Multifunctional integrated host case

Abstract

The utility model relates to a multifunctional integrated host case, which is used for radiating and guiding air for equipment in the host case, and comprises a case body, a radiating component and a dustproof component, the left side and the right side of the case body are respectively provided with an air inlet channel and an air outlet channel, the radiating component is arranged on the air inlet channel, and the dustproof component is arranged on the air outlet channel; the heat dissipation assembly comprises an installation frame installed on the air outlet channel and a fan installed on the installation frame. The fan comprises an air outlet formed in the side facing the air outlet channel and an air inlet formed in the side opposite to the air outlet channel. The dustproof assembly comprises a dustproof slide rail which is mounted on the outer wall of the box body away from one side of the heat dissipation assembly and a dustproof plate which is arranged on the dustproof slide rail in a sliding manner and is used for covering the air outlet channel; cold air is introduced through the air inlet channel, the heat dissipation assembly accelerates air flow, and hot air is discharged through the air outlet channel, so that stable performance of equipment is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of equipment chassis technology, and in particular to a multifunctional integrated host chassis. Background Technology

[0002] With the development of various production activities, the equipment housed in multi-functional integrated mainframe chassis often needs to operate stably for extended periods to support critical tasks such as production data processing and equipment control. During operation, the equipment continuously generates heat, and excessive heat accumulation can lead to a decline in the performance of internal electronic components. Utility Model Content

[0003] Therefore, the purpose of this utility model is to provide a multi-functional integrated host chassis with good heat dissipation.

[0004] The present invention adopts the following technical solution:

[0005] A multi-functional integrated host chassis is used for heat dissipation and airflow guidance for internal equipment. The multi-functional integrated host chassis includes a housing with air inlet and air outlet channels respectively set on the left and right sides, a heat dissipation component set on the air inlet channel, and a dustproof component set on the air outlet channel. The heat dissipation component includes a mounting bracket installed on the air outlet channel and a fan installed on the mounting bracket. The fan includes an air outlet set on one side of the air outlet channel and an air inlet set on the opposite side of the air outlet channel. The dustproof component includes a dustproof slide rail installed on the outer wall of the housing on the side opposite to the heat dissipation component and a dustproof plate slidably mounted on the dustproof slide rail for covering the air outlet channel.

[0006] Furthermore, the multi-functional integrated host chassis also includes a motherboard disposed inside the chassis and heat dissipation fins mounted on the outer surface of the motherboard, the heat dissipation fins being disposed on the motherboard on one side of the heat dissipation assembly.

[0007] Furthermore, the multi-functional integrated host chassis also includes a fixing component disposed within the chassis for fixing the motherboard.

[0008] Furthermore, the fixing component includes a fixing bracket installed at the upper and lower ends of the housing and a first roller rotatably mounted on the fixing bracket, and the motherboard is slidably mounted on the fixing bracket via the first roller.

[0009] Furthermore, the multi-functional integrated host chassis also includes a heat dissipation block, which is mounted on the motherboard on the side opposite to the heat dissipation fins.

[0010] Furthermore, the multi-functional integrated host chassis also includes a heat dissipation bracket for fixing the heat dissipation conduction block and a second roller that is rotatably mounted on the heat dissipation bracket. The heat dissipation bracket is mounted on the chassis on one side of the fixed support, and the heat dissipation conduction block is slidably mounted on the heat dissipation bracket via the second roller.

[0011] Furthermore, there are multiple fans, which are vertically arranged side by side on the mounting bracket.

[0012] Furthermore, there are multiple air intake channels, which are arranged horizontally side by side.

[0013] Furthermore, there are multiple dustproof plates, which are horizontally arranged side by side on the dustproof slide rail.

[0014] Furthermore, the dustproof plate is provided with multiple air outlets.

[0015] The beneficial effects of this utility model are as follows:

[0016] The multi-functional integrated host chassis involved in this utility model introduces cold air through the air intake channel, accelerates airflow through the heat dissipation component, and exhausts hot air through the air outlet channel. This can quickly remove the heat generated by the equipment inside the chassis, thereby ensuring the stable performance of the equipment. The positional design of the air intake and exhaust channels, as well as the function of the heat dissipation component, enable air to circulate in all parts of the chassis, preventing local equipment from overheating and causing damage when there is no good ventilation system. Attached Figure Description

[0017] Figure 1 This is a perspective view of a multi-functional integrated host chassis according to an embodiment of the present utility model;

[0018] Figure 2 for Figure 1 A three-dimensional diagram of the multi-functional integrated host chassis from another angle;

[0019] Figure 3 for Figure 1 Exploded view of a multi-functional integrated host chassis;

[0020] Figure 4 for Figure 3 An exploded view of the multi-functional integrated host chassis from another angle. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be noted that the terms "vertical direction," "up," "down," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0024] Please see Figures 1 to 4 This is a multi-functional integrated host chassis according to one embodiment of the present invention, used for heat dissipation and airflow for internal equipment. The multi-functional integrated host chassis includes a box body 10 with an air inlet channel 11 and an air outlet channel 12 respectively set on the left and right sides, a heat dissipation component 20 set on the air inlet channel 11, and a dustproof component 30 set on the air outlet channel 12. The heat dissipation component 20 includes a mounting bracket 21 installed on the air outlet channel 12, and a fan 22 installed on the mounting bracket 21. The fan 22 includes an air outlet 23 set on one side of the air outlet channel 12 and an air inlet 24 set on the opposite side of the air outlet channel 12. The dustproof component 30 includes a dustproof slide rail 31 installed on the outer wall of the box body 10 on the side away from the heat dissipation component 20, and a dustproof plate 32 slidably set on the dustproof slide rail 31 for covering the air outlet channel 12.

[0025] The working principle of this multi-functional integrated host chassis is as follows: When the multi-functional integrated host chassis starts working, the fan 22 in the heat dissipation component 20 starts; the air inlet 24 of the fan 22 draws air in from the air inlet channel 11 of the chassis 10; since the air inlet channel 11 and the air outlet channel 12 are located on the left and right sides of the chassis 10 respectively, the air can form good convection inside the chassis 10. After the external air is drawn into the air inlet channel 11, it will flow through various internal devices inside the chassis 10; these devices will generate heat during operation, and the flowing air can absorb this heat, playing a preliminary heat dissipation role; the air that has absorbed the heat will flow towards the air outlet channel 12 under the action of the fan 22; the air outlet 23 of the fan 22 will expel the hot air. The hot air is pushed towards the exhaust duct 12. When the hot air reaches the exhaust duct 12, it can be smoothly discharged to the outside of the enclosure 10, thus completing a heat dissipation cycle. The dustproof component 30 is mainly to prevent external dust and other impurities from entering the enclosure 10. When the enclosure is not working or the fan 22 is not turned on, the dustproof plate 32 can slide to cover the exhaust duct 12 to prevent dust from entering the enclosure 10 through the exhaust duct 12. When the fan 22 is working and hot air is discharged, the pressure of the hot air will cause the dustproof plate 32 to move to a suitable position on the dustproof slide rail 31, which will not obstruct the discharge of hot air. At the same time, after the air is discharged, the dustproof plate 32 can return to a certain protective position to prevent dust from entering when the enclosure is not working.

[0026] Compared to existing technologies, this utility model's multi-functional integrated host chassis introduces cool air through the air intake channel 11, accelerates airflow through the heat dissipation component 20, and exhausts hot air through the air outlet channel 12. This allows for the rapid removal of heat generated by the equipment within the chassis, ensuring stable performance. The placement of the air intake and exhaust channels 11 and 12, along with the function of the heat dissipation component 20, ensures airflow throughout the chassis, preventing overheating and damage to equipment in areas without adequate ventilation. Through these effective heat dissipation and dust prevention measures, the equipment within the chassis can operate stably. The equipment operates in an environment where it will not frequently crash or restart due to overheating or dust interference. The dustproof component 30 is designed to effectively prevent dust from entering the chassis. In production environments, dust is usually abundant, and dust entering the chassis may accumulate on electronic equipment, affecting its heat dissipation. Excessive dust may also cause short circuits in electronic components. The dustproof plate 32 can cover the exhaust duct 12 when the chassis is not in operation or after air is exhausted, reducing the chance of dust entering, keeping the inside of the chassis clean, thereby ensuring the normal operation of the equipment and reducing the risk of equipment failure caused by dust.

[0027] Please see Figure 4The multi-functional integrated host chassis also includes a motherboard 40 disposed within the chassis 10 and heat dissipation fins 50 mounted on the outer surface of the motherboard 40. The heat dissipation fins 50 are disposed on the motherboard 40 on one side of the heat dissipation assembly 20. In this embodiment, the heat dissipation fins 50 are copper sheets. Since the heat dissipation fins 50 are disposed on one side of the heat dissipation assembly 20, when the heat dissipation assembly 20 is working, the cold air drawn in through the air intake channel 11 will blow directly onto the heat dissipation fins 50; the cold air carries away the heat on the heat dissipation fins 50, thereby achieving heat dissipation for the motherboard 40; when the air flows through the heat dissipation fins 50, due to their special shape (such as fin shape), more sufficient convection can be generated between the air and the heat dissipation fins 50; this convection effect allows heat to be transferred more efficiently from the heat dissipation fins 50 to the air, further enhancing the heat dissipation effect, ensuring that the motherboard 40 can work in a suitable temperature environment, and avoiding performance degradation or failure due to overheating.

[0028] Please see Figure 3 and Figure 4 The multi-functional integrated host chassis also includes a fixing component disposed within the chassis 10 for fixing the motherboard 40. The fixing component includes fixing brackets 61 mounted at the upper and lower ends of the chassis 10 and first rollers 62 rolled on the fixing brackets. The motherboard 40 slides onto the fixing brackets 61 via the first rollers 62. When the motherboard 40 needs to be installed, it can slide into the fixing brackets 61 via the first rollers 62. The rolled first rollers 62 effectively reduce the friction between the motherboard 40 and the fixing brackets 61. This reduced friction allows the motherboard 40 to enter the designated position more smoothly during installation, and also reduces the risk of damage to the motherboard 40 or the fixing brackets due to friction during installation, protecting the motherboard 40 and the chassis structure. The precise installation positions of the upper and lower ends of the fixing brackets 61 ensure that the motherboard 40 is at the correct height within the chassis and restricts its vertical movement. The first rollers 62, when rolling... During the process, the first roller 62 also provides a certain lateral limiting function for the motherboard 40. When the motherboard 40 is placed in the correct position, the first roller 62 and the fixed bracket 61 work together to prevent the motherboard 40 from shifting in the horizontal direction. This ensures that the various interfaces on the motherboard 40 maintain stable connections with other devices in the chassis and prevents problems such as poor contact due to the shaking of the motherboard 40. In the production environment, the equipment may be affected by vibration. When the chassis is vibrated, the first roller 62 can play a certain buffering role. Because the roller can rotate flexibly to a certain extent, compared with the rigid connection method, it can reduce the force of vibration transmitted to the motherboard 40.

[0029] The multi-functional integrated chassis also includes a heat dissipation block 70, which is mounted on the motherboard 40 on the side opposite the heat sink fins 50. When the motherboard 40 is operating, the electronic components on the side opposite the heat sink fins 50 also generate heat; this heat is transferred to the heat dissipation block 70 on the motherboard 40. The heat dissipation block 70 can quickly collect the heat generated by the components on the back of the motherboard 40. After absorbing the heat, the heat dissipation block 70 diffuses the heat to the surroundings. Due to air convection inside the chassis, especially with the help of the heat dissipation component 20, heat is transferred from the heat dissipation block 70 to the surrounding air. This achieves balanced heat dissipation on both the front and back sides of the motherboard 40. Through the operation of the heat dissipation block 70, the overall temperature distribution of the motherboard 40 is more uniform, which is beneficial to improving the stability and lifespan of the motherboard 40.

[0030] The multi-functional integrated host chassis also includes a heat dissipation bracket 81 for fixing the heat dissipation conduction block 70 and a second roller 82 that is rolled on the heat dissipation bracket 81. The heat dissipation bracket 81 is mounted on the chassis 10 on one side of the fixing bracket 61, and the heat dissipation conduction block 70 slides on the heat dissipation bracket 81 via the second roller 82. When the heat dissipation conduction block 70 needs to be installed, the operator can easily push the heat dissipation conduction block 70 to the designated position along the second roller 82. The second roller 82 reduces the friction between the heat dissipation conduction block 70 and the heat dissipation bracket 81. During installation, the lower friction allows the heat dissipation conduction block 70 to enter the installation position more smoothly, reducing the damage that may be caused to the heat dissipation conduction block 70 and the heat dissipation bracket 81 during installation, while also saving installation time and labor costs. The heat dissipation bracket 81 provides a precise installation position for the heat dissipation conduction block 70; it is mounted on one side of the fixing bracket 61. On the enclosure 10, the relative position between the heat dissipation block 70 and the motherboard 40 is ensured to be accurate. This ensures that the heat dissipation block 70 is in close contact with the parts of the motherboard 40 that need heat dissipation, effectively transferring heat. The second roller 82 plays a certain lateral limiting role for the heat dissipation block 70 during the rolling process. After the heat dissipation block 70 is installed in place, the second roller 82 and the heat dissipation bracket 81 work together to prevent the heat dissipation block 70 from shifting unnecessarily in the horizontal direction. This is very important for ensuring that the heat dissipation block 70 works stably and continuously and effectively transfers heat from the back of the motherboard 40.

[0031] Please see Figure 1 and Figure 3Multiple fans 22 are mounted vertically side-by-side on the mounting bracket 21. This vertically arranged arrangement significantly increases airflow; when these fans 22 operate simultaneously, they act like a combined "air pump." Each fan 22 has its own air inlet 24 and air outlet 23, working together to draw in and expel more air per unit time. This vertically arranged fan layout helps achieve more uniform heat dissipation within the chassis. Because the fans 22 are arranged vertically, the airflow they generate can cover areas at different heights within the chassis. This is particularly beneficial for chassis with multiple layers of equipment or multiple heat sources distributed along the height (such as the motherboard 40, power supply, etc.). In situations where devices may be at different heights, the airflow generated by multiple fans 22 can act on these areas separately. For example, the fan 22 near the top can exhaust hot air from the upper part of the chassis, while the fan 22 below can push cool air upwards, allowing cool air to flow over the surfaces of various devices inside the chassis, thereby preventing localized overheating and ensuring a more even temperature distribution throughout the chassis. In a configuration with multiple fans 22, if one fan 22 fails, the other fans 22 can still continue to operate, providing redundancy and backup for chassis cooling.

[0032] Please see Figure 3 and Figure 4 The system has multiple air intake channels 11 arranged horizontally side-by-side. This arrangement is akin to having multiple air inlets open simultaneously; each channel can introduce external cool air, significantly increasing the total amount of air entering the chassis. In production environments, equipment generates significant heat, requiring substantial amounts of cool air for heat exchange. For example, when multiple heat-generating devices, such as high-performance CPUs and multiple hard drives, are operating simultaneously within the chassis, multiple air intake channels 11 ensure a sufficient supply of cool air to meet cooling demands. The horizontal arrangement of the air intake channels 11 allows for a more even distribution of cool air across the chassis. Once inside, the cool air covers a wider area, preventing congested airflow in some areas due to concentrated air intakes. For the devices within the chassis, the evenly distributed cool air allows for more comprehensive contact with their surfaces, effectively absorbing the heat generated.

[0033] Multiple dustproof panels 32 are arranged horizontally side-by-side on the dustproof slide rail 31. This horizontal arrangement of multiple dustproof panels 32 provides more comprehensive coverage of the air outlet duct 12. When the chassis is not in operation or the fan 22 is not turned on, these closely spaced dustproof panels 32 effectively prevent dust from entering the chassis through the air outlet duct 12. Like a tight protective fence, multiple dustproof panels 32 reduce gaps and opportunities for dust to enter, providing better dust protection for the equipment inside the chassis. This ensures that every part receives effective dust protection. For example, if the air outlet duct 12 is rectangular and has a large area, multiple smaller dustproof panels 32 can slide side-by-side, closely fitting the edge of the duct to achieve complete dust protection. When dustproof panels 32 accumulate dust and need cleaning, or when a dustproof panel 32 is damaged and needs replacement, the design of multiple dustproof panels 32 makes operation more convenient. Operators can remove or clean a single dustproof panel 32 without having to perform a complex disassembly of the entire dustproof assembly 30.

[0034] Multiple air vents 320 are provided on the dust cover 32. When the fan 22 inside the chassis is working and hot air needs to be expelled from the chassis, the multiple air vents 320 on the dust cover 32 provide an exhaust channel for the hot air; these air vents 320 are like small windows, allowing hot air to be smoothly exhausted from inside the chassis through the dust cover 32 to the external environment; even when the dust cover 32 covers the exhaust channel 12, hot air can still flow out through these air vents 320, ensuring that the air circulation and heat dissipation process inside the chassis proceed normally; although air vents 320 are provided, due to their relatively small size, it is difficult for dust and other impurities to directly enter the chassis in large quantities through these small holes; the movement of dust particles in the air is random, and the presence of the air vents 320 does not... This design prevents dust from entering the chassis as freely as it would without protection. Therefore, while ensuring ventilation and heat dissipation, it still provides basic dust protection, effectively preventing most dust from entering the chassis. Multiple exhaust vents 320 guide the direction of hot air exhaust. As hot air exits the chassis through the exhaust vents 320, it flows in a specific direction according to the distribution and shape of the vents. This guidance helps to expel hot air from the chassis more systematically, preventing turbulence near the exhaust channel 12. For example, when the exhaust vents 320 are evenly distributed, hot air can be evenly exhausted from all directions, improving overall heat dissipation efficiency.

[0035] The above description merely illustrates the preferred technical solution of this utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and this utility model also intends to include these modifications and variations.

Claims

1. A multi-functional integrated host chassis for heat dissipation and airflow for internal equipment, characterized in that, The multi-functional integrated host chassis includes a housing with air inlet and air outlet channels on the left and right sides respectively, a heat dissipation component on the air inlet channel, and a dustproof component on the air outlet channel; the heat dissipation component includes a mounting bracket installed on the air outlet channel, a fan installed on the mounting bracket, and the fan includes an air outlet facing the air outlet channel and an air inlet facing the opposite side of the air outlet channel; the dustproof component includes a dustproof slide rail installed on the outer wall of the housing on the side away from the heat dissipation component and a dustproof plate slidably mounted on the dustproof slide rail for covering the air outlet channel.

2. The multi-functional integrated host chassis according to claim 1, characterized in that, The multi-functional integrated host chassis also includes a motherboard disposed inside the chassis and heat dissipation fins mounted on the outer surface of the motherboard, wherein the heat dissipation fins are disposed on the motherboard on one side of the heat dissipation component.

3. The multifunctional integrated host chassis according to claim 2, characterized in that, The multi-functional integrated host chassis also includes a fixing component disposed inside the chassis for fixing the motherboard.

4. The multi-functional integrated host chassis according to claim 3, characterized in that, The fixing component includes a fixing bracket installed at the upper and lower ends of the housing and a first roller rotatably mounted on the fixing bracket. The motherboard is slidably mounted on the fixing bracket via the first roller.

5. The multi-functional integrated host chassis according to claim 4, characterized in that, The multi-functional integrated host chassis also includes a heat dissipation block, which is mounted on the motherboard on the side opposite to the heat dissipation fins.

6. The multi-functional integrated host chassis according to claim 5, characterized in that, The multi-functional integrated host chassis also includes a heat dissipation bracket for fixing the heat dissipation conduction block and a second roller that is rotatably mounted on the heat dissipation bracket. The heat dissipation bracket is mounted on the chassis on one side of the fixed support, and the heat dissipation conduction block is slidably mounted on the heat dissipation bracket via the second roller.

7. The multifunctional integrated host chassis according to claim 1, characterized in that, There are multiple fans, and the multiple fans are installed vertically side by side on the mounting bracket.

8. The multi-functional integrated host chassis according to claim 1, characterized in that, There are multiple air intake channels, which are arranged horizontally side by side.

9. The multifunctional integrated host chassis according to claim 8, characterized in that, There are multiple dustproof plates, which are horizontally arranged side by side on the dustproof slide rail.

10. The multifunctional integrated host chassis according to claim 9, characterized in that, The dustproof plate is provided with multiple air outlets.

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