Low stray inductance reactive power device testing device

By optimizing the component structure and movement mode of the reactive power device testing device, the problem of high random inductance in the testing system was solved, resulting in more accurate test results and a higher yield rate, which is applicable to fields such as new energy vehicles.

CN223842063UActive Publication Date: 2026-01-27杭州中安电子股份有限公司
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Patent Information

Application Number
CN202520033788.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-08
Publication Date
2026-01-27
Estimated Expiration
2035-01-08

AI Technical Summary

Technical Problem

Existing reactive power device testing systems have high stray inductance under high current and high voltage conditions, leading to inaccurate test results and potentially damaging the devices, thus failing to meet the stringent testing requirements of fields such as new energy vehicles.

Method used

A test device for low-stray-inductance reactive power devices was designed, including a test base component, a test load component, a test probe component, and a test busbar component. By optimizing the component structure and movement mode, the stray inductance of the test system is reduced and the test accuracy is improved.

Benefits of technology

It reduces noise in the testing system, improves the accuracy of IGBT power device testing, realistically simulates the operating conditions of the device's supporting components, increases yield, and reduces usage costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

A low-stray-inductance reactive power device testing device relates to the technical field of semiconductor device testing and comprises a testing basic assembly serving as a carrier, a testing load assembly, a testing probe assembly and a testing busbar assembly, the testing load assembly, the testing probe assembly and the testing busbar assembly are arranged on the testing basic assembly, the testing probe assembly is located in the middle, and the testing load assembly and the testing busbar assembly are located on the two sides respectively. The test load assembly and the test busbar assembly are respectively connected with the cylinder assembly, during testing, a device to be tested is pressed tightly with the test probe assembly in the vertical direction by the jacking device, and then the test load assembly and the test busbar assembly are pushed by the cylinder to move inwards to press the pins of the device so as to ensure fitting. And a large-current high-voltage working condition simulation test can be carried out. The testing device provided by the utility model can reduce the stray inductance of a reactive power testing system, improve the testing accuracy of an IGBT power device, simulate the use condition of a matched component of the device more truly, and further improve the yield of the matched component of the device.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor device testing technology, and in particular to a testing device for low-stray-inductance reactive power devices. Background Technology

[0002] The AC reactive power testing system is a testing device used for power semiconductor (Si / SiC) packaging testing, finished product aging, and dynamic and static testing. It is suitable for testing in application scenarios such as new energy vehicles, photovoltaics, and military industries. By simulating various real-world applications under high current and harsh operating conditions, it can screen for defects in modules, effectively improving the pass rate of supporting component products and reducing losses.

[0003] Currently, reactive power devices are highly sensitive to system stray inductance during high-current, high-voltage testing. High stray inductance leads to inaccurate test results, inconsistent product quality, and in severe cases, even device burnout. With the development of the new energy vehicle industry, the application of reactive power device testing is increasing. However, existing equipment has high stray inductance and cannot meet the increasingly stringent testing requirements for reactive power devices. Utility Model Content

[0004] To address the above needs, this utility model provides a low-stray-inductance reactive power device testing device, which can reduce the stray inductance of the reactive power testing system, improve the accuracy of IGBT power device testing, more realistically simulate the operating conditions of the device's supporting components, and thus improve the yield rate of the device's supporting components.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A testing device for low-stray-inductance reactive power devices includes a test base component as a carrier and a test load component, a test probe component, and a test busbar component on it. The test probe component is located in the middle, and the test load component and the test busbar component are located on the two sides respectively.

[0007] The test base assembly includes a test base assembly housing. Test base assembly slider rails are respectively arranged on both sides of the bottom surface of the test base assembly housing. Each test base assembly slider rail is equipped with a test load assembly fixing slider and a test busbar assembly fixing slider. The test load assembly includes a load moving base plate. Load fixing insulating seats are arranged on the inner top and end surfaces of the load moving base plate. A load UVW limiting plate is arranged on the inner bottom surface. Several rows of equidistantly distributed load flexible connections are arranged between the load fixing insulating seats and the load UVW limiting plate. The two sides of the load moving base plate are respectively fixed to the test load assembly fixing sliders. The test probe assembly includes a test fixing plate. Several rows of equidistantly distributed fixing plate reinforcing ribs are arranged on the bottom surface of the test fixing plate. Device clamping blocks are arranged at the ends of the fixing plate reinforcing ribs. The test fixing plate is fixed in the middle of the bottom surface of the test base assembly housing. The test busbar assembly includes an outer capacitor fixing base plate, an inner capacitor insulating cover plate, two side capacitor fixing side plates, and a capacitor between them. A busbar moving base plate is provided at the inner end of the bottom surface of the capacitor fixing side plate, and a PN limiting plate is provided at the inner end of the bottom surface of the busbar moving base plate. Several sets of equidistantly distributed capacitor busbars are provided between the PN limiting plate and the capacitor. The two sides of the busbar moving base plate are respectively fixed to the test busbar assembly fixing slider.

[0008] The test load assembly and test busbar assembly are connected to the cylinder assembly, and can move along the slider guide rail of the test base assembly under the push of the cylinder. During testing, the device under test is pressed vertically against the test probe assembly by the lifting device, and then the test load assembly and test busbar assembly move inward under the push of the cylinder to press the pins of the device to ensure contact, so that high current and high voltage operating condition simulation test can be performed.

[0009] Preferably, the number of fixed sliders for the test load component is two, one on each of the slider guide rails of the test base component, and the number of fixed sliders for the test busbar component is four, two on each of the slider guide rails of the test base component.

[0010] Preferably, the outer side of the bottom surface of the load-moving base plate is provided with a groove, a load adjustment cover plate is provided in the groove, and an adjustment spring is provided in the load adjustment cover plate.

[0011] Preferably, the bottom surface of the test fixing plate between the reinforcing ribs of the fixing plate is provided with a groove, and a temperature probe is installed in the groove.

[0012] The advantages of this utility model are: 1. The short test current creepage path of the device can reduce the noise of the reactive power test system, improve the accuracy of IGBT power device testing, and more realistically simulate the working conditions of the device's supporting components, thereby improving the yield rate of the device's supporting components; 2. Each component can be flexibly replaced according to different devices, compatible with bent-leg devices and straight-leg devices, and the load clamping force is adjustable, reducing the cost of use, matching the requirements of different devices, and improving the utilization rate of the equipment. Attached Figure Description

[0013] Figure 1 This is a perspective view of the present utility model;

[0014] Figure 2 This is a perspective view of the basic testing components in this utility model;

[0015] Figure 3 This is a perspective view of the test load component in this utility model;

[0016] Figure 4 This is a perspective view of the test probe assembly in this utility model;

[0017] Figure 5 This is a perspective view of the test busbar assembly in this utility model.

[0018] Explanation of key component symbols in the diagram:

[0019] 1. Test the basic components; 1.1 Test the housing of the basic components; 1.2 Test the fixed slider of the load components; 1.3 Test the slider guide rail of the basic components; 1.4 Test the fixed slider of the busbar components;

[0020] 2. Test load components; 2.1 Load moving base plate; 2.2 Load fixing insulating base; 2.3 Load adjusting cover plate; 2.4 Load UVW limit plate; 2.5 Load flexible connection;

[0021] 3. Test probe assembly; 3.1 Test mounting plate; 3.2 Mounting plate reinforcing ribs; 3.3 Device clamping block; 3.4 Temperature probe;

[0022] 4. Test busbar assembly; 4.1 Capacitor fixing base plate; 4.2 Capacitor fixing side plate; 4.3 Capacitor; 4.4 PN limiting plate; 4.5 Capacitor insulating cover plate; 4.6 Busbar moving base plate; 4.7 Capacitor busbar. Detailed Implementation

[0023] To more clearly illustrate this utility model, the following description, in conjunction with the accompanying drawings, will provide further details.

[0024] Example 1: As Figure 1As shown, a low-stray-inductance reactive power device testing device includes a test base component 1 as a carrier and a test load component 2, a test probe component 3 and a test busbar component 4 on it. The test probe component 3 is located in the middle, and the test load component 2 and the test busbar component 4 are located on the two sides respectively.

[0025] Combination Figure 2 As shown, the test base component 1 includes a test base component housing 1.1. Test base component slider guide rails 1.3 are respectively provided on both sides of the bottom surface of the test base component housing 1.1. Each test base component slider guide rail 1.3 is provided with a test load component fixing slider 1.2 and a test busbar component fixing slider 1.4.

[0026] Combination Figure 3 As shown, the test load assembly 2 includes a load moving base plate 2.1. The top and end faces of the inner side of the load moving base plate 2.1 are provided with load fixing insulating seats 2.2, and the bottom surface of the inner side is provided with load UVW limiting plates 2.4. Several rows of load soft connections 2.5 are provided between the load fixing insulating seats 2.2 and the load UVW limiting plates 2.4. The two sides of the load moving base plate 2.1 are respectively fixed to the test load assembly fixing sliders 1.2.

[0027] Combination Figure 4 As shown, the test probe assembly 3 includes a test fixing plate 3.1. The bottom surface of the test fixing plate 3.1 is provided with several rows of equally spaced fixing plate reinforcing ribs 3.2. The ends of the fixing plate reinforcing ribs 3.2 are provided with device clamping blocks 3.3. The test fixing plate 3.1 is fixed in the middle of the bottom surface of the test base assembly housing 1.1.

[0028] Combination Figure 5 As shown, the test busbar assembly 4 includes an outer capacitor fixing base plate 4.1, an inner capacitor insulating cover plate 4.5, two side capacitor fixing side plates 4.2, and a capacitor 4.3 between them. A busbar moving base plate 4.6 is provided at the inner end of the bottom surface of the capacitor fixing side plate 4.2, and a PN limiting plate 4.4 is provided at the inner end of the bottom surface of the busbar moving base plate 4.6. Several sets of equidistantly distributed capacitor busbars 4.7 are arranged between the PN limiting plate 4.4 and the capacitor 4.3. The two sides of the busbar moving base plate 4.6 are respectively fixed to the test busbar assembly fixing slider 1.4. The two sides of the busbar moving base plate 4.6 extend beyond the capacitor fixing side plate 4.2, and the extended portions are fixed to the test busbar assembly fixing slider 1.4.

[0029] Example 2: Figure 2As shown, based on Embodiment 1, the number of test load component fixing sliders 1.2 is two, one on each of the test base component slider guide rails 1.3, and the test load component 2 is fixed on the two test load component fixing sliders 1.2. The number of test busbar component fixing sliders 1.4 is four, two on each of the test base component slider guide rails 1.3, and the test busbar component 4 is fixed on the four test busbar component fixing sliders 1.4.

[0030] Example 3: Figure 3 As shown, based on Embodiment 1 or Embodiment 2, a groove is provided on the outer side of the bottom surface of the load motion base plate 2.1, and a load adjustment cover plate 2.3 is provided in the groove. An adjustment spring is provided inside the load adjustment cover plate 2.3. The adjustment spring can adjust the clamping force to adapt to the requirements of different devices.

[0031] Example 4: Figure 4 As shown, based on Embodiment 1, Embodiment 2, or Embodiment 3, a groove is provided on the bottom surface of the test fixing plate 3.1 between the fixing plate reinforcing ribs 3.2, and a temperature probe 3.4 is installed in the groove. The temperature probe 3.4 is used to detect the temperature of the device.

[0032] In the above embodiments, the number of fixed devices in the test probe assembly 3 is three, the number of load soft connections 2.5 on the corresponding test load assembly 2 is three, and the number of capacitor busbars 4.7 on the test busbar assembly 4 is three sets.

[0033] The above description is only a specific embodiment of the present utility model, but the structural features of the present utility model are not limited thereto. The present utility model can be used in similar products. Any changes or modifications made by those skilled in the art within the scope of the present utility model are covered by the patent scope of the present utility model.

Claims

1. A testing device for low-stray-inductance reactive power devices, characterized in that: It includes a test base component (1) as a carrier and a test load component (2), a test probe component (3) and a test busbar component (4) on it. The test probe component (3) is located in the middle, and the test load component (2) and the test busbar component (4) are located on the two sides respectively. The test base component (1) includes a test base component housing (1.1), and test base component slider guide rails (1.3) are respectively provided on both sides of the bottom surface of the test base component housing (1.1). Each test base component slider guide rail (1.3) is provided with a test load component fixing slider (1.2) and a test busbar component fixing slider (1.4). The test load assembly (2) includes a load moving base plate (2.1), a load fixing insulating seat (2.2) is provided on the inner top surface and end surface of the load moving base plate (2.1), a load UVW limiting plate (2.4) is provided on the inner bottom surface, and several rows of load soft connections (2.5) are provided between the load fixing insulating seat (2.2) and the load UVW limiting plate (2.4). The two sides of the load moving base plate (2.1) are respectively fixed to the test load assembly fixing slider (1.2). The test probe assembly (3) includes a test fixing plate (3.1), the bottom surface of the test fixing plate (3.1) is provided with several rows of equally spaced fixing plate reinforcing ribs (3.2), the ends of the fixing plate reinforcing ribs (3.2) are provided with device clamping blocks (3.3), and the test fixing plate (3.1) is fixed in the middle of the bottom surface of the test base assembly housing (1.1); The test busbar assembly (4) includes an outer capacitor fixing base plate (4.1), an inner capacitor insulating cover plate (4.5), two side capacitor fixing side plates (4.2), and a capacitor (4.3) between them. A busbar moving base plate (4.6) is provided at the inner end of the bottom surface of the capacitor fixing side plate (4.2). A PN limiting plate (4.4) is provided at the inner end of the bottom surface of the busbar moving base plate (4.6). Several sets of equidistantly distributed capacitor busbars (4.7) are provided between the PN limiting plate (4.4) and the capacitor (4.3). The two sides of the busbar moving base plate (4.6) are respectively fixed to the test busbar assembly fixing slider (1.4).

2. The low-stray-inductance reactive power device testing device according to claim 1, characterized in that: The number of fixed sliders (1.2) for the test load component is two, one on each of the test base component slider rails (1.3), and the number of fixed sliders (1.4) for the test busbar component is four, two on each of the test base component slider rails (1.3).

3. The low-stray-inductance reactive power device testing device according to claim 1, characterized in that: The load-moving base plate (2.1) has a groove on the outer side of its bottom surface, and a load adjustment cover plate (2.3) is provided in the groove. An adjustment spring is provided in the load adjustment cover plate (2.3).

4. A testing device for low-stray-inductance reactive power devices according to any one of claims 1-3, characterized in that: The bottom surface of the test fixing plate (3.1) between the fixing plate reinforcing ribs (3.2) is provided with a groove, and a temperature probe (3.4) is provided in the groove.