Semiconductor device test bench

Abstract

The utility model discloses a semiconductor device test seat, which relates to the technical field of semiconductor detection and comprises a test seat body, a circuit board is mounted on the inner bottom wall of the test seat body, a clamping assembly is arranged outside the circuit board and comprises a gear and two racks, the gear is arranged inside the test seat body, and the two racks are arranged on the gear. The gear is meshed with the two racks, a group of air holes are formed in the inner bottom wall of the testing seat body, and a sliding rail is embedded in the inner side wall of the testing seat body. According to the semiconductor device clamping device, through cooperation of the circuit board, the clamping assembly and the sliding rail, the rotating plate is rotated to drive the two racks to do relative motion, the two clamping plates get close to each other to clamp different semiconductor devices, convenience and rapidness are achieved, and the applicability of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, specifically a semiconductor device test socket. Background Technology

[0002] Semiconductors are among the most commonly used electronic components in electronic products. Semiconductors refer to materials whose conductivity at room temperature is between that of conductors and insulators. They have a wide range of applications in the electronics and electrical industries and are indispensable electronic components for intelligent industrial production.

[0003] Traditional semiconductor device test sockets can only be used to install and test semiconductor devices of a specific size. When installing semiconductor devices of different sizes, the test socket needs to be changed, which is quite troublesome and has certain shortcomings. To address these issues, we provide a semiconductor device test socket that solves the above problems. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a semiconductor device test socket.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor device test socket, comprising a test socket body, a circuit board mounted on the inner bottom wall of the test socket body, a clamping assembly disposed on the outside of the circuit board, the clamping assembly comprising a gear and two racks, the gear being disposed inside the test socket body, the gear meshing with the two racks, a set of vent holes being provided at the beginning of the inner bottom wall of the test socket body, and a slide rail being embedded in the inner side wall of the test socket body.

[0006] Preferably, a rotating rod is fixedly connected to the outer surface of the gear, and the end of the rotating rod away from the gear passes through the outer surface of the test base body and is rotatably connected to the test base body. A rotating plate is fixedly connected to the end of the rotating rod away from the gear.

[0007] Preferably, the upper and lower surfaces of the two racks are respectively fixedly connected to movable blocks, the outer surfaces of the two movable blocks are slidably connected to the inner top wall of the test seat body, the upper and lower surfaces of the two racks are respectively fixedly connected to connecting plates, and the side of the two connecting plates away from the racks is fixedly connected to limit blocks, and the outer surfaces of the two limit blocks are slidably connected to the inner wall of the slide rail.

[0008] Preferably, two movable rods are slidably connected to the inner wall of the connecting plate, and a clamping plate is fixedly connected to one end of the two movable rods away from the connecting plate. A buffer pad is provided on the outer surface of the clamping plate, and a first spring is sleeved on the outer surface of each of the two movable rods. The two ends of the two first springs are fixedly connected to the movable rod and the outer surface of the clamping plate, respectively.

[0009] Preferably, a limiting gear is fixedly connected to the outer surface of the rotating rod, an L-shaped plate is fixedly connected to the outer surface of the test seat body, a support rod is fixedly connected to the outer surface of the L-shaped plate, and a limiting claw is rotatably connected to the outer surface of the support rod.

[0010] Preferably, the limiting claw engages with the limiting gear, and a second spring is fixedly connected to the upper surface of the L-shaped plate, with the top end of the second spring fixedly connected to the bottom surface of the limiting claw.

[0011] Beneficial effects:

[0012] Compared with existing technologies, this semiconductor device test socket has the following advantages:

[0013] I. This utility model utilizes the cooperation between the circuit board, clamping components, and slide rail to rotate the rotating plate, causing the two racks to move relative to each other, thus bringing the two clamping plates closer together to clamp different semiconductor devices. This is convenient, quick, and improves the applicability of the device.

[0014] Second, this utility model, through the cooperation between the limiting gear and the limiting claw, can limit the gear after the clamping plate clamps the semiconductor device, preventing the gear from flipping under the action of the first spring and affecting the clamping effect of the semiconductor device. Attached Figure Description

[0015] Figure 1 This is a three-dimensional front view structural diagram of the present invention;

[0016] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0017] Figure 3 This is a three-dimensional schematic diagram of the clamping assembly of this utility model;

[0018] Figure 4 This is a partial structural diagram of the clamping assembly of this utility model.

[0019] In the diagram: 1. Test base body; 2. Circuit board; 3. Clamping assembly; 301. Gear; 302. Rotating rod; 303. Rack; 304. Moving block; 305. Connecting plate; 306. Moving rod; 307. Clamping plate; 308. First spring; 309. Buffer pad; 310. Limiting gear; 311. L-shaped plate; 312. Support rod; 313. Limiting claw; 314. Second spring; 315. Rotating plate; 316. Limiting block; 4. Vent hole; 5. Slide rail. Detailed Implementation

[0020] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0021] See Figures 1-4 A semiconductor device test socket includes a test socket body 1, a circuit board 2 is mounted on the inner bottom wall of the test socket body 1, and a metal part for testing semiconductor devices is provided on the upper surface of the circuit board 2. The semiconductor device can be tested through the circuit board 2.

[0022] The circuit board 2 is provided with a clamping assembly 3 on its exterior. The clamping assembly 3 includes a gear 301 and two racks 303. The gear 301 is located inside the test base body 1. The gear 301 meshes with the two racks 303. Through the meshing of the gear 301 and the two racks 303, the gear 301 can cause the two racks 303 to move in opposite directions when it rotates, which facilitates the subsequent clamping and fixing of the semiconductor device.

[0023] A rotating rod 302 is fixedly connected to the outer surface of the gear 301. The end of the rotating rod 302 away from the gear 301 passes through the outer surface of the test base body 1 and is rotatably connected to the test base body 1. A rotating plate 315 is fixedly connected to the end of the rotating rod 302 away from the gear 301. The rotating plate 315 facilitates the operator to rotate the gear 301, thereby facilitating the clamping of the semiconductor device by the two clamping plates 307, which is convenient for subsequent testing of the semiconductor device.

[0024] The upper and lower surfaces of the two racks 303 are respectively fixedly connected to movable blocks 304. The outer surfaces of the two movable blocks 304 are slidably connected to the inner top wall of the test base body 1. The inner bottom wall and inner top wall of the test base body 1 are provided with sliding grooves that are adapted to the movable blocks 304, so that the movable blocks 304 can slide in the sliding grooves, which facilitates the subsequent clamping and fixing of semiconductor devices.

[0025] Connecting plates 305 are fixedly connected to the upper and lower surfaces of the two racks 303 respectively. Limiting blocks 316 are fixedly connected to the side of the two connecting plates 305 away from the racks 303. The outer surfaces of the two limiting blocks 316 are slidably connected to the inner wall of the slide rail 5. The limiting blocks 316 can ensure that the clamping plate 307 can move horizontally and prevent the clamping plate 307 from tilting during the movement, which would affect the normal use of the device.

[0026] Two moving rods 306 are slidably connected to the inner wall of the connecting plate 305. A clamping plate 307 is fixedly connected to one end of the two moving rods 306 away from the connecting plate 305. A buffer pad 309 is provided on the outer surface of the clamping plate 307. The buffer pad 309 is made of rubber and can buffer the semiconductor device to prevent damage to the semiconductor device during clamping.

[0027] The outer surfaces of the two moving rods 306 are each fitted with a first spring 308. The two ends of the two first springs 308 are fixedly connected to the outer surfaces of the moving rods 306 and the clamping plate 307, respectively. After the moving rods 306 clamp the semiconductor device, they are compressed to generate a certain tension to prevent the semiconductor device from shifting.

[0028] The outer surface of the rotating rod 302 is fixedly connected to a limiting gear 310. The outer surface of the test seat body 1 is fixedly connected to an L-shaped plate 311. The outer surface of the L-shaped plate 311 is fixedly connected to a support rod 312. The outer surface of the support rod 312 is rotatably connected to a limiting claw 313. The limiting claw 313 engages with the limiting gear 310. The limiting claw 313 can limit the limiting gear 310, preventing the semiconductor device from flipping after clamping and affecting the clamping and fixing effect.

[0029] A second spring 314 is fixedly connected to the upper surface of the L-shaped plate 311. The top end of the second spring 314 is fixedly connected to the bottom surface of the limiting claw 313. A set of vent holes 4 are located on the inner bottom wall of the test base body 1. A slide rail 5 is embedded in the inner side wall of the test base body 1. The second spring 314 can drive the limiting claw 313 to rise and then reset when the limiting gear 310 rotates, which facilitates the limiting of the limiting gear 310. The vent holes 4 can achieve a certain heat dissipation function to prevent the internal temperature of the device from being too high when testing semiconductor devices.

[0030] Working principle: When installing a semiconductor device, first place the semiconductor into the test holder body 1. Then, rotate the rotating plate 315 to drive the gear 301 to rotate. Utilizing the meshing between the gear 301 and the two racks 303, the rotation of the gear 301 causes the two racks 303 to move in opposite directions, thereby driving the two clamping plates 307 to move closer together to clamp and fix the semiconductor device. When the clamping plates 307 contact the outer surface of the semiconductor device, continue rotating the rotating plate 315 to compress the first spring 308. When rotation stops, the first spring 308 will generate a certain tension, making the semiconductor device clamped more securely. This achieves the effect of clamping the semiconductor device, which is convenient and quick. It can clamp semiconductor devices of different sizes, improving the applicability of the device. At the same time, all contents not described in detail in this specification are prior art known to those skilled in the art.

[0031] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor device test socket, comprising a test socket body (1), characterized in that: A circuit board (2) is installed on the inner bottom wall of the test base body (1). A clamping assembly (3) is provided on the outside of the circuit board (2). The clamping assembly (3) includes a gear (301) and two racks (303). The gear (301) is located inside the test base body (1). The gear (301) meshes with the two racks (303). A set of ventilation holes (4) is located at the beginning of the inner bottom wall of the test base body (1). A slide rail (5) is embedded in the inner side wall of the test base body (1).

2. The semiconductor device test socket according to claim 1, characterized in that: A rotating rod (302) is fixedly connected to the outer surface of the gear (301). The end of the rotating rod (302) away from the gear (301) passes through the outer surface of the test base body (1) and is rotatably connected to the test base body (1). A rotating plate (315) is fixedly connected to the end of the rotating rod (302) away from the gear (301).

3. A semiconductor device test socket according to claim 1, characterized in that: Movable blocks (304) are fixedly connected to the upper and lower surfaces of the two racks (303), respectively. The outer surfaces of the two movable blocks (304) are slidably connected to the inner top wall of the test seat body (1). Connecting plates (305) are fixedly connected to the upper and lower surfaces of the two racks (303), respectively. Limiting blocks (316) are fixedly connected to the side of the two connecting plates (305) away from the racks (303), respectively. The outer surfaces of the two limiting blocks (316) are slidably connected to the inner wall of the slide rail (5).

4. A semiconductor device test socket according to claim 3, characterized in that: Two movable rods (306) are slidably connected to the inner wall of the connecting plate (305). A clamping plate (307) is fixedly connected to one end of the two movable rods (306) away from the connecting plate (305). A buffer pad (309) is provided on the outer surface of the clamping plate (307). A first spring (308) is sleeved on the outer surface of each of the two movable rods (306). The two ends of the two first springs (308) are fixedly connected to the outer surfaces of the movable rods (306) and the clamping plate (307), respectively.

5. A semiconductor device test socket according to claim 2, characterized in that: A limiting gear (310) is fixedly connected to the outer surface of the rotating rod (302), an L-shaped plate (311) is fixedly connected to the outer surface of the test seat body (1), a support rod (312) is fixedly connected to the outer surface of the L-shaped plate (311), and a limiting claw (313) is rotatably connected to the outer surface of the support rod (312).

6. A semiconductor device test socket according to claim 5, characterized in that: The limiting claw (313) engages with the limiting gear (310), and a second spring (314) is fixedly connected to the upper surface of the L-shaped plate (311). The top end of the second spring (314) is fixedly connected to the bottom surface of the limiting claw (313).

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