-conducting components, each heat-conducting component being arranged in a one-to-one correspondence with the flower basket, and each heat-conducting component including at least one heat-conducting part being arranged in a one-to-one correspondence with the bottom rod.

[0008] In some implementations, the thermally conductive components are arranged in a matrix.

[0009] In some embodiments, the heat-conducting part is in line contact with the corresponding base rod.

[0010] In some embodiments, the base rod is a cylindrical rod, and the heat-conducting part has a first surface that contacts the cylindrical surface of the base rod, the first surface being a plane or an arc-shaped surface.

[0011] In some embodiments, the flower basket further includes two end plates connected to both ends of the base rod in the second direction;

[0012] The heat-conducting and uniform flow plate of the silicon wafer drying tank also includes a support assembly, which includes two support portions spaced apart in the second direction, and the support portions support the corresponding end plates in the first direction.

[0013] The heat-conducting part is disposed between the two supporting parts.

[0014] In some implementations, each support component corresponds to at least one of the flower baskets.

[0015] In some embodiments, the support extends along a third direction perpendicular to the first direction and the second direction.

[0016] In some embodiments, the end of the end plate facing the support portion has a first limiting structure, and the end of the support portion facing the end plate has a second limiting structure, wherein the second limiting structure and the first limiting structure are inserted and engaged along the first direction.

[0017] Secondly, the silicon wafer drying tank provided in the embodiments of this application includes a tank body and a heat-conducting and uniform flow plate for the silicon wafer drying tank provided in any of the above embodiments.

[0018] Compared with the prior art, the beneficial features of the embodiments of this application are as follows: the silicon wafer drying tank heat-conducting and equalizing plate and the silicon wafer drying tank, the silicon wafer drying tank heat-conducting and equalizing plate includes a main body, which is constructed as a plate-shaped structure perpendicular to the first direction, and a plurality of uniformly spaced first air outlet holes are opened on the main body and penetrate the main body along the first direction; and a heat-conducting part, which protrudes from one end face of the main body in the first direction and extends along the second direction, the heat-conducting part supports the bottom rod in the first direction to transfer heat to the bottom rod, and a plurality of uniformly spaced second air outlet holes are opened on the heat-conducting part and communicate with the first air outlet holes along the first direction. Through the embodiments of this application, when the basket is placed on the silicon wafer drying tank heat-conducting and equalizing plate in the tank, the bottom rod and the heat-conducting part come into contact, and the heat-conducting part can conduct its own heat to the bottom rod of the basket, improving the drying effect. At the same time, the second air outlet holes distributed on the heat-conducting part can fully guide the hot airflow to dry the contact area between the silicon wafer and the bottom rod, further improving the drying effect, avoiding basket tooth marks and watermarks on the silicon wafer, thereby improving the product yield of silicon wafer. Attached Figure Description

[0019] Figure 1 This is a top view of the heat-conducting and flow-equalizing plate of the silicon wafer drying tank according to an embodiment of this application;

[0020] Figure 2 This is a top view of the heat-conducting and flow-equalizing plate of the silicon wafer drying tank in use according to an embodiment of this application;

[0021] Figure 3 This is a partial front view of the heat-conducting and flow-equalizing plate of the silicon wafer drying tank according to an embodiment of this application;

[0022] Figure 4 This is a schematic diagram showing the interaction between the heat-conducting part and the bottom rod in the heat-conducting and uniform flow plate of the silicon wafer drying tank according to an embodiment of this application;

[0023] Figure 5 This is a schematic diagram showing the interaction between the heat-conducting part and the bottom rod in the heat-conducting and uniform flow plate of the silicon wafer drying tank according to an embodiment of this application;

[0024] Figure 6 This is a schematic diagram of the cooperation between the support part and the end plate in the heat-conducting and uniform flow plate of the silicon wafer drying tank in an embodiment of this application;

[0025] Figure 7 This is a schematic diagram of the silicon wafer drying tank structure according to an embodiment of this application;

[0026] Figure 8 This is a schematic diagram of the silicon wafer drying tank structure according to an embodiment of this application;

[0027] Among them: 10-Silicon wafer drying tank heat-conducting and uniform flow plate (11-Main body (111-Second surface, 112-First air outlet), 12-Heat-conducting component (121-Heat-conducting part (1211-First surface, 1212-Second air outlet)), 13-Support component (131-Support part (1311-Fourth surface, 1312-Second limiting structure))), 20-Tank body (21-Ventilation hole), 30-Basket (31-Bottom rod, 32-End plate (321-Third surface, 322-First limiting structure), 33-Limiting rod), 40-First heater, 50-Blowing equipment, 60-Second heater. Detailed Implementation

[0028] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0029] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0031] Please refer to Figure 7 and Figure 8 In this embodiment of the application, a heat-conducting and flow-equalizing plate 10 for the silicon wafer drying tank is disposed at the bottom of the tank body 20 of the silicon wafer drying tank. Please refer to... Figure 3 As shown, the heat-conducting and flow-equalizing plate 10 of the silicon wafer drying tank supports the basket 30 in a first direction. The basket 30 includes a base rod 31 for supporting the silicon wafer in the first direction, and the base rod 31 extends along a second direction perpendicular to the first direction.

[0032] Please refer to Figures 1 to 5 The silicon wafer drying tank heat-conducting and flow-equalizing plate 10 of this application embodiment includes a main body 11 and a heat-conducting part 121. The main body 11 is a plate-shaped structure perpendicular to a first direction. For example, the main body 11 can be a flat plate perpendicular to the first direction. A plurality of first air outlet holes 112 are formed on the second surface 111 of the main body 11, wherein the second surface 111 is the surface of the main body 11 facing the basket 30 in the first direction. All the first air outlet holes 112 are evenly spaced, and each first air outlet hole 112 penetrates the main body 11 along the first direction. The heat-conducting part 121 protrudes from the second surface 111 of the main body 11, and the heat-conducting part 121 extends along a second direction. The heat-conducting part 121 can support the bottom rod 31 in the first direction, thereby transferring heat to the bottom rod 31. A plurality of second air outlets 1212 are provided on the first surface 1211 of the heat-conducting part 121. The first surface 1211 is the surface of the heat-conducting part 121 facing the bottom rod 31 in the first direction, that is, the first surface 1211 is the contact surface between the heat-conducting part 121 and the bottom rod 31. All the second air outlets 1212 are evenly spaced, and each second air outlet 1212 passes through the heat-conducting part 121 in the first direction and connects to the first air outlet 112.

[0033] In this embodiment, when the basket 30 is placed on the heat-conducting and uniform flow plate 10 of the silicon wafer drying tank in the tank body 20, the bottom rod 31 and the heat-conducting part 121 come into contact. The heat-conducting part 121 can conduct heat to the bottom rod 31 of the basket 30, improving the drying effect. At the same time, the second air outlet 1212 distributed on the heat-conducting part 121 can fully guide the hot airflow, so that the hot airflow can evenly dry the contact area between the silicon wafer and the bottom rod 31, further improving the drying effect and avoiding basket tooth marks and watermarks on the silicon wafer, thereby improving the product yield of the silicon wafer.

[0034] As an example, please refer to Figure 4 and Figure 5 The second air outlet 1212 can be positioned directly opposite the contact point between the base rod 31 and the heat-conducting part 121. Alternatively, the second air outlet 1212 can be located on either side of the contact point between the base rod 31 and the heat-conducting part 121. The specific configuration can be determined based on actual conditions and will not be elaborated upon here.

[0035] As one implementation method, please refer to Figure 8 A first heater 40 can be installed at the bottom of the silicon wafer drying tank 20, and the first heater 40 can be positioned between the heat-conducting and equalizing plate 10 and the tank 20. A ventilation hole 21 can also be provided at the bottom of the tank 20, and the ventilation hole 21 is connected to a blower 50. For example, the blower 50 can be a blower. The first heater 40 can heat the silicon wafer drying tank and the basket 30 and silicon wafers placed inside the silicon wafer drying tank. When the heat-conducting part 121 of the heat-conducting and equalizing plate 10 of the silicon wafer drying tank is heated by the first heater 40, the heat-conducting part 121 can transfer heat to the bottom rod 31 in contact with the heat-conducting part 121, improving the drying effect. The air output from the blower 50 enters the tank 20 through the ventilation hole 21 and is heated into hot air by the first heater 40. The hot air can be blown into the basket 30 and the silicon wafer placed in the basket 30 through the first air outlet 112. The hot air can also be blown into the base rod 31 through the first air outlet 112 and the second air outlet 1212 in sequence. The second air outlet 1212 can effectively guide the hot airflow to dry the contact area between the silicon wafer and the base rod 31, further improving the drying effect and increasing the product yield of the silicon wafer.

[0036] As an example, please refer to Figure 8 A second heater 60 can also be provided between the ventilation hole 21 and the blowing device 50. The second heater 60 can heat the air blown by the blowing device 50 toward the ventilation hole 21, thereby further improving the drying effect.

[0037] It should be noted that in other embodiments, only the second heater 60 may be provided, or the second heater 60 may not be provided, or other methods may be used to heat the heat-conducting and uniform flow plate 10 of the silicon wafer drying tank and the air output from the first air outlet 112 and the second air outlet 1212.

[0038] In some implementation methods, please refer to Figure 2The heat-conducting and flow-equalizing plate 10 of the silicon wafer drying tank can support multiple baskets 30, thereby improving production efficiency. Multiple heat-conducting components 12 are disposed on the second surface 111 of the main body 11, with each heat-conducting component 12 corresponding to a basket 30. Each heat-conducting component 12 can support the bottom rod 31 of its corresponding basket 30. Specifically, each basket 30 has at least one bottom rod 31, and correspondingly, each heat-conducting component 12 includes at least one heat-conducting part 121, which is disposed in a one-to-one correspondence with the bottom rod 31. Each heat-conducting part 121 directly contacts its corresponding bottom rod 31, thereby more fully heating the bottom rod 31.

[0039] As an example, each flower basket 30 has a base rod 31, and correspondingly, each heat-conducting assembly 12 includes a heat-conducting portion 121. Alternatively, please refer to... Figure 2 Each flower basket 30 has two bottom rods 31, and correspondingly, each heat-conducting assembly 12 includes two heat-conducting parts 121, one of which supports one bottom rod 31 and the other heat-conducting part 121 supports the other bottom rod 31.

[0040] In some implementation methods, please refer to Figure 1 The heat-conducting components 12 are arranged in a matrix, which not only makes the spatial layout more reasonable but also improves production efficiency. For example, please refer to... Figure 1 The main body 11 can be equipped with multiple rows and columns of heat conduction components 12.

[0041] In some examples, please refer to Figure 1 The main body 11 has a total of six heat-conducting components 12, which are divided into three rows of two heat-conducting components 12. Correspondingly, the heat-conducting and flow-equalizing plate 10 of the silicon wafer drying tank can support six baskets 30 at the same time. Each basket 30 corresponds to one heat-conducting component 12.

[0042] In some embodiments, the heat-conducting part 121 and the corresponding base rod 31 are in line contact. Compared to point contact, the contact area between the heat-conducting part 121 and the base rod 31 is larger, resulting in higher heat conduction efficiency and allowing the base rod 31 to be heated evenly and fully. Compared to surface contact, the line contact between the heat-conducting part 121 and the corresponding base rod 31 can effectively avoid interference between the heat-conducting part 121 and the base rod 31 caused by manufacturing errors or other reasons, which would prevent the support part 131 from stably and effectively supporting the base rod 31. Moreover, the line contact between the heat-conducting part 121 and the corresponding base rod 31 can also prevent the second air outlet 1212 from being blocked due to an excessively large contact area, thus affecting the output of hot air from the second air outlet 1212.

[0043] In some implementation methods, please refer to Figure 4 and Figure 5The base rod 31 is a cylindrical rod, meaning that the contact surface between the base rod 31 and the heat-conducting part 121 is the cylindrical outer circumferential surface of the base rod 31. For example, please refer to... Figure 4 The first surface 1211 of the heat-conducting part 121 can be planar, which not only simplifies the structure and facilitates manufacturing, but also offers high versatility. Alternatively, please refer to... Figure 5 The first surface 1211 of the heat-conducting part 121 can also be an arc-shaped surface, which can reduce the distance between the second air outlet 1212 and the bottom rod 31 in the first direction and further improve the drying effect. The radius of curvature of the first surface 1211 can be greater than the radius of the cylindrical outer circumference of the bottom rod 31, which can avoid interference between the heat-conducting part 121 and the bottom rod 31.

[0044] It should be noted that in other embodiments, the first surface 1211 can also be other shapes, which can be set according to actual needs, and will not be elaborated here.

[0045] In some implementation methods, please refer to Figure 2 and Figure 3 The flower basket 30 also includes two end plates 32, which are spaced apart in a second direction. One end plate 32 is connected to one end of the bottom rod 31 in the second direction, and the other end plate 32 is connected to the other end of the bottom rod 31 in the second direction. The silicon wafer drying tank heat-conducting and uniform flow plate 10 also includes a support assembly 13, which includes two support parts 131, which are spaced apart in a second direction. One support part 131 supports one end plate 32 of the flower basket 30 in a first direction, and the other support part 131 supports the other end plate 32 of the flower basket 30 in the first direction. A heat-conducting part 121 is disposed between the two support parts 131.

[0046] In this embodiment, the silicon wafer drying tank heat-conducting uniform flow plate 10 also includes a support component 13 corresponding to the end plate 32, so that the basket 30 can be placed quickly and accurately at a preset position on the silicon wafer drying tank heat-conducting uniform flow plate 10, making it more convenient to use.

[0047] In one implementation, the support components 13 are arranged in a one-to-one correspondence with the flower baskets 30. That is, the number of support components 13 is equal to the number of flower baskets 30, which makes the structure simpler and facilitates the placement of the flower baskets 30.

[0048] As one implementation method, please refer to Figure 2 Each support component 13 corresponds to multiple flower baskets 30, meaning that one support component 13 can support multiple flower baskets 30, resulting in a more reasonable spatial layout and improved production efficiency.

[0049] In some implementation methods, please refer to Figure 1 and Figure 2The support portion 131 extends along a third direction, which is perpendicular to the first and second directions.

[0050] As an example, please refer to Figure 1 , Figure 2 and Figure 7 The silicon wafer drying tank heat-conducting and uniform flow plate 10 includes two support components 13, which are spaced apart in a second direction. Each support component 13 can support three baskets 30, that is, each support component 13 is in contact with three baskets 30 at the same time, and the three baskets 30 are evenly spaced along a third direction.

[0051] In some implementation methods, please refer to Figure 6 The end plate 32 has a third surface 321, which faces the support portion 131 in a first direction. A first limiting structure 322 is provided on the third surface 321 of the end plate 32. The support portion 131 has a fourth surface 1311, which faces the end plate 32 in a first direction. A second limiting structure 1312 is provided on the fourth surface 1311 of the support portion 131. The second limiting structure 1312 and the corresponding first limiting structure 322 are inserted and engaged in the first direction.

[0052] In this embodiment, the end plate 32 and the support portion 131 are respectively provided with a first limiting structure 322 and a second limiting structure 1312 that cooperate with each other. This allows the flower basket 30 to be positioned quickly, accurately, and effectively onto the support assembly 13. Moreover, during the drying process, the first limiting structure 322 and the second limiting structure 1312 cooperate to prevent the flower basket 30 from moving relative to the heat-conducting and uniform flow plate 10 of the silicon wafer drying tank. In addition, if a robotic arm is used to pick up and place the flower basket 30, the cooperating first limiting structure 322 and the second limiting structure 1312 can fix the position of the robotic arm picking up the flower basket 30, preventing the robotic arm from damaging the flower basket 30.

[0053] As an example, please refer to Figure 6 The first limiting structure 322 can be a groove structure, and the second limiting structure 1312 can be a protrusion structure. This not only makes the structure simple, but also enables effective limiting.

[0054] It should be noted that in other embodiments, the first limiting structure 322 and the second limiting structure 1312 can also be other structures, which can be set according to the actual situation, and will not be elaborated here.

[0055] In some implementation methods, please refer to Figure 2 and Figure 3The basket 30 may also include limiting rods 33 spaced apart and symmetrically arranged in a third direction. The limiting rods 33 are parallel to the bottom rod 31, and the two ends of the limiting rods 33 in the second direction are respectively connected to two end plates 32. The bottom rod 31, the limiting rods 33 and the end plates 32 cooperate to confine the silicon wafer within the basket 30.

[0056] It should be noted that the structure of the flower basket 30 is existing technology and will not be described in detail here.

[0057] Please refer to Figure 7 and Figure 8 The silicon wafer drying tank in this application includes a tank body 20 and a heat-conducting and uniform flow plate 10 for the silicon wafer drying tank provided in any of the above embodiments.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The above embodiments merely illustrate preferred implementations of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this patent application should be determined by the appended claims.

Claims

1. A heat-conducting and uniform flow plate for a silicon wafer drying tank, characterized in that, A flower basket is disposed at the bottom of the silicon wafer drying tank and supports it in a first direction. The flower basket includes a bottom rod for supporting the silicon wafer in the first direction and extending in a second direction perpendicular to the first direction. The heat-conducting and flow-equalizing plate of the silicon wafer drying tank includes: The main body is constructed as a plate-like structure perpendicular to the first direction, and the main body has a plurality of evenly spaced first air outlet holes that penetrate the main body along the first direction; and A heat-conducting part protrudes from one end face of the main body in the first direction and extends along the second direction. The heat-conducting part supports the bottom rod in the first direction to transfer heat to the bottom rod. The heat-conducting part has a plurality of second air outlets that are evenly spaced and connected to the first air outlet in the first direction.

2. The heat-conducting and uniform flow plate for the silicon wafer drying tank as described in claim 1, characterized in that, The main body is provided with a plurality of heat-conducting components, each heat-conducting component being arranged in a one-to-one correspondence with the flower basket, and each heat-conducting component including at least one heat-conducting part being arranged in a one-to-one correspondence with the bottom rod.

3. The heat-conducting and uniform flow plate for the silicon wafer drying tank as described in claim 2, characterized in that, The heat-conducting components are arranged in a matrix.

4. The heat-conducting and uniform flow plate for the silicon wafer drying tank as described in claim 1, characterized in that, The heat-conducting part is in line contact with the corresponding bottom rod.

5. The heat-conducting and uniform flow plate for the silicon wafer drying tank as described in claim 4, characterized in that, The base rod is a cylindrical rod, and the heat-conducting part has a first surface that contacts the cylindrical surface of the base rod. The first surface is either a plane or an arc-shaped surface.

6. The heat-conducting and uniform flow plate for the silicon wafer drying tank as described in claim 1, characterized in that, The flower basket also includes two end plates connected to both ends of the base rod in the second direction; The heat-conducting and uniform flow plate of the silicon wafer drying tank also includes a support assembly, which includes two support portions spaced apart in the second direction, and the support portions support the corresponding end plates in the first direction. The heat-conducting part is disposed between the two supporting parts.

7. The heat-conducting and uniform flow plate for the silicon wafer drying tank as described in claim 6, characterized in that, Each support component corresponds to at least one of the flower baskets.

8. The heat-conducting and uniform flow plate for the silicon wafer drying tank as described in claim 6, characterized in that, The support extends along a third direction perpendicular to the first direction and the second direction.

9. The heat-conducting and uniform flow plate for the silicon wafer drying tank as described in claim 6, characterized in that, The end of the end plate facing the support portion has a first limiting structure, and the end of the support portion facing the end plate has a second limiting structure. The second limiting structure and the first limiting structure are inserted and engaged along the first direction.

10. A silicon wafer drying tank, characterized in that, include: Tank body; and The heat-conducting and uniform flow plate for the silicon wafer drying tank as described in any one of claims 1 to 9.

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